CN107742048A - A kind of re-optimization method of overvoltage protector gold thread skew technological parameter - Google Patents

A kind of re-optimization method of overvoltage protector gold thread skew technological parameter Download PDF

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Publication number
CN107742048A
CN107742048A CN201711107754.7A CN201711107754A CN107742048A CN 107742048 A CN107742048 A CN 107742048A CN 201711107754 A CN201711107754 A CN 201711107754A CN 107742048 A CN107742048 A CN 107742048A
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gold thread
optimized variable
offset
technological parameter
experiment
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梅益
朱春兰
杨秀伦
孙全龙
刘闯
杨幸雨
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Guizhou University
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Guizhou University
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/20—Design optimisation, verification or simulation
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/30—Circuit design
    • G06F30/39—Circuit design at the physical level
    • G06F30/398—Design verification or optimisation, e.g. using design rule check [DRC], layout versus schematics [LVS] or finite element methods [FEM]

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Evolutionary Computation (AREA)
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  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

The invention discloses a kind of re-optimization method of overvoltage protector gold thread skew technological parameter; with the minimum standard of gold thread offset; the numerical simulation of technological parameter is carried out to it with microchip package module; optimal procedure parameters combination is chosen with reference to orthogonal test; and use single factor test to change experiment and secondary Lagrange's interpolation and suboptimization again is carried out to combination of process parameters, contrast the optimum results of gold thread offset twice.The present invention passes through the double optimization to technological parameter, optimal forming parameters in section can be obtained, and predict minimum gold thread offset make the whole Process planning flow cycle shortens, design efficiency is higher, time and materials cost reduce, die trial number and part defect are reduced, theoretical foundation is provided for actual production.

