CN107910413B - A kind of the flood tide transfer device and transfer method of MicroLED - Google Patents
A kind of the flood tide transfer device and transfer method of MicroLED Download PDFInfo
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- CN107910413B CN107910413B CN201711162098.0A CN201711162098A CN107910413B CN 107910413 B CN107910413 B CN 107910413B CN 201711162098 A CN201711162098 A CN 201711162098A CN 107910413 B CN107910413 B CN 107910413B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0093—Wafer bonding; Removal of the growth substrate
Abstract
The present invention proposes the flood tide transfer method of MicroLED a kind of, includes the following steps；S1, by the vertical view of the asymmetrical MicroLED of upper lower edge to shape, select corresponding loading mold, the loading chute for being embedded in MicroLED intensively laid at the loading surface of the mold；The vertical view of loading chute is matched with the vertical view of MicroLED to shape to shape；S2, fixed loading mold, connect concussion source at loading mold, and blowing device is arranged in loading mold side；MicroLED batch is poured on loading surface；S3, starting concussion source and blowing device；Loading chute is fallen under acting on MicroLED earthquake power or wind-force；S4, the MicroLED that loading chute is not fallen at loading surface is blown out by loading surface with wind-force；The transfer method also successively includes the following steps after step S4；S5, loading surface is detected with light inspection device or infrared detection device, judgement is not embedded into the loading groove location of MicroLED；S6, MicroLED is inserted into vacant loading chute with manipulator；Present invention process is simple, and yield is high, at low cost.
Description
Technical field
The present invention relates to novel semi-conductor display field, the flood tide transfer device of especially a kind of MicroLED and transfer side
Method.
Background technique
Micro-LED is traditional LED structure to be carried out to microminiaturization and matrixing, and use CMOS integrated circuit technology system
At driving circuit, come the display technology realizing each pixel addressing control and being operated alone.Due to Micro-LED technology
The various indexs such as brightness, service life, contrast, reaction time, energy consumption, visible angle and resolution ratio are all better than LCD and OLED technology,
In addition the advantage that it belongs to self-luminous, structure is simple, small in size and energy saving, is considered as next-generation display technology by many production men
And start actively layout.It is Micro-LED member device in the core technology problem that Micro-LED faces in industrialization process
The flood tide of part shifts (Mass Transfer) technology；Since Micro-LED component is very tiny, and flood tide transfer techniques are wanted
Very high efficiency, yields and transfer precision, the maximum that flood tide transfer techniques become Micro-LED R&D process is asked to choose
War, hinders the popularization and use of Micro-LED technology；Therefore, how to make (design) and go out a whole set of simple and practical, economy
Good, high-efficient, yields is high and transfer flood tide transfer techniques with high accuracy are the problem to be solved in the present invention.
Summary of the invention
The present invention proposes the flood tide transfer device and transfer method of a kind of MicroLED, and simple process, yield is high, cost
It is low.
The present invention uses following technical scheme.
A kind of flood tide transfer method of MicroLED, for overlooking batch to the asymmetrical MicroLED of upper lower edge of shape
Amount transfer, the transfer method successively include the following steps；
S1, by the vertical view of the asymmetrical MicroLED of upper lower edge to shape, select corresponding loading mold, the mold
The loading chute for being embedded in MicroLED is intensively laid at loading surface；The vertical view of loading chute to shape and the vertical view of MicroLED to
Shape matching；
S2, fixed loading mold, connect concussion source at loading mold, and blowing device is arranged in loading mold side；?
MicroLED batch is poured on loading surface；
S3, starting concussion source and blowing device；Loading chute is fallen under acting on MicroLED earthquake power or wind-force；
The transfer method also successively includes the following steps after step S3；
S4, the MicroLED that loading chute is not fallen at loading surface is blown out by loading surface with wind-force；
S5, loading surface is detected with light inspection device or infrared detection device, judgement is not embedded into the loading of MicroLED
Groove location；
S6, MicroLED is inserted into vacant loading chute with manipulator.
Aspirating hole is equipped at the fixed bit of the loading mold；After MicroLED falls into loading chute, aspirating hole is evacuated shape
At negative pressure MicroLED is pull-in in loading chute.
