CN107722557A - A kind of ultra-thin capacitance material and preparation method thereof - Google Patents
A kind of ultra-thin capacitance material and preparation method thereof Download PDFInfo
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- CN107722557A CN107722557A CN201610666068.2A CN201610666068A CN107722557A CN 107722557 A CN107722557 A CN 107722557A CN 201610666068 A CN201610666068 A CN 201610666068A CN 107722557 A CN107722557 A CN 107722557A
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Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
- C08L27/02—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L27/12—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
- C08L27/16—Homopolymers or copolymers or vinylidene fluoride
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/14—Organic dielectrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
Abstract
The present invention relates to a kind of ultra-thin capacitance material and preparation method thereof.The ultra-thin capacitance material is made up of the dielectric layer between two layers of electrode and electrode, wherein, the dielectric layer includes inorganic particulate and high molecular polymer, the inorganic particulate is interspersed among the high molecular polymer, and the inorganic particulate is the one or more in the particle with high-k, the particle with low-k and conductive particle.The ultra-thin capacitance material can overcome the bad defect of capacitance material of the prior art, have a higher capacitance density, flexible during use, not easy to crack, do not play fold.
Description
Technical field
The present invention relates to a kind of ultra-thin capacitance material and preparation method thereof, belong to printed substrate technical field.
Background technology
With the development of printed wire plate technique, the development to electronic information material proposes higher and higher requirement.Electricity
Dielectric material is widely applied among printed circuit board as an important component in electronic information material.Electric capacity material
The structure of material is usually to be made up of one layer of dielectric substance of folder among two electrodes.But in application process in the printed circuit boards
It is not easy to crack in use, do not play fold it is required that it has good flexibility, while also require that it has higher electric capacity
Density.The composition for being generally used for the dielectric substance of wiring board is mainly made up of polymeric material, by adding certain nothing
Machine filler can further improve the dielectric constant of material.But when the content of filler is less than 50wt%, Jie of composite
Electric constant improves very little.When filer content further increases, the dielectric constant of composite improves, but its physical property
It can be weakened again.In order to obtain high capacitance density, mainly higher electricity is obtained by reducing the thickness of dielectric substance
Hold density.But the dielectric substance for there is filler to fill, when thickness is reduced to below 20 μm, to preparation technology requirement
It is very harsh, it is easy to the defects of producing bubble, leakage copper, uneven thickness in process of production, so as to influence the yield of material.
The content of the invention
In order to solve the above technical problems, it is an object of the invention to provide a kind of ultra-thin capacitance material and preparation method thereof.Should
Ultra-thin capacitance material can overcome the bad defect of capacitance material of the prior art, have higher capacitance density, used
It is flexible in journey, not easy to crack, do not play fold.
In order to achieve the above object, the invention provides a kind of ultra-thin capacitance material, its be by two layers of electrode and electrode it
Between dielectric layer composition, wherein, the dielectric layer includes inorganic particulate and high molecular polymer, and the inorganic particulate is interspersed in institute
State among high molecular polymer, the inorganic particulate be the particle with high-k, the particle with low-k and
One or more of combinations in conductive particle.
In above-mentioned ultra-thin capacitance material, it is preferable that the electrode is metal foil, more preferably copper foil, aluminium foil, goldleaf and
One or both of silver foil；Preferably, the high molecular polymer includes one kind in thermosetting resin and thermoplastic resin
Or two kinds.
In above-mentioned ultra-thin capacitance material, it is preferable that the particle with high-k refers to that dielectric constant is higher than
One or more of combinations in 100 particle, including barium titanate, strontium titanates, barium strontium titanate and lead zirconate titanate, it is described with low
The particle of dielectric constant refers to the particle that dielectric constant is less than 100, including in silica, titanium oxide, zirconium oxide and zinc oxide
One or more of combinations, the conductive particle is one or more of combinations in gold, silver, copper, aluminium and carbon.
