CN107706299A - A kind of stack PZT (piezoelectric transducer) and preparation method suitable for road piezo-electric generating - Google Patents

A kind of stack PZT (piezoelectric transducer) and preparation method suitable for road piezo-electric generating Download PDF

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CN107706299A
CN107706299A CN201710724955.5A CN201710724955A CN107706299A CN 107706299 A CN107706299 A CN 107706299A CN 201710724955 A CN201710724955 A CN 201710724955A CN 107706299 A CN107706299 A CN 107706299A
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fillet
ceramic substrate
piezoelectric ceramics
stack
face
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CN107706299B (en
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王朝辉
宋志�
李彦伟
高志伟
王海梁
王帅
赵建雄
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Changan University
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/01Manufacture or treatment
    • H10N30/03Assembling devices that include piezoelectric or electrostrictive parts
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/01Manufacture or treatment
    • H10N30/06Forming electrodes or interconnections, e.g. leads or terminals
    • H10N30/063Forming interconnections, e.g. connection electrodes of multilayered piezoelectric or electrostrictive parts
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/50Piezoelectric or electrostrictive devices having a stacked or multilayer structure
    • H10N30/501Piezoelectric or electrostrictive devices having a stacked or multilayer structure with non-rectangular cross-section in stacking direction, e.g. polygonal, trapezoidal

Abstract

The invention provides a kind of stack PZT (piezoelectric transducer) and preparation method suitable for road piezo-electric generating, the preparation method makes round ceramic substrate successively, makes fillet ceramic substrate, makes fillet piezoelectric ceramics monolithic, stack piezoelectric ceramics is made, makes stack PZT (piezoelectric transducer).Structure, shape of the present invention from manufacture craft to piezoelectric ceramic piece optimize, ensure the symmetry and uniformity of two lateral electrode brushings, fillet technique may be such that there is good stickiness to avoid Lou porcelain phenomenon for electrode layer and potsherd, reach good endurance, the purpose of service life length;Meanwhile the setting of both sides metallic plate can increase structural integrity and intensity.The stack PZT (piezoelectric transducer) that stack PZT (piezoelectric transducer) produced by the present invention is applied to road piezo-electric generating has the advantages that power photoelectric transformation efficiency is high, rigidity is big, compound with regular structure.

Description

A kind of stack PZT (piezoelectric transducer) and preparation method suitable for road piezo-electric generating
Technical field
The invention belongs to field of road, is related in road piezo-electric generating, and in particular to one kind is applied to road piezoelectricity The stack PZT (piezoelectric transducer) and preparation method of generating.
Background technology
China's road network is increasingly flourishing, and road undertakes increasing vehicular load.The continuous impact and shake of vehicular load It is dynamic to produce endlessly mechanical energy.If this mechanical energy is effectively collected and converted to electric energy, it will as except too Positive energy, wind energy, another clean energy resource outside nuclear energy.At this stage, China explores the cleaning production of novel intelligent piezo power generation pavement actively Energy pattern, to practicing green traffic, green highway construction is promoted, is completed《Communications and transportation energy-conserving and environment-protective " 13 " development plan》 Target has Great significance.
At present, stack PZT (piezoelectric transducer) has the characteristics that high power-photoelectric transformation efficiency, road coupling and good endurance, It is more suitable for the collection of energy in the road field that load is big, frequency is low, working environment is complicated.Conventional stack PZT (piezoelectric transducer) system There is only stone to burn two kinds of method and electrode adhesion method altogether as technique.According to existing data, because only stone burns method sintering temperature less than electricity altogether The optimal sintering temperature of very viscous connection monolithic, so the parameters such as its transducing and mechanical performance are slightly below optimal parameter, so as to Influence conversion efficiency and the structural behaviour of piezoelectric ceramics;Solely though stone burns stack PZT (piezoelectric transducer) globality made from method altogether simultaneously It is good, but fragility is big, is destroyed once at all impaired entirety, and the stack PZT (piezoelectric transducer) globality and collapse resistance of electrode adhesion method Performance is more preferable, so electrode adhesion method is preferably used as the production technology of road PZT (piezoelectric transducer).
