CN107806578A - Semiconductor light-emitting apparatus with air channel structure - Google Patents
Semiconductor light-emitting apparatus with air channel structure Download PDFInfo
- Publication number
- CN107806578A CN107806578A CN201610804918.0A CN201610804918A CN107806578A CN 107806578 A CN107806578 A CN 107806578A CN 201610804918 A CN201610804918 A CN 201610804918A CN 107806578 A CN107806578 A CN 107806578A
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- China
- Prior art keywords
- air channel
- semiconductor light
- shell
- light
- cell
- Prior art date
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- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 56
- 238000007639 printing Methods 0.000 claims abstract description 14
- 230000005855 radiation Effects 0.000 claims abstract description 12
- 238000007789 sealing Methods 0.000 claims abstract description 11
- 238000010521 absorption reaction Methods 0.000 claims abstract description 4
- 230000002045 lasting effect Effects 0.000 claims abstract description 3
- 230000000149 penetrating effect Effects 0.000 claims description 34
- 239000000758 substrate Substances 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 229910052594 sapphire Inorganic materials 0.000 claims description 3
- 239000010980 sapphire Substances 0.000 claims description 3
- 241001025261 Neoraja caerulea Species 0.000 claims description 2
- 238000005253 cladding Methods 0.000 claims description 2
- 230000003287 optical effect Effects 0.000 claims 2
- 230000005611 electricity Effects 0.000 claims 1
- 238000001727 in vivo Methods 0.000 claims 1
- 230000001681 protective effect Effects 0.000 abstract description 8
- 238000012546 transfer Methods 0.000 abstract description 8
- 230000009102 absorption Effects 0.000 abstract 1
- 239000007789 gas Substances 0.000 description 28
- 238000005516 engineering process Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 239000003086 colorant Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
A kind of semiconductor light-emitting apparatus with air channel structure; printing opacity cell-shell, semiconductor light-emitting elements and conductive mechanism including sealing etc.; heat radiation protection gas is filled with the cell-shell; and it is additionally provided with air channel around semiconductor light-emitting elements in the cell-shell; the gas access in the air channel and gas vent are respectively used to make colder heat radiation protection gas outside air channel to enter hotter heat radiation protection gas after air channel and the heat for distributing the absorptions semiconductor light-emitting elements in air channel and leave air channel, so as to form lasting air-flow in air channel.The application in the cell-shell of semiconductor light-emitting apparatus by setting air channel structure; the flowing velocity of gas in cell-shell can be significantly increased; so as to add the coefficient of heat transfer of semiconductor light-emitting elements and internal heat dissipating protective gas; reduce the thermal resistance between semiconductor light-emitting elements and bulb shell; significantly improve the heat-sinking capability of semiconductor light-emitting apparatus; the light decay of semiconductor light-emitting elements is reduced, improves the life-span of semiconductor light-emitting elements.
Description
Technical field
More particularly to a kind of semiconductor light-emitting apparatus with air channel structure of the application, belong to semiconductor light emitting technology neck
Domain.
Background technology
Conventional incandescent (tengsten lamp) power consumption is high, short life, under the nervous overall situation of global resources, gradually by various countries
Government forbids producing, and substitute products are electronic energy-saving lamps therewith, although electronic energy-saving lamp improves energy-saving effect, but due to using
The heavy metal element of many pollution environment, again run counter to the main trend of environmental protection.With the high speed development LED of LED technology
Illumination is increasingly becoming the only choosing of novel green illumination.LED principle of luminosity, energy-saving and environmental protection aspect on be all far superior to
Traditional lighting products.
Semiconductor light-emitting apparatus, such as LED bulb are truly realized 360 ° of full angles and lighted, and have efficiency high, without radiating
Piece, in light weight, profile is similar to traditional incandescent light bulb and is welcome by market.But the difficulty of current LED bulb maximum
Topic is heat dissipation problem, and this is also to now result in LED bulb generally in 5W or so, the reason for can not making more high-power LED bulb.
