CN107887293A - 一种批处理键合装置及键合方法 - Google Patents

一种批处理键合装置及键合方法 Download PDF

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CN107887293A
CN107887293A CN201610876747.2A CN201610876747A CN107887293A CN 107887293 A CN107887293 A CN 107887293A CN 201610876747 A CN201610876747 A CN 201610876747A CN 107887293 A CN107887293 A CN 107887293A
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chip
unit
pick
batch processing
pickup
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CN107887293B (zh
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姜晓玉
夏海
陈飞彪
郭耸
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Shanghai Micro Electronics Equipment Co Ltd
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Shanghai Micro Electronics Equipment Co Ltd
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Priority to US16/338,551 priority patent/US10763235B2/en
Priority to SG11201902878VA priority patent/SG11201902878VA/en
Priority to JP2019517337A priority patent/JP2019532511A/ja
Priority to KR1020197011731A priority patent/KR20190052126A/ko
Priority to PCT/CN2017/103330 priority patent/WO2018059373A1/zh
Priority to TW106133485A priority patent/TWI635557B/zh
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Abstract

本发明涉及一种批处理键合装置及键合方法，该装置包括芯片供应单元，用于提供待键合的芯片；基底供应单元，用于提供基底；传送单元，用于在所述芯片供应单元以及所述基底供应单元之间移送所述芯片；拾取单元，设置于所述芯片供应单元上方，用于从所述芯片供应单元拾取芯片，并将所述芯片的标记面翻转至所需方向后上载至所述传送单元。本发明中，单独完成每个芯片的拾取，但传送过程和键合过程中，多个芯片可同时完成，大大增加了产率；本发明根据键合时对芯片上标记面方向的要求，选择性采取翻转机构及翻转步骤，使该装置能够兼容芯片上的标记面朝上和朝下两种键合方式。

Description

一种批处理键合装置及键合方法
技术领域
本发明涉及芯片键合领域，特别涉及一种批处理键合装置及键合方法。
背景技术
芯片键合是将芯片与载片连接形成的一种互连形式。键合芯片一般以标记面朝上的方式放置在分离台上，采用机械手抓取和翻转的方式将芯片传输到基底上进行键合。键合流程串行完成时，对于下压接合时间较长(约为30秒)的工艺，由于一次只能接合一颗芯片，产率非常低，难以满足量产需求。另外，芯片键合分为芯片上的标记面朝下键合到基底上，以及芯片上的标记面朝上键合到基底上两种工艺，目前已知设备只能完成一种方式的芯片键合工艺，更换设备的过程复杂，进一步降低了键合的产率。