Description

A kind of re-optimization method of overvoltage protector gold thread skew technological parameter
Technical field
The invention belongs to chip Plastic Package forming technology field, more particularly to a kind of overvoltage protector gold thread skew technique The re-optimization method of parameter.
Background technology
The reliability of IC chip encapsulation is that must be solved the problems, such as before electronic product is launched to market, and plastic packaging is molded over It largely prevent that electronic chip is different degrees of, various forms of failures, but Plastic Package can produce in forming process Forming defect, the wherein gold threads such as buckling deformation, the lead frame skew in stowing operation or the gold thread skew of product appearance are offset The generation of defect will result directly in the rising of plastic part fraction defective and the decline of reliability, or even failure.
Ic component usually because gold thread offset excessive to cause adjacent gold thread to contact with each other short so as to be formed Road, or even gold thread is thrust, cause the short-circuit or breaking of component.In order to be effectively reduced gold thread offset, prevention short circuit or The situation of open circuit occurs, and carefully should control from encapsulating material and exactly molding technique parameter, reduce gold thread in die cavity By pluck power caused by mould stream, to avoid the excessive situation of gold thread offset from occurring.
The content of the invention
The technical problem to be solved in the present invention is：A kind of re-optimization side of overvoltage protector gold thread skew technological parameter is provided Method, the defects of existing and deficiency can be predicted during chip plastic packaging, in order to reduce the gold thread offset during plastic packaging, with full The reliability requirement of sufficient IC chip is carried out again, it is necessary on the premise of orthogonal test and extremum difference analysis Optimizing Process Parameters Optimization so that gold thread skew is minimum.
The technical scheme that the present invention takes is：A kind of re-optimization method of overvoltage protector gold thread skew technological parameter, should Method comprises the following steps：
(1) optimized variable is determined：Choosing influences principal element caused by gold thread shift phenomenon becomes as optimized variable, optimization Amount includes mold temperature a, melt temperature b, dwell pressure c, hardening time d, injection time e and moulding material f；
(2) horizontal parameters are chosen according to optimized variable；
(3) horizontal parameters are digitized with processing, designs orthogonal experiment group, using gold thread minimum offset as optimization mesh Mark；
(4) Orthogonal experiment results in step (3) are used into range analysis method, with the minimum standard of gold thread offset, The influence order of optimized variable has been obtained, has obtained optimized variable combination of process parameters；
(5) influence maximum experimental index in selecting step (4) in optimized variable combination of process parameters on object of experiment, enter Row single factor test changes experiment and secondary Lagrangian method interpolation arithmetic, obtains the combination of process parameters of optimized variable again so that Optimum results are optimal.
Preferably, horizontal parameters choose L in above-mentioned steps (2)18(37)。
Single factor test changes experiment and secondary Lagrangian method interpolation arithmetic：Single factor test is carried out to the second optimized variable to change in fact Sunykatuib analysis is tested, draws gold thread offset curve map, secondary Lagrange interpolation fittings are carried out to gold thread offset curve, chosen Single factor test becomes the single factor test value of dynamic test and corresponding minimum gold thread offset, brings the secondary Lagrange of interpolation formula acquisition into and inserts Value function.
Secondary Lagrange interpolating functions：
P2(x)=0.003x2-0.4632x+17.9138
In above formula, P2(x) minimum gold thread offset is represented, x is the second optimized variable.
Beneficial effects of the present invention：Compared with prior art, effect of the present invention is as follows：
(1) present invention carries out CAE analysis with microchip package module combination orthogonal experiment to microchip plastic part, draws Gold thread offset value under different technical parameters combination；By range analysis, the moulding process ginseng of overvoltage protector has been drawn Count optimized variable is to the primary and secondary order of gold thread bias effect：Fbecd a, specific optimized variable parameter are：Moulding material：GE- 8D (70%Silica), melt temperature：72 DEG C, injection time：1.2s, dwell pressure：70Mpa, hardening time：35s, mould temperature Degree：160℃.Gold thread offset：0.0400mm, offset reduce 4.3% than the minimum offset in orthogonal design table.
(2) moulding material is chosen for GE-8D, passed through by the present invention according to influence size of each parameter to gold thread offset Single factor test is carried out to melt temperature and changes experiment, the similar parabolical gold thread offset value drawn is subjected to secondary Lagrange Interpolation fitting, the approximate rule of the gold thread offset of the chip plastic packaging under single factor test variation is obtained, in conjunction with simulated experiment, Final Optimal Parameters combination is determined：Moulding material：GE-8D, melt temperature：78 DEG C, injection time：1.2s, dwell pressure： 70Mpa, hardening time：35s, mold temperature：160℃.Finally gold thread offset is：0.0362mm, offset compare orthogonal experiment Minimum offset in table reduces 13.9%, 9.6% is improved than orthogonal experiment optimal value, by the secondary of technological parameter Optimization, can obtain optimal forming parameters in section, and the gold thread offset for predicting minimum makes whole technological design stream The journey cycle shortens, design efficiency is higher, time and materials cost reduces, and reduces die trial number and part defect, is actual production Theoretical foundation is provided.
Brief description of the drawings
Fig. 1 is effect curve figure；
Fig. 2 is orthogonal experiment analysis result figure；
Fig. 3 is gold thread offset curve map；
Fig. 4 is optimization analysis result figure again.
Embodiment
Below in conjunction with the accompanying drawings and the present invention is described further specific embodiment.
Embodiment：As shown in figure 1, a kind of re-optimization method of overvoltage protector gold thread skew technological parameter, this method bag Include following steps：
(1) optimized variable is determined：Choosing influences principal element caused by gold thread shift phenomenon becomes as optimized variable, optimization Amount includes mold temperature a, melt temperature b, dwell pressure c, hardening time d, injection time e and moulding material f；
(2) horizontal parameters are chosen according to optimized variable；
(3) horizontal parameters are digitized with processing, designs orthogonal experiment group, using gold thread minimum offset as optimization mesh Mark；
(4) Orthogonal experiment results in step (3) are used into range analysis method, with the minimum standard of gold thread offset, The influence order of optimized variable has been obtained, has obtained optimized variable combination of process parameters；