The radiating of its LED filament of LED bulb of the prior art is mainly handed over by support conduction and filament with heat radiation protection air heat
The mode changed is radiated, and radiating efficiency is low, and radiating effect is poor.Temperature is higher when causing the LED filament to work, and not only accelerates
The light decay of LED filament, and the life-span of LED filament is influenceed, how to improve the heat-sinking capability of LED filament is that industry is urgently to be resolved hurrily
Major issue.There are some LED bulbs that opening is set on cell-shell at present, so as to form the design of gas channel to improve heat radiation energy
Power, but these designs structure mostly be present and manufacturing process is complicated, and profile is difficult to the defects of consumer receives, particularly
LED filament is exposed in external environment condition by such design, causes the easy absorption air reclaimed water of LED filament to be graded, so as to the serious shadow of meeting
Ring the efficiency and reliability of LED filament.
The content of the invention
In view of the shortcomings of the prior art, the main purpose of the application is to provide a kind of luminous dress with air channel structure
Put.
To realize aforementioned invention purpose, the technical scheme that the application uses includes：
This application discloses a kind of semiconductor light-emitting apparatus with air channel structure, including the printing opacity cell-shell of sealing, it is located at
Semiconductor light-emitting elements in the cell-shell, and to by the conductive machine of the semiconductor light-emitting elements and power electric connection
Structure, the cell-shell is interior to be filled with heat radiation protection gas, and in the cell-shell, is also set up around the semiconductor light-emitting elements
There is air channel, the gas access in the air channel and gas vent are respectively used to make the relatively low heat radiation protection gas of the temperature outside air channel
Body enters air channel and for making the radiating that temperature is of a relatively high after the heat that the absorption semiconductor light-emitting elements in air channel distribute
Protective gas leaves air channel, so as to form lasting air-flow in the air channel.
More preferable, the air channel includes an at least light penetrating object, and the light penetrating object has hollow structure and both ends open,
So as to form the air channel structure for being available for gas to circulate, the semiconductor light-emitting elements are located in the light penetrating object, while described half
Air gap is left between conductor light-emitting component and the light penetrating object, air gap is also left between the light penetrating object and the inner wall.
More preferable, the height in the air channel one end open portion is higher than the height of other end opening portion.Take this, can make
Gas after heated rises and from the of a relatively high one end effusion in air channel, then turns cold after being contacted with cell-shell, quickly sedimentation afterwards,
And relatively low one end is again introduced into air channel from air channel.
Further, the cell-shell includes printing opacity bulb shell, and the printing opacity bulb shell is provided with opening of being available for stem to pass through
Oral area, and the stem tail end is tightly connected with the opening portion, the semiconductor light-emitting elements are fixedly connected with the stem.
Further, the semiconductor light-emitting elements are fixedly connected through support with the stem, at least described support and core
Post locally through the light penetrating object, and leave gas between the support and stem and the light penetrating object and the inner wall
Gap.
In some embodiments, the light penetrating object is fixedly connected with the stem.
In some embodiments, the light penetrating object is fixedly connected with the cell-shell.
In some more specific embodiment, the semiconductor light-emitting elements can be by the support that is connected with stem
Be installed in light penetrating object, the light penetrating object is connected by attachment structure with stem, or is connected with printing opacity bulb shell, then or with
The connected support of stem is connected, so as to be fixed in the printing opacity cell-shell of sealing.
Further, the semiconductor light-emitting elements include one or more LED filament, preferably include what is be intervally installed
Plural bar LED filament.
Further, the LED filament includes the LED filament with printing opacity or impermeable photopolymer substrate, the transparent substrates bag
Sapphire or glass substrate are included, the impermeable photopolymer substrate includes copper base or aluminium base, but not limited to this.
Further, the LED filament includes the LED filament of cladding or uncoated fluorescent material, and the LED filament includes energy
Enough launch feux rouges or blue-ray LED filament etc., but not limited to this.
In some embodiments, the semiconductor light-emitting apparatus also includes driver, the semiconductor light-emitting elements with
Driver electrically connects, and the driver electrically connects with electric connector.
