CN107920147A - A kind of smart mobile phone with heat dissipation back cover - Google Patents
A kind of smart mobile phone with heat dissipation back cover Download PDFInfo
- Publication number
- CN107920147A CN107920147A CN201711225530.6A CN201711225530A CN107920147A CN 107920147 A CN107920147 A CN 107920147A CN 201711225530 A CN201711225530 A CN 201711225530A CN 107920147 A CN107920147 A CN 107920147A
- Authority
- CN
- China
- Prior art keywords
- mobile phone
- back cover
- heat
- layer
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/18—Telephone sets specially adapted for use in ships, mines, or other places exposed to adverse environment
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/085—Copper
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
Abstract
The present invention relates to a kind of smart mobile phone with heat dissipation back cover, the smart mobile phone with heat dissipation back cover includes mobile phone display screen, mainboard, battery and back cover, and the back cover includes heat conduction silicone, nonwoven layer, PET resin layer, heat conduction multi-wall carbon nano-tube tube layer, heat-absorbing material layer, magnesium alloy structured layer and the copper heat sink directly contacted with battery.The structure of the back cover of the smart mobile phone with heat dissipation back cover of the present invention is simple; it is easy to use; while effectively protection mobile phone is against damages; add heat dissipation effect; timely and effectively mobile phone generation heat is distributed; increase the mobile phone security and stability that use, while heat conduction silicone has good buffering and anti-seismic performance, cell damage when effectively avoiding the mobile phone from colliding with.
Description
Technical field
The present invention relates to moving communicating field, more particularly to a kind of smart mobile phone with heat dissipation back cover.
Background technology
In daily life, the user of smart mobile phone is more and more, and the function of mobile phone is also no longer only limitted to take phone
With send short messages.But use mobile phone for a long time, organism fever can all occur in most mobile phones, or even hot, and some mobile phones can also be because of
Use for a long time and situations such as battery explosion occur.Mobile phone for a long time use organism fever, not only have impact on user experience but also
Mobile phone built-in component is damaged huge.Existing mobile phone back cover heat dissipation effect unobvious, influence the service life of mobile phone, because
This is, it is necessary to a kind of excellent back cover of heat dissipation performance.
The content of the invention
The purpose of the present invention is overcome above-mentioned the deficiencies in the prior art, there is provided a kind of intelligent hand with heat dissipation back cover
Machine, effectively improves the heat dissipation performance of mobile phone, and then improves the service life of smart mobile phone.
To achieve the above object, a kind of smart mobile phone with heat dissipation back cover proposed by the present invention, it is described that there is heat dissipation
The smart mobile phone of back cover includes mobile phone display screen, mainboard, battery and back cover, and the back cover includes directly connecing with battery
Tactile heat conduction silicone, nonwoven layer, PET resin layer, heat conduction multi-wall carbon nano-tube tube layer, heat-absorbing material layer, magnesium alloy structure
Change layer and copper heat sink, the heat conduction silicone are made of following component by the parts by weight：
Preferably, the thickness of the heat conduction silicone is 100-300 microns, the thickness of the non-woven fabrics is 100-300
Micron.
Preferably, the thickness of the PET resin layer is 100-500 microns.
Preferably, the magnesium alloy structured layer has multiple grooves, a part for the heat-absorbing material layer is embedded
Into the groove.
Preferably, the thickness of the copper heat sink is 0.5-1.5 millimeters.
Preferably, the heat conduction silicone, nonwoven layer, PET resin layer, heat conduction multi-wall carbon nano-tube tube layer, heat absorption material
Bonded between the bed of material, magnesium alloy structured layer and copper heat sink by epobond epoxyn.
Preferably, the silane coupling agent is vinyltriethoxysilane, vinyltrimethoxysilane, ethene
One kind in three tert-butyl peroxide silane of base and vinyltriacetoxy silane；The inhibitor suppresses for amine
Agent；The metallic copper particle is the metallic copper particle particle of 5-20 microns of particle diameter, and the particle diameter of the alpha-silicon nitride powders is 5-20
Micron.