In above-mentioned ultra-thin capacitance material, it is preferable that the thermosetting resin includes epoxy resin, phenolic resin, amino
One or more of combinations in resin, unsaturated polyester (UP), silicon ether-ether and Lauxite；
Preferably, the epoxy resin is bisphenol A epoxide resin, phenol novolak type epoxy, o-cresol formaldehyde asphalt mixtures modified by epoxy resin
One or more of combinations of fat and biphenyl epoxy resin；
It is highly preferred that the bisphenol A type epoxy resin is NPEL128, NPEL of South Asia epoxy resin Co., Ltd production
144th, one or more of groups in NPES901, NPES902, NPES903, NPES904, NPES609, NPES907, NPES909
Close；The bisphenol epoxy is F51, F54 and the production of South Asia epoxy resin Co., Ltd of Wuxi resin Co., Ltd production
NPEF170, EPALLOY8220 and EPALLOY8230 one or more of combinations；The phenol aldehyde type epoxy resin is South Asia
In NPPN638S, NPPN631, EPALLOY8240, EPALLOY8250 and EPALLOY8330 of the production of epoxy resin Co., Ltd
One or more of combinations；The o-cresol formaldehyde epoxy resin is Shandong Shengquan Chemical Industry Co., Ltd.'s production
One or more of combinations in SQCN701, SQCN702, SQCN703 and SQCN704；The biphenyl epoxy resin is Japan three
YX4000, YX4000K, YX4000H, YX4000HK, YL6121H, YL6121HN, NC-7000L of water chestnut chemical production and
One or more of combinations in NC7300L；
Preferably, the phenolic resin is PR-55887, PR-55791A, PR- of SUMITOMO CHEMICAL bakelite Co., Ltd. production
29457、PR-33304、PR29115、PR-33160、PR-33356、PR-34419、PR-55735、PR-43204、PR-55725、
One or more of combinations in PR-55725 and PR-55674；
Preferably, the amino resins be Weng Kaier Co., Ltds of the U.S. production CYMEL303LF, CYMEL325,
One or more of combinations in CYMEL1158, CYMEL1141 and CYMEL1123；
Preferably, the unsaturated polyester (UP) is adjacent benzene-type unsaturated polyester (UP), metaphenylene unsaturated polyester (UP), bisphenol A-type insatiable hunger
With one or more of combinations in polyester and halo unsaturated polyester (UP).
In above-mentioned preparation method, it is preferable that the thermoplastic resin includes polyethylene, polystyrene, polyamide, poly- first
One or more of combinations in aldehyde, makrolon, polyphenylene oxide, polysulfones and polyvinylidene fluoride and its copolymer；
It is highly preferred that the polyvinylidene fluoride that the thermoplastic resin, which is the Ai Fu new materials Co., Ltd of Shanghai three, to be produced,
One or more of combinations in PVDF, P (VDF-TrEE), P (VDF-CTFE) and P (VDF-TrEE-CTFE).
In above-mentioned ultra-thin capacitance material, the particle diameter of the inorganic particulate is less than 10 μm, and shape includes spherical, square, piece
One or more of combinations in shape and dendroid.
In above-mentioned ultra-thin capacitance material, the thickness of the electrode is 6 μm -100 μm；The thickness of the dielectric layer be 1 μm-
20μm；The surface roughness of the electrode and the adhesive surface of the dielectric layer is 2 μm of Rz ＜.
The present invention also provides a kind of preparation method of ultra-thin capacitance material, and it comprises the following steps：
A floor height Molecularly Imprinted Polymer is respectively coated on two electrodes, then the coating inorganic grain on the high molecular polymer
Son, two electrodes are pressed together, then the ultra-thin capacitance material is obtained by solidification, wherein, after pressing
Inorganic particulate can not also contact with electrode material contacts.
, can only coating inorganic grain on a floor height Molecularly Imprinted Polymer of an electrode wherein in above-mentioned preparation method
Son, inorganic particulate can also be respectively coated on two layers of high molecular polymer of two electrodes.
In above-mentioned preparation method, it is preferable that the high molecular polymer is coated in the form of polymer solution, should
Polymer solution through the following steps that prepare：
The high molecular polymer is dissolved in appropriate organic solvent, adds rheological agent, obtain the polymer solution；
The mass percent of high molecular polymer and organic solvent is respectively 20%~99.9%, 0~79%.
The inorganic particulate be in the form of dispersion liquid coat, the dispersion liquid through the following steps that prepare：
The inorganic particulate is mixed with emulsifying agent, volatile organic solvent, the dispersion liquid is obtained by grinding.Nothing
The mass percent of machine particle, emulsifying agent and organic solvent is respectively 10%~85%, 0.1%~1%, 14%~89.9%.
