CN107806578B - Semiconductor light-emitting device with air duct structure - Google Patents
Semiconductor light-emitting device with air duct structure Download PDFInfo
- Publication number
- CN107806578B CN107806578B CN201610804918.0A CN201610804918A CN107806578B CN 107806578 B CN107806578 B CN 107806578B CN 201610804918 A CN201610804918 A CN 201610804918A CN 107806578 B CN107806578 B CN 107806578B
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- Prior art keywords
- semiconductor light
- air duct
- light
- emitting element
- bulb shell
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 58
- 230000017525 heat dissipation Effects 0.000 claims abstract description 23
- 230000001681 protective effect Effects 0.000 claims abstract description 18
- 239000000758 substrate Substances 0.000 claims description 13
- 238000007789 sealing Methods 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 239000000843 powder Substances 0.000 claims description 3
- 229910052594 sapphire Inorganic materials 0.000 claims description 3
- 239000010980 sapphire Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 2
- 230000002035 prolonged effect Effects 0.000 abstract description 3
- 239000007789 gas Substances 0.000 description 22
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 239000003086 colorant Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
A semiconductor light-emitting device with an air duct structure comprises a sealed light-transmitting bulb shell, a semiconductor light-emitting element, a conductive mechanism and the like, wherein heat-radiating protective gas is filled in the bulb shell, an air duct is further arranged in the bulb shell around the semiconductor light-emitting element, a gas inlet and a gas outlet of the air duct are respectively used for enabling cooler heat-radiating protective gas outside the air duct to enter the air duct and enabling hotter heat-radiating protective gas in the air duct after absorbing heat emitted by the semiconductor light-emitting element to leave the air duct, so that continuous airflow is formed in the air duct. According to the application, the air duct structure is arranged in the bulb shell of the semiconductor light-emitting device, so that the flow speed of gas in the bulb shell can be greatly increased, the heat exchange coefficient of the semiconductor light-emitting element and the internal heat dissipation protective gas is increased, the heat resistance between the semiconductor light-emitting element and the bulb shell is reduced, the heat dissipation capacity of the semiconductor light-emitting device is obviously improved, the light attenuation of the semiconductor light-emitting element is reduced, and the service life of the semiconductor light-emitting element is prolonged.
Description
Technical Field
The application particularly relates to a semiconductor light-emitting device with an air duct structure, and belongs to the technical field of semiconductor light-emitting.
Background
The traditional incandescent lamp (tungsten filament lamp) has high energy consumption and short service life, and is forbidden to be produced by various governments under the large environment with shortage of global resources, and then the replacement product is an electronic energy-saving lamp, which improves the energy-saving effect, but is contrary to the large trend of environmental protection due to the use of a plurality of heavy metal elements polluting the environment. LED lighting is becoming a different option for new green lighting with the rapid development of LED technology. The LED is far superior to the traditional illumination products in the aspects of luminous principle, energy conservation and environmental protection.
Semiconductor light emitting devices, such as LED bulbs, truly achieve 360 ° full angle light emission, are efficient, free of heat sinks, lightweight, and similar in appearance to conventional incandescent bulbs, and are popular in the marketplace. However, the biggest problem of the current LED bulb is the heat dissipation problem, which is also the reason that the LED bulb is generally about 5W and cannot be manufactured into a larger power LED bulb. The LED lamp bulb in the prior art mainly dissipates heat in a mode of heat exchange between the support conduction and the heat dissipation protection gas and has low heat dissipation efficiency and poor heat dissipation effect. The LED lamp filament has higher temperature during working, so that the light attenuation of the LED lamp filament is accelerated, the service life of the LED lamp filament is influenced, and how to improve the heat dissipation capacity of the LED lamp filament is an important problem to be solved in the industry. At present, some LED bulbs are provided with openings on the bulb shell so as to form an air flow channel for improving heat dissipation capability, however, most of the designs have the defects of complex structure and manufacturing process, difficult acceptance by consumers and the like, and particularly, the designs expose the LED filaments to the external environment, so that the LED filaments are easy to absorb moisture in the air and the like, and the efficiency and reliability of the LED filaments are seriously affected.
