CN107887713A - Integrated circuit antenna oscillator and preparation method thereof - Google Patents
Integrated circuit antenna oscillator and preparation method thereof Download PDFInfo
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- CN107887713A CN107887713A CN201710979318.2A CN201710979318A CN107887713A CN 107887713 A CN107887713 A CN 107887713A CN 201710979318 A CN201710979318 A CN 201710979318A CN 107887713 A CN107887713 A CN 107887713A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
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Abstract
The invention discloses a kind of integrated circuit antenna oscillator and preparation method thereof, the first current feed department and the second current feed department that integrated circuit antenna oscillator includes oscillator body on panel first surface of panel, injection molding, the first circuit for being arranged on panel first surface and being isolated and second circuit, is arranged on oscillator first body surface and is isolated；First current feed department includes symmetrically arranged two the first feed layers, and the both ends of the first circuit connect two the first feed layers, turn on two the first feed layers respectively；Second current feed department includes symmetrically arranged two the second feed layers, and the both ends of second circuit connect two the second feed layers, turn on two the second feed layers respectively.The integrated circuit antenna oscillator of the present invention is an overall structure, compared to the package assembly of existing sheet metal component, plastic fixtures and circuit board, weight is small, number of parts is few, and overall structure dimensional stability is more preferable, assembling and debugging production efficiency are improved, reduces manufacturing process cost.
Description
Technical field
The present invention relates to communication antenna technical field, more particularly to a kind of integrated circuit antenna oscillator and preparation method thereof.
Background technology
With the continuous development and network upgrade of 4G/5G wireless communication industries, the frequency more and more higher used, demand is got over
Come more.Structure design, selection, manufacture method and the packaging technology of antenna are antenna performance reliability, stability and durable journey
The guarantee of degree.Oscillator is the mostly important functional parts of inner antenna, and general structure designs complex, traditional production system
It is to use metal material (aluminium alloy or kirsite) die cast to make technique, or sheet metal component, plastic fixtures and circuit board group
The mode of conjunction.
However, existing assembled metal oscillator has the following disadvantages：
1st, the usage quantity of oscillator will be multiplied on following 4G/5G antenna for base station, add the overall weight of antenna.My god
Line is typically all arranged on outdoors building roof or the steel tower in suburb, if antenna overall weight increases, supports the brandreth of antenna
With suspended structure insufficient strength.The weather of blowing and raining is run into, antenna, which is easy for being scraped by high wind, falls down or support brandreth to bend
Deformation, can so have larger potential safety hazard, so communications carrier requires that antenna manufacturer mitigates the weight of antenna, equally
The problem of oscillator is also required to consider loss of weight.
2nd, current metal oscillator typically uses kirsite and aluminum alloy materials, and aluminium alloy density is in 2.78g/cm3, kirsite
Density in 6.75g/cm3, density is big, overall heavier.
3rd, the frequency band more and more higher that 4G/5G antenna for base station uses, high frequency oscillator is high to balun dimension precision requirement, die casting
With metal plate oscillator complex manufacturing technology, it is easy to cause deformation of products, dimensional accuracy is difficult to meet to require.
4th, because needing to be punched cast gate after pack alloy oscillator die cast, the process such as burr, polishing of polishing, then
Electroplated again, the complex manufacturing cost of technique is also higher.
5th, because being easily deformed after metal plate oscillator punch forming, it is necessary to be fixed using plastic card button, then with circuit board
Welded, one-piece parts quantity is more, and production and assembly process costs are higher.
In view of this, it is necessary to existing oscillator is improved, solved the above problems.
The content of the invention
The technical problem to be solved in the present invention is, there is provided one kind reduces antenna element quantity, reduces weight and improves knot
Integrated circuit antenna oscillator of structure dimensional stability and preparation method thereof.
The technical solution adopted for the present invention to solve the technical problems is：A kind of integrated circuit antenna oscillator is provided, including
Oscillator body on the panel first surface of panel, injection molding, it is arranged on the panel first surface and is isolated
The first circuit and second circuit, be arranged on the oscillator first body surface and the first current feed department being isolated and second feedback
Electric portion；
First current feed department includes symmetrically arranged two the first feed layers, and the both ends of first circuit connect respectively
Two first feed layers, turn on two first feed layers；
Second current feed department includes symmetrically arranged two the second feed layers, and the both ends of the second circuit connect respectively
Two second feed layers, turn on two second feed layers.