However, electrode adhesion method when manually applying brush electrode, because potsherd outer rim has corner angle, can have electricity in edges and corners Pole layer and potsherd stickiness are poor, leak the problems such as porcelain, and are difficult to ensure that symmetry and uniformity that electrode layer two sides is brushed;This Outside, the problems such as piezoelectric ceramic piece horizontal sliding is there is also during stacking.Therefore, need a kind of prioritization scheme badly and cause PZT (piezoelectric transducer) With mass production and maximum effect can be played to meet the needs of road collection of energy field.
The content of the invention
In view of the deficienciess of the prior art, it is an object of the present invention to provide a kind of suitable for road piezo-electric generating Stack PZT (piezoelectric transducer) and preparation method, solve existing PZT (piezoelectric transducer) poor durability, the technical problem of short life.
In order to solve the above-mentioned technical problem, the present invention, which adopts the following technical scheme that, is achieved:
A kind of preparation method of stack PZT (piezoelectric transducer) suitable for road piezo-electric generating, the preparation method include following Step:
Step 1: make round ceramic substrate:
Round ceramic substrate is made using conventional method;
Step 2: make fillet ceramic substrate:
Round ceramic substrate made from step 1 is fixed with fixture, from the symmetrical both ends of round ceramic substrate to circle centre position Polishing, form a pair of symmetrical electrode adhesion end faces;One arris of one electrode adhesion end face is fallen with chamfer tool Fillet processing, rounding processing is carried out to another arris of another electrode adhesion end face with chamfer tool, form circle and fall Angle, two rounded corners are connected with two different surfaces of round ceramic substrate respectively, and fillet ceramic substrate is made;
Step 3, make fillet piezoelectric ceramics monolithic:
Made from each step 2 exclusion region, exclusion region and circle are also respectively provided with two surfaces of fillet ceramic substrate Shape chamfering is oppositely arranged on two surfaces of fillet ceramic substrate, and the end through electrode of exclusion region bonds end face;Each circle Position on two surfaces of angle ceramic substrate in addition to exclusion region is conduction region;
Insulating epoxy glue is printed in exclusion region using screen process press, led using screen process press in conduction region printing Electric elargol, using manual pen in electrode adhesion end coating conductive silver glue;
Dry 15 minutes under the conditions of 150 DEG C, then fillet ceramic substrate is polarized so that each fillet ceramic base The conduction region on one surface of piece forms positive pole-face, and the conduction region on another surface forms negative pole face, fillet piezoelectric ceramics is made Monolithic;
Step 4, make stack piezoelectric ceramics:
Multiple fillet piezoelectric ceramics monolithics made from step 3 are stacked in a manner of physics series connection and electrical parallel, are used in combination Tightening device fixed clamp, 120 DEG C are warming up to after vertical static pressure and is solidified 4~5 hours, stack piezoelectric ceramics is made;
Described physics series connection and the mode of electrical parallel are specially:
Multiple fillet piezoelectric ceramics monolithics are stacked and realize that physics is connected;
It is in contact conducting by conductive silver glue between the positive pole-face of adjacent fillet piezoelectric ceramics monolithic so that multiple fillet pressures The positive pole-face turned in parallel of electroceramics monolithic;It is in contact between the negative pole face of adjacent fillet piezoelectric ceramics monolithic by conductive silver glue Conducting so that the negative pole face of multiple fillet piezoelectric ceramics monolithics also turned in parallel;A pair of circles of adjacent fillet piezoelectric ceramics monolithic Shape chamfering is disposed adjacent, and a pair of exclusion regions of adjacent fillet piezoelectric ceramics monolithic are in contact insulation by insulating epoxy glue, So that positive pole-face and the negative pole face of multiple fillet piezoelectric ceramics monolithic parallel conductings mutually completely cuts off, electrical parallel is realized;
Step 5, make stack PZT (piezoelectric transducer):
The both ends of stack piezoelectric ceramics made from step 4 are bonded into each self-forming one in end face by multiple electrodes respectively Electrode adhesion face, i.e. positive pole adhesive surface and negative pole adhesive surface, are bonded with cathode metal piece on positive pole adhesive surface, on negative pole adhesive surface Negative metal piece is bonded with, cathode metal piece and negative metal piece are connected by solder joint with wire respectively;
Top surface insulation ceramics is bonded in the top surface of stack piezoelectric ceramics, bottom surface is bonded in the bottom surface of stack piezoelectric ceramics Insulate ceramics, and stack PZT (piezoelectric transducer) is made.
