CN107755888A - A kind of laser index carving method of infrared graticle - Google Patents
A kind of laser index carving method of infrared graticle Download PDFInfo
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- CN107755888A CN107755888A CN201711045139.8A CN201711045139A CN107755888A CN 107755888 A CN107755888 A CN 107755888A CN 201711045139 A CN201711045139 A CN 201711045139A CN 107755888 A CN107755888 A CN 107755888A
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Abstract
The invention discloses a kind of laser index carving method of graticle, comprise the following steps：S1：The pattern to be etched of infrared graticle is drawn on marking machine, the lines that horizontally and vertically uniform crossover is drawn inside each figure of pattern to be etched is formed, forms netted filling；S2：Respectively each figure establishes horizontal marking figure layer, sets the Marking parameters of horizontal line in each figure；S3：Pattern to be etched is replicated, and ensures that it is completely superposed with former pattern to be etched, vertical marking figure layer is established for each figure after duplication, the Marking parameters of vertical lines in each figure is set；S4：The marking number of horizontal marking figure layer and vertical marking figure layer is set；S5：Infrared graticle to be etched is placed on marking machine, marking is carried out to it according to setting.The present invention is easy to operate, and the manufacturing cycle is short, adopts and computerizeds control, it is easy to accomplish automation, can greatly improve the efficiency of graticle production.
Description
Technical field
The invention belongs to graticle technical field, more particularly, to a kind of laser index carving method of infrared graticle.
Background technology
Infrared graticle is mainly used in the optical axises such as calibration thermal infrared imager, low-light level night vision device, CCD TVs, laser range finder
Between collimation.Infrared graticle uses hollow metal target plate, by infrared sources such as black matrixes, is heated to infrared graticle,
So that graticle is imaged in infrared optical system, infrared graticle is controlled by the height of blackbody temperature in optical system
The brightness of imaging, to reach the correction of infrared optical system optical axis.
Traditional infrared graticle is made using mechanical scratching, chemical attack or the method for photocopying, the manufacturing cycle
Long, manufacturing cost is high, and chemical solvent is harmful to human body and environment, low production efficiency, has had a strong impact on the batch production of product.
The content of the invention
For the disadvantages described above or Improvement requirement of prior art, the invention provides a kind of laser index carving quarter side of graticle
Method, solve traditional infrared graticle and made using the method for chemical attack or photocopying, manufacturing cycle length, is manufactured into
This height, the problem of low production efficiency.
To achieve the above object, according to one aspect of the present invention, there is provided a kind of laser index carving side of infrared graticle
Method, comprise the following steps：
S1：The pattern to be etched of infrared graticle is drawn on marking machine, and inside each figure for forming pattern to be etched
The lines of horizontal direction and vertical direction uniform crossover are drawn, form netted filling；
S2：Respectively each figure establishes horizontal marking figure layer, sets the Marking parameters of horizontal line in each figure；
S3：Pattern to be etched is replicated, and ensures that replicate pattern is completely superposed with former pattern to be etched, to replicate each figure of pattern
Vertical marking figure layer is established, the Marking parameters of vertical lines in each figure for replicating pattern are set；
S4：The marking number of vertical marking figure layer in horizontal marking figure layer and step S3 in setting steps S2 respectively；
S5：Infrared graticle to be etched is placed on marking machine, it entered according to the Marking parameters and marking number of setting
Rower is carved.
Preferably, the laser index carving method of above-mentioned infrared graticle, it is further comprising the steps of between its step S4 and S5：If
Put the Marking parameters of infrared graticle boundary line.
Preferably, the laser index carving method of above-mentioned infrared graticle, its step S5 also include below to motherboard mark before
The step of：
S01：Diameter is drawn on marking machine and is more than the circle of infrared graticle, and Marking parameters are set；
S02：Motherboard is placed on marking machine, infrared graticle to be etched is carved in motherboard subscript；
S03：Infrared graticle to be etched is fixed by fixing device.