Preferably, the integrated circuit antenna oscillator also includes the first welded post being arranged on the panel second surface
With the second welded post；
First welded post is connected with first feed layer, one end connection first weldering of first circuit
Post is connect, the other end connects another first feed layer；
Second welded post is connected with second feed layer, one end connection second weldering of the second circuit
Post is connect, the other end connects another second feed layer.
Preferably, the first surface of the panel is provided with insertion to the first through hole and the second through hole of the second surface；
One end of first circuit extends to the second surface, connection first welding by the first through hole
Post；One end of the second circuit extends to the second surface by second through hole, connects second welded post.
Preferably, the oscillator body is in funnel-form, is uprightly connected on the panel first surface；The oscillator body
Inner peripheral surface form the first surface of the oscillator body, the outer surface of the oscillator body forms the second of the oscillator body
Surface；Two first feed layers are oppositely arranged on the inner peripheral surface of the oscillator body, two the second feed layer phases
Inner peripheral surface to being arranged on the oscillator body；
The other end of first circuit is extended on the outer surface of the oscillator body, is connected by the first via another
One first feed layer；
The other end of the second circuit is extended on the outer surface of the oscillator body, is connected by the second via another
One second feed layer.
Preferably, the second surface of the oscillator body is provided with metal level and four are distributed on the metal level
Separation trough；The metal level is divided into four metal level areas by the separation trough, is formed and is corresponded to two first feedbacks respectively
The first metal layer area of electric layer and the second metal layer area of corresponding two second feed layers；
The first metal layer area connects with corresponding first feed layer, the second metal layer area and corresponding institute
State the connection of the second feed layer.
Preferably, the oscillator second body surface where the first metal layer area is provided with the first guide hole, and described first leads
Hole penetrates to the oscillator first body surface, the first metal layer area and connects first feed by first guide hole
Layer；
Oscillator second body surface where the second metal layer area is provided with the second guide hole, second guide hole penetrate to
The oscillator first body surface, the second metal layer area connect second feed layer by second guide hole.
Preferably, first circuit insulate with the second circuit with the metal level.
Preferably, the oscillator body is integrally attached to the medium position of the panel first surface；First circuit
The oscillator body periphery is centered around with second circuit.
The present invention also provides a kind of preparation method of integrated circuit antenna oscillator, comprises the following steps：
S1, integrated injection molding form panel and the oscillator body being connected on the panel first surface；
S2, circuit pattern layer is set on the panel first surface, forms the first circuit and second circuit being isolated；
S3, the oscillator first body surface set feed patterned layer, form the first current feed department and second being isolated
Current feed department；
First current feed department includes symmetrically arranged two the first feed layers, and the both ends of first circuit connect respectively
Two first feed layers, turn on two first feed layers；
Second current feed department includes symmetrically arranged two the second feed layers, and the both ends of the second circuit connect respectively
Two second feed layers, turn on two second feed layers.
Preferably, step S2 comprises the following steps：
S2.1, the deposited nickel layer on the first surface of the panel；
S2.2, the laser carving line of demarcation on the nickel dam of the panel first surface, mark preinstalled circuit patterned layer region, and go
Except the nickel dam on line of demarcation；
S2.3, energization processing is carried out to preinstalled circuit patterned layer region；
S2.4, in preinstalled circuit patterned layer region plate layers of copper；
S2.5, the nickel dam for removing other regions outside preinstalled circuit patterned layer region on the panel first surface；
S2.6, tin layers are plated in the layers of copper in preinstalled circuit patterned layer region, so as to the nickel in preinstalled circuit patterned layer region
Layer, layers of copper and tin layers are sequentially overlapped to form circuit pattern layer；
Step S3 comprises the following steps：
S3.1, deposited nickel layer is distinguished on the first surface of the oscillator body；
S3.2, the laser carving line of demarcation on the nickel dam of the oscillator first body surface, default feed patterned layer region is marked,
And remove the nickel dam on line of demarcation；
S3.3, energization processing is carried out to default feed patterned layer region；
S3.4, in default feed patterned layer region plate layers of copper；
S3.5, remove the nickel dam that other regions outside feed patterned layer region are preset on the oscillator first body surface；
S3.6, tin layers are plated in the layers of copper in default feed patterned layer region, so as to the nickel in default feed patterned layer region
Layer, layers of copper and tin layers are sequentially overlapped to form feed patterned layer.
