CN107863453A - A kind of OLED based on end face encapsulation and preparation method thereof - Google Patents
A kind of OLED based on end face encapsulation and preparation method thereof Download PDFInfo
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- CN107863453A CN107863453A CN201711088798.XA CN201711088798A CN107863453A CN 107863453 A CN107863453 A CN 107863453A CN 201711088798 A CN201711088798 A CN 201711088798A CN 107863453 A CN107863453 A CN 107863453A
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- 238000005538 encapsulation Methods 0.000 title claims abstract description 82
- 238000002360 preparation method Methods 0.000 title description 12
- 229910052751 metal Inorganic materials 0.000 claims abstract description 62
- 239000002184 metal Substances 0.000 claims abstract description 62
- 239000000758 substrate Substances 0.000 claims abstract description 58
- 239000010408 film Substances 0.000 claims abstract description 50
- 239000010409 thin film Substances 0.000 claims abstract description 10
- 239000011888 foil Substances 0.000 claims abstract description 5
- 239000010410 layer Substances 0.000 claims description 33
- 239000000853 adhesive Substances 0.000 claims description 12
- 230000001070 adhesive effect Effects 0.000 claims description 12
- 239000011230 binding agent Substances 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 8
- 239000010936 titanium Substances 0.000 claims description 8
- 229910052719 titanium Inorganic materials 0.000 claims description 8
- 238000004026 adhesive bonding Methods 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 6
- 239000000956 alloy Substances 0.000 claims description 5
- 229910045601 alloy Inorganic materials 0.000 claims description 5
- 229910052804 chromium Inorganic materials 0.000 claims description 5
- 230000007704 transition Effects 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 239000003795 chemical substances by application Substances 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 239000002356 single layer Substances 0.000 claims description 3
- 238000010276 construction Methods 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 7
- 238000005516 engineering process Methods 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 230000004888 barrier function Effects 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 238000004528 spin coating Methods 0.000 description 3
- 230000007812 deficiency Effects 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000005424 photoluminescence Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8423—Metallic sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
This application discloses a kind of OLED based on end face encapsulation, including：Substrate, the luminescent layer being formed on substrate, the thin-film encapsulation layer for encapsulating light emitting layer and the circle metal film formed on the substrate end-face edge, and the encapsulation paper tinsel with base plate bonding, the substrate edges metal film are coupled by ultra-sonic welded with encapsulation foil edge；The metal film and encapsulation paper tinsel are both positive and negative polarity future insufficiency on substrate.Based on above-mentioned design, substrate edges metal film and encapsulation paper tinsel are linked together by ultra-sonic welded, can be effectively realized screen body edge seal, be strengthened edge seal effect.
Description
Technical field
The present invention relates generally to electronic display technology field, and in particular to it is a kind of based on end face encapsulation OLED and its
Preparation method.
Background technology
OLED (Organic Light Emitting Display, Chinese name OLED) refers to organic partly lead
Body material and luminescent material pass through the phenomenon of carrier injection and composite guide photoluminescence under electric field driven.According to this luminous
Principle and display is made or illuminating product is referred to as OLED or organic light emission illuminating product.Flexibility, bending
Change, the ultra-thin developing direction as OLED screen body future, encapsulation technology will be an important factor for restricting its development.
OLED packaged types mainly have following two at present：
(1) hard screen encapsulation：I.e. in preparing OLED on glass substrate, by the top of case chip or device surrounding is distributed
Drier, and edge pass through packaging plastic or Frit hermetic barrier water oxygens；Although hard screen encapsulation packaging effect is good, its screen body is thick
Degree is big and base material can not be bent, therefore is not suitable for the encapsulation of ultra-thin OLED screen and flexible OLED screen.
