CN107852811A - 印刷电路板以及用于制造印刷电路板的方法 - Google Patents
印刷电路板以及用于制造印刷电路板的方法 Download PDFInfo
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Abstract
本发明涉及一种印刷电路板(1),所述印刷电路板包括绝缘层(2)和布置在绝缘层(2)上的导电层(3),所述导电层结构化为用于待装备到印刷电路板(1)上的电子部件(11)的接触面(4),印刷电路板(1)在接触面(4)的区域中具有至少一个穿过接触面(4)和绝缘层(2)的通道(8),所述通道被填充以导热材料。所述方法的特征在于如下步骤:提供绝缘层(2)和与绝缘层(2)连接的导电层(3);制造至少一个穿过导电层(3)和绝缘层(2)的通道(8);给通道(8)涂覆以导热材料;将导电层(3)结构化为用于待装备的电子部件(11)的接触面(4);提供焊料堆(9),所述焊料堆与接触面(4)至少最小地重叠;放置电子部件(11);熔化并且冷却焊料。
Description
技术领域
本发明涉及一种印刷电路板以及一种用于制造印刷电路板的方法,所述印刷电路板至少包括绝缘层和布置在绝缘层上导电层,并且所述导电层结构化为用于待装备到印刷电路板上的电子部件的接触面。
背景技术
印刷电路板在现有技术中也作为印刷电路板或印刷线路板公知并且用于使电部件、然而首先是电子部件节约空间地和稳定地相互连接。针对该目的,印刷电路板具有布置在绝缘层上的导电层,导电层为了使部件互连而结构化为导体电路并且与绝缘层分离。部件在此可以布置在印刷电路板的表面上或者嵌入印刷电路板中。为了在小结构的设备中提供很大数量的功能性而进一步小型化印刷电路板导致关于热导出的明显的强制性,该热由部件放出并且为了保护部件和为了保护印刷电路板而必须高效地导出和辐射出。放出特别多的热的部件是特别有问题的,并且因此例如在车辆制造中越来越多地使用的功率晶体管和LED(发光二极管)需要对印刷电路板进行合理的热管理,以避免印刷电路板的过热和随之发生的损坏。
在现有技术中针对此方面公知的是:传热面与电子部件直接相邻地设置。传热面是铜层或者也是很小的金属板,其适用于吸收由部件发射的热并且将其通过比部件的面更大的面辐射出。然而这种结构不利的是:其需要相对大的空间,该空间基于传热面的传导性质对于布置导体电路来说不再是可用的。
发明内容
因此,本发明的任务在于说明一种具有改进的热管理的印刷电路板。
为了解决该任务,根据本发明,开头提到的类型的印刷电路板的特征在于,印刷电路板在接触面的区域中(即在接触面的延伸区域内部)具有至少一个穿过接触面和绝缘层的通道,所述通道被填充以导热材料。与本发明相结合,通道理解为印刷电路板中的空隙,所述空隙与简单的钻孔或开口不同地在印刷电路板的平面中具有明显水平的延伸。这种通道因此与长孔具有相似性,并且通道的水平延伸用于一方面提供尽可能大的金属质量用以吸收由部件放出的热,并且另一方面将热在印刷电路板的平面中水平地从部件导出,从而热可以在印刷电路板的远离部件的地带中辐射出。
由于通道根据本发明穿过印刷电路板的接触面和绝缘层并且被填充以导热材料,导热材料通常是金属,所以部件的热可以不仅水平地,即在印刷电路板的平面中从部件导出,而且其也可以同时被引导至绝缘层的另一侧,并且在那里可以附加地辐射出。与简单的通孔不同地,印刷电路板中的根据本发明的通道可以根据由部件放出的实际的或待期望的热量确定规格,从而可以实现针对相应的印刷电路板的有针对性的热管理。
根据优选的实施方式,根据本发明的印刷电路板以如下方式改进:印刷电路板在接触面的区域中具有多个穿过接触面和绝缘层的通道,所述通道被填充以导热材料。当根据本发明设置仅一个如上面描述的通道可以是足够的时,为了提高将热导出部件的效率,在同时尽可能有利地充分利用在印刷电路板上可用的空间的情况下优选地布置有接触面的多个通道,由此,对于每个接触面来说,可能尽可能大的金属质量可以引入印刷电路板中,而不会由于大体积的通道干扰且由此削弱印刷电路板的绝缘层的连续拼接,绝缘层在很大的程度上促进印刷电路板的机械稳定性。同时,通过在每个接触面中设置多个通道实现热在印刷电路板上的更均匀的分布,这又反作用于温度峰值的形成和随之产生的应力和因此印刷电路板的削弱。
像已经提到的那样,本发明的优点在于:通道如上面描述和限定的那样穿过根据本发明的印刷电路板的接触面和绝缘层,从而热也可以在与部件对置的侧面辐射出。针对此方面优选的是:接触面沿通道从绝缘层的一侧引导至另一对置的侧面。这意味着的是:用于部件的接触面不仅布置在印刷电路板的、也承载放出热的部件的那一侧,而且接触面例如对称地构造在印刷电路板的两个侧面上或者构造在印刷电路板的绝缘层的两个侧面上,从而热通过所述至少一个通道不仅被施加到印刷电路板的另一侧,而且在那里也可以根据接触面的规格平面地分布并且相应有效地辐射出。