The integrated circuit antenna oscillator of the present invention, circuit and current feed department are integrated in the panel of integrated injection molding and shaken respectively
On sub- body, an overall structure is formed, compared to the package assembly of existing sheet metal component, plastic fixtures and circuit board, weight
It is few and reduce assembling procedure to measure small, number of parts, overall structure dimensional stability is more preferable, improves assembling and debugging production efficiency,
Reduce manufacturing process cost.
Brief description of the drawings
Below in conjunction with drawings and Examples, the invention will be further described, in accompanying drawing：
Fig. 1 is the dimensional structure diagram of the integrated circuit antenna oscillator of one embodiment of the invention；
Fig. 2 is the top view of integrated circuit antenna oscillator shown in Fig. 1；
Fig. 3 is the oppositely positioned structural representation of integrated circuit antenna oscillator shown in Fig. 1；
Fig. 4 is the side view of integrated circuit antenna oscillator shown in Fig. 3.
Embodiment
In order to which technical characteristic, purpose and the effect of the present invention is more clearly understood, now compares accompanying drawing and describe in detail
The embodiment of the present invention.
As shown in Figure 1, 2, the integrated circuit antenna oscillator of one embodiment of the invention, including panel 10, it is integrally attached to face
Oscillator body 20 on plate 10, the first circuit 30 on the faceplate 10 and second circuit 40 are set and are arranged on oscillator body
The first current feed department 50 and the second current feed department 60 on 20.
Wherein, panel 10 includes opposite first surface 11 and second surface 12, and oscillator body 20 is existed by injection molding
On the first surface 11 of panel 10.First circuit 30 and second circuit 40 are arranged on the first surface 11 of panel 10 and are isolated
(not connecting).Oscillator body 20 includes opposite first surface 21 and second surface 22, the first current feed department 50 and the second current feed department
60 are arranged on the first surface 21 of oscillator body 20 and are isolated.
First current feed department 50 includes symmetrically arranged two the first feed layers 51, and the both ends of the first circuit 30 connect two respectively
Individual first feed layer 51, turn on two the first feed layers 51.Second current feed department 60 includes symmetrically arranged two the second feed layers
61, the both ends of second circuit 40 connect two the second feed layers 61 respectively, turn on two the second feed layers 61.The He of first circuit 30
Second circuit 40 corresponds to positive pole respectively, negative polarity is set.
Specifically, panel 10 and oscillator body 20 are by thermostability engineering plastic integrated injection molding；Thermostability engineering plastic
Including poly- stupid thioether (PPS), PEI (PEI) and liquid crystal polymer (LCP) etc..
Panel 10 can be flat board, and oscillator body 20 can be in funnel-form, and face is uprightly connected to towards panel 10 with slot one end
On the first surface 11 of plate 10.The inner peripheral surface of oscillator body 20 forms the first surface 21 of the oscillator body 20, oscillator body 20
Outer surface form the second surface 22 of the oscillator body 20.Two the first feed layers 51 are oppositely arranged on oscillator body 20
Inner peripheral surface, be not directly connected conducting between the two.Two the second feed layers 61 are oppositely arranged on the interior weekly form of oscillator body 20
Face, be not directly connected conducting between the two.
In the present embodiment, as shown in figure 1, oscillator body 20 is integrally attached to the medium position of the first surface 11 of panel 10；
First circuit 30 and second circuit 40 are centered around the periphery of oscillator body 20.
First circuit 30 and second circuit 40, the first current feed department 50 and the second current feed department 60 are respectively by being arranged on panel 10
Formed with the metal level on oscillator body 20；Metal level may include nickel dam, layers of copper and the tin layers being sequentially stacked.To be shaken according to antenna
Sub- performance etc. needs, and the first circuit 30 and second circuit 40 can suitably increase its entire length more by bending to set respectively, and two
Person mutually avoids on first surface 11, avoids being in contact.
, can be by a circuit (the first circuit 30 or the second electricity when two circuits are intersecting on the first surface 11 of panel 10
Road 40) disconnected with the position of another circuit intersection, the both ends of gap extend to the second surface of panel 10 by through hole
12, connect connection in second surface 12.As shown in Figure 1,3, by taking the first circuit 30 as an example, its gap both ends is existed by through hole 31
Second panel 12 connects.
Further, as shown in figure 3, integrated circuit antenna oscillator also includes the be arranged on the second surface 12 of panel 10
One welded post 70 and the second welded post 80.
