CN106529034A - Gold wire bonding process optimization method - Google Patents
Gold wire bonding process optimization method Download PDFInfo
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- CN106529034A CN106529034A CN201610987515.4A CN201610987515A CN106529034A CN 106529034 A CN106529034 A CN 106529034A CN 201610987515 A CN201610987515 A CN 201610987515A CN 106529034 A CN106529034 A CN 106529034A
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- G06F30/20—Design optimisation, verification or simulation
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Abstract
The invention relates to a gold wire bonding process optimization method. The gold wire bonding process optimization method comprises the following steps: S1, selecting key factors influencing the gold wire bonding strength; S2, selecting level parameters for the key factors; S3, performing digital processing on the level parameters, designing an orthogonal test group, and checking a test result with a tension test result; S4, performing mathematical analysis on an orthogonal test result obtained in the step S3; S5, building a prediction model, and predicting the influences of gold wire bonding process parameters on bonding quality; and S6, acquiring a process window to achieve a process parameter optimization result. Through adoption of the gold wire process optimization method provided by the invention, the cost and workload are controlled appropriately; comparison among influence priorities of the parameters on process quality is facilitated; the prediction model with high accuracy is obtained; a process parameter window is obtained; and the aim of optimizing a process is fulfilled.
Description
Technical field
The present invention relates to a kind of encapsulation field of quasiconductor, more particularly to a kind of gold thread bonding technology parameter optimization side
Method.
Background technology
Gold thread bonding is the key technology for realizing multi-chip module electric interconnection in quasiconductor.In multi-chip module, lead to
Frequently with gold thread bonding techniques, components and parts and the micro-strips such as monolithic integrated microwave circuit (MMIC), lump type resistance and electric capacity is realized
The interconnection of line, co-planar waveguide, and the interconnection between microwave transmission line or with radio frequency ground plane.Although flip-chip and carrier band are certainly
Dynamic welding technology quickly grows, but gold thread bonding has the advantages that process is simple, cheap, thermal coefficient of expansion are little, navigates in aviation
There is in the Microwave Multichip Module in its field prominent using value.
The good and bad reliability for directly determining semiconductor device of gold thread bonding quality, stability or even overall performance electrical performance.Key
Close quality controlled in many factors such as lead material, bonding face film quality, bonding technology parameters, different technical parameters set
The formation for putting and matching meeting para-linkage quality constitutes appreciable impact.The impact rule of technological parameter para-linkage quality are fully grasped only
Rule, is only possible to each technological parameter of the precise coordination in practical operation, makes bonding effect reach optimum state.
The content of the invention
In view of this, it is an object of the invention to provide a kind of gold thread bonding technology optimization method.
The purpose of the present invention is achieved through the following technical solutions, a kind of gold thread bonding technology optimization method, including
Following steps：S1, choosing affects the key factor of gold thread bond strength；S2, is that key factor chooses horizontal parameters；S3 is right
Horizontal parameters carry out digital processing, design orthogonal test group, with tensile test product test result of the test；S4, by step S3
The result of orthogonal test carries out mathematical analyses；S5, sets up forecast model, predicts the shadow of gold thread bonding technology parameter para-linkage quality
Ring；S6, obtains process window, reaches process parameter optimizing effect.
Further, the material of bond partner is purity >=99%, and the gold thread that 25 μm of diameter, bonding pattern are hot pressing wedge type.
Further, the key factor quantity is 4；The quantity of the horizontal parameters of key factor is 5.
Further, the orthogonal table of the orthogonal test is L25 (54)。
Further, the Mathematical Method includes following sub-step：
S41, variance analyses：
Calculate the average of the corresponding result of each factor each level：
KiN=(factor N takes result sum during horizontal i)/k
Wherein N is the factor label that test is chosen, and k is each parameter correspondence horizontal number；
Calculate sum of square of deviations：
WhereinIt is the meansigma methodss of all result of the tests；
Calculate degree of freedom fN：
fN=k-1；
Obtain variance VN：
VN=SN/fN；
S42, range analysiss：
RN=max | KiN-KjN|=KNmax-KNmin,
Wherein N is the factor label that test is chosen, and k is each parameter correspondence horizontal number.