电部件和电子部件的大部分以多个,例如两个或三个接触面来接触同一个导电层,从而结合本发明有利地显示的是:导电层结构化为用于待装备到印刷电路板上的电子部件的多个接触面,并且针对多个接触面的至少一个接触面设置至少一个穿过接触面和绝缘层的通道。穿过接触面和绝缘层的通道的迄今为止针对仅一个接触面描述的布置因此也可以应用于针对同一个部件的多个接触面,但或者也应用于针对不同的部件的多个接触面,这对于导出相应的部件的热来说又是有益的。
实现对部件的热辐射的进一步的改进的是,接触面构造为传热面(Wärmespreizfläche)。这意味着的是:用于待装备的部件的接触面构造有如下面积,该面积明显超过为了接触部件实际上需要的面积,从而不仅部件的电连接通过接触面的规格实现,而且基于明显更大的构造也可以实现由部件放出的热的水平分布。
根据本发明的优选的实施方式可以设置的是:至少一个通道从接触面的区域(即接触面沿其延伸的区域)延伸出。不管接触面现在作为简单的接触面并且因此基本上以相应于待装备的部件的接触的面积确定规格,或者不管接触面构造为传热面,即带有明显大于用于装备或接触部件来说需要的面积的面积,上面描述的根据本发明的通道在两个情况下都能够以如下方式确定规格并且尤其是具有这种水平延伸,即在印刷电路板的平面中的这种延伸:通道从接触面或传热面的区域伸出,并且因此部件的热可以任意远地从部件导出,只要通道如上面提到的那样通常被填充以金属,不与导体电路相交,并且首先不使印刷电路板的导体电路以不期望的方式短路。
一系列的材料和尤其是金属考虑用于填充穿过接触面和绝缘层的通道。铜、银和金具有高的导热性,其中铜可以被电沉积。然而根据本发明的优选的实施方式设置的是:导热材料从由焊料,尤其是SAC焊料、银纳米膏、导热粘合剂和热界面材料构成的小组中选出。给穿过接触面和绝缘层的通道填充以焊料因此是有利的,这是因为在该情况下,将部件装备到印刷电路板上(这通常通过焊接实现)可以在共同的方法步骤中与填充至少一个通道一起实施。SAC焊料证实为特别有利于焊接并且同时证实为是特别导热的,SAC焊料是包含成分锡、银和铜的焊料。所提到的银纳米膏以名称“Inkron固晶材料IDA-22”获得并且其特征在于高的导热性。银纳米膏可以借助喷射分配或丝网印刷施加。市场上常见的热界面材料例如以商标名称“DOW Corning®TC-4025可涂布式导热垫”或者“Tpcm®200sp”公知。
本发明迄今为止在对印刷电路板的最小化要求的意义下描述,该最小化要求应该在如在权利要求书中限定的印刷电路板的保护区域以内。然而本发明也可以以多层的印刷电路板实现,从而根据本发明的印刷电路板优选包括多个绝缘层和导电层。在此,绝缘层和导电层可以如迄今为止描述和限定的那样针对接触面和通道被处理,通道贯穿接触面和绝缘层并且被填充以导热材料。绝缘层和导电层然而也可以是如下层:其相应于印刷电路板的常规的结构并且通常用于使电子部件互连。穿过接触面和绝缘层的至少一个通道的根据本发明的布置因此可以与多层的印刷电路板组合地使用。因此,通道可以穿过整个多层印刷电路板或者垂直于印刷电路板表面地在中间层,尤其是在导热层上终止。
根据优选的实施方式设置的是,至少一个通道在印刷电路板的一侧以绝缘层封闭或覆盖,在该情况下,通道根据本发明也可以作用为沟槽。
此外可以设置的是:通道以导热材料涂覆,其中尤其是其侧面以金属来施涂,优选以铜来施涂。涂覆至少设置在通道壁上。以导热材料,例如铜来涂覆能够实现将毛细力作用到布置在通道上方的焊料堆上,从而焊料堆在其熔化后至少部分容纳在通道中并且填充通道。此外,通过该施涂明显改进了焊料与印刷板的连接。
尤其可以设置的是:阻焊漆施加到印刷电路板上,其中至少一个接触面包括用于接触电子部件的接触区域,其中至少一个通道以及接触区域是被避开的(即没有阻焊漆)。
本发明首先用于导出热,该热由印刷电路板上的电子部件放出,但也由电部件放出,因此,本发明优选以如下方式改进:印刷电路板装备有电子部件,尤其是LED、激光二极管和/或SMD部件。LED尤其是在车辆制造中越来越多地用于制造高功率的探照灯单元,其中LED放出特别多的热量,并且热的有效的导出对于保护印刷电路板来说是非常重要的。这同样适用于激光二极管,其同样越来越多地作为用于车辆探照灯的照明装置而意义重大。本发明在此可以做出突出的贡献,并且因此能够以尽可能大的收益使用。
根据本发明的用于制造如上面限定的那样的印刷电路板的方法的特征在于如下步骤:
提供绝缘层和与绝缘层连接的导电层;
制造至少一个穿过导电层和绝缘层的通道;
