CN201226636Y - Liquid cooling radiating device with evaporation cavity - Google Patents
Liquid cooling radiating device with evaporation cavity Download PDFInfo
- Publication number
- CN201226636Y CN201226636Y CNU2008201090471U CN200820109047U CN201226636Y CN 201226636 Y CN201226636 Y CN 201226636Y CN U2008201090471 U CNU2008201090471 U CN U2008201090471U CN 200820109047 U CN200820109047 U CN 200820109047U CN 201226636 Y CN201226636 Y CN 201226636Y
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- cavity
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- cooling heat
- heat radiator
- evaporates
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Abstract
The utility model relates to a liquid cooling radiating device with an evaporating cavity, which comprises a fin radiator, a pump, a cold plate, a hose and the evaporating cavity; the evaporating cavity is fixed on one side of the cold plate which is close to a heat source. The utility model relates to a liquid cooling radiating device with the evaporating cavity which improves the radiating capability of the cold plate and reduces thermal resistance.
Description
Technical field
The utility model relates to a kind of heat abstractor, particularly a kind of liquid-cooling heat radiator that evaporates cavity that has.
Background technology
One of the founder of Intel height is stepped on mole and is proposed prophesy in nineteen sixty-five: the transistorized quantity on the semiconductor chip approximately every 18 months will be double, Moore's Law that Here it is.The nearly 40 years development course of Intel has been verified the prophesy of mole, and by 2010, transistorized quantity will reach 1,000,000,000, and along with the maturation of 32 nanometer technologies, microprocessor of future generation is with integrated 2,000,000,000 transistors.Increase along with the computer chip number of transistors, circuit on the unit are is more and more closeer, the heat that is produced also will be more than 10 times of present chip, its caloric value can reach every square centimeter more than 1000 watts, especially the high power components and parts of chip internal, its core temperature can be near 6000 ℃, and this high temperature dot is called hot spot, if there is not suitable radiating mode, the performance and the life-span of chip will be had a strong impact on.
The main radiating mode of present high-end electronic product is the liquid cooling heat radiation, sees also shown in Fig. 1,2,3,4, and existing liquid cooling product commonly used mainly comprises fin slices radiator 1, pump 2, cold drawing 3 and the flexible pipe 4 that is connected said modules.It (is electronic chip that cold drawing 3 is close to thermal source, CPU for example), flow of liquid under pump 2 drives is after cold drawing 3 absorbs heat, at fin slices radiator 1 place to the external environment condition release heat, the liquid that the is cooled cold drawing 3 of flowing through once more, moving in circles continuously is delivered to heat the environment from euthermic chip.Fin slices radiator can adopt natural wind or fan to force cooling.Cooling liquid can be pure water or other liquid and the mixture that deionized pure water, admixture have anti-icing fluid, and its type of flow in cold drawing can be way flow or impingement flow etc.As shown in Figure 2, cold drawing 3 by have the lid 31 of importing and exporting runner and cold base plate 32 by be spirally connected, one-body molded or microelectromechanical systems processing method is in conjunction with forming, cold base plate 32 generally is processed into by metal or monocrystalline silicon, to guarantee that material has higher conductive coefficient, its structure can also be designed to micro-channel structure shown in Fig. 3 a or the pin rib structure shown in Fig. 3 b, with the heat conductivility of further raising cold drawing 3.
Though above-mentioned liquid cooling mode has the advantage that thermal resistance is low, transmission thermal capacity is big, transmission range is far away, but, because the limitation of cold drawing material, and the requirement of machining accuracy and intensity, make that the thermal resistance of cold drawing can not further be reduced, there is the limit in the liquid cooling effect.For example, copper has higher conductive coefficient, and the copper cooled plate is to think that at present performance is best, and still, all there is a preferable size range in the cold drawing especially thickness of its substrate and size etc., should not be too big or too little.Therefore, under certain liquid driven power, its thermal resistance value is certain, and this thermal resistance value is difficult to satisfy the radiating requirements of following electronic chip, especially be difficult to hot spot is effectively cooled off, and the high heat flux condition also makes the life-span of fan noise and liquor pump face huge challenge.