In some specific embodiments, the shape of the light penetrating object includes straight tube shape, taper type or dolioform.
In some specific embodiments, the LED filament passes through connecting line and the positive pole and negative pole of driver output end
Connection.
In some embodiments, the output end of the driver electrically connects with semiconductor light-emitting elements, the driver
Input electrically connected with electric connector, the electric connector be used for connect external power source.
In some specific embodiments, connecting line and driver output end that the semiconductor light-emitting elements pass through setting
Positive pole connected with negative pole.
In some specific embodiments, the electric connection line of upper end first and driver output end of the LED filament
Negative or positive electrode connection, the negative pole or positive pole of the connecting line of bottom second of the LED filament and driver output end connect
Connect.
Compared with prior art, the application, can by setting air channel structure in the sealing cell-shell of semiconductor light-emitting apparatus
The flowing velocity of gas in cell-shell is significantly increased, so as to add the coefficient of heat transfer of LED filament and internal heat dissipating protective gas, subtracts
Thermal resistance between small semiconductor light-emitting elements and bulb shell, hence it is evident that improve the heat-sinking capability of semiconductor light-emitting apparatus, reduce by half
The light decay of conductor light-emitting component, improve the life-span of semiconductor light-emitting elements.
Brief description of the drawings
Fig. 1 is a kind of structural representation of the LED bulb with air channel structure in the exemplary embodiments of the application one；
Fig. 2 is that a kind of LED bulb with air channel structure is when bulb shell is upward in the exemplary embodiments of the application one, cell-shell
Interior air-flow schematic diagram；
Fig. 3 is that a kind of LED bulb with air channel structure is when bulb shell is downward in the exemplary embodiments of the application one, cell-shell
Interior air-flow schematic diagram.
Description of reference numerals：Light penetrating object -1, LED filament -2, stem -3, driver -4, electric connector -5, connecting line -6,
Bulb shell -7, support -8.
Embodiment
In view of deficiency of the prior art, inventor is able to propose the application's through studying for a long period of time and largely putting into practice
Technical scheme.As follows will be further to works such as the technical scheme, its implementation process and principles with reference to accompanying drawing and exemplary embodiments
Illustrate.
Referring to Fig. 1, a kind of light-emitting device with air channel structure disclosed in the present embodiment includes printing opacity bulb shell 7, core
Post 3, at least one LED filament 2, driver 4, electric connector 5 and at least one light penetrating object 1, set in the printing opacity bulb shell 7
Have be available for stem 3 integrally through opening portion, and the opening portion of the tail end of the stem 3 and bulb shell 7 be tightly connected it is (such as logical
Cross the modes such as welding, high-temperature molten envelope) sealing cell-shell is formed, it is equipped with heat radiation protection gas in the sealing cell-shell.
The LED filament 2 is fixedly connected with the stem 3, and wherein at least one light penetrating object 1 is fixedly installed on the sealing
In cell-shell, the light penetrating object 1 has hollow structure and both ends open, so as to form air channel structure, while the LED filament 2 with
Air gap is left between the light penetrating object 1, air gap is also left between the light penetrating object 1 and the bulb shell 7, is gone back on the stem 3
Support 8 is fixedly installed, the both ends of LED filament 2 are separately fixed on support 8, and are arranged in the light penetrating object 1；It is described
The both ends of LED filament 2 are connected by the connecting line 6 of setting with the positive pole and negative pole of the output end of driver 4；The connecting line 6
Electrically connected with LED filament 2 and driver 4；The driver 4 electrically connects with electric connector 5, the sealing cell-shell and electric connector
5 are fixedly connected, wherein the electric connector 5 is used to connect external power source.
Further, the height in the one end open portion of light penetrating object 1 is higher than the height of other end opening portion.
It is more preferable, the shape of the light penetrating object 1 include straight tube shape, taper, it is dolioform in any one, it is but unlimited
In this.
Further, the light penetrating object 1 is fixedly connected by connector with stem 3.
In some embodiments, the light penetrating object 1 can also be fixedly connected by connector with bulb shell 7.