给通道涂覆以导热材料;
将导电层结构化为用于待装备的电子部件的接触面;
提供焊料堆,所述焊料堆与接触面至少最小地重叠;
放置电子部件;
熔化并且冷却焊料。
提供绝缘层和位于其上面的导电层根据如下方法实现:其对于制造印刷电路板的领域中的技术人员来说最好是公知的。为此考虑层压法。因此,导电层和绝缘层能够以各自适合的方法加工,以便制造至少一个穿过这些层的通道。钻孔和铣削以及激光切割法被视为这些方法。随后,通道以导热材料涂覆,通道的侧面和必要时底面例如通过Cu的电沉积被覆盖以金属。在该加工状态下,导电层在上侧结构化为用于待装备的电子部件的接触面。为此例如使用照相平板印刷法,其例如对于制造导体电路和接触面来说是常见的。随后,焊料堆、即准确地测定的量的固体焊料与设置用于接触部件的一个或多个接触面至少最小重叠地布置,并且电子部件布置在接触面上方的区域中,其中电子部件可以支撑在焊料堆上。焊料堆包含可以被挤压的膏状部分,并且必要时附加地包含可以被装备的固体部分,例如焊接块。焊料堆与接触面的仅部分重叠是有利的,当剩余的助焊剂可以在不存在润湿的区域中漏出时,而不会干扰焊料流入期望的区域中。通过提高部件的周围环境中的温度来熔化焊料,由此,焊料堆在通道和接触面的区域中的可能施加的助焊剂的同时排气的情况下通过毛细力且通过重力渗入至少一个通道的区域中,并且在相应测定焊料量的情况下同时填充至少一个通道和接触部件。
根据本发明的优选的实施方式,在提供焊料堆的步骤之前,阻焊漆在避开接触面的用于接触电子部件的区域的情况下施加。该可选的步骤用于可以将在后面熔化的、在随后的步骤中出现的焊料仅渗入没有用阻焊漆覆盖的区域中,从而避免焊料的不期望的分布。为此,阻焊漆可以事先在忽略相应的区域的情况下施加,或者阻焊漆被全面地施加并且随后建立避开。被避开的区域在此也包括通道。
按照根据本发明的方法的优选的实施方式,在提供焊料堆的步骤之前,至少一个通道被填充以导热材料,尤其是从由焊料,尤其是SAC焊料、银纳米膏、导热粘合剂和热界面材料构成的小组中选出的导热材料。在该情况下,填充通道和焊接部件不是同时的,然而却实现关于通道的填充材料的更大的设计自由。
像已经结合根据本发明的印刷电路板提到的那样,多个穿过接触面和绝缘层的通道可以优选被制造,以便相应改进由部件放出的热的导出。当根据本发明设置仅一个如上面描述的通道可以是足够的时,为了提高将热导出部件的效率,在同时尽可能有利地充分利用在印刷电路板上可用的空间的情况下优选地布置有接触面的多个通道,由此,对于每个接触面来说,可能尽可能大的金属质量可以引入印刷电路板中,而不会由于大体积的通道干扰且由此削弱印刷电路板的绝缘层的连续拼接,绝缘层在很大的程度上促进印刷电路板的机械稳定性。同时,通过在每个接触面中设置多个通道实现热在印刷电路板上的更均匀的分布,这又反作用于温度峰值的形成和随之产生的应力和因此印刷电路板的削弱。
同样可以优选设置的是:导电层结构化为用于待装备到印刷电路板上的电子部件的多个接触面,并且针对多个接触面的至少一个接触面制造至少一个穿过接触面和绝缘层的通道。
根据本发明的优选的实施方式,至少一个通道从接触面的区域伸出。不管接触面现在作为简单的接触面和因此基本上以相应于待装备的部件的接触的面积确定规格,或者不管接触面构造为传热面,即带有明显大于用于装备或接触部件来说需要的面积的面积,上面描述的根据本发明的通道在两个情况下都能够以如下方式确定规格并且尤其是具有这种水平延伸,即在印刷电路板的平面中的这种延伸:通道从接触面或传热面的区域伸出,并且因此部件的热可以任意远地从部件导出,只要通道如上面提到的那样通常被填充以金属,不与导体电路相交,并且首先不使印刷电路板的导体电路短路。
根据本发明的优选的实施方式,焊料堆由SAC焊料构成。给穿过接触面和绝缘层的通道填充以焊料因此是有利的,这是因为在该情况下,将部件装备到印刷电路板上(这通常通过焊接实现)可以在共同的方法步骤中与填充至少一个通道一起实施。SAC焊料证实为特别有利于焊接并且同时证实为是特别导热的,SAC焊料是包含成分锡、银和铜的焊料。
附图说明
本发明随后借助在附图中示意性地示出的实施例详细阐述。其中:
图1a示出了在制造根据本发明的印刷电路板时的中间产品的示意性的俯视图;
图1b示出了根据图1a的点划线穿过所提到的中间产品的横截面图;
图2局部以截面示出了穿过根据图1a和1b的中间产品的立体图;
图3示出了在制造根据本发明的印刷电路板时的中间产品,其中已经放置有焊料堆和部件;并且
图4a和4b示出了在熔化焊料后的俯视图以及在熔化焊料后的截面图。
具体实施方式