(2) soft screen encapsulation：By bonded adhesives and envelope after the completion of baseplate material OLED prepares (including thin-film package)
Fill film fitting and complete OLED encapsulation.Soft screen encapsulation is the mode of end face encapsulation, generally use encapsulation paper tinsel and binding agent fitting
Encapsulation, because binding agent belongs to organic material and water oxygen obstructing capacity is limited, particularly screen body marginal position be even more directly with
Atmosphere, influenceed to a certain extent for screen body life time serious.
The content of the invention
In a first aspect, in view of drawbacks described above of the prior art or deficiency, it is expected to provide one kind compared to prior art and
Speech, the OLED based on end face encapsulation of water oxygen barrier can be effectively realized in screen body marginal position.
A kind of OLED based on end face encapsulation, including：Substrate, the luminescent layer being formed on substrate, for encapsulate send out
The thin-film encapsulation layer of photosphere and the circle metal film formed on the substrate end-face edge, and the encapsulation with base plate bonding
Paper tinsel, the substrate and encapsulation foil edge ultra-sonic welded；The metal film and encapsulation paper tinsel are both positive and negative polarity future insufficiency on substrate.
The technical scheme provided according to the embodiment of the present application, the thickness of metal film are more than 200nm, width 1-3mm.
The technical scheme provided according to the embodiment of the present application, one or more layers is provided between the metal film and the substrate
Intermediate metal.
The technical scheme provided according to the embodiment of the present application, the intermediate metal are one kind or several in Cr, Ti or Ni
Kind alloy；10-50nm of its thickness.
The technical scheme provided according to the embodiment of the present application, the metal film and encapsulation foil matter is identical and material for aluminium or
Copper or titanium.
According to the embodiment of the present application provide technical scheme, the thin-film encapsulation layer be single-layer inorganic layer or it is organic with it is inorganic
Laminated construction.
Second aspect, in view of drawbacks described above of the prior art or deficiency, it is expected to provide one kind compared to prior art and
Speech, the OLED preparation method based on end face encapsulation of water oxygen barrier can be effectively realized in screen body marginal position.
A kind of OLED preparation method based on end face encapsulation, comprises the following steps：
Make basic components：Electrode and luminescent layer are formed on the substrate and the film for encapsulating light emitting layer seals
Layer is filled, obtains basic components；
Patterned metal film：A circle metal film is formed on the substrate end-face edge and is lacked for both positive and negative polarity on substrate is reserved
Mouthful；
Gluing encapsulation paper tinsel：, will in the encapsulation paper tinsel surface coated with adhesive or the coated with adhesive on the basic components
The encapsulation paper tinsel is bonded with substrate；
High temperature deaeration：The screen body progress high temperature deaeration that above-mentioned steps are prepared to gained obtains tentatively shielding body；
Ultra-sonic welded：Tentatively shield body edge described in ultra-sonic welded so that substrate and encapsulation paper tinsel are welded as a whole.
The technical scheme provided according to the embodiment of the present application, also includes before the patterned metal film：Graphical gold
Belong to transition zone：It is one or more layers that a circle intermediate metal and the intermediate metal are formed on the substrate end-face edge.
The technical scheme provided according to the embodiment of the present application, the intermediate metal are one kind or several in Cr, Ti or Ni
Kind alloy；10-50nm of its thickness.
The technical scheme provided according to the embodiment of the present application, the thickness of metal film are more than 200nm, width 1-3mm.
The technical scheme provided according to the embodiment of the present application, in gluing encapsulates paper tinsel, the coating zone of binding agent is more than base
Light-emitting zone on plate.
The technical scheme provided according to the embodiment of the present application, the edge in adhesive coated region and the metal film edge it
Between distance be more than 0.3mm.
In summary, improvement of the application based on above-mentioned technical proposal, there is provided have a kind of OLED devices based on end face encapsulation
Part, based on above-mentioned design, substrate edges metal film and encapsulation paper tinsel are linked together by ultra-sonic welded, can effectively realize screen
Body edge seal, strengthen edge seal effect.