This shows that above-mentioned existing liquid-cooling heat radiator obviously still has inconvenience and defective, and demands urgently further being improved in structure and use.In order to solve the problem that liquid-cooling heat radiator exists, relevant manufacturer there's no one who doesn't or isn't seeks solution painstakingly, but do not see always that for a long time suitable design finished by development, and common product does not have appropriate structure to address the above problem, and this obviously is the problem that the anxious desire of relevant dealer solves.Therefore how to found the new structure liquid-cooling heat radiator of a kind of low thermal resistance, high heat dispersion, real one of the current important research and development problem that belongs to, also becoming the current industry utmost point needs improved target.
Because the defective that above-mentioned existing liquid-cooling heat radiator exists, the design people is based on being engaged in this type of product design manufacturing abundant for many years practical experience and professional knowledge, and the utilization of cooperation scientific principle, actively studied innovation, in the hope of founding a kind of a kind of liquid-cooling heat radiator that evaporates cavity that has of new structure, can improve general existing liquid-cooling heat radiator, make it have more practicality.Through constantly research, design, and after studying sample and improvement repeatedly, create the utility model that has practical value finally.
The utility model content
The purpose of this utility model is, overcome the defective that existing liquid-cooling heat radiator exists, and a kind of liquid-cooling heat radiator that evaporates cavity that has of new structure, technical problem to be solved are provided is to make it have lower thermal resistance and better heat dispersion, thereby is suitable for practicality more.
The purpose of this utility model and to solve its technical problem be to adopt following technical scheme to realize.According to a kind of liquid-cooling heat radiator that evaporates cavity that has that the utility model proposes, comprise fin slices radiator, pump, cold drawing and be connected the flexible pipe of said modules, wherein cold drawing is made up of lid and cold base plate, also comprises an evaporation cavity, and this evaporation cavity is fixed in cold plate outer side.
The purpose of this utility model and solve its technical problem and can also be further achieved by the following technical measures.
Aforesaid a kind of liquid-cooling heat radiator that evaporates cavity that has, described evaporation cavity has capillary structure and cavity wall, and its inside is full of working medium.
Aforesaid a kind of liquid-cooling heat radiator that evaporates cavity that has, described working medium is water, propyl alcohol, methyl alcohol, ammoniacal liquor or freon.
Aforesaid a kind of liquid-cooling heat radiator that evaporates cavity that has, the material of described cavity wall is copper, aluminium or silicon.
Aforesaid a kind of liquid-cooling heat radiator that evaporates cavity that has, described evaporation cavity and cold base plate are fixed with welding, bonding or bonding (Bonding) mode.
Aforesaid a kind of liquid-cooling heat radiator that evaporates cavity that has, described cold base plate be as the one side of evaporation cavity, and contact-making surface is fixed with welding, bonding or bonding (Bonding) mode mode around it.
Aforesaid a kind of liquid-cooling heat radiator that evaporates cavity that has, described cold base plate is the micro-channel structure.
Aforesaid a kind of liquid-cooling heat radiator that evaporates cavity that has, described cold base plate is the pin rib structure.
The utility model compared with prior art has tangible advantage and beneficial effect, and has an extensive value on the industry, it has following advantage at least: it is the high thermal conduction characteristic that utilizes evaporation cavity (vapor chamber) that the utility model has the liquid-cooling heat radiator that evaporates cavity, the thermal resistance of whole cold drawing is obviously descended, local high heat flux thermal source effectively extend (spreading), make local high hot-fluid through behind this evaporation cavity, density of heat flow rate obviously descends, and the electronic chip temperature is more even.
In sum, a kind of liquid-cooling heat radiator that evaporates cavity that has of the utility model novelty has improved the heat-sinking capability of cold drawing, has reduced thermal resistance.The utlity model has above-mentioned advantage and practical value, no matter it all has bigger improvement on product structure or performance, obvious improvement is arranged technically, and produced handy and practical effect, and more existing liquid-cooling heat radiator has the outstanding effect of enhancement, thereby be suitable for practicality more, and have the extensive value of industry.
Above-mentioned explanation only is the general introduction of technical solutions of the utility model, for can clearer understanding technological means of the present utility model, and can be implemented according to the content of specification, and for above-mentioned and other purposes, feature and advantage of the present utility model can be become apparent, below especially exemplified by preferred embodiment, and conjunction with figs., be described in detail as follows.