(5) influence maximum experimental index in selecting step (4) in optimized variable combination of process parameters on object of experiment, enter Row single factor test changes experiment and secondary Lagrangian method interpolation arithmetic, obtains the combination of process parameters of optimized variable again so that Optimum results are optimal.
Preferably, horizontal parameters choose L in above-mentioned steps (2)18(37)。
Single factor test changes experiment and secondary Lagrangian method interpolation arithmetic：Single factor test is carried out to the second optimized variable to change in fact Sunykatuib analysis is tested, draws gold thread offset curve map, secondary Lagrange interpolation fittings are carried out to gold thread offset curve, chosen Single factor test becomes the single factor test value of dynamic test and corresponding minimum gold thread offset, brings the secondary Lagrange of interpolation formula acquisition into and inserts Value function.
Secondary Lagrange interpolating functions：
P2(x)=0.003x2-0.4632x+17.9138
In above formula, P2(x) minimum gold thread offset is represented, x is the second optimized variable.
In order to illustrate the effect of the present invention, tested as follows：
(1) orthogonal test
Orthogonal test main technologic parameters：Mold temperature a, melt temperature (b), dwell pressure (c), hardening time d, injection Time e, moulding material f.Each factor sets three influence levels respectively, as shown in table 1.
The empirical factor water-glass of table 1
Note：Epoxide resin polymer material Ni dem5, GE-8D, GE-7L packing material are powdered solidifying fused silica (Silica), difference is that the accounting of packing material is different, and wherein the filler of Nidem5 materials is 65%Silica, The filler of GE-8D materials is 70%Silica, and the filler of GE-7L materials is 75%Silica.
According to the related data of empirical factor water-glass, L is selected in Orthogonal Experiment and Design18(37) type orthogonal test table, no Consider each factor reciprocation, testing program is as shown in table 2.
The orthogonal design table of table 2
It is calculated analytically, the extreme difference value between different lines is different, and this illustrates the horizontal change of different factors to reality The influence degree for testing result is different.It is bigger, illustrate that influence of the change of the factor level to result of the test is bigger, extreme difference is most Big factor is exactly to influence the most important factor of result of the test.Each affecting parameters are inclined in the gold thread that varying level Imitating is tested Move value to represent with the relation of factor level and extreme difference with figure, such as Fig. 1.
It is apparent that each parameter is to the influence size of index (gold thread offset), i.e. Rf ＞ Rb ＞ Re ＞ from figure Rc ＞ Rd ＞ Ra, the primary and secondary order for obtaining each influence factor are:F2b1e3c1d3a3, i.e. Optimal Parameters are：Moulding material：GE- 8D (70%Silica), melt temperature：72 DEG C, injection time：1.2s, dwell pressure：70Mpa, hardening time：35s, mould temperature Degree：160℃.The parameter combination of optimization is applied into microchip package module to be simulated, the gold thread offset drawn is： 0.0400mm。
(2) single factor test changes experiment and secondary Lagrangian method interpolation method
Influence of the bigger explanation factor of extreme difference R value to testing end value is bigger in orthogonal test, by (g) moulding material After electing GE-8D (70%Silica) as, influence of (b) melt temperature to testing end value is maximum, therefore (b) factor is carried out into list Factor changes experiment, and melt temperature is since 62 DEG C, and spacing is 5 DEG C, and experimental data is as shown in Table 3：
The single factor test of table 3 changes experiment
Experiment is changed to single factor test using microchip package module and carries out sunykatuib analysis, draws gold thread offset curve map：
The rule described according to curve map, secondary Lagrange interpolation fittings are carried out, choosing melt temperature is：72℃、77 DEG C, 82 DEG C and its corresponding gold thread offset, bring secondary Lagrange interpolation formulas into：
Obtain secondary Lagrange interpolating functions：
P2(x)=0.003x2-0.4632x+17.9138
Because secondary Lagrange interpolation is Quadratic interpolation, and function opening upwards, thus it is molten when drawing function minimum Temperature is 77.2 DEG C.The approximation to function is depicted the minimum point of gold thread offset, thus to select melt temperature be 76 DEG C, 77 DEG C, 78 DEG C progress simulated experiments, as shown in table 4：
The Optimal Experimental of table 4
Experiment and secondary Lagrange interpolation methods are changed using single factor test and carry out simulation point with reference to microchip package module Analysis, it is determined that final optimization pass combination of process parameters is：Moulding material：GE-8D (70%Silica), melt temperature：78 DEG C, injection Time：1.2s, dwell pressure：70Mpa, hardening time：35s, mold temperature：160℃.Finally gold thread offset is： 0.0362mm。
Interpretation of result：
(1) CAE analysis is carried out to microchip plastic part with microchip package module combination orthogonal experiment, has drawn difference Gold thread offset value under combination of process parameters；By range analysis, the molding technique parameter optimization of overvoltage protector has been drawn Variable is to the primary and secondary of gold thread bias effect order：Fbecda, specific optimized variable parameter are：Moulding material：GE-8D (70% Silica), melt temperature：72 DEG C, injection time：1.2s, dwell pressure：70Mpa, hardening time：35s, mold temperature：160 ℃.Gold thread offset：0.0400mm, offset reduce 4.3% than the minimum offset in orthogonal design table.
(2) according to influence size of each parameter to gold thread offset, moulding material is chosen for GE-8D, by melt Temperature carries out single factor test and changes experiment, and the similar parabolical gold thread offset value drawn is carried out into secondary Lagrange interpolation intends Close, approximate rule of the gold thread offset of the chip plastic packaging under single factor test variation obtained, in conjunction with simulated experiment, it is determined that Final Optimal Parameters combination：Moulding material：GE-8D, melt temperature：78 DEG C, injection time：1.2s, dwell pressure：70Mpa、 Hardening time：35s, mold temperature：160℃.Finally gold thread offset is：0.0362mm, offset is than in orthogonal design table Minimum offset reduces 13.9%, and 9.6% is improved than orthogonal experiment optimal value, by the double optimization to technological parameter, Optimal forming parameters in section can be obtained, and the gold thread offset for predicting minimum makes the whole Process planning flow cycle Shorten, design efficiency is higher, time and materials cost reduces, reduce die trial number and part defect, reason provided for actual production By foundation.
The foregoing is only a specific embodiment of the invention, but protection scope of the present invention is not limited thereto, any Those familiar with the art the invention discloses technical scope in, change or replacement can be readily occurred in, should all be contained Cover within protection scope of the present invention, therefore, protection scope of the present invention should be based on the protection scope of the described claims.