With reference to Fig. 1-3, the position of corresponding first feed layer 51 of the first welded post 70 is arranged on the second surface of panel 10
12, and conducting is connected with first feed layer 51, one end of the first circuit 30 connects the first welded post 70, and other end connection is another
First feed layer 51, so as to which two the first feed layers 51 are interconnected by the first welded post 70 and the first circuit 30.
Similarly, the position of corresponding second feed layer 61 of the second welded post 80 is arranged on the second surface 12 of panel 20,
And conducting is connected with second feed layer 61, one end of second circuit 40 connects the second welded post 80, other end connection another the
Two feed layers 61, so as to which two the second feed layers 61 are interconnected by the second welded post 80 and second circuit 40.
Alternatively, the first surface 11 of panel 10 is provided with insertion to the through hole of first through hole 13 and second of second surface 12
14.First through hole 13 is on the faceplate 10 close to the first welded post 70 and positioned at the side of the first welded post 70；Second through hole 14 exists
Close to the second welded post 80 and positioned at the side of the second welded post 80 on panel 10.
One end of first circuit 30 extends to second surface 12 by first through hole 13, connects the first welded post 70.Second
One end of circuit 40 extends to second surface 12 by the second through hole 14, connects the second welded post 80.
As shown in Fig. 1,2,4, the other end of the first circuit 30 may extend to the outer surface (second surface of oscillator body 20
22) on, another first feed layer 51 is connected by the first via 23.The other end of second circuit 40 extends to oscillator body 20
On outer surface (second surface 22), another second feed layer 62 is connected by the second via 24.
Further, as in Figure 2-4, in integrated circuit antenna oscillator of the invention, the second surface of oscillator body 20
22 are provided with metal level 25 and four separation troughs 26 being spaced apart on the metal layer.The setting of metal level 25 contributes to antenna to shake
Son produces resonance signal, and it can be with the shape simultaneously such as the first circuit 30, second circuit 40, the first current feed department 50 and the second current feed department 60
Into on oscillator body 20, material structure layer and the first circuit 30, second circuit 40, the first current feed department 50 and the second current feed department 60
Etc. identical.According to the generation type of metal level 25, the second surface 12 of panel 10 is also formed with metal level, and the metal level shakes with antenna
Metal level on son 20 is formed simultaneously, and material structure layer is identical.Metal level and the first circuit 30, second circuit on panel 10
40th, insulated between the first welded post 70 and the second welded post 80.
The circuit 30 of metal level 25 and first, second circuit 40 with insulation.First circuit 30 extends to oscillator body 20
It is spaced between the one end on two surfaces 22 and metal level 25, both are separated；Second circuit 40 extends to oscillator body 20
It is spaced between the one end on two surfaces 22 and metal level 25, both are separated.
Metal level 25 is divided into four metal level areas by four separation troughs 26, is formed and is corresponded to two the first feed layers 51 respectively
The first metal layer area 251 and corresponding two the second feed layers 61 second metal layer area 252.Separation trough 26 is located at metal level 25
On balun position, can be formed by laser laser carving technique, precision can be controlled in ± 0.1mm.
The first metal layer area 251 and second metal layer area 252 are arranged alternately.The first metal layer area 251 and corresponding first
Feed layer 51 connects, and second metal layer area 252 connects with corresponding second feed layer 61.
Wherein, the second surface 22 of oscillator body 20 where the first metal layer area 251 is provided with the first guide hole 261, and first leads
Hole 261, which is penetrated to the first surface 21 of oscillator body 20 and the first feed layer 51, the first metal layer area 251, passes through the first guide hole 261
Connect the first feed layer 51.The second surface 22 of oscillator body 20 where second metal layer area 252 is provided with the second guide hole 262, the
Two guide holes 262, which are penetrated to the first surface 21 of oscillator body 20 and the second feed layer 61, second metal layer area 252, passes through the second guide hole
262 the second feed layers 61 of connection.
In addition, in the integrated circuit antenna oscillator of the present invention, first through hole 13, the second through hole 14, the first guide hole 261, the
The openend periphery in the holes such as two guide holes 262, the first via 23, the second via 24 and through hole 31 is required to rounding angle, avoids
Electroplate metapore side and produce burr, have influence on electric property.