Description of drawings
Fig. 1 is the structural representation of prior art liquid-cooling heat radiator.
Fig. 2 is the cold drawing structural representation of prior art liquid-cooling heat radiator.
Fig. 3 a is the cold base plate schematic diagram of the micro-channel structure of prior art liquid-cooling heat radiator.
Fig. 3 b is the cold base plate schematic diagram of the pin rib structure of prior art liquid-cooling heat radiator.
Fig. 4 is a kind of evaporation cavity generalized section that has the liquid-cooling heat radiator that evaporates cavity of the utility model.
Fig. 5 is the schematic diagram that a kind of cold drawing that has the liquid-cooling heat radiator that evaporates cavity of the utility model combines with the evaporation cavity.
Fig. 6 is a kind of cold drawing of the liquid-cooling heat radiator that evaporates cavity and schematic diagram of another combination of evaporation cavity of having of the utility model.
Fig. 7 is a kind of application example schematic diagram that has the liquid-cooling heat radiator that evaporates cavity of the utility model.
Fig. 8 is a kind of Another Application example schematic that has the liquid-cooling heat radiator that evaporates cavity of the utility model.
Embodiment
For further setting forth the utility model is to reach technological means and the effect that predetermined utility model purpose is taked, below in conjunction with accompanying drawing and preferred embodiment, to according to a kind of its embodiment of liquid-cooling heat radiator, structure, feature and the effect thereof of evaporate cavity that have that the utility model proposes, describe in detail as after.
See also shown in Figure 4ly, a kind of cold drawing 3 that has the liquid-cooling heat radiator that evaporates cavity of the utility model has an evaporation cavity 5 and is fixed in cold drawing near thermal source one side, and evaporation cavity 5 has capillary structure 51 and cavity wall 52, and its inside is full of working medium.
The material of cavity wall 52 can be metals such as copper or aluminium, also can be that silicon etc. is nonmetal.Capillary structure 51 can be a groove shape, by directly cutting obtains to the cavity inner wall flooring, also can be that dusty material obtains at cavity inner wall face sintering.When cavity wall 52 when being siliceous, can be by chemical etching, vapor deposition or nanotube growth technology obtain capillary structure 51.The working medium of evaporation cavity 5 inside can be water, can be other working medium such as acetone, methyl alcohol, ammoniacal liquor or freon class also, selects according to the condition of material compatibility and use.
As everyone knows, the temperature difference that heat pipe can transmit bigger heat and cold and hot end is very little, and the evaporation cavity is a kind of flat-plate heat pipe of special shape, is used as the substrate of liquid cooling heat radiator cold drawing in the utility model.As shown in Figure 4, in the evaporation cavity, liquid undergoes phase transition in the place near thermal source and is converted to steam, and steam flows in cavity naturally, changes liquid into after the cryosurface release heat.Be subjected to gravity and capillary force swabbing action, liquid turns back to evaporating surface again---promptly near the place of thermal source, and the circulation of finishing the work.
The effective thermal conductivity (effective thermalconductivity) of the evaporation cavity of measuring according to Fourier's law is greatly between 5000-20000W/mK.And the conductive coefficient of fine copper is 380W/mK, and aluminium is 270W/mK, and silicon is 140W/mK.As seen, utilize the latent heat of phase change of liquid, the evaporation cavity has very high heat-transfer capability and equivalent heat conductivity, can effectively reduce the thermal resistance of cold drawing substrate, for electronic chip provides reliable cooling.In addition, evaporation cavity 5 is as a kind of special flat-plate heat pipe, can be on the cryosurface of any many times of thermal source area to area the thermal source spread heat on the small size, fully play the effect of thermal diffusion, thereby improve the heat diffusion capabilities at the utility model cold drawing substrate place, realize the purpose of high heat flux heat radiation.
See also shown in Figure 5, the utility model has the liquid-cooling heat radiator that evaporates cavity, and its cold base plate 32 and evaporation cavity 5 are with soldered (sintering), high-temperature soldering (brazing) or microelectromechanical systems processing method---and bonding (Bonding) is combined as a whole.Also can be as shown in Figure 6, directly, will evaporate cavity 5 and directly be made on the cold base plate 32 lower surface of cold base plate 32 cryosurface as evaporation cavity 5, again with its all around the mode of contact-making surface soldered, high-temperature soldering or bonding become as a whole.Scheme shown in Figure 6 can reduce the overall thermal resistance and the height of cold drawing 3 most possibly.