In above-mentioned preparation method, it is preferable that the rheological agent includes association synthesis class, non-association synthesis class, cellulose
One or more in class, organic clay class, organic wax class, metallorganic colloid and natural gum derivative.
In above-mentioned preparation method, it is preferable that the organic solvent is one or both of volatile organic solvent.
When the polymer solution is coated to the electrode, if flowing then adds rheological agent, the matter of the rheological agent
Amount percentage is 0.1%-1%；After adding rheological agent, Polymer Solution Viscosity increase, it is not easy to flow, what can be stablized is coated in
On the electrode.
In above-mentioned preparation method, it is preferable that the volatile organic solvent is arene, fat hydrocarbon, halogenation
One or more of combinations in hydro carbons, alcohols, ethers, esters, ketone and amide solvent；
It is highly preferred that the arene is one or more of combinations in benzene, toluene and dimethylbenzene, the aliphatic hydrocarbon
Class be hexamethylene, cyclohexanone and toluene cyclohexanone in one or more of combinations, the halogenated hydrocarbons be chlorobenzene, dichloro-benzenes and
One or more of combinations in chloroform, the alcohols are one or more of combinations in methanol, ethanol and isopropanol,
The ethers is one or both of ether and expoxy propane, the esters such as methyl acetate, ethyl acetate and propyl acetate
In one or more of combinations, the ketone be acetone, butanone and hexone in one or more of combinations.
In above-mentioned preparation method, it is preferable that the emulsifying agent is nonionic emulsifier, anionic emulsifier and sun
One or more of combinations in ionic emulsifying agent；
It is highly preferred that the nonionic emulsifier is NPE, OPEO, alkyl phenol
APEO, phenethyl phenol polyethenoxy ether, Ben-zylphenol Polyoxyethyl Ether, castor oil polyoxyethylene ether, fatty alcohol polyoxy second
Alkene ether, polyoxyethylene oleic acid ester, stearic acid polyoxyethylene ester, polyoxylethylene abietate, dialkyl benzene sulfonic acids sodium, polyethylene pyrrole
One or more of combinations in pyrrolidone and neopelex, the anionic emulsifier are alkyl phenol polyoxy second
Alkene ether formaldehyde condensation products sulfate and alkyl how one or both of sulfonic formaldehyde condensation compound sodium salt, the cationic emulsifier
For one kind in hexadecyltrimethylammonium chloride, OTAC and DTAC or two
Kind.
In above-mentioned preparation method, it is preferable that the rotating speed of the grinding is 300-5000rpm, more preferably 600rpm；Institute
The time for stating grinding is 8h-12h, preferably 2h-48h.
In above-mentioned preparation method, it is preferable that the temperature of the solidification is 150 DEG C -200 DEG C, more preferably 100 DEG C -230
℃；The time of the solidification is 0.2h-5.5h, more preferably 1h-2.5h.
By the implementation of above technical scheme, it can obtain that size uniformity, flexibility are good, defect is few and have and be higher
The capacitance material of capacitance density.
Brief description of the drawings
Fig. 1 is the structural representation of unitary piece of metal paper tinsel.
Fig. 2 is the structural representation that a floor height Molecularly Imprinted Polymer is coated with unitary piece of metal paper tinsel.
Fig. 3 is the structural representation coated with high molecular polymer and inorganic particulate on unitary piece of metal paper tinsel.
Fig. 4 is inorganic particle layer and the structural representation of the discontiguous capacitance material of metal foil after pressing.
Fig. 5 is the structural representation of the capacitance material that inorganic particulate has contact with metal foil up and down after pressing.
Fig. 6 is the structural representation for the capacitance material for having multilayer inorganic particulate after pressing.
Embodiment
In order to which technical characteristic, purpose and the beneficial effect of the present invention is more clearly understood, now to the skill of the present invention
Art scheme carry out it is described further below, but it is not intended that to the present invention can practical range restriction.