Preferably, the laser index carving method of above-mentioned infrared graticle, its Marking parameters include processing mesh number, marking speed,
Marking power and frequency, delay of opening the light, close light delay, terminate delay, turning delay and marking angle.
Preferably, the laser index carving method of above-mentioned infrared graticle, its motherboard use aluminum.
Preferably, the laser index carving method of above-mentioned infrared graticle, its fixing device include graduation sheet frame and trim ring, will treated
Carve infrared graticle to be placed in the graduation sheet frame, be fixed with the trim ring.
Preferably, the laser index carving method of above-mentioned infrared graticle, diameter of a circle is drawn in its step S01 than infrared graduation
The big 10mm of diameter of plate.
In general, by the contemplated above technical scheme of the present invention compared with prior art, it can obtain down and show
Beneficial effect：
Infrared graticle laser index carving method provided by the invention, using laser as manufacturing process, by for graduation figure
Each figure of case establishes figure layer, and sets netted intersection lines respectively inside each figure, according to Layer Order successively to each figure
Netted lines inside shape carry out marking；Marking parameters can be set respectively according to being actually needed, and laser is total during avoiding marking
Against same position marking, cause pattern edge irregular, paste side phenomenon, easy to operate, the manufacturing cycle is short, using computer
Control, it is easy to accomplish automation can greatly improve the efficiency of graticle production.
Brief description of the drawings
Fig. 1 is the installation drawing provided in an embodiment of the present invention that laser index carving is carried out to infrared graticle；
Fig. 2 is the marking schematic diagram of aluminium business card provided in an embodiment of the present invention；
Fig. 3 is the sectional view of graticle frock provided in an embodiment of the present invention；
Fig. 4 is common circular cross-shaped graticle and its graduation pattern；
Fig. 5 is Fig. 5 close-up schematic view；
Fig. 6 is the infrared graticle that marking provided in an embodiment of the present invention is completed.
Embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, it is right below in conjunction with drawings and Examples
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.As long as in addition, technical characteristic involved in each embodiment of invention described below
Conflict can is not formed each other to be mutually combined.
It is the device provided in an embodiment of the present invention for infrared graticle laser index carving shown in Fig. 1, including graticle work
Fill 1, aluminium business card 2 and optical fiber marking machine 3；During work, graticle frock 1 and aluminium business card 2 are both placed in the two dimension of optical fiber marking machine 3
Above platform.
Fig. 2 is the marking schematic diagram of aluminium business card, and aluminium business card 2 is used as the base material for scribing infrared graticle, through optical fiber marking machine 3
Infrared graticle 21 to be etched is formed after marking.
The marking process of aluminium business card 2 is as follows：
S1：Open the industrial computer of optical fiber marking machine 3；
S2：Circle of the diameter slightly larger than infrared graticle is drawn in the marking window of mark software, and it is placed in the middle, this implementation
The preferred drafting diameter of a circle of example is bigger 10mm than graduation board diameter；
S3：Laser index carving parameter, including processing mesh number, marking speed, marking power and frequency, delay of opening the light, pass are set
Light delay, terminate delay and turning delay etc.；It is 6 times that the present embodiment, which is preferably provided with processing number, and marking speed is 1mm/s, work(
Rate percentage is 90%, frequency 20KHz；
S4：Aluminium business card 2 is placed in the two-dimensional stage of laser marking machine 3, adjusts focal length, open feux rouges preview,
By adjusting X, Y-direction adjusting knob above two-dimentional work bench, aluminium business card 2 is moved to suitable position；
S5：The marking order on mark software is clicked on, laser marking machine carves circular pattern in aluminium business card subscript, treated
After the completion of marking, it is standby to remove infrared graticle 21 to be etched.