With reference to figure 1-4, the preparation method of integrated circuit antenna oscillator of the invention, it may include following steps：
S1, integrated injection molding form panel 10 and the oscillator body 20 being connected on the first surface 11 of panel 10.
Panel 10 and antenna oscillator 20 using thermostability engineering plastic as gather stupid thioether (PPS), PEI (PEI),
The injection moldings such as liquid crystal polymer (LCP), both form integrative-structure.Because the integrative-structure material is engineering plastics, density
Substantially 1.60g/cm3, much smaller than primary aluminum alloy, the antenna oscillator of sheet metal component, therefore weight can mitigate 50%, while also save
The process such as extrusion process deburring and assembling plastic fixtures.
The panel 10 and oscillator body 20 of injection molding also pass through mechanical coarsening processing, ensure subsequent plating layer adhesive force,
Be not in that coating such as comes off and bubbled at the situation during welding.
S2, circuit pattern layer is set on the first surface 11 of panel 10, forms the first circuit 30 and the second electricity being isolated
Road 40.
Step S2 may include following steps：
S2.1, the deposited nickel layer on the first surface 11 of panel 10.Nickel layer thickness is no more than 1 μm.
S2.2, the laser carving line of demarcation on the nickel dam of the first surface 11 of panel 10, mark preinstalled circuit patterned layer region, and go
Except the nickel dam on line of demarcation.
Line width of demarcating can be 0.5mm.The corresponding first required circuit 30 of distribution in preinstalled circuit patterned layer region and the
The distribution of two circuits 40 is set.
S2.3, energization processing is carried out to preinstalled circuit patterned layer region, make its positively charged or negative electricity.
S2.4, in preinstalled circuit patterned layer region plate layers of copper.Copper layer thickness is 10 μm.
S2.5, the nickel dam for removing other regions outside preinstalled circuit patterned layer region on the first surface 11 of panel 10.
S2.6, tin layers are plated in the layers of copper in preinstalled circuit patterned layer region, so as to the nickel in preinstalled circuit patterned layer region
Layer, layers of copper and tin layers are sequentially overlapped to form circuit pattern layer.
Tin thickness is more than 6 μm.The circuit pattern layer formed includes the first circuit 30 and second circuit 40.
S3, in the first surface 21 of oscillator body 20 feed patterned layer is set, forms the first current feed department 50 for being isolated and the
Two current feed departments 60.
First current feed department 50 includes symmetrically arranged two the first feed layers 51, and the both ends of the first circuit 30 connect two respectively
Individual first feed layer 51, turn on two the first feed layers 51；Second current feed department 60 includes symmetrically arranged two the second feed layers
61, the both ends of second circuit 40 connect two the second feed layers 61 respectively, turn on two the second feed layers 61.
Step S3 may include following steps：
S3.1, deposited nickel layer is distinguished on the first surface 21 of oscillator body 20.Nickel layer thickness is no more than 1 μm.
S3.2, the laser carving line of demarcation on the nickel dam of the first surface 21 of oscillator body 20, default feed patterned layer region is marked,
And remove the nickel dam on line of demarcation.
Line width of demarcating can be 0.5mm.The corresponding required He of the first current feed department 50 of distribution in default feed patterned layer region
The distribution of second current feed department 60 is set.
S3.3, energization processing is carried out to default feed patterned layer region, make its positively charged or negative electricity.
S3.4, in default feed patterned layer region plate layers of copper.Copper layer thickness is 10 μm.
S3.5, remove the nickel dam that other regions outside feed patterned layer region are preset on the first surface 21 of oscillator body 20.
S3.6, tin layers are plated in the layers of copper in default feed patterned layer region, so as to the nickel in default feed patterned layer region
Layer, layers of copper and tin layers are sequentially overlapped to form feed patterned layer.
Tin thickness is more than 6 μm.The feed patterned layer formed includes the first current feed department 50 and the second current feed department 60.
Specifically, the making of integrated circuit antenna oscillator of the present invention, in practical operation, counter plate 10 and oscillator body 20
Overall to carry out deposited nickel layer, nickel dam is as prime coat, all surface of cover plate 10 and oscillator body 20.Then laser is passed through
Laser carving technique about wide 0.5mm line of demarcation of laser carving between plating and electroless coating region, by laser by the nickel on line of demarcation
Layer is cleaned out；Plating area includes above-mentioned preinstalled circuit patterned layer region and default feed patterned layer region.Be powered conducting
Plating area, and it is more than 10 μm of layers of copper in electroplating surface thickness.The nickel dam on electroless coating region is returned, electroless coating region includes
Feed is preset on position, the first surface 21 of oscillator body 20 on the first surface 11 of panel 10 beyond preinstalled circuit patterned layer region
Position beyond patterned layer region.Wherein, carried out because the operation counter plate 10 and oscillator body 20 of returning nickel dam are overall, therefore
Also the layers of copper on other regions such as plating area can be decorporated 1 μm or so, does not influence layers of copper structure sheaf.Finally electroplated in layers of copper
Thickness is more than 6 μm of tin layers.