Detection light source is equipped at the aspirating hole；In step s 5, if detection source light cannot generate at loading chute
The reflection light that can be detected, then light inspection device determines that the loading chute is not embedded into MicroLED.
For the vertical view for the MicroLED that the transfer method is shifted in a rectangular trapezoid, MicroLED size range is 500
Nanometer ~ 500 microns, after step S6, also successively includes the following steps；
S7, the loading mold that filling is completed is connected to test device, the MicroLED in each loading chute is carried out
MicroLED dependence test, and non-defective unit is inserted after removing defective products with manipulator；
S8, the loading mold that test, filling are completed is moved to welding sequence or packaging process, by loading groove location to loading
MicroLED on face carries out batch welding or encapsulation.
Preferably, the transfer method carries out batch transfer, the transfer dress to MicroLED using flood tide transfer device
It sets including sample stage；Loading mold is fixed on the sample stage, is intensively laid at the loading surface of the mold for being embedded in
The loading chute of MicroLED；The vertical view of loading chute is matched with the vertical view of MicroLED to shape to shape；The loading chute is filling
Layout on section is consistent with MicroLED alignment placement needed for welding sequence or packaging process.
Concussion source, blowing device and manipulator are set at the sample stage of the transfer device；The concussion source includes ultrasound
Concussion source, piezo-electric crystal concussion source, mechanical concussion source.
The loading chute of the loading surface is processed with laser micro/nano or the preparation of the method for chemical wet etching.
The loading mold further includes the screening template being adapted to loading mold；When only need to the part cargo shipment slot of loading surface into
When row MicroLED is embedded in, the screening template covers the loading chute for being not involved in embeding operation.
Remarkable advantage of the invention is to introduce chip and corresponding mold design at asymmetry structure, in design mould
Chip is first prepared as unsymmetric structure before tool, carrys out custom mold further according to chip form, so that chip can only be along a kind of fixation
Mode is put into mold, and by way of ultrasound, pressure electrically or mechanically concussion and blowing device makes most of chip be fixed on mould automatically
In tool, it is only necessary to fraction chip need to be using manipulator filling vacant locations or replacement defective products, and simple process, yields is high, at
This is low.
The present invention carries out the masking for having regulation to be laid out to mold due to that can pass through screening template, can prepare RGB color
When Micro-LED display device or high density Micro LED array, by repeatedly, in proportion, by the flood tide transfer techniques of layout
It realizes, after the completion of shifting the Micro LED of a color to mold every time and welding, after the screening template of mold is adjusted position
It welds after retransferring the Micro LED of another color, is completed until polychrome Micro LED is all shifted and welded encapsulation.
Detailed description of the invention
The present invention is described in more detail with reference to the accompanying drawings and detailed description:
A kind of Fig. 1: flood tide transfer device schematic diagram of MicroLED of the present invention；
Fig. 2: MicroLED structural schematic diagram used by the embodiment of the present invention one；
Fig. 3: MicroLED mold schematic diagram used by the embodiment of the present invention one；
Fig. 4: MicroLED mold groove schematic diagram used by the embodiment of the present invention one；
Fig. 5: batch MicroLED component is poured into the schematic diagram of mold loading surface by the embodiment of the present invention one；
Fig. 6: concussion source and blowing device signal are set on a kind of flood tide transfer device sample stage of MicroLED of the present invention
Figure；
Fig. 7: one MicroLED mold vacancy detection schematic diagram of the embodiment of the present invention；
Fig. 8: schematic diagram is filled in one MicroLED mold vacancy of the embodiment of the present invention；
In attached drawing, main element description of symbols is as follows:
01-MicroLED component, 011-n type GaN epitaxial layer, 012- multiple quantum well layer 012,013- p-type GaN epitaxy
Layer 013；
02-MicroLED loading mold, the loading chute on 021- loading mold loading surface；
03-MicroLED flood tide transfer device sample stage, (aspirating hole is arranged with the aspirating hole being arranged on 031- sample stage
Detect light source), the concussion source being arranged on 032- sample stage；
04- blowing device, the signal of 041- blowing device wind-force；
05- light examines device, 051- detector, 052- probing light, when 053- loading chute is not filled by MicroLED component
Probing light reflective condition；
06- manipulator.