Fig. 3 is the sectional view of graticle frock, and graticle frock 1 is used to fix infrared graticle 21 to be etched, and for holding
Infrared graticle 21 to be etched caused chip during marking is put, avoids chip from being adhered directly in two-dimensional stage；Graticle work
Filling 1 includes graduation sheet frame 11 and trim ring 12；First a trim ring 12 is arranged in graduation sheet frame 11, infrared graticle 21 to be etched is put
Put on trim ring 12, then another trim ring 12 is placed on infrared graticle 21 to be etched, will be to be etched by two trim rings 12
Infrared graticle 21 is pressed abd fixed in graduation sheet frame 11.
Common circular cross-shaped graticle shown in Fig. 4, the graduation pattern of the graticle by 12 rectangular reticles 211,
212nd, 213,214,215,216,217,218,220,221,222,223, center circles 219 and cylindrical 224 composition.This
Embodiment illustrates infrared graticle laser index carving method provided by the present invention by taking circular cross-shaped graticle as an example, including following
Step：
Step 1：Infrared graticle 21 to be etched is arranged in graduation sheet frame 11, and compressed with trim ring 12, by graduation sheet frame
11 are placed in the two-dimensional stage of optical fiber marking machine 3；
Step 2：Pattern to be etched and the boundary line of graticle are drawn in the marking window of mark software, needle drawing is treated in composition
The lines of horizontally and vertically uniform crossover are drawn inside each figure of case, form netted filling；It is software in Fig. 4 shown in Fig. 5
The pattern to be etched drawn amplifies the schematic internal view of partial graphical after 20 times, can be clearly seen that from Fig. 5 inside each figure
The netted filling lines set.
Step 3：The marking order and Marking parameters of each figure are set, are specifically divided into following sub-step：
Step 31：Be followed successively by each figure and establish horizontal marking figure layer, specifically, by rectangular reticle 211,212,213,214,
215th, 216,217,218 and center circle 219 be separately positioned in figure layer 11,21,31,41, A11, A21, A31, A41, y1, it is corresponding
Laser parameter be disposed as：Process number 20 times, marking speed 200mm/s, power percentage 40%, frequency 20KHz；Open the light
Be delayed 100 microseconds, close light be delayed 100 microseconds, terminate delay 300 microseconds, turning be delayed 100 microseconds, 0.01 millimeter of line spacing, mark
0 ° of angle is carved, this is provided for inside marking rectangular reticle 211,212,213,214,215,216,217,218 and center circle 219
Horizontal line.
Step 32：Pattern to be etched is replicated, and ensures that it is completely superposed with former pattern to be etched, is established for each figure after duplication
Vertical marking figure layer；Specifically, rectangular reticle 211,212,213,214,215,216,217,218 and center circle 219 are replicated, will
Rectangular reticle 211,212,213,214,215,216,217,218 and center circle 219 be separately positioned on figure layer 12,22,32,42,
In A12, A22, A32, A42 and y2, corresponding laser parameter is disposed as：Process number 20 times, marking speed 200mm/s, work(
Rate percentage is 40%, frequency 20KHz；Open the light delay 100 microseconds, close light be delayed 100 microseconds, terminate delay 300 microseconds, turning
Be delayed 100 microseconds, 0.01 millimeter of line spacing, 90 ° of marking angle, this be provided for marking rectangular reticle 211,212,213,214,
215th, 216,217,218 and center circle 219 inside vertical lines.
Step 33：The marking number of horizontal line and vertical lines, specifically, the horizontal marking figure of continuous replication are set respectively
Layer 11,21,31,41, A11, A21, A31, A41, y1 and vertical marking figure layer 12,22,32,42, A12, A22, A32, A42, y2
Each 19 times, and ensure that all figures correspond to respectively and overlap；So, the figure of the horizontal marking figure layer of each figure and vertical marking figure layer
Number of layers is 20, each figure layer 11,21,31,41, A11, A21, A31, A41, y1,12,22,32,42, A12, A22,
The processing number that A32, A42, y2 correspond to figure is 20 times, and the horizontal line and vertical lines in each figure distinguish marking 400 times.