Further, the forecast model is modeled using Multiple Non Linear Regression；The realistic model of gold thread bonding technology parameter
It is as follows：
Y=f (x1,x2,x3,x4)
Wherein y is tensile test result, x1It is bonding pressure, x2It is to be bonded power, x3It is bonding time, x4It is bonding temperature
Degree, f is the non-linear relation function between input quantity and output.
As using above technical scheme, the present invention has advantages below：
Using the present invention gold thread technique optimization method, cost and workload control it is moderate, be conducive to each parameter pair of comparison
The impact priority of processing quality, obtains the high forecast model of accuracy, obtains mechanical property, reach process optimization mesh
's.
The present invention is conducive to semiconductor packages, obtains gold thread bonding technology window, and on this basis, obtains error and exist
Forecast model within 5%, so that reduce experiment and the human cost of Optimizing Process Parameters.
Description of the drawings
In order that the object, technical solutions and advantages of the present invention are clearer, below in conjunction with accompanying drawing the present invention is made into
The detailed description of one step, wherein：
Fig. 1 is the schematic flow sheet of the present invention；
Fig. 2 is the schematic diagram of the effect curve of present invention process parameter orthogonal test.
Specific embodiment
Below in conjunction with accompanying drawing, the preferred embodiments of the present invention are described in detail.
In order to realize the above-mentioned purpose of the present invention, the invention provides gold thread bonding technology optimization method, methods described bag
Include following steps：
S1, choosing affects the key factor of gold thread bond strength；
Wherein, the key factor quantity selected by the present embodiment is 4：Bonding power, bonding time, bonding pressure, key
Close temperature.
S2, is that key factor chooses horizontal parameters：
Wherein, the horizontal parameters quantity selected by the present embodiment is 5：Bonding pressure, ultrasonic power, ultrasonic time, key
Close temperature, tension intensity.
Horizontal parameters are carried out digital processing by S3, design orthogonal test group, with tensile test product test result of the test,
As shown in table 1；
1 orthogonal test table schematic diagram of table
The result of orthogonal test in step S3 is carried out mathematical analyses, as shown in table 2 by S4；
2 bonding technology parameter of table and test value of thrust analytical table
In the present embodiment, concrete data analysing method is：Method of analysis of variance and extremum difference analysis.
Method of analysis of variance is applied to the significance test for analyzing two or more sample average difference.Due to it is multiple because
There is wave phenomenon in the effect of element, the data of gained.The reason for causing fluctuation has two kinds, and one kind is uncontrollable random factor,
Controllable factor that is another kind of then being experiment condition applying in research.Compared to qualitative modeling, variance can more reflect data from
Scattered feature.Variance analyses are set about from the variance of observation variable, the influence degree size in the numerous control variable of research to result,
By the variation of separate sources of analyzing and researching for the contribution of total variation, so that it is determined that shadow of the controllable factor to result of study
Ring significance.Calculation procedure is as follows：
Calculate the average of the corresponding result of each factor each level：
KiN=(factor N takes result sum during horizontal i)/k,
Wherein N is the factor label that test is chosen, and k is each parameter correspondence horizontal number.
Calculate sum of square of deviations：
WhereinIt is the meansigma methodss of all result of the tests.
Calculate degree of freedom：
fN=k-1.
Calculate variance：
VN=SN/fN。
Extremum difference analysis are used to indicate that the measures of variation in statistics, calculate relatively easy, can show one group
The dispersion degree of data.Extremum difference analysis just can obtain important information by making a small amount of calculating to result of the test, no
Only can directly compare each factor, impact of the reciprocal action between factor to test index can also be compared and optimum is therefrom selected
Technological parameter.Computational methods are as follows：
RN=max | KiN-KjN|=KNmax-KNmin,
Wherein N is the factor label that test is chosen, and k is each parameter correspondence horizontal number.