在图1a中,根据本发明的印刷电路板以附图标记1表示。印刷电路板基本上由绝缘层2以及导电层3构成,导电层结构化为导体线路和用于待装备的部件的接触面4。接触面4在图1a中以虚线示出,这是因为其轮廓棱边隐藏在阻焊漆5下方,并且仅接触面4的对于接触部件来说需要的接触区域6可直接看到。因此在图1a中,用于待装备的部件的接触面4构造为传热面,这是因为接触面的面积明显大于为了纯粹地电接触部件所需要的面积。阻焊漆5在避开留空部7的情况下施加,以便空出用于接触部件的接触面6。穿过接触面4和绝缘层2的通道设有附图标记8并且能够以上面描述的方法制造。
图1b以截面图描绘出图1a的情况并且可看到的是,接触面4沿通道8引导至绝缘层2的另一侧并且在那里对称地布置。通道8穿过接触面4和绝缘层2,并且像已经提到的那样在图1a和1b中还没有填充以导热材料,尤其是金属。
在图2中又看到的是,绝缘层2和位于其上面的接触面4在该中间产品中由阻焊漆5覆盖,阻焊漆然而和接触面4和绝缘层2一样为了构造出通道8已经被穿过。绝缘层用2'表示,该绝缘层可以作为附加的绝缘层施加在根据本发明的印刷电路板复合件上,以便在与部件对置的侧面上封闭通道8。
在图3中,焊料堆9目前在留空部7旁提供在阻焊漆5上,其中箭头10示出的是:在温度相应提高并且随之发生焊料堆9的熔化的情况下,液化的焊料流入通道8以及接触区域6中。电子部件11在焊料熔化之前位于焊料堆9上,并且由粘合点13临时保持固定。由此,在焊料堆9熔化时,部件11在其相对于印刷电路板1的高度和水平位置中保持固定,从而没有导致电子部件11的下降或漂浮。通过来自焊料堆9的焊料接触电子部件11的接触垫12以如下方式确保:在印刷电路板1的印刷布局中,在焊料堆9和印刷电路板1上的接触区域6以及电子部件11的接触垫12之间设置有至少最小的重叠,并且接触垫10和接触面4的接触区域6之间的间距是相对小的,从而导致接触垫12和接触区域6之间的毛细效应,并且焊料从焊料堆9在这些区域中朝接触垫升高。
图4a示出了在印刷电路板熔化后的情况,然而其中为了通道8的更好的俯视图没有示出电子部件11。在图4a中看到的是:通道8和接触区域6完全被填充以焊料,并且从部件11放出的热因此可以分布在用于待装备的部件11的、构造为传热面的接触面4的整个区域上,其中尤其是从图4b得到的是:大的金属体积和因此大的金属质量可以在通道8中提供,从而由部件11吸收的热在该金属质量中消散,并且尤其是也可以被施加到印刷电路板1的另一侧上。以该方式实现的是:大的热量也由电子部件,例如LED分布和导出,从而通常在根据本发明的印刷电路板中得到印刷电路板和部件11的更小的点负荷,这对于印刷电路板的更长的运行持续时间和运行安全性来说在很大程度上是有益的。
Claims (19)
1.印刷电路板(1),所述印刷电路板包括绝缘层(2)和布置在绝缘层(2)上的导电层(3),所述导电层结构化为用于待装备到印刷电路板(1)上的电子部件(11)的接触面(4),其特征在于,所述印刷电路板(1)在接触面(4)的区域中具有至少一个穿过接触面(4)和绝缘层(2)的通道(8),所述通道被填充以导热材料。
2.根据权利要求1所述的印刷电路板,其特征在于,所述印刷电路板(1)在接触面(4)的区域中具有多个穿过接触面(4)和绝缘层(2)的彼此间隔开的通道(8),所述通道被填充以导热材料。
3.根据权利要求1或2所述的印刷电路板,其特征在于,所述接触面(4)沿通道(8)从绝缘层(2)的一侧引导至另一侧。
4.根据权利要求1至3中任一项所述的印刷电路板,其特征在于,所述导电层(3)结构化为用于待装备到印刷电路板(1)上的电子部件(11)的多个接触面(4),并且针对所述多个接触面(4)的至少一个接触面设置至少一个穿过至少一个接触面(4)和绝缘层(2)的通道(8)。
5.根据权利要求1至4中任一项所述的印刷电路板,其特征在于,所述接触面(4)构造为传热面。
6.根据权利要求1至5中任一项所述的印刷电路板,其特征在于,所述至少一个通道(8)从接触面(4)延伸出。
7.根据权利要求1至6中任一项所述的印刷电路板,其特征在于,所述导热材料从由焊料,尤其是SAC焊料、银纳米膏、导热粘合剂和热界面材料构成的小组中选出。
8.根据权利要求1至7中任一项所述的印刷电路板,其特征在于,所述印刷电路板(1)包括多个交替相叠地布置的绝缘层(2、2')和导电层(3)。
9.根据权利要求1至8中任一项所述的印刷电路板,其特征在于,所述至少一个通道(8)在所述印刷电路板(1)的一侧以绝缘层(2')封闭。
10.根据前述权利要求中任一项所述的印刷电路板,其特征在于,所述通道(8)以导热材料涂覆,其中尤其是其侧面以金属来施涂,优选以铜来施涂。