发明内容
本发明提供一种批处理键合装置及键合方法，以解决现有的芯片键合产率低的问题。
为解决上述技术问题，本发明提供一种批处理键合装置，包括：
芯片供应单元，用于提供待键合的芯片；
基底供应单元，用于提供基底；
传送单元，用于在所述芯片供应单元以及所述基底供应单元之间移送所述芯片拾取单元，设置于所述芯片供应单元上方，用于从所述芯片供应单元拾取芯片，并将所述芯片的标记面翻转至所需方向后上载至所述传送单元。
较佳地，所述拾取单元包括第一拾取组件和第二拾取组件，所述第一拾取组件设置于所述芯片供应单元上方，包括第一转动部件和设置于所述第一转动部件上的第一拾取头；所述第二拾取组件包括第二转动部件和设置于所述第二转动部件上的第二拾取头，所述第一拾取头从所述芯片供应单元上拾取芯片，并交接至所述传送单元或交接至所述第二拾取头。
较佳地，所述第一转动部件旋转一次的角度为90°或180°。
较佳地，所述第二拾取组件还包括第一对准部件，用于识别所述第二拾取头上的芯片的位置。
较佳地，所述第二拾取头的数量为一个，所述第二转动部件驱动所述第二拾取头在与所述第一对准部件对应的对准位、与所述第一拾取头对应的交接位、以及与所述传送单元对应的传送位之间转换。
较佳地，所述第二拾取头的数量为多个，多个所述第二拾取头均匀设置于所述第二转动部件上，且呈环形间隔分布，所述第二转动部件转动停止时，有三个第二拾取头分别位于与所述第一对准部件对应的对准位、与所述第一拾取头对应的交接位、以及与所述传送单元对应的传送位。
较佳地，所述第二转动部件转动一次的角度与相邻两个第二拾取头之间的角度相同。
较佳地，所述批处理键合装置还包括精调单元，所述精调单元包括第二对准部件和精调手，所述第二对准部件扫描所述传送单元上的芯片的位置，所述精调手根据所述第二对准部件的扫描结果对所述芯片的位置进行调整。
较佳地，所述传送单元包括导轨和安装于所述导轨上并能沿所述导轨滑动的载台，所述载台上设有吸头，芯片在所述吸头上的位置布局可按需调整。
本发明还提供了一种批处理键合方法，应用于如上所述的批处理键合装置，包括如下步骤：
S1：将带有芯片的晶片上载至所述芯片供应单元，将基底上载至所述基底供应单元；
S2：判断键合时要求的芯片上标记面的方向；
S3：若要求标记面朝下键合，则所述拾取单元依次从所述芯片供应单元拾取芯片旋转180°并传递至所述传送单元，所述传送单元将所有芯片移送至所述基底供应单元的基底上并一次性完成所有芯片的键合；
S4：若要求标记面朝上键合，则所述拾取单元从所述芯片供应单元拾取芯片并翻转，将翻转后的芯片依次传递至所述传送单元，所述传送单元将所有芯片移送至所述基底供应单元的基底上并一次性完成所有芯片的键合。
较佳地，步骤S3和S4均还包括：所述传送单元携载所述芯片移动至精调单元上方，所述精调单元对每个芯片在所述传送单元上的位置进行调整。
较佳地，步骤S4中所述拾取单元从所述芯片供应单元拾取芯片并翻转步骤为：利用第一拾取组件从所述芯片供应单元上拾取芯片后旋转90°交接给第二拾取组件，所述第二拾取组件将所述芯片上载至所述传送单元。
较佳地，所述步骤S4中还包括利用第一对准部件识别所述第二拾取组件上芯片的位置，之后将所述芯片与所述传送单元进行对准交接。
与现有技术相比，本发明提供的批处理键合装置及键合方法，具有如下优点：
1.本发明中，每个芯片的拾取和精度调整是单独完成的，但芯片的传送和键合，可多个芯片同时完成，从而大大提高了产率，以满足量产要求；
2.本发明根据键合时对芯片上标记面方向的要求，选择性使用第二拾取组件，使该装置能够兼容芯片上的标记面朝上和朝下两种键合方式。
附图说明
图1为本发明一具体实施方式中批处理键合装置的结构示意图(要求标记面朝下键合)；
图2为本发明一具体实施方式中批处理键合装置的结构示意图(要求标记面朝上键合)；
图3为本发明一具体实施方式中拾取单元的结构示意图；
图4为本发明一具体实施方式中精调单元的结构示意图；
图5为本发明一具体实施方式中基底供应单元的结构示意图；
图6为本发明一具体实施方式中传送单元的结构示意图；
图7为本发明一具体实施方式中芯片的结构示意图；