As shown in table 2 and Fig. 2, can be seen that from range analysiss result R value：Affect bypass module gold thread bonding technology pulling force
As a result factor sequence is followed successively by：Bonding pressure, bonding temperature, ultrasonic power, bonding time；Changes in process parameters is tied to pulling force
Fruit affects larger, shows as extreme difference and changes greatly；And the extreme difference change of pulling force is less.Consider that gold thread bond-pull test value is got over
Greatly, bonding quality is better, it can be deduced that：In 5 horizontal parameters, relatively optimum technological parameter is：Bonding pressure 0.7N, is bonded work(
Rate 2W, bonding time 85ms, 170 DEG C of bonding temperature；Can be seen that from the V-value of the results of analysis of variance：Technological parameter to pulling force
Influence degree is ordered as：Bonding pressure, bonding temperature, bonding time ultrasonic power；This has difference with analysis result directly perceived,
But bonding pressure, temperature are all the ranking influence factors of the first two.
S5：Set up tensile test forecast model.
Intercouple between gold thread bonding technology parameter, between have extremely complex non-linear relation, this can all affect gold
Line bonding quality, therefore, present embodiment is modeled using Multiple Non Linear Regression.
In the present invention, the realistic model of gold thread bonding technology parameter is as follows：
Y=f (x1,x2,x3,x4)
Wherein y is tensile test result, x1It is bonding pressure, x2It is to be bonded power, x3It is bonding time, x4It is bonding temperature
Degree, f is the non-linear relation function between input quantity and output.
It is based on bonding that it is bonding pressure that the present embodiment selects technological parameter, be bonded power, bonding time and bonding temperature
Intercouple between technological parameter, between have an extremely complex non-linear relation, impact of each technological parameter to key and quality is difficult
To be represented with accurate mathematical model.Multiple Non Linear Regression is modeled, more accurately can disclose technological parameter and bonding quality it
Between internal relation.
In the present embodiment, tension intensity and bonding pressure during four collective effects are deposited between bonding power and ultrasonic time
In quadratic function relation, i.e. multivariate nonlinear regression analysis model it is：
Wherein y is bond-pull intensity, and a, b, c, d are unknown parameters to be asked.
Orthogonal experiment results are substituted into, parameters value can be obtained.First every group of variable is normalized,
Modeling is analyzed using SAS softwares again, multivariate nonlinear regression analysis model is set up.
Parameters value is：
a1=-7.564, a2=-6.033, a3=0.146, a4=-2.028；
b1=-0.158, b2=4.915, b3=-1.839, b4=0.111, b5=-2.077, b6=1.608；
c1=-0.122, c2=2.857, c3=2.342, c4=1.572；
D=14.739.
Therefore, regression model is：
Coefficient of determination R2=1-SSE/SST,
Wherein SSE is residual sum of squares (RSS), and SST is total sum of squares.
As shown in table 3, the regression sum of square of model is far longer than residual sum of squares (RSS), illustrates between independent variable and dependent variable
Dependency is fine.
3 nonlinear regression model (NLRM) mathematical analyses of table
Coefficient of determination R2=0.83048, illustrate that the nonlinear regression model (NLRM) for obtaining can explain 83.05% experiment knot
Really, therefore the nonlinear regression model (NLRM) fitting effect is good.
S6：Obtain process window, process optimization；
The error of the regression model is verified, due to having carried out normalized to data when calculating nonlinear regression model (NLRM),
So when substituting into nonlinear regression model (NLRM) validation error, renormalization process will be carried out.It is extra to choose in 5 groups of nonopiate test tables
Data detected.As a result it is as shown in table 4.
Table 4 is tested measured value and is contrasted with nonlinear regression model (NLRM) predictive value
Error analyses result shows that the error of model is respectively less than 5%, illustrates to can be used for when different technical parameters are arranged
Bond-pull prediction of strength.
In the present embodiment, process window parameter is：Bonding pressure 0.7N, is bonded power 2W, bonding time 85ms, bonding
170 DEG C of temperature, now tensile test is 0.71N.
Finally illustrate, preferred embodiment above is only unrestricted to illustrate technical scheme, although logical
Cross above preferred embodiment to be described in detail the present invention, it is to be understood by those skilled in the art that can be
Various changes are made in form and to which in details, without departing from claims of the present invention limited range.