In manufacturing process, the second surface 12 of panel 10 and the second surface 22 of oscillator body 20 are also respectively formed with nickel simultaneously
Layer, layers of copper and tin layers, form metal level.
Embodiments of the invention are the foregoing is only, are not intended to limit the scope of the invention, it is every to utilize this hair
The equivalent structure or equivalent flow conversion that bright specification and accompanying drawing content are made, or directly or indirectly it is used in other related skills
Art field, is included within the scope of the present invention.
Claims (10)
1. a kind of integrated circuit antenna oscillator, it is characterised in that including panel（10）, injection molding is in the panel（10）First
Surface（11）On oscillator body（20）, be arranged on the panel（10）First surface（11）The first circuit gone up and be isolated
（30）And second circuit（40）, be arranged on the oscillator body（20）First surface（21）The first current feed department gone up and be isolated
（50）With the second current feed department（60）；
First current feed department（50）Including symmetrically arranged two the first feed layers（51）, first circuit（30）Both ends
Two first feed layers are connected respectively（51）, turn on two first feed layers（51）；
Second current feed department（60）Including symmetrically arranged two the second feed layers（61）, the second circuit（40）Both ends
Two second feed layers are connected respectively（61）, turn on two second feed layers（61）.
2. integrated circuit antenna oscillator according to claim 1, it is characterised in that the integrated circuit antenna oscillator also wraps
Include and be arranged on the panel（10）Second surface（12）On the first welded post（70）With the second welded post（80）；
First welded post（70）With first feed layer（51）Connection, first circuit（30）One end connection institute
State the first welded post（70）, another first feed layer of other end connection（51）；
Second welded post（80）With second feed layer（61）Connection, the second circuit（40）One end connection institute
State the second welded post（80）, another second feed layer of other end connection（61）.
3. integrated circuit antenna oscillator according to claim 2, it is characterised in that the panel（10）First surface
（11）Provided with insertion to the second surface（12）First through hole（13）With the second through hole（14）；
First circuit（30）One end pass through the first through hole（13）Extend to the second surface, connection described first
Welded post（70）；The second circuit（40）One end pass through second through hole（14）The second surface is extended to, is connected
Second welded post（80）.
4. integrated circuit antenna oscillator according to claim 2, it is characterised in that the oscillator body（20）In funnel
Shape, uprightly it is connected to the panel（10）On first surface；The oscillator body（20）Inner peripheral surface form the oscillator body
（20）First surface（21）, the oscillator body（20）Outer surface form the oscillator body（20）Second surface
（22）；Two first feed layers（51）It is oppositely arranged on the oscillator body（20）Inner peripheral surface, two described second
Feed layer（61）It is oppositely arranged on the oscillator body（20）Inner peripheral surface；
First circuit（30）The other end extend to the oscillator body（20）Outer surface on, pass through the first via
（23）Connect another first feed layer（51）；
The second circuit（40）The other end extend to the oscillator body（20）Outer surface on, pass through the second via
（24）Connect another second feed layer（61）.
5. integrated circuit antenna oscillator according to claim 4, it is characterised in that the oscillator body（20）The second table
Face（22）Provided with metal level（25）And four be distributed in the metal level（25）On separation trough（26）；The separation trough
（26）By the metal level（25）It is divided into four metal level areas, is formed and correspond to two first feed layers respectively（51）
One metal level area（251）With corresponding two second feed layers（61）Second metal layer area（252）；
The first metal layer area（251）With corresponding first feed layer（51）Connection, the second metal layer area（252）
With corresponding second feed layer（61）Connection.