Embodiment 1
Present embodiments provide a kind of ultra-thin capacitance material, itself through the following steps that prepare：
100g Epon828 are dissolved in 90g methylhexahydrophthalic anhydrides and 1g dimethyl tetraethyl imidazoles, stirred
Uniformly, BYK-R607 rheological agent 0.2g are added, obtain the polymer solution；
The 100g barium titanates that particle diameter is 3 μm are mixed with 3g castor oil polyoxyethylene ethers and 250g butanone, are by rotating speed
600rpm ball mill grinding obtains inorganic particulate dispersion liquid after 8 hours；
The copper foil that two pieces of thickness are 35 μm is taken, its structure is as shown in figure 1, the upper surface of its agent structure 1 is mat surface knot
Structure 2, lower surface are smooth surface structure 3；
Using the mode of scraper for coating, each coating thickness is 7 μm of one layer of polymeric solution on two blocks of copper foils, such as Fig. 2
Shown, high polymer layer 4 is formed at the side of mat surface structure 2；
Then one layer of inorganic particulate dispersion liquid is coated on one layer of polymeric solution with the mode of spraying and forms metatitanic acid granellae
Sublayer 5, spraying measure control barium titanate particles thickness degree is controlled as 5 μm by quantitative, as shown in Figure 3；
Two panels copper membrane 1,6 is pressed to together by way of roll-in, as shown in Figure 4, Figure 5, wherein, Fig. 4 is process
Inorganic particle layer and the structural representation of the discontiguous capacitance material of metal foil after pressing, Fig. 5 are the inorganic particulate after pressing
There is the structural representation of the capacitance material of contact up and down with metal foil；When coated with multiple layer inorganic particulate, the electric capacity material that is formed
The structure of material is as shown in Figure 6；
Finally, hot setting is warming up to hot setting 2.5 hours at 190 DEG C at 150 DEG C after 1 hour, obtains thickness and is
19 μm of ultra-thin capacitance material.
The ultra-thin capacitance material is made up of the dielectric layer between two layers of electrode and electrode, wherein, dielectric layer includes inorganic
Particle barium titanate and high molecular polymer Epon828, inorganic particulate are interspersed among high molecular polymer.
Embodiment 2
Present embodiments provide a kind of ultra-thin capacitance material, itself through the following steps that prepare：
100g polyvinylidene fluoride is dissolved in 250g DMFs, adds BYK-R607 0.35g, stirring
Uniformly, the polymer solution is obtained；
The 100g zinc oxide that particle diameter is 200nm is mixed with 3g AEOs and 250g butanone, passes through rotating speed
After 600rpm ball mill grinding 8 hours, inorganic particulate dispersion liquid is obtained；
The copper foil that two pieces of thickness are 8 μm is taken, its structure is as shown in figure 1, the upper surface of its agent structure 1 is mat surface structure
2, lower surface is smooth surface structure 3；
Using the mode of spraying, the polymer solution that respectively coating a layer thickness is 5 μm on two blocks of copper foils, as shown in Fig. 2
High polymer layer 4 is formed at the side of mat surface structure 2；
Then with the mode of spraying, each one layer of inorganic particulate dispersion liquid of coating forms zinc oxide on two layers of polymers solution
Particle layer 5, spraying measure control zinc oxide particles thickness degree is controlled as 2 μm by quantitative, as shown in Figure 3；
By way of roll-in, two panels copper membrane 1,6 is pressed to together, as shown in Figure 4, Figure 5, wherein, Fig. 4 is process
Inorganic particle layer and the structural representation of the discontiguous capacitance material of metal foil after pressing, Fig. 5 are the inorganic particulate after pressing
There is the structural representation of the capacitance material of contact up and down with metal foil；When coated with multiple layer inorganic particulate, the electric capacity material that is formed
The structure of material is as shown in Figure 6；Finally, the high-temperature heat treatment 30min at 200 DEG C, the ultra-thin capacitance material that thickness is 12 μm is obtained,
Detailed process and structure are as shown in figs 1 to 6.
The ultra-thin capacitance material is made up of the dielectric layer between two layers of electrode and electrode, wherein, dielectric layer includes inorganic
Particle zinc oxide and high molecular polymer polyvinylidene fluoride, inorganic particulate are interspersed among high molecular polymer.