Disclosure of Invention
In view of the shortcomings of the prior art, a main object of the present application is to provide a light emitting device with an air duct structure.
In order to achieve the purpose of the application, the technical scheme adopted by the application comprises the following steps:
The application discloses a semiconductor light-emitting device with an air duct structure, which comprises a sealed light-transmitting bulb shell, a semiconductor light-emitting element arranged in the bulb shell, and a conductive mechanism used for electrically connecting the semiconductor light-emitting element with a power supply, wherein heat-dissipation protective gas is filled in the bulb shell, an air duct is further arranged in the bulb shell around the semiconductor light-emitting element, a gas inlet and a gas outlet of the air duct are respectively used for enabling the heat-dissipation protective gas with relatively low temperature outside the air duct to enter the air duct and enabling the heat-dissipation protective gas with relatively high temperature after absorbing heat emitted by the semiconductor light-emitting element in the air duct to leave the air duct, so that continuous airflow is formed in the air duct.
More preferably, the air duct comprises at least one light-transmitting body, the light-transmitting body has a hollow structure and is provided with openings at two ends, so that an air duct structure capable of allowing air to circulate is formed, the semiconductor light-emitting element is arranged in the light-transmitting body, an air gap is reserved between the semiconductor light-emitting element and the light-transmitting body, and an air gap is reserved between the light-transmitting body and the inner wall of the bulb shell.
Preferably, the height of the opening at one end of the air duct is higher than the height of the opening at the other end. Thereby, the heated gas can rise and escape from the relatively higher end of the air duct, then cool after contacting the bulb shell, then quickly settle, and reenter the air duct from the relatively lower end of the air duct.
Further, the bulb shell comprises a light-transmitting bulb shell body, an opening part through which the core column can pass is formed in the light-transmitting bulb shell body, the tail end of the core column is in sealing connection with the opening part, and the semiconductor light-emitting element is fixedly connected with the core column.
Furthermore, the semiconductor light-emitting element is fixedly connected with the stem through a bracket, at least part of the bracket and the stem passes through the light-transmitting body, and an air gap is reserved between the bracket and the stem and between the light-transmitting body and between the bracket and the stem and between the bracket and the inner wall of the bulb shell.
In some embodiments, the optically transmissive body is fixedly connected to the stem.
In some embodiments, the optically transmissive body is fixedly connected to the bulb.
In some more specific embodiments, the semiconductor light emitting element may be mounted in the light transmitting body by a bracket connected to the stem, and the light transmitting body is connected to the stem by a connection structure, or connected to the light transmitting bulb shell, or connected to the bracket connected to the stem, so as to be fixed in the sealed light transmitting bulb shell.
Further, the semiconductor light emitting element includes one or more LED filaments, preferably a plurality of LED filaments disposed at a distance from each other.
Further, the LED filament includes an LED filament having a light-transmitting or light-impermeable substrate including sapphire or glass substrate, and the light-impermeable substrate includes a copper substrate or an aluminum substrate, but is not limited thereto.
Further, the LED filament includes a fluorescent powder coated or uncoated LED filament including an LED filament capable of emitting red light or blue light, etc., but is not limited thereto.
In some embodiments, the semiconductor light emitting device further comprises a driver, the semiconductor light emitting element being electrically connected to the driver, the driver being electrically connected to the electrical connector.
In some embodiments, the shape of the optically transmissive body comprises a straight cylinder, a frustum, or a waist drum.
In some embodiments, the LED filaments are connected to the positive and negative poles of the driver output by connection wires.
In some embodiments, the output of the driver is electrically connected to the semiconductor light emitting element, and the input of the driver is electrically connected to an electrical connector for connecting to an external power source.