In some embodiments, the light penetrating object 1 is fixedly connected with support 8；May be selected any one or it is two or more
Combination fix, its object is to which light penetrating object 1 is fixed in bulb shell 7, the logical of gas circulation is formed around LED filament 2
Road.
In some more specific embodiment, LED filament can be the LED strip shape filament of all size, such as：Can
Be sapphire either the LED filament of the transparency carrier such as glass, can also be the impermeable photopolymer substrate such as copper base or aluminium base
LED filament, can be that surface wraps up the LED filament that fluorescent material or multi-colored led chip portfolio emit white light, can also be rubescent
The LED filament of a variety of colors such as light, blue light.
Wherein described thermal diffusivity protective gas may be selected from the conventional bulb filling gas of industry or other thermal diffusivities are good
Protective gas, such as nitrogen, inert gas.
When the LED bulb works, thermal diffusivity protective gas around LED filament because of heated heating, in air channel by
Heat rise, and then the bulb shell relatively low with temperature exchanged heat after temperature reduce, sink afterwards, then enter inlet air from air channel bottom
Road.So repeatedly, gas-circulating system is formd in sealing bulb shell, adds the flowing velocity of gas, and then significantly
Add internal protection gas and LED filament and the coefficient of heat transfer of bulb shell, it is possible to significantly improve the radiating of LED filament lamp
Ability, the light decay of LED filament is reduced, improve the life-span of LED filament.And then make it that the light efficiency of the LED filament lamp is high, it is easy to accomplish
The LED filament lamp of large power high efficiency.
Referring to Fig. 2, the LED bulb with air channel structure of the present embodiment with bulb in lower and electric connector upper
When pose (bulb shell is under) works, thermal diffusivity protective gas can cause due to being risen by filament " heating " in air channel
Air channel bottom air pressure reduces, so air channel bottom needs gas to enter supplement, so as to produce air-flow from bottom to top in air channel；And
Heated gas flows out from air channel top expanded by heating, runs into the cooling of cell-shell body wall and is flowed into again from air channel bottom；Therefore, air channel structure
Introducing in the sealing cell-shell internal build directed flow of air-flow including bulb shell, make gas and filament and bulb shell
The coefficient of heat transfer increase；Assuming that before and after air channel structure is added, the total amount to be radiated by bulb shell is constant, according to formula：P=hA Δs
T, wherein P are the heats to be dissipated by bulb shell, and h is the coefficient of heat transfer, and A is heat exchange area, and Δ T is gas temperature and filament temperature
Difference；After adding air channel structure, internal gas flow directed flow speed increase, according to coefficient of heat transfer h and gas flow rate v relation:h∝
v0.8, cause coefficient of heat transfer h to increase, so under conditions of the heat amount for needing to dissipate is constant, Δ T reduces.Reduce
The temperature of LED filament, improve LED filament luminous efficiency and life-span.
Referring to Fig. 3, the present embodiment have the LED bulb of air channel structure with bulb in position upper and that electric connector is under
When appearance (bulb shell is upper) works, heat radiation protection gas can produce air-flow from bottom to top in air channel, and increase LED filament is with dissipating
The coefficient of heat transfer of hot protective gas, the temperature of LED filament is reduced, improve LED filament luminous efficiency and life-span；It is former caused by air-flow
Because being consistent with above-mentioned reason.
It should be appreciated that above-described embodiment is only the technical concepts and features for illustrating the application, its object is to allow be familiar with this
The personage of item technology can understand present context and implement according to this, and the protection domain of the application can not be limited with this.It is all
The equivalent change or modification made according to the application Spirit Essence, it should all cover within the protection domain of the application.