Claims (6)
1. a kind of gold thread bonding technology optimization method, it is characterised in that：Comprise the following steps：
S1, choosing affects the key factor of gold thread bond strength；
S2, is that key factor chooses horizontal parameters；
Horizontal parameters are carried out digital processing by S3, design orthogonal test group, with tensile test product test result of the test；
The result of orthogonal test in step S3 is carried out mathematical analyses by S4；
S5, sets up forecast model, predicts the impact of gold thread bonding technology parameter para-linkage quality；
S6, obtains process window, reaches process parameter optimizing effect.
2. a kind of gold thread bonding technology optimization method according to claim 1, it is characterised in that：The material of bond partner is
Purity >=99%, the gold thread that 25 μm of diameter, bonding pattern are hot pressing wedge type.
3. a kind of gold thread bonding technology optimization method according to claim 1, it is characterised in that：The key factor quantity
For 4；The quantity of the horizontal parameters of key factor is 5.
4. a kind of gold thread bonding technology optimization method according to claim 3, it is characterised in that：The orthogonal test is just
Friendship table is L25 (54)。
5. a kind of gold thread bonding technology optimization method according to claim 1, it is characterised in that：
The Mathematical Method includes following sub-step
S41, variance analyses：
Calculate the average of the corresponding result of each factor each level：
KiN=(factor N takes result sum during horizontal i)/k
Wherein N is the factor label that test is chosen, and k is each parameter correspondence horizontal number；
Calculate sum of square of deviations：
WhereinIt is the meansigma methodss of all result of the tests；
Calculate degree of freedom fN：
fN=k-1；
Obtain variance VN：
VN=SN/fN；
S42, range analysiss：
RN=max | KiN-KjN|=KNmax-KNmin,
Wherein N is the factor label that test is chosen, and k is each parameter correspondence horizontal number.
6. a kind of gold thread bonding technology optimization method according to claim 1, it is characterised in that：The forecast model is adopted
Multiple Non Linear Regression is modeled；
The realistic model of gold thread bonding technology parameter is as follows：
Y=f (x1,x2,x3,x4)
Wherein y is tensile test result, x1It is bonding pressure, x2It is to be bonded power, x3It is bonding time, x4It is bonding temperature, f is
Non-linear relation function between input quantity and output.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107742048A (en) * | 2017-11-10 | 2018-02-27 | 贵州大学 | A kind of re-optimization method of overvoltage protector gold thread skew technological parameter |
| CN109376372A (en) * | 2018-08-29 | 2019-02-22 | 桂林电子科技大学 | A kind of optimization optical interconnection module key position postwelding coupling efficiency method |
| CN117542945A (en) * | 2023-11-13 | 2024-02-09 | 迈铼德微电子科技(无锡)有限公司 | Bonding method of flip MICRO LED chip and substrate |
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| CN102999676A (en) * | 2012-12-24 | 2013-03-27 | 湖南大学 | Process optimization method of steel/aluminum laser welding brazing |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107742048A (en) * | 2017-11-10 | 2018-02-27 | 贵州大学 | A kind of re-optimization method of overvoltage protector gold thread skew technological parameter |
| CN109376372A (en) * | 2018-08-29 | 2019-02-22 | 桂林电子科技大学 | A kind of optimization optical interconnection module key position postwelding coupling efficiency method |
| CN109376372B (en) * | 2018-08-29 | 2022-11-18 | 桂林电子科技大学 | Method for optimizing postweld coupling efficiency of key position of optical interconnection module |
| CN117542945A (en) * | 2023-11-13 | 2024-02-09 | 迈铼德微电子科技(无锡)有限公司 | Bonding method of flip MICRO LED chip and substrate |
| CN117542945B (en) * | 2023-11-13 | 2024-05-14 | 迈铼德微电子科技(无锡)有限公司 | Bonding method of flip MICRO LED chip and substrate |
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Application publication date: 20170322 |