The present invention also has following distinguishing feature:
In step 1, as a preferred embodiment, the conventional method of described making round ceramic substrate is:Ceramic powder is forged Burn and mixed after ball milling with solvent, dispersant and defrother, binding agent, plasticizer and lubricant are added after wet ball grinding, so Secondary mix grinding 12h forms slurry afterwards, is molded and cut using casting machine, and round ceramic substrate is made after dumping sintering.
In step 2, the distance in the center of circle of the described electrode adhesion end face to round ceramic substrate is than round ceramic substrate The small 0.3mm of radius;A diameter of 30mm of described round ceramic substrate;
In step 2, chamfer radius when described rounding is handled are 0.3~0.6 times of round ceramic substrate thickness, It is preferred that 0.5 times.
In step 2, described fixture is gripped by the way of clamping up and down to round ceramic substrate.
In step 4, described tightening device includes a pair of lock ring half-shells to match with stack piezoelectric ceramics, a pair Two inclines of fastening half-shell are connected by hinge, are provided with what can be fastened for a pair on another two inclines of a pair of fastening half-shells Buckle;The bottom of a pair of described fastening half-shells is configured with base.
In step 4, the pressure of described vertical static pressure is 20kPa, and the speed of described heating is 3 DEG C/min.
In step 5, described solder joint is sealed by epoxy resin.
A kind of stack PZT (piezoelectric transducer) suitable for road piezo-electric generating, described stack PZT (piezoelectric transducer) is using such as Upper described preparation method is made.
The present invention compared with prior art, has the following technical effect that:
(I) structure, shape of the present invention from manufacture craft to piezoelectric ceramic piece optimize, and ensure two lateral electrode brushings Symmetry and uniformity, fillet technique may be such that there is good stickiness to avoid Lou porcelain phenomenon for electrode layer and potsherd, reach The purpose grown to good endurance, service life;Meanwhile the setting of both sides metallic plate can increase structural integrity and intensity.
(II) manufacture craft of PZT (piezoelectric transducer) of the invention is simple, and cost is cheap, cost-effective, can meet different road surfaces Condition uses.
(III) stack PZT (piezoelectric transducer) produced by the present invention is simple in construction, and manufacture craft is convenient and good endurance, use Long lifespan, it is practical, more electric energy are collected, reaches and is widely used in highway, urban road and Special section road And rebuilding old road.Suitable for road piezo-electric generating stack PZT (piezoelectric transducer) have power-photoelectric transformation efficiency is high, rigidity is big, The advantages that compound with regular structure.
Brief description of the drawings
Fig. 1 is the overall structure diagram of stack PZT (piezoelectric transducer).
Fig. 2 is the decomposition texture schematic diagram of stack PZT (piezoelectric transducer).
Fig. 3 is the structural representation of stack piezoelectric ceramics.
Fig. 4 is the structural representation of the positive pole-face of fillet piezoelectric ceramics monolithic.
Fig. 5 is the structural representation in the negative pole face of fillet piezoelectric ceramics monolithic.
Fig. 6 is the view that rounding processing is carried out to round ceramic substrate.
Fig. 7 is the structural representation of the fillet ceramic substrate obtained after rounding is handled.
Fig. 8 is the structural representation of tightening device.
The implication of each label is in figure:1- round ceramic substrates, 2- fixtures, 3- electrode adhesions end face, 4- electrode adhesions End face, 5- rounded corners, 6- fillet ceramic substrates, 7- exclusion regions, 8- conduction regions, 9- insulating epoxy glue, 10- conductive silvers Glue, the positive pole-faces of 11-, 12- negative poles face, 13- fillet piezoelectric ceramics monolithics, 14- stack piezoelectric ceramics, 15- positive pole adhesive surfaces, 16- negative pole adhesive surfaces, 17- cathode metal pieces, 18- negative metal pieces, 19- solder joints, 20- tightening devices, 21- chamfer tools, 22- Wire, 23- top surfaces insulation ceramics, 24- bottom surfaces insulation ceramics;
(20-1)-lock ring half-shell, (20-2)-lock ring half-shell, (20-3)-hinge, (20-4)-buckle, (20-5)-base;
A and B represents an electrode adhesion end face respectively.
Explanation is further explained in detail to the particular content of the present invention with reference to embodiments.