Fig. 7 is a kind of application example schematic diagram that the utility model proposed, cold drawing 3 links to each other with electronic chip 7 by a bed boundary Heat Conduction Material 6, the heat that electronic chip 7 is produced is delivered to the lower surface of evaporation cavity 5 cavity walls 52 by interface Heat Conduction Material 6, this heat is delivered to capillary structure 51 by heat conduction, become steam after the working medium heat absorption in the capillary structure, steam flows in evaporation cavity 5 naturally, then under the close cold drawing 3 side condensations in the top of the capillary structure 51 that evaporates cavity 5, the cold base plate 32 of heat transferred cold drawing 3, the chilled liquid temperature of cold drawing inside raises, flow in direction shown in the arrow of the driving lower edge of pump 2, cold base plate 32 is transmitted the heat that comes up to be taken away, the heat transferred natural environment, fluid temperature reduces, and comes back in the cold drawing 3 again during through air-cooled fin slices radiator 1.In this application example, evaporation cavity 5 and cold base plate 32 are processed by metal, are welded as a whole at its faying face place.
Fig. 8 is another application example schematic diagram that the utility model proposed.Cold drawing 3 directly links to each other with electronic chip 7 by the microelectromechanical systems processing method, the heat that electronic chip 7 is produced is directly delivered to cavity wall 52 lower surfaces of evaporation cavity 5, this heat is delivered to capillary structure 51 by heat conduction, working medium heat absorption back in the capillary structure becomes steam by liquid, steam flows in evaporation cavity 5 naturally, then at the upper surface that evaporates cavity 5, the lower surface condensation that is to say cold base plate 32 is got off, the cold base plate 32 of heat transferred cold drawing 3, the chilled liquid temperature of cold drawing inside raises, flow in direction shown in the arrow of the driving lower edge of pump 2, take away transmitting the heat that comes up from cold base plate 32, the heat transferred natural environment, fluid temperature reduces and comes back in the cold drawing 3 again cooling liquid during through air-cooled fin slices radiator 1.In this application example, evaporation cavity 5 and cold base plate 32 are formed by nonmetal semiconductor grade silicon materials processing.By the microelectron-mechanical processing technology, faying face place at electronic chip 7, evaporation cavity 5 and cold base plate 32, directly employing electronic chip packaging technology---bonding becomes one it, owing to avoided the appearance of using and evaporating wall layers such as weld layer between cavity 5 and the cold base plate 32 of heat-conducting interface material 6, can at utmost reduce thermal resistance.
The utility model will have the flat-plate heat pipe of high effective thermal conductivity---evaporation cavity (vaporchamber) is applied to the high-end technology of electronic chip heat radiation---in the liquid cooling heat dissipation technology, make full use of its excellent thermal diffusion performance simultaneously, can realize the purpose of high density of heat flow rate heat radiation, reduction cold drawing thermal resistance, the heat-sinking capability of liquid cooling heat dissipation technology is further improved.Can be as required and the heat radiation potentiality that strengthen in conjunction with the liquid cooling mode, the utility model can effectively cool off the hot spot of electronic chip, simultaneously can guarantee that electronic chip is no more than its safe operation temperature, for following high power electronic chip provides a kind of cooling technology that dispels the heat efficiently, reliably.
The above, it only is preferred embodiment of the present utility model, be not that the utility model is done any pro forma restriction, though the utility model discloses as above with preferred embodiment, yet be not in order to limit the utility model, any those skilled in the art, in not breaking away from the technical solutions of the utility model scope, when the technology contents that can utilize above-mentioned announcement is made a little change or is modified to the equivalent embodiment of equivalent variations, in every case be the content that does not break away from technical solutions of the utility model, according to technical spirit of the present utility model to any simple modification that above embodiment did, equivalent variations and modification all still belong in the scope of technical solutions of the utility model.