The structure of the back cover of the smart mobile phone with heat dissipation back cover of the present invention is simple, easy to use, effectively protection
While mobile phone is against damages, heat dissipation effect is added, is timely and effectively distributed mobile phone generation heat, increase mobile phone uses
Security and stability, while heat conduction silicone has good buffering and anti-seismic performance, effectively avoids mobile phone electric when colliding with
Pond is damaged, and the addition of alpha-silicon nitride powders improves the insulation performance of heat conduction silicone, and the addition of metallic copper particle is improved and led
The heat dissipation performance of hot layer of silica gel, the addition of ethylene-vinyl acetate copolymer improve the adhesive property of heat conduction silicone.
Brief description of the drawings
Fig. 1 is the structure diagram of the smart mobile phone with heat dissipation back cover of the present invention；
Fig. 2 is the structure diagram of the back cover of the smart mobile phone with heat dissipation back cover of the present invention.
Embodiment
As shown in Figs. 1-2, a kind of smart mobile phone with heat dissipation back cover, the smart mobile phone with heat dissipation back cover
Including mobile phone display screen 1, mainboard 2, battery 3 and back cover 4, the back cover 4 includes the thermal conductive silicon directly contacted with battery
Glue-line 41, nonwoven layer 42, PET resin layer 43, heat conduction multi-wall carbon nano-tube tube layer 44, heat-absorbing material layer 45, magnesium alloy structure
Change layer 46 and copper heat sink 47, the heat conduction silicone 41 are made of following component by the parts by weight：
Preferably, the thickness of the heat conduction silicone is 100-300 microns, the thickness of the non-woven fabrics is 100-300
Micron, the thickness of the PET resin layer is 100-500 microns, and the magnesium alloy structured layer has multiple grooves, the suction
A part for hot material layer is embedded into the groove, and the thickness of the copper heat sink is 0.5-1.5 millimeters, the heat conductive silica gel
Layer, nonwoven layer, PET resin layer, heat conduction multi-wall carbon nano-tube tube layer, heat-absorbing material layer, magnesium alloy structured layer and copper dissipate
Bonded between hot plate by epobond epoxyn, the silane coupling agent is vinyltriethoxysilane, vinyl three
One kind in methoxy silane, three tert-butyl peroxide silane of vinyl and vinyltriacetoxy silane；The suppression
Preparation is amine inhibitor；The metallic copper particle be 5-20 microns of particle diameter metallic copper particle particle, the silicon nitride powder
The particle diameter at end is 5-20 microns.
Embodiment 1：
A kind of smart mobile phone with heat dissipation back cover, the smart mobile phone with heat dissipation back cover are shown including mobile phone
Screen 1, mainboard 2, battery 3 and back cover 4, the back cover 4 include heat conduction silicone 41, the non-woven fabrics directly contacted with battery
Layer 42, PET resin layer 43, heat conduction multi-wall carbon nano-tube tube layer 44, heat-absorbing material layer 45, magnesium alloy structured layer 46 and copper dissipate
Hot plate 47, the heat conduction silicone 41 are made of following component by the parts by weight：
Wherein, the thickness of the heat conduction silicone is 100 microns, and the thickness of the non-woven fabrics is 300 microns, the PET
The thickness of resin bed is 200 microns, and the magnesium alloy structured layer has multiple grooves, a part for the heat-absorbing material layer
It is embedded into the groove, the thickness of the copper heat sink is 0.5 millimeter, the heat conduction silicone, nonwoven layer, PET resin
Pass through epoxy resin between layer, heat conduction multi-wall carbon nano-tube tube layer, heat-absorbing material layer, magnesium alloy structured layer and copper heat sink
Adhesives, the silane coupling agent are vinyltriethoxysilane；The inhibitor is amine inhibitor；It is described
Metallic copper particle be 5 microns of particle diameter metallic copper particle particle, the particle diameters of the alpha-silicon nitride powders is 5 microns.