Embodiment
Specific embodiment of the invention given below is, it is necessary to which explanation is that the invention is not limited in implement in detail below Example, all equivalents done on the basis of technical scheme each fall within protection scope of the present invention.
Embodiment:
Above-mentioned technical proposal is deferred to, as shown in Figures 1 to 8, the present embodiment provides a kind of suitable for road piezo-electric generating The preparation method of stack PZT (piezoelectric transducer), the preparation method comprise the following steps:
Step 1: make round ceramic substrate:
Round ceramic substrate 1 is made using conventional method.
In the present embodiment, as a preferred embodiment, the conventional method for making round ceramic substrate is:By ceramic powder calcining simultaneously Mixed after ball milling with solvent, dispersant and defrother, binding agent, plasticizer and lubricant are added after wet ball grinding, then two Secondary mix grinding 12h forms slurry, is molded and cut using casting machine, and round ceramic substrate is made after dumping sintering.
Step 2: make fillet ceramic substrate:
Round ceramic substrate 1 made from step 1 is fixed with fixture 2, from 1 symmetrical both ends of round ceramic substrate to circle Polished at the heart, form a pair of symmetrical electrode adhesion end faces 3,4;One with chamfer tool 21 to an electrode adhesion end face 3 Arris carries out rounding processing, and another arris of another electrode adhesion end face 4 is carried out at rounding with chamfer tool 21 Reason, rounded corners 5 are formed, two rounded corners 5 are connected with two different surfaces of round ceramic substrate 1 respectively, and fillet is made Ceramic substrate 6;
In the present embodiment, the distance in the center of circle of electrode adhesion end face 3,4 to round ceramic substrate 1 is than round ceramic substrate 1 The small 0.3mm of radius.A diameter of 30mm of round ceramic substrate 1;
In the present embodiment, chamfer radius when rounding is handled are 0.3~0.6 times of the thickness of round ceramic substrate 1, this reality It is 0.5 times to apply a preferred result in example.
In the present embodiment, fixture 2 is gripped by the way of clamping up and down to round ceramic substrate 1.
Step 3, make fillet piezoelectric ceramics monolithic:
Made from each step 2 exclusion region 7, exclusion region 7 are also respectively provided with two surfaces of fillet ceramic substrate 6 It is oppositely arranged with rounded corners 5 on two surfaces of fillet ceramic substrate 6, the end through electrode of exclusion region 7 bonds end face 3、4;Position on two surfaces of each fillet ceramic substrate 6 in addition to exclusion region 7 is conduction region 8;
Insulating epoxy glue 9 is printed in exclusion region 7 using screen process press, printed using screen process press in conduction region 8 Brush conductive silver glue 10, using manual pen in electrode adhesion end face 3,4 brushing conductive silver glues 10;
Dry 15 minutes under the conditions of 150 DEG C, then fillet ceramic substrate 6 is polarized so that each fillet ceramics The conduction region 8 on one surface of substrate 6 forms positive pole-face 11, and the conduction region 8 on another surface forms negative pole face 12, fillet is made Piezoelectric ceramics monolithic 13;
Step 4, make stack piezoelectric ceramics:
Multiple fillet piezoelectric ceramics monolithics 13 made from step 3 are stacked in a manner of physics series connection and electrical parallel, and With the fixed clamp of tightening device 20,120 DEG C are warming up to after vertical static pressure and is solidified 4~5 hours, stack piezoelectric ceramics is made 14;
The pressure of vertical static pressure is 20kPa, and the speed of described heating is 3 DEG C/min.
Described physics series connection and the mode of electrical parallel are specially:
Multiple fillet piezoelectric ceramics monolithics 13 are stacked and realize that physics is connected.
It is in contact conducting by conductive silver glue 10 between the positive pole-face 11 of adjacent fillet piezoelectric ceramics monolithic 13 so that multiple The positive pole-face turned in parallel of fillet piezoelectric ceramics monolithic 13;By leading between the negative pole face 12 of adjacent fillet piezoelectric ceramics monolithic 13 Electric elargol 10 is in contact conducting so that the negative pole face 12 of multiple fillet piezoelectric ceramics monolithics 13 also turned in parallel;Adjacent fillet pressure A pair of rounded corners 5 of electroceramics monolithic 13 are disposed adjacent, and a pair of exclusion regions 7 of adjacent fillet piezoelectric ceramics monolithic 13 are by exhausted Edge epoxide-resin glue is in contact insulation so that the positive pole-face 11 of multiple turned in parallel of fillet piezoelectric ceramics monolithic 13 and negative pole face 12 Mutually isolation, realizes electrical parallel.