11.根据前述权利要求中任一项所述的印刷电路板,其特征在于,阻焊漆施加到所述印刷电路板(1)上,其中所述至少一个接触面(4)包括用于接触电子部件(11)的接触区域(6),其中所述至少一个通道(8)以及接触区域(6)是被避开的。
12.根据权利要求1至11中任一项所述的印刷电路板,其特征在于,所述印刷电路板(1)装备有电子部件(11),尤其是LED、激光二极管和/或SMD部件,其方法是:所述电子部件(11)与所述印刷电路板(1)的至少一个接触面(4)电连接。
13.用于制造根据权利要求12所述的印刷电路板的方法,其特征至少在于如下步骤:
提供绝缘层(2)和与绝缘层(2)连接的导电层(3);
制造至少一个穿过导电层(3)和绝缘层(2)的通道(8);
尤其是通过安置铜涂层,例如通过电镀给至少一个通道(8)涂覆以导热材料;
将导电层(3)结构化为至少一个用于待装备的电子部件(11)的接触面(4);
提供焊料堆(9)到导电层(3)上,其中所述焊料堆(9)与所述至少一个接触面(4)具有至少最小的重叠;
放置电子部件(11)到所述至少一个接触面(4)上;
熔化并且随后冷却焊料堆(9),用以使电子部件(11)与所述至少一个接触面(4)电连接和机械连接。
14.根据权利要求13所述的方法,其特征在于,在提供焊料堆(9)的步骤之前,阻焊漆施加到印刷电路板(1)上,其中所述至少一个接触面(4)包括用于接触电子部件(11)并且以如下方式布置的接触区域(6):所述接触区域与随后待施加的焊料堆(9)重叠,其中所述至少一个通道(8)以及接触区域(6)是被避开的。
15.根据权利要求13或14所述的方法,其特征在于,在提供焊料堆的步骤之前,所述至少一个通道(8)被填充以导热材料,尤其是从由焊料,尤其是SAC焊料、银纳米膏、导热粘合剂和热界面材料构成的小组中选出的导热材料。
16.根据权利要求13至15中任一项所述的方法,其特征在于,制造多个穿过接触面(4)和绝缘层(2)的彼此间隔开的通道(8)。
17.根据权利要求13至16中任一项所述的方法,其特征在于,所述导电层(3)结构化为用于待装备到印刷电路板(1)上的电子部件(11)的多个接触面(4),并且针对所述多个接触面(4)的至少一个接触面制造至少一个穿过至少一个接触面(4)和绝缘层(2)的通道(8)。
18.根据权利要求1至17中任一项所述的方法,其特征在于,所述至少一个通道(8)从接触面(4)的区域伸出。
19.根据权利要求13至18中任一项所述的方法,其特征在于,所述焊料堆(9)由SAC焊料构成。
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113170573A (zh) * | 2018-10-30 | 2021-07-23 | 自动电缆管理有限公司 | 高电流电路 |
CN113517105A (zh) * | 2020-04-10 | 2021-10-19 | 盾安环境技术有限公司 | 电子线圈及具有其的电子膨胀阀 |
WO2022205504A1 (zh) * | 2021-03-31 | 2022-10-06 | 光华临港工程应用技术研发(上海)有限公司 | 一种功率半导体模块制造方法 |
WO2023025099A1 (zh) * | 2021-08-27 | 2023-03-02 | 中兴通讯股份有限公司 | 一种pcb印刷电路板 |
WO2023103808A1 (zh) * | 2021-12-07 | 2023-06-15 | 华为技术有限公司 | 导热结构及其制备方法、散热器及包括散热器的电子设备 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018094057A1 (en) * | 2016-11-21 | 2018-05-24 | 3M Innovative Properties Company | Automatic registration between circuit dies and interconnects |
US11156491B2 (en) * | 2019-01-17 | 2021-10-26 | Te Connectivity Corporation | Inductive sensor assembly for fluid measurements |
US20210112654A1 (en) * | 2020-12-22 | 2021-04-15 | Intel Corporation | Thermal management systems having signal transfer routing for use with electronic devices |