In some embodiments, the semiconductor light emitting element is connected to the positive and negative electrodes of the driver output via connection lines.
In some embodiments, the upper end of the LED filament is connected to the positive or negative pole of the driver output via a first electrical connection line, and the lower end of the LED filament is connected to the negative or positive pole of the driver output via a second connection line.
Compared with the prior art, the air duct structure is arranged in the sealed bulb of the semiconductor light-emitting device, so that the flow speed of gas in the bulb can be greatly increased, the heat exchange coefficient of the LED filament and the internal heat dissipation protective gas is increased, the heat resistance between the semiconductor light-emitting element and the bulb shell is reduced, the heat dissipation capacity of the semiconductor light-emitting device is obviously improved, the light attenuation of the semiconductor light-emitting element is reduced, and the service life of the semiconductor light-emitting element is prolonged.
Drawings
FIG. 1 is a schematic view of an LED bulb with an air duct structure according to an exemplary embodiment of the present application;
FIG. 2 is a schematic view of the airflow in the bulb shell when the LED bulb with the air duct structure is arranged upwards in the bulb shell according to an exemplary embodiment of the application;
fig. 3 is a schematic view of the airflow in the bulb shell when the bulb shell is downward, according to an exemplary embodiment of the present application.
Reference numerals illustrate: the LED bulb comprises a light-transmitting body-1, an LED filament-2, a stem-3, a driver-4, an electric connector-5, a connecting wire-6, a bulb shell-7 and a bracket-8.
Detailed Description
In view of the shortcomings in the prior art, the inventor of the present application has long studied and practiced in a large number of ways to propose the technical scheme of the present application. The technical scheme, implementation process and principle and the like will be further explained with reference to the attached drawings and the typical embodiments.
Referring to fig. 1, a light emitting device with an air duct structure disclosed in this embodiment includes a light-transmitting bulb shell 7, a stem 3, at least one LED filament 2, a driver 4, an electrical connector 5, and at least one light-transmitting body 1, wherein an opening portion through which the stem 3 integrally passes is disposed on the light-transmitting bulb shell 7, and the tail end of the stem 3 is hermetically connected (e.g. by welding, high-temperature sealing, etc.) with the opening portion of the bulb shell 7 to form a sealed bulb shell in which a heat dissipation protective gas is disposed.
The LED lamp filaments 2 are fixedly connected with the stem 3, at least one light-transmitting body 1 is fixedly arranged in the sealed bulb, the light-transmitting body 1 is of a hollow structure and is provided with openings at two ends, so that an air duct structure is formed, an air gap is reserved between the LED lamp filaments 2 and the light-transmitting body 1, an air gap is reserved between the light-transmitting body 1 and the bulb shell 7, a support 8 is fixedly arranged on the stem 3, and two ends of the LED lamp filaments 2 are respectively fixed on the support 8 and are arranged in the light-transmitting body 1; the two ends of the LED filament 2 are connected with the positive electrode and the negative electrode of the output end of the driver 4 through connecting wires 6; the connecting wire 6 is electrically connected with the LED filament 2 and the driver 4; the driver 4 is electrically connected with the electric connector 5, and the sealing bulb is fixedly connected with the electric connector 5, wherein the electric connector 5 is used for connecting an external power supply.
Further, the height of the opening at one end of the transparent body 1 is higher than the height of the opening at the other end.
Preferably, the shape of the light-transmitting body 1 includes any one of a straight cylinder, a cone, and a drum, but is not limited thereto.
Further, the light-transmitting body 1 is fixedly connected with the stem 3 through a connecting piece.
In some embodiments, the light-transmitting body 1 may also be fixedly connected to the bulb housing 7 by means of a connecting piece.
In some embodiments, the light-transmitting body 1 is fixedly connected to the support 8; any one or a combination of two or more types of fixing can be selected, and the purpose of the fixing is to fix the light-transmitting body 1 in the bulb housing 7 and form a gas circulation channel around the LED filament 2.