图8为本发明一具体实施方式中第二拾取头的结构示意图；
图9为本发明一具体实施方式中当要求芯片上的标记面朝上时，第一拾取组件与第二拾取组件的交接流程示意图。
图中：10-芯片供应单元、11-分离台、12-载盘、20-基底供应单元、21-键合台、22-载板、30-拾取单元、31-第一转动部件、32-第一拾取头、33-第二转动部件、34-第二拾取头、35-第一对准部件、40-传送单元、41-导轨、42-载台、50-精调单元、51-第二对准部件、52-精调手、60-芯片、61-标记面。
具体实施方式
为使本发明的上述目的、特征和优点能够更加明显易懂，下面结合附图对本发明的具体实施方式做详细的说明。需说明的是，本发明附图均采用简化的形式且均使用非精准的比例，仅用以方便、明晰地辅助说明本发明实施例的目的。
本发明提供的批处理键合装置，如图1和图2所示，包括：
芯片供应单元10，用于从晶片中分离芯片60，并提供待键合的芯片60，请结合图3，所述芯片供应单元10包括分离台11以及安装于所述分离台11上的载盘12，所述载盘12用于承载芯片60，所述分离台11可带动所述芯片60在水平面上移动；
基底供应单元20，用于提供基底，请重点参考图5，包括键合台21和安装于所述键合台21上的载板22，所述载板22用于承载基底，所述键合台21可带动所述基底在水平面上移动；
传送单元40，用于在所述芯片供应单元10以及所述基底供应单元20之间移送所述芯片60；
拾取单元30，设置于所述芯片供应单元10上方，用于从所述芯片供应单元10拾取芯片60，并将所述芯片60的标记面61翻转至所需方向后上载至所述传送单元40，如图7所示。
具体地，本发明中，每个芯片60的拾取和精度调整是单独完成的，但芯片60的传送和键合，可多个芯片60同时完成，从而大大提高了产率，以满足量产要求；本发明根据键合时对芯片60上标记面61方向的要求，选择性使用第二拾取组件，使该装置能够兼容芯片60上的标记面61朝上和朝下两种键合方式。
较佳地，请重点参考图3，所述拾取单元30包括第一拾取组件和第二拾取组件，所述第一拾取组件设置于所述芯片供应单元10上方，包括第一转动部件31和设置于所述第一转动部件31上的第一拾取头32；所述第二拾取组件包括第二转动部件33和设置于所述第二转动部件33上的第二拾取头34，所述第一拾取头32从所述芯片供应单元10上拾取芯片60，并交接至所述传送单元40或交接至所述第二拾取头34，具体地，不需翻转时，第一拾取头32直接将芯片60交接至传送单元40；若需翻转，则第一拾取头32将芯片60交接至第二拾取头34进行翻转，再通过第二拾取头34将翻转后的芯片60传递至传送单元40。较佳地，所述第二拾取组件还包括第一对准部件35，用于识别所述第二拾取头34上的芯片60的位置，所述第一对准部件35设置于所述第二转动部件33的下方，在第一拾取头32与第二拾取头34交接完成后，利用所述第一对准部件35扫描芯片60在所述第二拾取头34上的位置，利用该位置信息确保第二拾取头34可将芯片60传递至传送单元40的准确位置。
较佳地，请继续参考图3，所述第二拾取头34的数量为一个，所述第二转动部件33驱动所述第二拾取头34在与所述第一对准部件35对应的对准位、与所述第一拾取头32对应的交接位、以及与所述传送单元40对应的传送位之间转换，交接时，所述第一转动部件31旋转一次的角度为90°或180°，确保交接精度的同时，简化装置结构。
较佳地，请重点参考图8，所述第二拾取头34的数量为多个(本实施例以4个为例)，4个所述第二拾取头34均匀设置于所述第二转动部件33上，且呈环形间隔分布，所述第二转动部件33转动停止时，有三个第二拾取头34分别位于与所述第一对准部件35对应的对准位、与所述第一拾取头32对应的交接位、以及与所述传送单元40对应的传送位。这样，每个第二拾取头34可在不同的工位处做不同的动作，进一步提高键合效率。本实施例中，所述第二转动部件33转动一次的角度与相邻两个第二拾取头34之间的角度相同，同样以四个第二拾取头34为例，第二转动部件33转动一次的角度为90°。