Claims (4)

  1. A kind of 1. re-optimization method of overvoltage protector gold thread skew technological parameter, it is characterised in that：This method includes following step Suddenly：
    (1) optimized variable is determined：Choosing influences principal element caused by gold thread shift phenomenon as optimized variable, optimized variable bag Include mold temperature a, melt temperature b, dwell pressure c, hardening time d, injection time e and moulding material f；
    (2) horizontal parameters are chosen according to optimized variable；
    (3) horizontal parameters are digitized with processing, orthogonal experiment group is designed, using gold thread minimum offset as optimization aim；
    (4) Orthogonal experiment results in step (3) are used into range analysis method, with the minimum standard of gold thread offset, obtained The influence order of optimized variable, obtains optimized variable combination of process parameters；
    (5) influence maximum experimental index in selecting step (4) in optimized variable combination of process parameters on object of experiment, carry out single Factor changes experiment and secondary Lagrangian method interpolation arithmetic, obtains the combination of process parameters of optimized variable again so that optimization As a result it is optimal.
  2. 2. a kind of re-optimization method of overvoltage protector gold thread skew technological parameter according to claim 1, its feature exist In：Horizontal parameters choose L in step (2)18(37)。
  3. 3. a kind of re-optimization method of overvoltage protector gold thread skew technological parameter according to claim 1, its feature exist In：Single factor test changes experiment and secondary Lagrangian method interpolation arithmetic：Single factor test is carried out to the second optimized variable and changes experiment mould Intend analysis, draw gold thread offset curve map, secondary Lagrange interpolation fittings are carried out to gold thread offset curve, choose Dan Yin Element becomes the single factor test value of dynamic test and corresponding minimum gold thread offset, brings interpolation formula into and obtains secondary Lagrange interpolation letter Number.
  4. 4. a kind of re-optimization method of overvoltage protector gold thread skew technological parameter according to claim 1, its feature exist In：Secondary Lagrange interpolating functions：
    P2(x)=0.003x2-0.4632x+17.9138
    In above formula, P2(x) minimum gold thread offset is represented, x is the second optimized variable.
CN201711107754.7A 2017-11-10 2017-11-10 A kind of re-optimization method of overvoltage protector gold thread skew technological parameter Pending CN107742048A (en)

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CN113806914A (en) * 2021-08-18 2021-12-17 东华大学 Method for optimizing parameters of ultrasonic traceless glue pressing process of fabric based on orthogonal method
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