In addition, the application is also provided with a kind of preparation method of the OLED based on end face encapsulation, this preparation method phase
For prior art, the above-mentioned OLED based on end face encapsulation, compared to existing technologies, energy can be prepared
It is enough to effectively realize water oxygen barrier in screen body marginal position, screen body edge seal, enhancing edge seal effect can be effectively realized
Fruit.
Brief description of the drawings
By reading the detailed description made to non-limiting example made with reference to the following drawings, the application's is other
Feature, objects and advantages will become more apparent upon：
Fig. 1 is a kind of schematic diagram (embodiment one) of the OLED based on end face encapsulation in the application；
Fig. 2 is a kind of flow chart (He of embodiment two of the OLED preparation method based on end face encapsulation in the application
Three)；
Fig. 3 be in the application it is a kind of based on end face encapsulation OLED preparation method flow chart (example IV and
Five).
In figure：1st, substrate；2nd, luminescent layer；3rd, thin-film encapsulation layer；4th, paper tinsel is encapsulated；5th, metal film.
Embodiment
The application is described in further detail with reference to the accompanying drawings and examples.It is understood that this place is retouched
The specific embodiment stated is used only for explaining related invention, rather than the restriction to the invention.It also should be noted that in order to
It is easy to describe, the part related to invention is illustrate only in accompanying drawing.
It should be noted that in the case where not conflicting, the feature in embodiment and embodiment in the application can phase
Mutually combination.Describe the application in detail below with reference to the accompanying drawings and in conjunction with the embodiments.
Embodiment one：
Referring to Fig. 1, a kind of OLED edge seal structures based on end face encapsulation, bag are specifically disclosed in the present embodiment
Include：Substrate 1, the luminescent layer 2 being formed on substrate 1, the thin-film encapsulation layer 3 for encapsulating light emitting layer 2 and in the end face of substrate 1
The circle metal film 5 formed on edge, and the encapsulation paper tinsel 4 glued with substrate 1, the substrate 1 and the encapsulation edge ultrasonic bond of paper tinsel 4
Connect；The metal film 5 and encapsulation paper tinsel 4 are both positive and negative polarity future insufficiency on substrate 1.
In the above-mentioned technical solutions, part based on the substrate, luminescent layer and thin-film encapsulation layer, for realizing OLED's
Basic function.
In any preferred embodiment, the thin-film encapsulation layer is single-layer inorganic layer or organic and inorganic lamination knot
Structure.
The metal film, the key structure in the present embodiment, it is formed in the end face edge of substrate 1 and it is a circle
Structure, its specific method formed are：Suitable thickness is prepared by modes such as photoetching or sputterings at screen body edge.
Certainly, during its formation, the metal film 5 is both positive and negative polarity future insufficiency on substrate 1.
To ensure that metal film and substrate adhesion are good, in any preferred embodiment, the metal film and the base
It is provided with one or more layers intermediate metal between plate, one or more of alloys in intermediate metal Cr, Ti or Ni；Its thickness
10—50nm；The thickness of metal film is more than 200nm, width 1-3mm.
The encapsulation paper tinsel, the key structure in the present embodiment, certain area blade coating or spin coating away from its marginal position have
The binding agent of certain water absorbing capacity, in order to mutually glued with substrate., it is necessary to pay attention to according to screen during blade coating or spin coating
Body both positive and negative polarity, which is set, arranges relevant position future insufficiency.
Binding agent scratches or the certain area of spin coating can be identical with the light-emitting zone on substrate or slightly larger than light-emitting zone,
But it can not be coated on metal film, otherwise have influence on welding effect.
In the above-mentioned technical solutions, metal film can be linked together with encapsulation paper tinsel by ultra-sonic welded, realize screen body side
Edge seals, and strengthens edge seal effect, efficiently solves technical problem of the prior art.
In any preferred embodiment, the metal film is identical with encapsulation foil matter and material is aluminium or copper or titanium.