较佳地，请重点参考图1和图2，所述批处理键合装置还包括精调单元50，结合图4，所述精调单元50包括第二对准部件51和精调手52，所述第二对准部件51扫描所述传送单元40上的芯片60的位置，所述精调手52根据所述第二对准部件51的扫描结果对所述芯片60的位置进行调整。
较佳地，请重点参考图6，所述传送单元40包括导轨41和安装于所述导轨41上并能沿所述导轨41滑动的载台42，所述载台42上设有吸头(未图示)，芯片60在所述吸头上的位置布局可按需调整。
请重点参考图1和图2，本发明还提供了一种批处理键合方法，应用于如上所述的批处理键合装置，包括如下步骤：
S1：将带有芯片60的晶片上载至所述芯片供应单元10，当然，此时所述芯片60标记面61朝上的；将基底上载至所述基底供应单元20；
S2：判断键合时要求的芯片60上标记面61的方向，即要求标记面61朝上键合还是要求标记面61朝下键合；
S3：若要求标记面61朝下键合，如图1所示，则所述拾取单元30依次从所述芯片供应单元10拾取芯片60，并将多个芯片60依次旋转180°并传递至所述传送单元40，直至所述传送单元40中载台42上的芯片60数量与布局满足要求，所述传送单元40将所有芯片60移送至所述基底供应单元20的基底上并一次性完成所有芯片60的键合；
S4：若要求标记面61朝上键合，如图2所示，则所述第一拾取头32从所述芯片供应单元10拾取芯片60，交接至所述第二拾取头34实现翻转，该步骤中所述拾取单元从所述芯片供应单元10拾取芯片60并翻转步骤为：利用第一拾取组件从所述芯片供应单元10上拾取芯片60后旋转90°交接给第二拾取组件，实现翻转，所述第二拾取组件将所述芯片60上载至所述传送单元40，即第二拾取头34承载芯片60依次传递至所述传送单元40。所述传送单元40将所有芯片60移送至所述基底供应单元20的基底上并一次性完成所有芯片60的键合。
请参考图9，当要求标记面61朝下键合时，第一拾取头32向下伸出，从芯片供应单元10拾取一个芯片60；第一拾取头32上升并逆时针旋转90°，与所述第二拾取头34交接该芯片60；然后第一拾取头32顺时针旋转90°拾取下一个芯片60，同时第二拾取头34旋转至第一对准部件35进行位置扫描；第一拾取头32将第二个芯片60旋转至与第二拾取头34交接处，等待第二拾取头34来拾取，同时第二拾取头34带着第一个芯片60，按照第一对准部件35扫描的位置信息，精确交接至传送单元40上，依此类推，从而完成芯片60从芯片供应单元10到传送单元40的移送。
较佳地，步骤S3和S4均还包括：所述传送单元40携载所述芯片60移动至精调单元50上方，所述精调单元50对每个芯片60在所述传送单元40上的位置进行调整。
具体地，步骤S3中，所述传送单元40将多个所述芯片60同时移动至所述精调单元50上方，利用精调单元50对每个芯片60在所述传送单元40上的位置进行调整，具体地，第二对准部件51扫描载台42上的芯片60，待第二对准部件51扫描完芯片60并计算后，精调手52根据每个芯片60的扫描结果逐个将载台42上的芯片60取下，调整，同时载台42亦根据扫描结果水平调整，使载台42上的芯片60的位置、角度满足要求。
步骤S4中还包括利用第一对准部件35识别所述第二拾取组件上芯片60的位置，之后将所述芯片60与所述传送单元40进行对准交接，具体地，翻转后的芯片60移动至第一对准部件35处，第一对准部件35扫描芯片标记并计算，载台42根据对准结果运动到位，同时第二拾取头34带芯片60翻转与载台42完成交接，在该过程中，由于第一对准部件35已经对位置精度进行了调整，因此，启用精调单元50进行精度调整的步骤可以省略，在确保精度的前提下，节约了时间和能源。
综上所述，本发明提供的批处理键合装置及键合方法，该装置包括芯片供应单元10，用于提供待键合的芯片60；基底供应单元20，用于提供基底；传送单元40，用于在所述芯片供应单元10以及所述基底供应单元20之间移送所述芯片60；拾取单元30，设置于所述芯片供应单元10上方，用于从所述芯片供应单元10拾取芯片60，并将所述芯片60的标记面61翻转至所需方向后上载至所述传送单元40。本发明中，单独完成每个芯片60的拾取和精度调整，但传送过程和键合过程中，多个芯片60可同时完成，大大增加了产率；本发明根据键合时对芯片60上标记面61方向的要求，选择性采取翻转机构及步骤，使该装置能够兼容芯片60上的标记面61朝上和朝下两种键合方式。