Step 34：Rectangular reticle 220,221,222,223 is separately positioned in figure layer B11, B21, B31, B41, it is corresponding
Laser parameter be disposed as：Process number 20 times, marking speed 200mm/s, power percentage 40%, frequency 20KHz；Open the light
Be delayed 100 microseconds, close light be delayed 100 microseconds, terminate delay 300 microseconds, turning be delayed 100 microseconds, 0.01 millimeter of line spacing, mark
0 ° of angle is carved, this is provided for the horizontal line inside marking rectangular reticle 220,221,222,223.
Step 35：Rectangular reticle 220,221,222,223 is replicated, rectangular reticle 220,221,222,223 is set respectively
In figure layer B12, B22, B32, B42, corresponding laser parameter is disposed as：Number 20 times, marking speed 200mm/s is processed,
Power percentage is 40%, frequency 20KHz；Open the light delay 100 microseconds, close light be delayed 100 microseconds, terminate delay 300 microseconds, turn
Angle be delayed 100 microseconds, 0.01 millimeter of line spacing, 90 ° of marking angle, this be provided for marking rectangular reticle 220,221,222,
Vertical lines inside 223.
Step 36：Horizontal marking figure layer B11, B21, B31, B41 of continuous replication and vertical marking figure layer B12, B22, B32,
Each 19 times of B42, and ensure that all figures correspond to respectively and overlap；So, the horizontal marking figure layer of each figure and vertical marking figure layer
Figure layer number be 20, each figure layer B11, B21, B31, B41, B12, B22, B32, B42 correspond to the processing number of figure
For 20 times, horizontal line in each figure and vertical lines difference marking 400 times.
Step 37：The Marking parameters of infrared graticle boundary line are set, and specifically, the Marking parameters of circular groove 224 are：
It is 6 times to process number, and marking speed is 1mm/s, power percentage 90%, frequency 20KHz；Open the light delay 100 microseconds, close
100 microseconds of light delay, 300 microseconds of delay that terminate, 100 microseconds of turning delay.
Step 4：After the completion of all parameter settings, the marking order on mark software is clicked on, optical fiber marking machine is according to step 1
The Layer Order and Marking parameters set in~3 carries out mark to infrared graticle 21 to be etched.
Specific marking order and number are as follows：According to figure layer foundation order, respectively marking figure layer 11,21,31,41, A11,
A21, A31, A41, y1 correspond to the horizontal line 20 times of the inside of figure 211~219 filling, then respectively marking figure layer 12,22,32,
42nd, A12, A22, A32, A42, y2 correspond to the vertical lines 20 times of the inside of figure 211~219 filling；Above procedure is repeated 19 times.
Next, the horizontal line of the inside of rectangular reticle 220~223 filling corresponding to marking figure layer B11, B21, B31, B41 20 times, so
The vertical lines of the inside of rectangular reticle 220~223 filling corresponding to marking figure layer B12, B22, B32, B42 20 times afterwards, above mistake
Journey is repeated 19 times.Then marking circle groove 224 6 times, the infrared graduation as shown in Figure 6 with hollow out figure is finally processed
Plate.
It is pointed out that the Marking parameters and marking that are set during the progress marking described above to infrared graticle are suitable
Sequence can modify according to being actually needed, and be not intended to limit the present invention, the present embodiment preferably according to figure 211,212,
213rd, 214 → 215,216,217,218 → 219 → 220,221,222,223 order carries out marking, during can avoiding marking
Fuel factor caused by laser heat influences Marking accuracy.
The present invention carries out marking using optical fiber marking machine to aluminium business card, will treat that marking pattern is divided into multiple figure layers and enters rower
Carve, during marking, avoid laser from always against same position marking, causing pattern edge irregular, paste side phenomenon.
Compared to existing graduation board manufacturing method, a kind of laser index carving method operation letter of graticle provided by the invention
Just, the manufacturing cycle is short, can greatly improve the efficiency of graticle production.