Claims (10)
1, a kind of liquid-cooling heat radiator that evaporates cavity that has, comprise fin slices radiator, pump, cold drawing and be connected the flexible pipe of said modules, wherein cold drawing is made up of lid and cold base plate, it is characterized in that also comprising an evaporation cavity, and this evaporation cavity is fixed in cold plate outer side.
2, a kind of liquid-cooling heat radiator that evaporates cavity that has according to claim 1 it is characterized in that described evaporation cavity has capillary structure and cavity wall, and its inside is full of working medium.
3, a kind of liquid-cooling heat radiator that evaporates cavity that has according to claim 2 is characterized in that described working medium is water, propyl alcohol, methyl alcohol, ammoniacal liquor or freon.
4, a kind of liquid-cooling heat radiator that evaporates cavity that has according to claim 2, the material that it is characterized in that described cavity wall is copper, aluminium or silicon.
5,, it is characterized in that described evaporation cavity and cold base plate fix with welding, bonding or bonding mode according to the described a kind of liquid-cooling heat radiator that evaporates cavity that has of arbitrary claim in the claim 1 to 4.
6, according to the described a kind of liquid-cooling heat radiator that evaporates cavity that has of arbitrary claim in the claim 1 to 4, it is characterized in that the one side of described cold base plate as the evaporation cavity, contact-making surface is fixed with welding, bonding or bonding mode around it.
7, a kind of liquid-cooling heat radiator that evaporates cavity that has according to claim 5 is characterized in that described cold base plate is the micro-channel structure.
8, a kind of liquid-cooling heat radiator that evaporates cavity that has according to claim 5 is characterized in that described cold base plate is the pin rib structure.
9, a kind of liquid-cooling heat radiator that evaporates cavity that has according to claim 6 is characterized in that described cold base plate is the micro-channel structure.
10, a kind of liquid-cooling heat radiator that evaporates cavity that has according to claim 6 is characterized in that described cold base plate is the pin rib structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CNU2008201090471U CN201226636Y (en) | 2008-07-04 | 2008-07-04 | Liquid cooling radiating device with evaporation cavity |
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| Application Number | Priority Date | Filing Date | Title |
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| CNU2008201090471U CN201226636Y (en) | 2008-07-04 | 2008-07-04 | Liquid cooling radiating device with evaporation cavity |
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| CN201226636Y true CN201226636Y (en) | 2009-04-22 |
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Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101989585A (en) * | 2009-07-30 | 2011-03-23 | 台湾积体电路制造股份有限公司 | Microelectronic package |
| CN104317374A (en) * | 2014-10-28 | 2015-01-28 | 曙光信息产业(北京)有限公司 | Radiating device and method |
| CN104729338A (en) * | 2015-03-16 | 2015-06-24 | 上海交通大学 | Gradient metal foam heat dissipation device |
| CN105188324A (en) * | 2015-11-04 | 2015-12-23 | 天津商业大学 | Liquid cooling heat radiator |
| CN105374767A (en) * | 2015-09-24 | 2016-03-02 | 无锡佰利兄弟能源科技有限公司 | A high performance micro-channel heat dissipation structure |
| CN105431005A (en) * | 2015-11-19 | 2016-03-23 | 南车株洲电力机车研究所有限公司 | Heat exchange apparatus |
| CN106197108A (en) * | 2016-07-29 | 2016-12-07 | 广州华钻电子科技有限公司 | A kind of board-like liquid cold temperature-uniforming plate composite heating radiator |
| CN108521745A (en) * | 2018-03-12 | 2018-09-11 | 上海卫星工程研究所 | The efficient phase-change energy storage for adapting to the big heat spreader of pulsed is heat sink |