DE102021117131A1 (de) * | 2021-07-02 | 2023-01-05 | Lisa Dräxlmaier GmbH | Leiterplatte und verfahren zum prozesssicheren auflöten eines chipgehäuses |
CN117082726B (zh) * | 2023-10-17 | 2024-03-29 | 荣耀终端有限公司 | 电路板组件和电子设备 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2304999A (en) * | 1995-09-05 | 1997-03-26 | Ford Motor Co | Reflow soldering of electronic components to a printed circuit board |
US6190941B1 (en) * | 1998-09-17 | 2001-02-20 | Daimlerchrysler Ag | Method of fabricating a circuit arrangement with thermal vias |
JP2005183559A (ja) * | 2003-12-18 | 2005-07-07 | Nec Corp | プリント配線板およびその製造方法 |
JP2005340233A (ja) * | 2004-05-24 | 2005-12-08 | Hitachi Kokusai Electric Inc | 電子回路基板 |
CN101252809A (zh) * | 2007-02-22 | 2008-08-27 | 希克斯株式会社 | 表面安装电路板及其制造方法以及安装表面安装电子器件的方法 |
EP2129197A1 (en) * | 2008-05-30 | 2009-12-02 | Delphi Technologies, Inc. | Method of manufacturing a printed circuit board. |
JP2012230937A (ja) * | 2011-04-25 | 2012-11-22 | Denso Corp | 回路基板 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02256296A (ja) * | 1989-03-29 | 1990-10-17 | Japan Radio Co Ltd | プリント基板のスルーホール部への半田充填方法 |
US5019941A (en) | 1989-11-03 | 1991-05-28 | Motorola, Inc. | Electronic assembly having enhanced heat dissipating capabilities |
US5506755A (en) | 1992-03-11 | 1996-04-09 | Kabushiki Kaisha Toshiba | Multi-layer substrate |
US6212071B1 (en) | 1999-08-20 | 2001-04-03 | Lucent Technologies, Inc. | Electrical circuit board heat dissipation system |
JP2004214249A (ja) | 2002-12-27 | 2004-07-29 | Renesas Technology Corp | 半導体モジュール |
US20080206516A1 (en) * | 2007-02-22 | 2008-08-28 | Yoshihiko Matsushima | Surface mount circuit board, method for manufacturing surface mount circuit board, and method for mounting surface mount electronic devices |
DE102009060123B4 (de) | 2009-12-17 | 2019-01-24 | Pilz Gmbh & Co. Kg | Elektrische Schaltung mit mindestens einer Leiterplatte und einer Anzahl von mit Bauelementekontaktierungen versehener elektrischer Bauelemente |