As it will be easily appreciated by one skilled in the art that the foregoing is merely illustrative of the preferred embodiments of the present invention, not to
The limitation present invention, all any modification, equivalent and improvement made within the spirit and principles of the invention etc., all should be included
Within protection scope of the present invention.
Claims (7)
- A kind of 1. laser index carving method of infrared graticle, it is characterised in that comprise the following steps：S1：The pattern to be etched of infrared graticle is drawn on marking machine, and is drawn inside each figure for forming pattern to be etched The lines of horizontal direction and vertical direction uniform crossover, form netted filling；S2：Respectively each figure establishes horizontal marking figure layer, sets the Marking parameters of horizontal line in each figure；S3：Pattern to be etched is replicated, and ensures that replicate pattern is completely superposed with former pattern to be etched, establishes to replicate each figure of pattern Vertical marking figure layer, the Marking parameters of vertical lines in each figure for replicating pattern are set；S4：The marking number of vertical marking figure layer in horizontal marking figure layer and step S3 in setting steps S2 respectively；S5：Infrared graticle to be etched is placed on marking machine, rower is entered to it according to the Marking parameters and marking number of setting Carve.
- 2. the laser index carving method of graticle as claimed in claim 1, it is characterised in that also wrapped between the step S4 and S5 Include following steps：The Marking parameters of infrared graticle boundary line are set.
- 3. the laser index carving method of infrared graticle as claimed in claim 1 or 2, it is characterised in that before the step S5 The step of also including below to motherboard mark：S01：Diameter is drawn on marking machine and is more than the circle of infrared graticle, and Marking parameters are set；S02：Motherboard is placed on marking machine, infrared graticle to be etched is carved in motherboard subscript；S03：Infrared graticle to be etched is fixed by fixing device.
- 4. the laser index carving method of the infrared graticle as any one of claim 1-3, it is characterised in that the marking Parameter includes processing mesh number, marking speed, marking power and frequency, delay of opening the light, closes light delay, terminates delay, turning delay With marking angle.
- 5. the laser index carving method of infrared graticle as claimed in claim 4, it is characterised in that the motherboard uses aluminium Material.
- 6. the laser index carving method of the infrared graticle as described in claim 3 or 5, it is characterised in that the fixing device bag Include graduation sheet frame and trim ring, infrared graticle to be etched is placed in the graduation sheet frame during marking, compressed with the trim ring solid It is fixed.
- 7. the laser index carving method of infrared graticle as claimed in claim 3, it is characterised in that drawn in the step S01 Diameter of a circle is bigger 10mm than the diameter of infrared graticle.
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| CN201711045139.8A CN107755888A (en) | 2017-10-31 | 2017-10-31 | A kind of laser index carving method of infrared graticle |
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| CN201711045139.8A CN107755888A (en) | 2017-10-31 | 2017-10-31 | A kind of laser index carving method of infrared graticle |
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| CN108817672A (en) * | 2018-03-20 | 2018-11-16 | 深圳市吉祥云科技有限公司 | A method of fish scale-shaped lines is made on almag surface with laser |
| CN112882222A (en) * | 2021-03-23 | 2021-06-01 | 重庆市毅博机械有限公司 | A device is drawn to division line for gun sight lens |
| CN116689951A (en) * | 2023-08-08 | 2023-09-05 | 常州厚德再生资源科技有限公司 | Underwater pulse laser waste battery structure disassembling device and control method thereof |
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| CN116689951A (en) * | 2023-08-08 | 2023-09-05 | 常州厚德再生资源科技有限公司 | Underwater pulse laser waste battery structure disassembling device and control method thereof |
| CN116689951B (en) * | 2023-08-08 | 2023-10-27 | 常州厚德再生资源科技有限公司 | Underwater pulse laser waste battery structure disassembling device and control method thereof |
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Application publication date: 20180306 |