Specific embodiment
As shown in figures 1-8, the flood tide transfer method of a kind of MicroLED, it is asymmetrical to the upper lower edge of shape for overlooking
The batch of MicroLED01 shifts, and the transfer method successively includes the following steps；
S1, by the vertical view of the asymmetrical MicroLED01 of upper lower edge to shape, select corresponding loading mold 02, the mould
The loading chute 021 for being embedded in MicroLED is intensively laid at the loading surface of tool；The vertical view of loading chute 021 to shape with
The vertical view of MicroLED01 is matched to shape；
S2, fixed loading mold, connect concussion source 032 at loading mold, and blowing device 04 is arranged in loading mold side；
MicroLED batch is poured on loading surface；
S3, starting concussion source and blowing device 04；Loading chute is fallen under acting on MicroLED earthquake power or wind-force；
The transfer method also successively includes the following steps after step S3；
S4, the MicroLED that loading chute is not fallen at loading surface is blown out by loading surface with wind-force 041；
S5, loading surface is detected with light inspection device 05 or infrared detection device, judgement is not embedded into the dress of MicroLED
Carry groove location；
S6, MicroLED is inserted into vacant loading chute with manipulator.
Aspirating hole 031 is equipped at the fixed bit (sample stage 03) of the loading mold；After MicroLED falls into loading chute,
Aspirating hole is evacuated the negative pressure to be formed and MicroLED is pull-in in loading chute.
Detection light source is equipped at the aspirating hole；In step s 5, if detection source light cannot generate at loading chute
The reflection light that can be detected, then light inspection device determines that the loading chute is not embedded into MicroLED.
For the vertical view for the MicroLED that the transfer method is shifted in a rectangular trapezoid, MicroLED size range is 500
Nanometer ~ 500 microns, after step S6, also successively includes the following steps；
S7, the loading mold that filling is completed is connected to test device, the MicroLED in each loading chute is carried out
MicroLED dependence test, and non-defective unit is inserted after removing defective products with manipulator 06；
S8, the loading mold that test, filling are completed is moved to welding sequence or packaging process, by loading groove location to loading
MicroLED on face carries out batch welding or encapsulation.
Preferably, the transfer method carries out batch transfer, the transfer dress to MicroLED using flood tide transfer device
It sets including sample stage 03；Loading mold 02 is fixed on the sample stage 03, is intensively laid at the loading surface of the mold for embedding
Enter the loading chute 021 of MicroLED01；The vertical view of loading chute is matched with the vertical view of MicroLED to shape to shape；The loading
Layout of the slot on loading surface is consistent with MicroLED alignment placement needed for welding sequence or packaging process.
Concussion source 032, blowing device 04 and manipulator 06 are set at the sample stage of the transfer device；The concussion source packet
Include ultrasonic vibration source, piezo-electric crystal concussion source, mechanical concussion source.
The loading chute of the loading surface is processed with laser micro/nano or the preparation of the method for chemical wet etching.
The loading mold further includes the screening template being adapted to loading mold；When only need to the part cargo shipment slot of loading surface into
When row MicroLED is embedded in, the screening template covers the loading chute for being not involved in embeding operation.
Embodiment one:
The present embodiment elaborates the flood tide of MicroLED a kind of by taking ladder structure of right angle MicroLED unit component as an example
Transfer device and method.
The flood tide transfer device of the MicroLED is as shown in Figure 1, include MicroLED loading mold, sample stage, blowing
Device, detection system, manipulator, electrical system, it is characterised in that: the sample stage is provided with aspirating hole, and can carry out difference
The concussion of frequency；The blowing device position can move on platform, and the angle of wind, speed and frequency are adjustable；The detection system
System includes detection light source and detector, for judging whether mold is completely filled with by reflected light (visible light or infrared sensing)
And the relative position of output vacancy；The flood tide transfer method of described device comprises the following steps:
(1) design of MicroLED component structure and preparation:
(MOCVD) method is deposited using Metallo-Organic Chemical Vapor, GaN epitaxial layer is deposited in clean GaN substrate, it is described
Epitaxial layer is including but not limited to N-shaped GaN epitaxial layer 011, multiple quantum well layer 012, p-type GaN epitaxial layer 013, using photoetching, clearly
It washes, etch, MicroLED component 01 as shown in Figure 2 is made in electrode fabrication, passivation, rubbing down, the chip technologies such as cutting.It is preferred that
, MicroLED component uses the unsymmetric structure of right-angled trapezium in the present embodiment.