US8908383B1 (en) | 2012-05-21 | 2014-12-09 | Triquint Semiconductor, Inc. | Thermal via structures with surface features |
-
2015
- 2015-07-06 AT ATA50581/2015A patent/AT517203B1/de active
-
2016
- 2016-06-21 JP JP2018500501A patent/JP2018519672A/ja active Pending
- 2016-06-21 US US15/741,585 patent/US10327325B2/en active Active
- 2016-06-21 WO PCT/AT2016/050215 patent/WO2017004632A1/de unknown
- 2016-06-21 EP EP16739391.7A patent/EP3320760B1/de active Active
- 2016-06-21 CN CN201680039954.0A patent/CN107852811B/zh active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2304999A (en) * | 1995-09-05 | 1997-03-26 | Ford Motor Co | Reflow soldering of electronic components to a printed circuit board |
US6190941B1 (en) * | 1998-09-17 | 2001-02-20 | Daimlerchrysler Ag | Method of fabricating a circuit arrangement with thermal vias |
JP2005183559A (ja) * | 2003-12-18 | 2005-07-07 | Nec Corp | プリント配線板およびその製造方法 |
JP2005340233A (ja) * | 2004-05-24 | 2005-12-08 | Hitachi Kokusai Electric Inc | 電子回路基板 |
CN101252809A (zh) * | 2007-02-22 | 2008-08-27 | 希克斯株式会社 | 表面安装电路板及其制造方法以及安装表面安装电子器件的方法 |
EP2129197A1 (en) * | 2008-05-30 | 2009-12-02 | Delphi Technologies, Inc. | Method of manufacturing a printed circuit board. |
US8166650B2 (en) * | 2008-05-30 | 2012-05-01 | Steering Solutions IP Holding Company | Method of manufacturing a printed circuit board |
JP2012230937A (ja) * | 2011-04-25 | 2012-11-22 | Denso Corp | 回路基板 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113170573A (zh) * | 2018-10-30 | 2021-07-23 | 自动电缆管理有限公司 | 高电流电路 |
CN113517105A (zh) * | 2020-04-10 | 2021-10-19 | 盾安环境技术有限公司 | 电子线圈及具有其的电子膨胀阀 |
CN113517105B (zh) * | 2020-04-10 | 2023-11-28 | 盾安环境技术有限公司 | 电子线圈及具有其的电子膨胀阀 |
WO2022205504A1 (zh) * | 2021-03-31 | 2022-10-06 | 光华临港工程应用技术研发(上海)有限公司 | 一种功率半导体模块制造方法 |
WO2023025099A1 (zh) * | 2021-08-27 | 2023-03-02 | 中兴通讯股份有限公司 | 一种pcb印刷电路板 |
WO2023103808A1 (zh) * | 2021-12-07 | 2023-06-15 | 华为技术有限公司 | 导热结构及其制备方法、散热器及包括散热器的电子设备 |
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