In some more specific embodiments, the LED filament may be a strip filament of LEDs of various gauges, such as: the LED lamp filament can be an LED lamp filament of a transparent substrate such as sapphire or glass, an LED lamp filament of an opaque substrate such as a copper substrate or an aluminum substrate, an LED lamp filament of which the surface is coated with fluorescent powder or a multicolor LED chip combination to emit white light, or an LED lamp filament of various colors such as red light, blue light and the like.
The heat dissipation protective gas can be selected from bulb filling gas or other protective gases with good heat dissipation property, such as nitrogen, inert gases and the like, which are conventional in the industry.
When the LED bulb works, the heat-dissipation protective gas around the LED filament is heated up, heated up in the air duct, subjected to heat exchange with the bulb shell with lower temperature, then lowered in temperature, sunk and then enters the air duct from the bottom of the air duct. So repeatedly, formed gas circulation system in sealed bubble casing, increased gaseous flow rate, and then obvious increase inside shielding gas and LED filament and bubble casing's heat transfer coefficient, so can obviously improve the heat dispersion of LED filament lamp, reduce the light decay of LED filament, improve the life-span of LED filament. And then make this LED filament lamp's light efficiency high, easily realize high-power efficient LED filament lamp.
Referring to fig. 2, when the LED bulb with the air duct structure of the present embodiment works in a position with the bulb down and the electrical connector up (with the bulb housing down), the air pressure at the bottom of the air duct is reduced due to the rising of the heat-dissipating protective gas in the air duct caused by the heating of the filament, so that the air at the bottom of the air duct needs to be supplemented, thereby generating an air flow from bottom to top in the air duct; heated gas flows out from the upper part of the air duct through thermal expansion, and then flows in from the lower part of the air duct after being cooled by the wall of the bubble shell; therefore, the introduction of the air duct structure constructs directional flow of air flow in the sealed bulb shell including the bulb shell, so that the heat exchange coefficient of the air, the filament and the bulb shell is increased; assuming that the total amount of heat dissipation through the bubble shell is unchanged before and after the air duct adding structure, according to the formula: p=ha Δt, where P is the heat dissipated by the bulb shell, h is the heat exchange coefficient, a is the heat exchange area, Δt is the gas temperature and filament temperature difference; after the air duct structure is added, the directional flow speed of the internal air flow is increased, and the heat exchange coefficient h is increased according to the relation between the heat exchange coefficient h and the air flow velocity v, namely h-to-v 0.8, so that the delta T is reduced under the condition that the total amount of heat to be dissipated is unchanged. The temperature of the LED lamp filament is reduced, the luminous efficiency of the LED lamp filament is improved, and the service life of the LED lamp filament is prolonged.
Referring to fig. 3, when the LED bulb with the air duct structure of the present embodiment works in a position where the bulb is on the upper side and the electrical connector is on the lower side (the bulb housing is on the upper side), the heat dissipation protective gas in the air duct can generate an air flow from bottom to top, so as to increase the heat exchange coefficient between the LED filament and the heat dissipation protective gas, reduce the temperature of the LED filament, improve the luminous efficiency and prolong the service life of the LED filament; the reason for the generation of the air flow is in agreement with the above.
It should be understood that the above embodiments are merely for illustrating the technical concept and features of the present application, and are intended to enable those skilled in the art to understand the present application and implement the same according to the present application without limiting the scope of the present application. All equivalent changes or modifications made in accordance with the spirit of the present application should be construed to be included in the scope of the present application.