(2) it designs and makes mold:
According to the size and shape of MicroLED component, the corresponding mold 02 for reprinting MicroLED component is designed, such as
Shown in Fig. 3.The groove type structure of the mold of MicroLED is reprinted using laser micro/nano processing or the method preparation of chemical wet etching
021, as shown in Figure 4.Since the groove structure of MicroLED component and mold is unsymmetric structure, MicroLED component is only
Alignment mark can be set along the groove that mold is inserted in a kind of orientation on mold, for connecting encapsulation with the accurate of driving circuit.
(3) MicroLED component is reprinted:
MicroLED mold is fixed on sample 03, pours into MicroLED component in batches, as shown in Figure 5.Sample stage
On be provided with aspirating hole 031 and blowing device 04, as shown in Figure 6.Preferably, it in the present embodiment, using ultrasonic vibration mode, beats
Ultrasonic vibration source and blowing device are opened, MicroLED component is fallen under ultrasonication in mold position appropriate on mold,
Fixation is sucked by air extractor in the MicroLED component for falling into mold, and the MicroLED component for not falling within mold is filled in blowing
The effect of setting is lower to fill vacant locations, until most of position is filled by MicroLED component in mold.
(4) vacancy detection and filling:
It, will be extra using blowing device when position most of on mold is filled up by MicroLED component
MicroLED component blows to returnable.Platform pumping hole site is provided with light source, under platform static position, opens platform
Upper detection light source and detector 051 judge whether mold is completely filled with by reflected light (projection light or infrared sensing).It is preferred that
, the present embodiment uses optical detector, and when mold groove is filled by MicroLED component, aspirating hole light can not reach spy
Device is surveyed, detector indicates that the groove is filled by MicroLED component；When mold groove is not filled by MicroLED component,
Aspirating hole light injects detector, and detector indicates that the groove is not filled by MicroLED component, and exports the opposite of vacancy
Position, as shown in Figure 7.MicroLED component is inserted using empty place of the manipulator 06 on mold, as shown in Figure 8.
(5) defective products detection and replacement:
MicroLED component array in mold is connected to beta version, the function of MicroLED component is tested, using machine
Tool hand removes defective products, and inserts non-defective unit.
(6) mold removal and backboard wielding neck:
It is loaded with the mold of MicroLED, due to air-extraction function, MicroLED component locations will not be moved on mold.
The CMOS for having pixel-driving circuit or TFT backplate and MicroLED component wielding neck will be made, and is sealed
Dress is realized the addressing control of each pixel and is operated alone.
So far, flood tide transfer, welding and the encapsulation of MicroLED is completed.
It, can be also when to mold is inserted with MicroLED component of the same colour for RGB color MicroLED display device
The die location for the same MicroLED of the same colour not inserted is packed into tri- color Micro of RGB with template covering is hidden in a mold step by step
LED component.For RGB color MicroLED display device, three independent molds can be designed and produced, are shifted in three times
And welding.For highdensity Micro LED array, it can be realized by flood tide transfer techniques repeatedly, in proportion, such as be divided into 4
Secondary transfer, transfer MicroLED density is overall a quarter to realize high density Micro LED array every time.
Example above primarily illustrates some embodiments of the present invention program；Although only to some of realities of the invention
The mode of applying is described, but those of ordinary skill in the art it is to be appreciated that the present invention can without departing from its spirit with model
Implement in enclosing in many other forms.Therefore, the example and way of example shown is considered as schematical rather than limits
Property, in the case where not departing from the spirit and scope of the present invention as defined in appended claims, the present invention may cover
Various modifications and replacement.The foregoing is merely presently preferred embodiments of the present invention, all to be done according to scope of the present invention patent
Equivalent changes and modifications are all covered by the present invention.