Tightening device 20 in the present embodiment include a pair of lock ring half-shell 20-1 to match with stack piezoelectric ceramics 14, 20-2, two inclines of a pair of fastening half-shells 20-1,20-2 are connected by hinge 20-3, a pair of fastening half-shells 20-1,20-2 A pair of buckle 20-4 that can be fastened are provided with another two inclines;Match somebody with somebody the bottom of a pair of described fastening half-shells 20-1,20-2 It is cased with base 20-5.
Step 5, make stack PZT (piezoelectric transducer):
The both ends of stack piezoelectric ceramics 14 made from step 4 are bonded into each self-forming one in end face 3 by multiple electrodes respectively Individual electrode adhesion face, i.e. positive pole adhesive surface 15 and negative pole adhesive surface 16, cathode metal piece 17 is bonded with positive pole adhesive surface 15, bear Negative metal piece 18 is bonded with very viscous junction 16, cathode metal piece 17 and negative metal piece 18 pass through solder joint 19 and wire respectively 22 are connected;
Top surface insulation ceramics 23 is bonded in the top surface of stack piezoelectric ceramics 14, is glued in the bottom surface of stack piezoelectric ceramics 14 Bottom surface insulation ceramics 24 is tied, stack PZT (piezoelectric transducer) is made.
Solder joint 19 in the present embodiment is sealed by insulating epoxy glue 9.
Embodiment 2:
The present embodiment provides a kind of stack PZT (piezoelectric transducer) suitable for road piezo-electric generating, as shown in Figure 1 to Figure 5, wherein, The stack PZT (piezoelectric transducer) is made using the preparation method of embodiment 1.

Claims (9)

  1. A kind of 1. preparation method of stack PZT (piezoelectric transducer) suitable for road piezo-electric generating, it is characterised in that the making side Method comprises the following steps:
    Step 1: make round ceramic substrate:
    Round ceramic substrate (1) is made using conventional method;
    Step 2: make fillet ceramic substrate:
    Round ceramic substrate (1) made from step 1 is fixed with fixture (2), from the symmetrical both ends of round ceramic substrate (1) to Circle centre position is polished, and forms a pair of symmetrical electrode adhesion end faces (3,4);With chamfer tool (21) to an electrode adhesion end face (3) a arris carries out rounding processing, another arris with chamfer tool (21) to another electrode adhesion end face (4) Rounding processing is carried out, forms rounded corners (5), two rounded corners (5), two differences with round ceramic substrate (1) respectively Surface is connected, and fillet ceramic substrate (6) is made;
    Step 3, make fillet piezoelectric ceramics monolithic:
    Made from each step 2 exclusion region (7), exclusion region are also respectively provided with two surfaces of fillet ceramic substrate (6) (7) it is oppositely arranged with rounded corners (5) on two surfaces of fillet ceramic substrate (6), the end through electrode of exclusion region (7) Bond end face (3,4);Position on two surfaces of each fillet ceramic substrate (6) in addition to exclusion region (7) is conduction region (8);
    Insulating epoxy glue (9) is printed in exclusion region (7) using screen process press, using screen process press in conduction region (8) Conductive silver glue (10) is printed, using manual pen in electrode adhesion end face (3,4) brushing conductive silver glue (10);
    Dry 15 minutes under the conditions of 150 DEG C, then fillet ceramic substrate (6) is polarized so that each fillet ceramic base The conduction region (8) on one surface of piece (6) forms positive pole-face (11), and the conduction region (8) on another surface forms negative pole face (12), Fillet piezoelectric ceramics monolithic (13) is made;
    Step 4, make stack piezoelectric ceramics:
    Multiple fillet piezoelectric ceramics monolithics (13) made from step 3 are stacked in a manner of physics series connection and electrical parallel, are used in combination Tightening device (20) fixed clamp, 120 DEG C are warming up to after vertical static pressure and is solidified 4~5 hours, stack piezoelectric ceramics is made (14);
    Described physics series connection and the mode of electrical parallel are specially:
    Multiple fillet piezoelectric ceramics monolithics (13) are stacked and realize that physics is connected;