Claims (11)
1. A semiconductor light-emitting device with an air duct structure comprises a sealed light-transmitting bulb shell, a semiconductor light-emitting element arranged in the bulb shell and a conductive mechanism used for electrically connecting the semiconductor light-emitting element with a power supply; the bulb shell is filled with heat dissipation protective gas; the method is characterized in that: the bulb shell is internally provided with an air channel surrounding the semiconductor light-emitting element, a gas inlet of the air channel is used for enabling relatively low-temperature heat-dissipation protective gas outside the air channel to enter the air channel, and a gas outlet of the air channel is used for enabling relatively high-temperature heat-dissipation protective gas in the air channel to leave the air channel after absorbing heat emitted by the semiconductor light-emitting element, so that continuous circulating air flow is formed in the air channel;
The air duct comprises at least one light-transmitting body, the light-transmitting body is of a hollow structure and is provided with openings at two ends, the semiconductor light-emitting element is arranged in the light-transmitting body, an air gap is reserved between the semiconductor light-emitting element and the light-transmitting body, and an air gap is reserved between the light-transmitting body and the inner wall of the bulb shell;
And the height of the opening part at one end of the air duct is higher than that of the opening part at the other end.
2. The semiconductor light emitting device having an air duct structure according to claim 1, wherein: the bulb shell comprises a light-transmitting bulb shell body, an opening part through which the core column can pass is formed in the light-transmitting bulb shell body, the tail end of the core column is in sealing connection with the opening part, and the semiconductor light-emitting element is fixedly connected with the core column.
3. The semiconductor light emitting device having an air duct structure according to claim 2, wherein: the semiconductor light-emitting element is fixedly connected with the core column through the support, at least part of the support and the core column penetrates through the light-transmitting body, and air gaps are reserved among the support, the core column, the light-transmitting body and the inner wall of the bulb shell.
4. The semiconductor light emitting device having an air duct structure according to claim 2, wherein: the light-transmitting body is fixedly connected with the core column.
5. The semiconductor light emitting device having an air duct structure according to claim 1, wherein: the light-transmitting body is fixedly connected with the bulb shell.
6. The semiconductor light emitting device having an air duct structure according to claim 1, wherein: the semiconductor light emitting element comprises an LED filament or a plurality of filaments arranged at intervals.
7. The semiconductor light emitting device with air duct structure of claim 6, wherein: the LED filament includes an LED filament having a light transmissive or opaque substrate including a sapphire or glass substrate and an opaque substrate including a copper or aluminum substrate.
8. The semiconductor light emitting device with air duct structure of claim 6, wherein: the LED filaments comprise LED filaments coated or uncoated with fluorescent powder, and the LED filaments comprise LED filaments capable of emitting red light or blue light.
9. The semiconductor light emitting device having an air duct structure according to claim 1, wherein: the semiconductor light emitting device further includes a driver, the semiconductor light emitting element is electrically connected with the driver, and the driver is electrically connected with the electrical connector.
10. The semiconductor light emitting device having an air duct structure according to any one of claims 1 to 9, wherein: the shape of the light-transmitting body comprises a straight cylinder shape, a frustum shape or a waist drum shape.