Embodiment 2：
A kind of smart mobile phone with heat dissipation back cover, the smart mobile phone with heat dissipation back cover are shown including mobile phone
Screen 1, mainboard 2, battery 3 and back cover 4, the back cover 4 include heat conduction silicone 41, the non-woven fabrics directly contacted with battery
Layer 42, PET resin layer 43, heat conduction multi-wall carbon nano-tube tube layer 44, heat-absorbing material layer 45, magnesium alloy structured layer 46 and copper dissipate
Hot plate 47, the heat conduction silicone 41 are made of following component by the parts by weight：
Wherein, the thickness of the heat conduction silicone is 200 microns, and the thickness of the non-woven fabrics is 200 microns, the PET
The thickness of resin bed is 300 microns, and the magnesium alloy structured layer has multiple grooves, a part for the heat-absorbing material layer
Be embedded into the groove, the thickness of the copper heat sink is 1 millimeter, the heat conduction silicone, nonwoven layer, PET resin layer,
Glued between heat conduction multi-wall carbon nano-tube tube layer, heat-absorbing material layer, magnesium alloy structured layer and copper heat sink by epoxy resin
Mixture bonds, and the silane coupling agent is vinyltrimethoxysilane；The inhibitor is amine inhibitor；Described
Metallic copper particle is the metallic copper particle particle of 10 microns of particle diameter, and the particle diameter of the alpha-silicon nitride powders is 10 microns.
Embodiment 3：
A kind of smart mobile phone with heat dissipation back cover, the smart mobile phone with heat dissipation back cover are shown including mobile phone
Screen 1, mainboard 2, battery 3 and back cover 4, the back cover 4 include heat conduction silicone 41, the non-woven fabrics directly contacted with battery
Layer 42, PET resin layer 43, heat conduction multi-wall carbon nano-tube tube layer 44, heat-absorbing material layer 45, magnesium alloy structured layer 46 and copper dissipate
Hot plate 47, the heat conduction silicone 41 are made of following component by the parts by weight：
Wherein, the thickness of the heat conduction silicone is 300 microns, and the thickness of the non-woven fabrics is 140 microns, the PET
The thickness of resin bed is 500 microns, and the magnesium alloy structured layer has multiple grooves, a part for the heat-absorbing material layer
It is embedded into the groove, the thickness of the copper heat sink is 1.5 millimeters, the heat conduction silicone, nonwoven layer, PET resin
Pass through epoxy resin between layer, heat conduction multi-wall carbon nano-tube tube layer, heat-absorbing material layer, magnesium alloy structured layer and copper heat sink
Adhesives, the silane coupling agent are vinyltriacetoxy silane；The inhibitor is amine inhibitor；Institute
The metallic copper particle stated is the metallic copper particle particle of 20 microns of particle diameter, and the particle diameter of the alpha-silicon nitride powders is 20 microns.
The structure of the back cover of the smart mobile phone with heat dissipation back cover of the present invention is simple, easy to use, effectively protection
While mobile phone is against damages, heat dissipation effect is added, is timely and effectively distributed mobile phone generation heat, increase mobile phone uses
Security and stability, while heat conduction silicone has good buffering and anti-seismic performance, effectively avoids mobile phone electric when colliding with
Pond is damaged, and the addition of alpha-silicon nitride powders improves the insulation performance of heat conduction silicone, and the addition of metallic copper particle is improved and led
The heat dissipation performance of hot layer of silica gel, the addition of ethylene-vinyl acetate copolymer improve the adhesive property of heat conduction silicone.
The above is the preferred embodiment of the present invention, it is noted that for those skilled in the art
For, various improvements and modifications may be made without departing from the principle of the present invention, these improvements and modifications are also considered as
Protection scope of the present invention.
Claims (7)
- A kind of 1. smart mobile phone with heat dissipation back cover, it is characterised in that the smart mobile phone bag with heat dissipation back cover Mobile phone display screen, mainboard, battery and back cover are included, the back cover includes heat conduction silicone, the nothing directly contacted with battery Woven fabric layer, PET resin layer, heat conduction multi-wall carbon nano-tube tube layer, heat-absorbing material layer, magnesium alloy structured layer and copper heat sink, The heat conduction silicone is made of following component by the parts by weight：
- 2. the smart mobile phone with heat dissipation back cover according to claim 1, it is characterised in that the heat conduction silicone Thickness is 100-300 microns, and the thickness of the non-woven fabrics is 100-300 microns.