Embodiment 3
Present embodiments provide a kind of ultra-thin capacitance material, itself through the following steps that prepare：
100g EPPN-638S are dissolved in 90g methylhexahydrophthalic anhydrides, 1g dimethyl tetraethyl imidazoles and 50g fourths
In ketone, stir, add BYK-R607 rheological agent 0.24g, obtain the polymer solution；
The 10g Argent grains that particle diameter is 250nm are mixed with 0.5g castor oil polyoxyethylene ethers and 200g butanone, pass through rotating speed
After 600rpm ball mill grinding 12 hours, inorganic particulate dispersion liquid is obtained；
The copper foil that two pieces of thickness are 70 μm is taken, its structure is as shown in figure 1, the upper surface of its agent structure 1 is mat surface knot
Structure 2, lower surface are smooth surface structure 3；
Using the mode of spraying, each coating thickness is 2 μm of one layer of polymeric solution on two blocks of copper foils, as shown in Fig. 2
High polymer layer 4 is formed at the side of mat surface structure 2；
Then the silver granuel sublayer 5 that a layer thickness is 1 μm is coated on one layer of polymeric solution with the mode of spraying, such as Fig. 3
It is shown；
Two panels copper membrane 1,6 is pressed to together by way of vacuum lamination, as shown in Figure 4, Figure 5, wherein, Fig. 4 is
Inorganic particle layer and the structural representation of the discontiguous capacitance material of metal foil after pressing, Fig. 5 are inorganic after pressing
Particle has the structural representation of the capacitance material of contact with metal foil up and down；When coated with multiple layer inorganic particulate, the electricity that is formed
The structure of capacity materials is as shown in Figure 6；
Finally, hot setting is warming up to hot setting 2.5 hours at 190 DEG C at 150 DEG C after 1 hour, obtains thickness as 5
μm ultra-thin capacitance material, detailed process and structure are as shown in figs 1 to 6.
The ultra-thin capacitance material is made up of the dielectric layer between two layers of electrode and electrode, wherein, dielectric layer includes inorganic
Particle Argent grain and high molecular polymer EPPN-638S, inorganic particulate are interspersed among high molecular polymer.
Claims (10)
1. a kind of ultra-thin capacitance material, it is made up of the dielectric layer between two layers of electrode and electrode, wherein, the dielectric layer bag
Containing inorganic particulate and high molecular polymer, the inorganic particulate is interspersed among the high molecular polymer, the inorganic particulate
It is one or more of in the particle with high-k, the particle with low-k and conductive particle
Combination.
2. ultra-thin capacitance material as claimed in claim 1, wherein, the electrode is metal foil, it is preferable that the metal foil is
One or both of copper foil, aluminium foil, goldleaf and silver foil；The high molecular polymer includes thermosetting resin and thermoplastic resin
One or both of.
3. ultra-thin capacitance material as claimed in claim 1 or 2, wherein, the particle with high-k includes metatitanic acid
One or more of combinations in barium, strontium titanates, barium strontium titanate and lead zirconate titanate, the particle with low-k include
One or more of combinations in silica, titanium oxide, zirconium oxide and zinc oxide, the conductive particle be gold, silver,
One or more of combinations in copper, aluminium and carbon.
4. ultra-thin capacitance material as claimed in claim 1 or 2, wherein, the thermosetting resin includes epoxy resin, phenolic aldehyde tree
One or more of combinations in fat, amino resins, unsaturated polyester (UP), silicon ether-ether and Lauxite；
Preferably, the epoxy resin is bisphenol epoxy, phenol aldehyde type epoxy resin, o-cresol formaldehyde epoxy resin and cyclohexyl biphenyl
One or more of combinations of oxygen tree fat；
Preferably, the thermoplastic resin includes polyethylene, polystyrene, polyamide, polyformaldehyde, makrolon, polyphenylene oxide, poly-
One or more of combinations in sulfone and polyvinylidene fluoride and its copolymer.
5. the ultra-thin capacitance material as any one of claim 1-4, wherein, the particle diameter of the inorganic particulate is less than 10 μ
M, shape include one or more of combinations in spherical, square, sheet and dendroid.
6. the ultra-thin capacitance material as any one of claim 1-5, wherein, the thickness of the electrode is 6 μm -100 μm；
The thickness of the dielectric layer is 1 μm -20 μm；The surface roughness of the electrode and the adhesive surface of the dielectric layer is 2 μm of Rz ＜.