Claims (9)
1. the flood tide transfer method of a kind of MicroLED, for overlooking the batch to the asymmetrical MicroLED of upper lower edge of shape
Transfer, it is characterised in that: the transfer method successively includes the following steps；
S1, by the vertical view of the asymmetrical MicroLED of upper lower edge to shape, select corresponding loading mold, the loading of the mold
The loading chute for being embedded in MicroLED is intensively laid at face；The vertical view of loading chute is to shape and the vertical view of MicroLED to shape
Matching；
S2, fixed loading mold, connect concussion source at loading mold, and blowing device is arranged in loading mold side；?
MicroLED batch is poured on loading surface；
S3, starting concussion source and blowing device；Loading chute is fallen under acting on MicroLED earthquake power or wind-force.
2. the flood tide transfer method of MicroLED according to claim 1 a kind of, it is characterised in that: the transfer method exists
After step S3, also successively include the following steps；
S4, the MicroLED that loading chute is not fallen at loading surface is blown out by loading surface with wind-force；
S5, loading surface is detected with light inspection device, judgement is not embedded into the loading groove location of MicroLED；
S6, MicroLED is inserted into vacant loading chute with manipulator.
3. the flood tide transfer method of MicroLED according to claim 2 a kind of, it is characterised in that: the loading mold
Aspirating hole is equipped at fixed bit；After MicroLED falls into loading chute, aspirating hole is evacuated the negative pressure to be formed and MicroLED is attracted
In loading chute.
4. the flood tide transfer method of MicroLED according to claim 3 a kind of, it is characterised in that: set at the aspirating hole
There is detection light source；In step s 5, if detection source light cannot generate the reflection light that can be detected, light at loading chute
Inspection device determines that the loading chute is not embedded into MicroLED.
5. the flood tide transfer method of MicroLED according to claim 4 a kind of, it is characterised in that: the transfer method institute
The vertical view of the MicroLED of transfer is in a rectangular trapezoid, and MicroLED size range is 500 nanometers ~ 500 microns, in step S6
Afterwards, also successively include the following steps；
S7, the loading mold that filling is completed is connected to test device, MicroLED is carried out to the MicroLED in each loading chute
Dependence test, and non-defective unit is inserted after removing defective products with manipulator；
S8, the loading mold that test, filling are completed is moved to welding sequence or packaging process, by loading groove location on loading surface
MicroLED carry out batch welding or encapsulation.
6. the flood tide transfer device of MicroLED a kind of, it is characterised in that: transfer method described in claim 5 is shifted using flood tide
Device carries out batch transfer to MicroLED, and the transfer device includes sample stage；Loading mold, institute are fixed on the sample stage
State the loading chute intensively laid at the loading surface of mold for being embedded in MicroLED；The vertical view of loading chute is to shape and MicroLED
Vertical view to shape match；Layout and MicroLED of the loading chute on loading surface institute in welding sequence or packaging process
The alignment placement needed is consistent.
7. the flood tide transfer device of MicroLED according to claim 6 a kind of, it is characterised in that: the transfer device
Concussion source, blowing device and manipulator are set at sample stage；The concussion source include ultrasonic vibration source, piezo-electric crystal concussion source,
Mechanical concussion source.
8. the flood tide transfer device of MicroLED according to claim 7 a kind of, it is characterised in that: the dress of the loading surface
Slot is carried with laser micro/nano processing or the method preparation of chemical wet etching.
9. the flood tide transfer device of MicroLED according to claim 8 a kind of, it is characterised in that: the loading mold is also
Including the screening template being adapted to loading mold；It is described when only needing the part cargo shipment slot to loading surface to carry out MicroLED insertion
Template is hidden to cover the loading chute for being not involved in embeding operation.
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| CN103872213A (en) * | 2014-02-14 | 2014-06-18 | 严敏 | Manufacturing method of automatic needle beating paster LED (light emitting diode) |
| CN106486027A (en) * | 2015-08-31 | 2017-03-08 | 三星显示有限公司 | Display device and the method manufacturing display device |
| CN105449054A (en) * | 2015-11-11 | 2016-03-30 | 海迪科（南通）光电科技有限公司 | Accurate positioning method for LED chips |
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