- 3. the smart mobile phone with heat dissipation back cover according to claim 1, it is characterised in that the PET resin layer Thickness is 100-500 microns.
- 4. the smart mobile phone with heat dissipation back cover according to claim 1, it is characterised in that the magnesium alloy structure Changing layer has multiple grooves, and a part for the heat-absorbing material layer is embedded into the groove.
- 5. the smart mobile phone with heat dissipation back cover according to claim 1, it is characterised in that the thickness of the copper heat sink Spend for 0.5-1.5 millimeters.
- 6. the smart mobile phone with heat dissipation back cover according to claim 1, it is characterised in that the heat conduction silicone, Nonwoven layer, PET resin layer, heat conduction multi-wall carbon nano-tube tube layer, heat-absorbing material layer, magnesium alloy structured layer and copper heat sink Between bonded by epobond epoxyn.
- 7. the smart mobile phone with heat dissipation back cover according to claim 1, it is characterised in that the silane coupling agent For vinyltriethoxysilane, vinyltrimethoxysilane, three tert-butyl peroxide silane of vinyl and vinyl three One kind in acetoxylsilane；The inhibitor is amine inhibitor；The metallic copper particle is 5-20 microns of particle diameter Metallic copper particle particle, the particle diameters of the alpha-silicon nitride powders is 5-20 microns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711225530.6A CN107920147A (en) | 2017-11-29 | 2017-11-29 | A kind of smart mobile phone with heat dissipation back cover |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711225530.6A CN107920147A (en) | 2017-11-29 | 2017-11-29 | A kind of smart mobile phone with heat dissipation back cover |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107920147A true CN107920147A (en) | 2018-04-17 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711225530.6A Withdrawn CN107920147A (en) | 2017-11-29 | 2017-11-29 | A kind of smart mobile phone with heat dissipation back cover |
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| Country | Link |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104448836A (en) * | 2014-11-24 | 2015-03-25 | 深圳德邦界面材料有限公司 | Puncture-resistant type heat radiation silica gel pad and preparation method thereof |
| CN105219092A (en) * | 2015-10-29 | 2016-01-06 | 惠州市粤泰翔科技有限公司 | A kind of high filling flexible heat-conducting silicon rubber and preparation method thereof |
| CN205356441U (en) * | 2016-01-05 | 2016-06-29 | 黄艺红 | Heat dissipation type cell -phone shell |
| CN106084794A (en) * | 2016-06-16 | 2016-11-09 | 上海利隆化工化纤有限公司 | Heat-conducting silica gel sheet and preparation method thereof |
| CN205934024U (en) * | 2016-08-23 | 2017-02-08 | 苏州库浩斯信息科技有限公司 | Environment -friendly micro arc oxidation treatment's magnesium aluminium alloy housing |
-
2017
- 2017-11-29 CN CN201711225530.6A patent/CN107920147A/en not_active Withdrawn
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104448836A (en) * | 2014-11-24 | 2015-03-25 | 深圳德邦界面材料有限公司 | Puncture-resistant type heat radiation silica gel pad and preparation method thereof |
| CN105219092A (en) * | 2015-10-29 | 2016-01-06 | 惠州市粤泰翔科技有限公司 | A kind of high filling flexible heat-conducting silicon rubber and preparation method thereof |
| CN205356441U (en) * | 2016-01-05 | 2016-06-29 | 黄艺红 | Heat dissipation type cell -phone shell |
| CN106084794A (en) * | 2016-06-16 | 2016-11-09 | 上海利隆化工化纤有限公司 | Heat-conducting silica gel sheet and preparation method thereof |
| CN205934024U (en) * | 2016-08-23 | 2017-02-08 | 苏州库浩斯信息科技有限公司 | Environment -friendly micro arc oxidation treatment's magnesium aluminium alloy housing |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
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| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20180417 |
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| WW01 | Invention patent application withdrawn after publication |