Embodiment two：
Referring to Fig. 2, a kind of OLED method for sealing edge based on end face encapsulation, bag are specifically disclosed in the present embodiment
Include following steps：
S1, make basic components：Electrode and luminescent layer and the film for encapsulating light emitting layer are formed on the substrate
Encapsulated layer, obtain basic components；
S2, patterned metal film：Formation one encloses metal film and is that both positive and negative polarity is pre- on substrate on the substrate end-face edge
Stay breach；
S3, glued encapsulation paper tinsel：In encapsulation paper tinsel surface coated with adhesive, the encapsulation paper tinsel is bonded with substrate；
S4, high temperature deaeration：The screen body progress high temperature deaeration that above-mentioned steps are prepared to gained obtains tentatively shielding body；
S5, ultra-sonic welded：Tentatively shield body edge described in ultra-sonic welded so that substrate and encapsulation paper tinsel are welded as a whole.
In any preferred embodiment, the thickness of metal film is more than 200nm, width 1-3mm.
In any preferred embodiment, in gluing encapsulates paper tinsel, the coating zone of binding agent is more than lighting on substrate
Region." being more than " mainly emphasizes that binding agent can not be coated on metal film herein, otherwise has influence on welding effect.
In any preferred embodiment, the distance between the edge in adhesive coated region and the metal film edge are big
In 0.3mm.
Based on the above-mentioned steps in the present embodiment, you can obtain the OLED devices based on end face encapsulation as described in embodiment one
Part.
, glued the step for encapsulating paper tinsel, not only can be by viscous in encapsulation paper tinsel surface coating in above-mentioned steps
Knot agent realizes, can also by the basic components coated with adhesive realize, as shown in the embodiment three.
The step of making basic components and patterned metal film order is not fixed, i.e., patterned metal film may be alternatively located at system
Before making basic components, as implemented shown in four.
, glued the step for encapsulating paper tinsel, not only can be by viscous in encapsulation paper tinsel surface coating based on example IV
Knot agent realizes, can also by the basic components coated with adhesive realize, as shown in the embodiment five.
Embodiment three：
Referring to Fig. 2, a kind of preparation method of the OLED based on end face encapsulation is specifically disclosed in the present embodiment,
Unlike embodiment two, in the present embodiment, when gluing encapsulates paper tinsel, the coated with adhesive on the basic components, by institute
Encapsulation paper tinsel is stated to be bonded with substrate.
Example IV：
Referring to Fig. 3, a kind of preparation method of the OLED based on end face encapsulation is specifically disclosed in the present embodiment,
Unlike embodiment two, in the present embodiment, positioned at the step of the making basic components the step of patterned metal film
Before rapid.
Embodiment five：
Referring to Fig. 3, a kind of preparation method of the OLED based on end face encapsulation is specifically disclosed in the present embodiment,
Unlike embodiment two and three, it is located at the making basic components in the present embodiment, the step of the patterned metal film
The step of before.
Unlike example IV, in the present embodiment, in the present embodiment, when gluing encapsulates paper tinsel, in the basic courses department
Coated with adhesive on part, the encapsulation paper tinsel is bonded with substrate.
To ensure that metal film and substrate adhesion are good, in any preferred embodiment, in the patterned metal film
Also include before：Patterned metal transition zone：A circle intermediate metal and the metal are formed on the substrate end-face edge
Transition zone is one or more layers.Need to avoid both positive and negative polarity position on substrate during intermediate metal is formed.
In any preferred embodiment, the intermediate metal is one or more of alloys in Cr, Ti or Ni；It is thick
Spend 10-50nm.
Above description is only the preferred embodiment of the application and the explanation to institute's application technology principle.People in the art
Member should be appreciated that invention scope involved in the application, however it is not limited to the technology that the particular combination of above-mentioned technical characteristic forms
Scheme, while should also cover in the case where not departing from the inventive concept, carried out by above-mentioned technical characteristic or its equivalent feature
The other technical schemes for being combined and being formed.Such as features described above has similar work(with (but not limited to) disclosed herein
The technical scheme that the technical characteristic of energy is replaced mutually and formed.