显然，本领域的技术人员可以对发明进行各种改动和变型而不脱离本发明的精神和范围。这样，倘若本发明的这些修改和变型属于本发明权利要求及其等同技术的范围之内，则本发明也意图包括这些改动和变型在内。

Claims (12)

1.一种批处理键合装置，其特征在于，包括：
芯片供应单元，用于提供待键合的芯片；
基底供应单元，用于提供基底；
传送单元，用于在所述芯片供应单元以及所述基底供应单元之间移送所述芯片；
拾取单元，设置于所述芯片供应单元上方，用于从所述芯片供应单元拾取芯片，并将所述芯片的标记面翻转至所需方向后上载至所述传送单元。
2.如权利要求1所述的批处理键合装置，其特征在于，所述拾取单元包括第一拾取组件和第二拾取组件，所述第一拾取组件设置于所述芯片供应单元上方，包括第一转动部件和设置于所述第一转动部件上的第一拾取头；所述第二拾取组件包括第二转动部件和设置于所述第二转动部件上的第二拾取头，所述第一拾取头从所述芯片供应单元上拾取芯片，并交接至所述传送单元或交接至所述第二拾取头。
3.如权利要求2所述的批处理键合装置，其特征在于，所述第一转动部件旋转一次的角度为90°或180°。
4.如权利要求2所述的批处理键合装置，其特征在于，所述第二拾取组件还包括第一对准部件，用于识别所述第二拾取头上的芯片的位置。
5.如权利要求4所述的批处理键合装置，其特征在于，所述第二拾取头的数量为一个，所述第二转动部件驱动所述第二拾取头在与所述第一对准部件对应的对准位、与所述第一拾取头对应的交接位、以及与所述传送单元对应的传送位之间转换。
6.如权利要求4所述的批处理键合装置，其特征在于，所述第二拾取头的数量为多个，多个所述第二拾取头均匀设置于所述第二转动部件上，且呈环形间隔分布，所述第二转动部件转动停止时，有三个第二拾取头分别位于与所述第一对准部件对应的对准位、与所述第一拾取头对应的交接位、以及与所述传送单元对应的传送位。
7.如权利要求6所述的批处理键合装置，其特征在于，所述第二转动部件转动一次的角度与相邻两个第二拾取头之间的角度相同。
8.如权利要求1所述的批处理键合装置，其特征在于，所述批处理键合装置还包括精调单元，所述精调单元包括第二对准部件和精调手，所述第二对准部件扫描所述传送单元上的芯片的位置，所述精调手根据所述第二对准部件的扫描结果对所述芯片的位置进行调整。
9.如权利要求1所述的批处理键合装置，其特征在于，所述传送单元包括导轨和安装于所述导轨上并能沿所述导轨滑动的载台，所述载台上设有吸头，芯片在所述吸头上的位置布局可按需调整。
10.一种批处理键合方法，应用于如权利要求1所述的批处理键合装置，其特征在于，包括如下步骤：
S1：将带有芯片的晶片上载至所述芯片供应单元，将基底上载至所述基底供应单元；
S2：判断键合时要求的芯片上标记面的方向；
S3：若要求标记面朝下键合，则所述拾取单元依次从所述芯片供应单元拾取芯片旋转180°并传递至所述传送单元，所述传送单元将所有芯片移送至所述基底供应单元的基底上并一次性完成所有芯片的键合；
S4：若要求标记面朝上键合，则所述拾取单元从所述芯片供应单元拾取芯片并翻转，将翻转后的芯片依次传递至所述传送单元，所述传送单元将所有芯片移送至所述基底供应单元的基底上并一次性完成所有芯片的键合。
11.如权利要求10所述批处理键合方法，其特征在于，步骤S3和S4均还包括：所述传送单元携载所述芯片移动至精调单元上方，所述精调单元对每个芯片在所述传送单元上的位置进行调整。
12.如权利要求10所述批处理键合方法，其特征在于，步骤S4中所述拾取单元从所述芯片供应单元拾取芯片并翻转步骤为：利用第一拾取组件从所述芯片供应单元上拾取芯片后旋转90°交接给第二拾取组件，所述第二拾取组件将所述芯片上载至所述传送单元。如权利要求12所述批处理键合方法，其特征在于，所述步骤S4中还包括利用第一对准部件识别所述第二拾取组件上芯片的位置，之后将所述芯片与所述传送单元进行对准交接。
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