11. The semiconductor light emitting device with air duct structure according to claim 9, wherein: the semiconductor light emitting element is connected to the positive and negative poles of the driver output by electrical connection lines passing through the bulb.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610804918.0A CN107806578B (en) | 2016-09-06 | 2016-09-06 | Semiconductor light-emitting device with air duct structure |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610804918.0A CN107806578B (en) | 2016-09-06 | 2016-09-06 | Semiconductor light-emitting device with air duct structure |
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| Publication Number | Publication Date |
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| CN107806578A CN107806578A (en) | 2018-03-16 |
| CN107806578B true CN107806578B (en) | 2024-05-28 |
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| CN201610804918.0A Active CN107806578B (en) | 2016-09-06 | 2016-09-06 | Semiconductor light-emitting device with air duct structure |
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Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4216411A (en) * | 1978-08-08 | 1980-08-05 | Wylain, Inc. | Underwater light assembly with low-water cut-off |
| US4827382A (en) * | 1988-06-03 | 1989-05-02 | Feliks Robert C | Turbine lamp shade assembly |
| JPH11134909A (en) * | 1997-10-27 | 1999-05-21 | Meiji Natl Ind Co Ltd | Cold cathode discharge lamp device |
| CN201396658Y (en) * | 2009-05-15 | 2010-02-03 | 深圳市金积嘉世纪光电科技有限公司 | LED embedded lamp |
| CN201992601U (en) * | 2010-12-31 | 2011-09-28 | 深圳市德泽能源科技有限公司 | Heat-dissipating cylinder structure and LED (light-emitting diode) lamp comprising same |
| CN102330960A (en) * | 2010-07-27 | 2012-01-25 | 冯林 | Cooling device of LED (light slight-emitting diode) light source and LED (light-emitting diode) light source |
| CN103148384A (en) * | 2013-02-19 | 2013-06-12 | 深圳市洲明科技股份有限公司 | LED bulb |
| WO2013124927A1 (en) * | 2012-02-23 | 2013-08-29 | パナソニック株式会社 | Illumination light source and illumination device |
| CN204153513U (en) * | 2014-10-08 | 2015-02-11 | 新和（绍兴）绿色照明有限公司 | A kind of LED bulb |
| CN204227094U (en) * | 2014-10-17 | 2015-03-25 | 杨志伟 | A kind of high-efficiency LED lamp bulb |
| CN206018321U (en) * | 2016-09-06 | 2017-03-15 | 中国科学院苏州纳米技术与纳米仿生研究所 | There are the semiconductor light-emitting apparatus of air channel structure |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7810965B2 (en) * | 2008-03-02 | 2010-10-12 | Lumenetix, Inc. | Heat removal system and method for light emitting diode lighting apparatus |
| TW201031859A (en) * | 2009-02-23 | 2010-09-01 | Taiwan Green Point Entpr Co | High efficiency luminous body |
| US20150260352A1 (en) * | 2014-03-14 | 2015-09-17 | Switch Bulb Company, Inc. | Led bulb with chassis for passive convective liquid cooling |
-
2016
- 2016-09-06 CN CN201610804918.0A patent/CN107806578B/en active Active
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4216411A (en) * | 1978-08-08 | 1980-08-05 | Wylain, Inc. | Underwater light assembly with low-water cut-off |
| US4827382A (en) * | 1988-06-03 | 1989-05-02 | Feliks Robert C | Turbine lamp shade assembly |
| JPH11134909A (en) * | 1997-10-27 | 1999-05-21 | Meiji Natl Ind Co Ltd | Cold cathode discharge lamp device |
| CN201396658Y (en) * | 2009-05-15 | 2010-02-03 | 深圳市金积嘉世纪光电科技有限公司 | LED embedded lamp |
| CN102330960A (en) * | 2010-07-27 | 2012-01-25 | 冯林 | Cooling device of LED (light slight-emitting diode) light source and LED (light-emitting diode) light source |
| CN201992601U (en) * | 2010-12-31 | 2011-09-28 | 深圳市德泽能源科技有限公司 | Heat-dissipating cylinder structure and LED (light-emitting diode) lamp comprising same |
| WO2013124927A1 (en) * | 2012-02-23 | 2013-08-29 | パナソニック株式会社 | Illumination light source and illumination device |
| CN103148384A (en) * | 2013-02-19 | 2013-06-12 | 深圳市洲明科技股份有限公司 | LED bulb |
| CN204153513U (en) * | 2014-10-08 | 2015-02-11 | 新和（绍兴）绿色照明有限公司 | A kind of LED bulb |
| CN204227094U (en) * | 2014-10-17 | 2015-03-25 | 杨志伟 | A kind of high-efficiency LED lamp bulb |
| CN206018321U (en) * | 2016-09-06 | 2017-03-15 | 中国科学院苏州纳米技术与纳米仿生研究所 | There are the semiconductor light-emitting apparatus of air channel structure |
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| Publication number | Publication date |
|---|---|
| CN107806578A (en) | 2018-03-16 |
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