    It is in contact conducting by conductive silver glue (10) between the positive pole-face (11) of adjacent fillet piezoelectric ceramics monolithic (13) so that more The positive pole-face turned in parallel of individual fillet piezoelectric ceramics monolithic (13);The negative pole face (12) of adjacent fillet piezoelectric ceramics monolithic (13) it Between be in contact conducting by conductive silver glue (10) so that also parallel connection is led in the negative pole face (12) of multiple fillet piezoelectric ceramics monolithics (13) It is logical;A pair of rounded corners (5) of adjacent fillet piezoelectric ceramics monolithic (13) are disposed adjacent, adjacent fillet piezoelectric ceramics monolithic (13) A pair of exclusion regions (7) be in contact insulation by insulating epoxy glue so that multiple fillet piezoelectric ceramics monolithics (13) are in parallel The positive pole-face (11) of conducting and negative pole face (12) mutually completely cut off, and realize electrical parallel;
    Step 5, make stack PZT (piezoelectric transducer):
    The both ends of stack piezoelectric ceramics (14) made from step 4 are bonded into end face (3) each self-forming one by multiple electrodes respectively Individual electrode adhesion face, i.e. positive pole adhesive surface (15) and negative pole adhesive surface (16), positive pole adhesive surface are bonded with cathode metal on (15) Piece (17), negative metal piece (18), cathode metal piece (17) and negative metal piece (18) point are bonded with negative pole adhesive surface (16) It is not connected by solder joint (19) with wire (22);
    Top surface insulation ceramics (23) is bonded in the top surface of stack piezoelectric ceramics (14), in the bottom surface of stack piezoelectric ceramics (14) Bottom surface insulation ceramics (24) is bonded, stack PZT (piezoelectric transducer) is made.
  2. 2. preparation method as claimed in claim 1, it is characterised in that in step 1, as a preferred embodiment, described making circle The conventional method of shape ceramic substrate is:It will be mixed after ceramic powder calcining and ball milling with solvent, dispersant and defrother, wet method ball Binding agent, plasticizer and lubricant are added after mill, then secondary mix grinding 12h forms slurry, is molded and cuts using casting machine, row Round ceramic substrate is made after glue sintering.
  3. 3. preparation method as claimed in claim 1, it is characterised in that in step 2, described electrode adhesion end face (3,4) are arrived The distance in the center of circle of round ceramic substrate (1) is smaller 0.3mm than the radius of round ceramic substrate (1);Described round ceramic substrate (1) a diameter of 30mm.
  4. 4. preparation method as claimed in claim 2, it is characterised in that in step 2, chamfering when described rounding is handled Radius is 0.3~0.6 times of round ceramic substrate (1) thickness.
  5. 5. preparation method as claimed in claim 1, it is characterised in that in step 2, described fixture (2) uses to be clamped up and down Mode round ceramic substrate (1) is gripped.
  6. 6. preparation method as claimed in claim 1, it is characterised in that in step 4, described tightening device (20) includes one Pair lock ring half-shell (20-1,20-2) to match with stack piezoelectric ceramics (14), the two of a pair of fastening half-shells (20-1,20-2) Bar incline is connected by hinge (20-3), and being provided with a pair on another two inclines of a pair of fastening half-shells (20-1,20-2) can The buckle (20-4) of fastening;The bottom of a pair of described fastening half-shells (20-1,20-2) is configured with base (20-5).
  7. 7. preparation method as claimed in claim 1, it is characterised in that in step 4, the pressure of described vertical static pressure is 20kPa, the speed of described heating is 3 DEG C/min.
  8. 8. preparation method as claimed in claim 1, it is characterised in that in step 5, described solder joint (19) passes through dead ring Oxygen resin glue (9) seals.
  9. 9. a kind of stack PZT (piezoelectric transducer) suitable for road piezo-electric generating, it is characterised in that described stack piezoelectricity changes Energy device is made using the preparation method as described in claim 1 to 8 any claim.
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CN114853471A (en) * 2022-05-31 2022-08-05 成都汇通西电电子有限公司 High-voltage stacked piezoelectric ceramic actuator and preparation method thereof
CN114853471B (en) * 2022-05-31 2023-02-10 成都汇通西电电子有限公司 High-voltage stacked piezoelectric ceramic actuator and preparation method thereof

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