| CN108601288A (en) * | 2018-03-12 | 2018-09-28 | 上海卫星工程研究所 | A kind of high-power matrix fin enhanced heat exchange phase transition heat sink |
| WO2018210067A1 (en) * | 2017-05-17 | 2018-11-22 | 华为技术有限公司 | Radiator and communication device |
| CN109163591A (en) * | 2018-06-25 | 2019-01-08 | 上海卫星工程研究所 | A kind of high-power Latent Heat Storage Exchanger |
| CN110351993A (en) * | 2019-07-25 | 2019-10-18 | 何昊 | A kind of liquid cooling plate based on phase transformation liquid cooling and the phase transformation liquid cooling heat radiation system using it |
| CN110793368A (en) * | 2019-11-14 | 2020-02-14 | 刘溯晓 | Flexible heat conduction module |
| WO2023070341A1 (en) * | 2021-10-27 | 2023-05-04 | 华为技术有限公司 | Heat dissipation device and manufacturing method therefor, semiconductor apparatus, and electronic device |
| WO2023134141A1 (en) * | 2022-01-17 | 2023-07-20 | 华为云计算技术有限公司 | Computing device and cold plate thereof |
| EP4072254A4 (en) * | 2019-12-03 | 2023-12-27 | ZTE Corporation | Liquid-cooled plate and heat dissipation device |
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2008
- 2008-07-04 CN CNU2008201090471U patent/CN201226636Y/en not_active Expired - Fee Related
Cited By (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101989585A (en) * | 2009-07-30 | 2011-03-23 | 台湾积体电路制造股份有限公司 | Microelectronic package |
| CN104317374A (en) * | 2014-10-28 | 2015-01-28 | 曙光信息产业(北京)有限公司 | Radiating device and method |
| CN104729338A (en) * | 2015-03-16 | 2015-06-24 | 上海交通大学 | Gradient metal foam heat dissipation device |
| CN105374767A (en) * | 2015-09-24 | 2016-03-02 | 无锡佰利兄弟能源科技有限公司 | A high performance micro-channel heat dissipation structure |
| CN105374767B (en) * | 2015-09-24 | 2019-05-17 | 无锡佰利兄弟能源科技有限公司 | A kind of high-performance micro-channel radiator structure |
| CN105188324A (en) * | 2015-11-04 | 2015-12-23 | 天津商业大学 | Liquid cooling heat radiator |
| CN105188324B (en) * | 2015-11-04 | 2017-08-04 | 天津商业大学 | A kind of liquid cooling heat radiator |
| CN105431005A (en) * | 2015-11-19 | 2016-03-23 | 南车株洲电力机车研究所有限公司 | Heat exchange apparatus |
| CN106197108A (en) * | 2016-07-29 | 2016-12-07 | 广州华钻电子科技有限公司 | A kind of board-like liquid cold temperature-uniforming plate composite heating radiator |
| WO2018210067A1 (en) * | 2017-05-17 | 2018-11-22 | 华为技术有限公司 | Radiator and communication device |
| US11310935B2 (en) | 2017-05-17 | 2022-04-19 | Huawei Technologies Co., Ltd. | Heat dissipator and communications device |
| US11641725B2 (en) | 2017-05-17 | 2023-05-02 | Huawei Technologies Co., Ltd. | Heat dissipator and communications device |
| CN108601288A (en) * | 2018-03-12 | 2018-09-28 | 上海卫星工程研究所 | A kind of high-power matrix fin enhanced heat exchange phase transition heat sink |
| CN108521745A (en) * | 2018-03-12 | 2018-09-11 | 上海卫星工程研究所 | The efficient phase-change energy storage for adapting to the big heat spreader of pulsed is heat sink |
| CN108601288B (en) * | 2018-03-12 | 2020-10-09 | 上海卫星工程研究所 | High-power matrix fin enhanced heat exchange phase change heat sink |
| CN109163591A (en) * | 2018-06-25 | 2019-01-08 | 上海卫星工程研究所 | A kind of high-power Latent Heat Storage Exchanger |
| CN110351993A (en) * | 2019-07-25 | 2019-10-18 | 何昊 | A kind of liquid cooling plate based on phase transformation liquid cooling and the phase transformation liquid cooling heat radiation system using it |
| CN110793368A (en) * | 2019-11-14 | 2020-02-14 | 刘溯晓 | Flexible heat conduction module |
| EP4072254A4 (en) * | 2019-12-03 | 2023-12-27 | ZTE Corporation | Liquid-cooled plate and heat dissipation device |
| WO2023070341A1 (en) * | 2021-10-27 | 2023-05-04 | 华为技术有限公司 | Heat dissipation device and manufacturing method therefor, semiconductor apparatus, and electronic device |
| WO2023134141A1 (en) * | 2022-01-17 | 2023-07-20 | 华为云计算技术有限公司 | Computing device and cold plate thereof |
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Legal Events
| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090422 Termination date: 20170704 |