7. the preparation method of the ultra-thin capacitance material described in claim any one of 1-6, it comprises the following steps：
The each one floor height Molecularly Imprinted Polymer of coating on two electrodes, then wherein on one layer or two layers of high molecular polymer
Coating inorganic particle, two electrodes are pressed together, then the ultra-thin capacitance material is obtained by solidification.
8. preparation method as claimed in claim 7, the high molecular polymer is coated in the form of polymer solution, should
Polymer solution through the following steps that prepare：
High molecular polymer will be stated to be dissolved in appropriate organic solvent, obtain the polymer solution, high molecular polymer and had
The mass percent of solvent is respectively 20%~99.9%, 0~79%；
The inorganic particulate be in the form of dispersion liquid coat, the dispersion liquid through the following steps that prepare：By the nothing
Machine particle is mixed with emulsifying agent, volatile organic solvent, and the dispersion liquid is obtained by grinding, inorganic particulate, emulsifying agent and
The mass percent of organic solvent is respectively 10%~85%, 0.1%~1%, 14%~89.9%.
9. preparation method as claimed in claim 8, wherein, the organic solvent is volatile organic solvent；
When the polymer solution is coated to the electrode, if flowing then adds rheological agent, the quality hundred of the rheological agent
It is 0.1%-1% to divide ratio；Preferably, the rheological agent includes association synthesis class rheological agent, non-association synthesis class rheological agent, fiber
One in plain class rheological agent, organic clay class rheological agent, organic wax class rheological agent, metallorganic colloid and natural gum derivative
Kind is several；
Preferably, the volatile organic solvent is arene, fat hydrocarbon, halogenated hydrocarbons, alcohols, ethers, esters, ketone
One or more of combinations in class and amide-type；
Preferably, the emulsifying agent be nonionic emulsifier, anionic emulsifier and cationic emulsifier in one kind or
Several combinations.
10. preparation method as claimed in any one of claims 7-9, wherein, in above-mentioned preparation method, the grinding turns
Speed is 300-5000rpm, preferably 600rpm；The time of the grinding is 8h-12h, preferably 2h-48h；
The temperature of the solidification is 150 DEG C -200 DEG C, preferably 100 DEG C -230 DEG C；The time of the solidification is 0.2h-5.5h,
Preferably 1h-2.5h.
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109054297A (en) * | 2018-07-13 | 2018-12-21 | 吴江市聚盈电子材料科技有限公司 | A kind of low-loss dielectric composite material preparation method |
| CN110310829A (en) * | 2019-05-23 | 2019-10-08 | 深圳先进技术研究院 | Buried capacitor material, preparation method and printed wiring board |
| WO2020118551A1 (en) * | 2018-12-12 | 2020-06-18 | 深圳先进技术研究院 | Three-dimensional flexible capacitor material, preparation method therefor, and application thereof |
| WO2020232693A1 (en) * | 2019-05-23 | 2020-11-26 | 深圳先进技术研究院 | Buried capacitive material, preparation method therefor and printed circuit board |
| CN112890789A (en) * | 2021-01-19 | 2021-06-04 | 北京邮电大学 | Flexible capacitive sensor and preparation method and application thereof |
| CN113739693A (en) * | 2021-09-06 | 2021-12-03 | 中国工程物理研究院总体工程研究所 | Flexible hollow spherical roughness measuring head based on capacitance method |
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| CN110310829A (en) * | 2019-05-23 | 2019-10-08 | 深圳先进技术研究院 | Buried capacitor material, preparation method and printed wiring board |
| WO2020232693A1 (en) * | 2019-05-23 | 2020-11-26 | 深圳先进技术研究院 | Buried capacitive material, preparation method therefor and printed circuit board |
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| CN113739693A (en) * | 2021-09-06 | 2021-12-03 | 中国工程物理研究院总体工程研究所 | Flexible hollow spherical roughness measuring head based on capacitance method |
| CN113739693B (en) * | 2021-09-06 | 2024-01-30 | 中国工程物理研究院总体工程研究所 | Flexible hollow sphere roughness measuring head based on capacitance method |
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