Claims (12)
1. a kind of semiconductor light-emitting apparatus with air channel structure, including the printing opacity cell-shell of sealing, half in the cell-shell
Conductor light-emitting component, and by the conductive mechanism of the semiconductor light-emitting elements and power electric connection, to be filled out in the cell-shell
Filled with heat radiation protection gas, it is characterised in that：In the cell-shell, air channel is additionally provided with around the semiconductor light-emitting elements,
The gas access in the air channel and gas vent are respectively used to make the relatively low heat radiation protection gas of the temperature outside air channel to enter
Air channel and for making the heat radiation protection gas that temperature is of a relatively high after the heat that the absorption semiconductor light-emitting elements in air channel distribute
Body leaves air channel, so as to form lasting air-flow in the air channel.
2. the semiconductor light-emitting apparatus according to claim 1 with air channel structure, it is characterised in that：The air channel includes
An at least light penetrating object, the light penetrating object have hollow structure and both ends open, and the semiconductor light-emitting elements are located at the printing opacity
In vivo, while between the semiconductor light-emitting elements and the light penetrating object air gap, the light penetrating object and the inner wall are left
Between also leave air gap.
3. the semiconductor light-emitting apparatus according to claim 2 with air channel structure, it is characterised in that：Described air channel one end
The height of opening portion is higher than the height of other end opening portion.
4. the semiconductor light-emitting apparatus according to claim 2 with air channel structure, it is characterised in that：The cell-shell includes
Printing opacity bulb shell, the printing opacity bulb shell, which is provided with, is available for the opening portion that stem passes through, and the stem tail end and the opening
Portion is tightly connected, and the semiconductor light-emitting elements are fixedly connected with the stem.
5. the semiconductor light-emitting apparatus according to claim 4 with air channel structure, it is characterised in that：The semiconductor hair
Optical element is fixedly connected through support with stem, at least described support and stem locally through the light penetrating object, and the support
And leave air gap between stem and the light penetrating object and the inner wall.
6. the semiconductor light-emitting apparatus according to claim 4 with air channel structure, it is characterised in that：The light penetrating object with
The stem is fixedly connected.
7. the semiconductor light-emitting apparatus according to claim 2 with air channel structure, it is characterised in that：The light penetrating object with
The cell-shell is fixedly connected.
8. the semiconductor light-emitting apparatus according to claim 1 with air channel structure, it is characterised in that：The semiconductor hair
Optical element includes a LED filament or the plural bar filament being intervally installed.
9. the semiconductor light-emitting apparatus according to claim 8 with air channel structure, it is characterised in that：The LED filament
Including the LED filament with printing opacity or impermeable photopolymer substrate, the transparent substrates include sapphire or glass substrate, described impermeable
Photopolymer substrate includes copper base or aluminium base；And/or the LED filament includes the LED filament of cladding or uncoated fluorescent material,
The LED filament includes that feux rouges or blue-ray LED filament can be launched.
10. the semiconductor light-emitting apparatus according to claim 1 with air channel structure, it is characterised in that：The semiconductor
Light-emitting device also includes driver, and the semiconductor light-emitting elements electrically connect with driver, the driver and electric connector electricity
Connection.
11. the semiconductor light-emitting apparatus with air channel structure according to any one of claim 1-10, it is characterised in that：
The shape of the light penetrating object includes straight tube shape, taper type or dolioform.
12. the semiconductor light-emitting apparatus according to claim 10 with air channel structure, it is characterised in that：The semiconductor
Light-emitting component is connected by the electric connection line through the cell-shell and the positive pole of driver output end and negative pole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610804918.0A CN107806578B (en) | 2016-09-06 | 2016-09-06 | Semiconductor light-emitting device with air duct structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610804918.0A CN107806578B (en) | 2016-09-06 | 2016-09-06 | Semiconductor light-emitting device with air duct structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107806578A true CN107806578A (en) | 2018-03-16 |
| CN107806578B CN107806578B (en) | 2024-05-28 |
Family
ID=61575962
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610804918.0A Active CN107806578B (en) | 2016-09-06 | 2016-09-06 | Semiconductor light-emitting device with air duct structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107806578B (en) |
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| CN206018321U (en) * | 2016-09-06 | 2017-03-15 | 中国科学院苏州纳米技术与纳米仿生研究所 | There are the semiconductor light-emitting apparatus of air channel structure |
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