6. integrated circuit antenna oscillator according to claim 5, it is characterised in that the first metal layer area（251）Institute
Oscillator body（20）Second surface（22）Provided with the first guide hole（261）, first guide hole（261）Penetrate to the oscillator
Body（20）First surface（21）, the first metal layer area（251）Pass through first guide hole（261）Connect first feedback
Electric layer（51）；
The second metal layer area（252）The oscillator body at place（20）Second surface（22）Provided with the second guide hole（262）, it is described
Second guide hole（262）Penetrate to the oscillator body（20）First surface（21）, the second metal layer area（252）By described
Second guide hole（262）Connect second feed layer（61）.
7. integrated circuit antenna oscillator according to claim 6, it is characterised in that first circuit（30）With described
Two circuits（40）With the metal level（25）Insulation.
8. according to the integrated circuit antenna oscillator described in claim any one of 1-7, it is characterised in that the oscillator body（20）
It is integrally attached to the panel（10）First surface（11）Medium position；First circuit（30）And second circuit（40）Enclose
It is wound on the oscillator body（20）Periphery.
9. a kind of preparation method of integrated circuit antenna oscillator, it is characterised in that comprise the following steps：
S1, integrated injection molding form panel（10）And it is connected to the panel（10）First surface（11）On oscillator body
（20）；
S2, in the panel（10）First surface（11）Upper setting circuit pattern layer, form the first circuit being isolated（30）With
Second circuit（40）；
S3, in the oscillator body（20）First surface（21）Feed patterned layer is set, forms the first current feed department being isolated
（50）With the second current feed department（60）；
First current feed department（50）Including symmetrically arranged two the first feed layers（51）, first circuit（30）Both ends
Two first feed layers are connected respectively（51）, turn on two first feed layers（51）；
Second current feed department（60）Including symmetrically arranged two the second feed layers（61）, the second circuit（40）Both ends
Two second feed layers are connected respectively（61）, turn on two second feed layers（61）.
10. the preparation method of integrated circuit antenna oscillator according to claim 9, it is characterised in that step S2 include with
Lower step：
S2.1, in the panel（10）First surface（11）Upper deposited nickel layer；
S2.2, in the panel（10）First surface（11）Nickel dam on laser carving line of demarcation, mark preinstalled circuit patterned layer region,
And remove the nickel dam on line of demarcation；
S2.3, energization processing is carried out to preinstalled circuit patterned layer region；
S2.4, in preinstalled circuit patterned layer region plate layers of copper；
S2.5, remove the panel（10）First surface（11）The nickel dam in other regions outside upper preinstalled circuit patterned layer region；
S2.6, tin layers are plated in the layers of copper in preinstalled circuit patterned layer region, so as to nickel dam, the copper in preinstalled circuit patterned layer region
Layer and tin layers are sequentially overlapped to form circuit pattern layer；
Step S3 comprises the following steps：
S3.1, in the oscillator body（20）First surface（21）Upper deposited nickel layer respectively；
S3.2, in the oscillator body（20）First surface（21）Nickel dam on laser carving line of demarcation, mark default feed patterned layer
Region, and remove the nickel dam on line of demarcation；
S3.3, energization processing is carried out to default feed patterned layer region；
S3.4, in default feed patterned layer region plate layers of copper；
S3.5, remove the oscillator body（20）First surface（21）The nickel in other regions outside upper default feed patterned layer region
Layer；
S3.6, tin layers are plated in the layers of copper in default feed patterned layer region, so as to nickel dam, the copper in default feed patterned layer region
Layer and tin layers are sequentially overlapped to form feed patterned layer.
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| CN108417998A (en) * | 2018-05-11 | 2018-08-17 | 京信通信***（中国）有限公司 | Antenna and its radiating element |
| CN108417998B (en) * | 2018-05-11 | 2024-01-30 | 京信通信技术(广州)有限公司 | Antenna and radiating element thereof |
| CN112582786A (en) * | 2019-09-30 | 2021-03-30 | 深圳科创新源新材料股份有限公司 | Manufacturing method of antenna oscillator module, antenna oscillator module and base station antenna |
| CN112582786B (en) * | 2019-09-30 | 2023-08-25 | 深圳科创新源新材料股份有限公司 | Manufacturing method of antenna oscillator module, antenna oscillator module and base station antenna |
| CN111355022A (en) * | 2020-02-28 | 2020-06-30 | 深圳市聚慧达科技有限公司 | Antenna oscillator and manufacturing method thereof |
| CN111355022B (en) * | 2020-02-28 | 2023-03-10 | 深圳慧联达科技有限公司 | Antenna oscillator and manufacturing method thereof |
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