Claims (10)
- A kind of 1. OLED based on end face encapsulation, it is characterised in that：Including：Substrate (1), the hair being formed on substrate (1) Photosphere (2), the thin-film encapsulation layer (3) for encapsulating light emitting layer (2) and the circle gold formed in the substrate (1) end face edge Belong to film (5), and the encapsulation paper tinsel (4) glued with substrate (1), the substrate (1) and encapsulation paper tinsel (4) edge ultra-sonic welded；It is described Metal film (5) and encapsulation paper tinsel (4) are both positive and negative polarity future insufficiency on substrate (1).
- A kind of 2. OLED based on end face encapsulation according to claim 1, it is characterised in that：The thickness of metal film More than 200nm, width 1-3mm.
- A kind of 3. OLED based on end face encapsulation according to claim 1 or 2, it is characterised in that：The metal film (5) one or more layers intermediate metal is provided between the substrate (1).
- A kind of 4. OLED based on end face encapsulation according to claim 3, it is characterised in that：The intermediate metal For one or more of alloys in Cr, Ti or Ni；10-50nm of its thickness.
- A kind of 5. OLED based on end face encapsulation according to claim 1, it is characterised in that：The metal film and envelope Dress foil matter is identical and material is aluminium or copper or titanium.
- A kind of 6. OLED based on end face encapsulation according to claim 1 or 2, it is characterised in that：The film envelope It is single-layer inorganic layer or organic and inorganic laminated construction to fill layer (3).
- A kind of 7. method for preparing the OLED based on end face encapsulation, it is characterised in that：Comprise the following steps：Make basic components：Electrode and luminescent layer and the thin-film encapsulation layer for encapsulating light emitting layer are formed on the substrate, Obtain basic components；Patterned metal film：Formation one encloses metal film and is both positive and negative polarity future insufficiency on substrate on the substrate end-face edge；Gluing encapsulation paper tinsel：Paper tinsel surface coated with adhesive or the coated with adhesive on the basic components are encapsulated described, by described in Encapsulation paper tinsel is bonded with substrate；High temperature deaeration：The screen body progress high temperature deaeration that above-mentioned steps are prepared to gained obtains tentatively shielding body；Ultra-sonic welded：Tentatively shield body edge described in ultra-sonic welded so that substrate and encapsulation paper tinsel are welded as a whole.
- A kind of 8. method for preparing the OLED based on end face encapsulation according to claim 7, it is characterised in that：Institute Also include before stating patterned metal film：Patterned metal transition zone：A circle metal mistake is formed on the substrate end-face edge It is one or more layers to cross layer and the intermediate metal.
- 9. a kind of method for preparing the OLED based on end face encapsulation according to claim any one of 7-8, its feature It is：In gluing encapsulates paper tinsel, the coating zone of binding agent is more than the light-emitting zone on substrate.
- A kind of 10. method for preparing the OLED based on end face encapsulation according to claim 9, it is characterised in that：It is viscous Tie the distance between the edge of agent coating zone and described metal film edge and be more than 0.3mm.
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| CN201711088798.XA CN107863453B (en) | 2017-11-08 | 2017-11-08 | OLED device based on end face packaging and preparation method thereof |
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| CN201711088798.XA CN107863453B (en) | 2017-11-08 | 2017-11-08 | OLED device based on end face packaging and preparation method thereof |
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| US10707452B2 (en) | 2018-09-27 | 2020-07-07 | OLEDWorks LLC | Method for making OLED with pass-through hole |
| WO2020199268A1 (en) * | 2019-04-04 | 2020-10-08 | 深圳市华星光电半导体显示技术有限公司 | Oled packaging structure and oled packaging method |
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| WO2020199268A1 (en) * | 2019-04-04 | 2020-10-08 | 深圳市华星光电半导体显示技术有限公司 | Oled packaging structure and oled packaging method |
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