CN107686090A - Sensor device and its manufacture method - Google Patents
Sensor device and its manufacture method Download PDFInfo
- Publication number
- CN107686090A CN107686090A CN201610635635.8A CN201610635635A CN107686090A CN 107686090 A CN107686090 A CN 107686090A CN 201610635635 A CN201610635635 A CN 201610635635A CN 107686090 A CN107686090 A CN 107686090A
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- CN
- China
- Prior art keywords
- sensor
- flexible
- electrode
- sensor device
- flexible membrane
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0018—Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators
- B81B3/0021—Transducers for transforming electrical into mechanical energy or vice versa
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
- B81C1/00158—Diaphragms, membranes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2201/00—Manufacture or treatment of microstructural devices or systems
- B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
- B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
Abstract
The embodiment provides a kind of sensor device, including：First flexible membrane and the second flexible membrane；Flexible print circuit, the flexible print circuit are arranged on the first side of first flexible membrane；Multiple sensors, it is arranged on first side and between first flexible membrane and second flexible membrane；Wherein, the multiple sensor electrically connects with the flexible print circuit.Embodiments of the invention additionally provide a kind of method for manufacturing sensor device.The traditional distributed measurement network presence that sensor device according to an embodiment of the invention and manufacture method overcome traditional sensors array connects up the defects of complicated, difficult in maintenance etc., and present invention obtains improve sensor output accuracy while reduce the beneficial effect of engineering construction difficulty and later maintenance cost.
Description
Technical field
The present invention relates to integrated circuit fields, relate more specifically to sensor device and its manufacture method.
Background technology
With the development of flexible electronic, flexible sensor technology has been increasingly becoming the high-new intelligence to attract people's attention and handed over
Mutual technology, and be widely used in structural healthy monitoring system, intelligent bionic system and medical monitoring.Flexible sensor
Technology to realizing the sensing of the touch interaction active force between flexible contact interface, curved surface and irregular shape contact interface, with
And the sensing of DYNAMIC DISTRIBUTION information has vital effect.Flexible sensor array based on this technology is that measurement is a variety of soft
The ideal component of distributed intelligence between property contact interface and ultra-narrow gap contact interface, shows great application prospect.
However, the traditional distributed measurement network of flexible sensor array is present, wiring is complicated, system is huge, maintenance is tired
Difficult, the deficiencies of cost is higher, and the usually weight to original component, geometry integrality, physical features (such as additional mass or wiring
Groove causes the change of component vibration characteristics, stress distribution) different degrees of influence is caused, such as cause the output accuracy of sensor
Difference.Accordingly, it is desirable to provide a kind of new flexible sensor array and its manufacture method, to greatly simplify sensor array arrangement work
Sequence, improve sensor output accuracy.
The content of the invention
In order to solve the various defects of the distributed measurement network of traditional flexible sensor array, the invention provides one
The new sensor device of kind and its manufacture method.
The embodiment provides a kind of sensor device, it is characterised in that the sensor device includes：First
Flexible membrane and the second flexible membrane；Flexible print circuit, the flexible print circuit are arranged on the first side of first flexible membrane
On；Multiple sensors, it is arranged on first side and between first flexible membrane and second flexible membrane；Its
In, the multiple sensor electrically connects with the flexible print circuit.
According to one embodiment of present invention, it is characterised in that the flexible print circuit includes a plurality of wire and multiple
Electrode, wherein, the quantity of a plurality of wire is identical with the quantity of the multiple electrode, and a wire is electrically connected with an electrode
Connect.
According to one embodiment of present invention, it is characterised in that the flexible print circuit also includes multiple position marks,
One sensor is set in each position mark, the multiple electrode occurs in the form of paired, each sensor and
A pair of electrodes electrically connects.
According to one embodiment of present invention, it is characterised in that the pair of electrode is respectively high-potential electrode and low electricity
Position electrode.
According to one embodiment of present invention, it is characterised in that the multiple sensor is arranged to include multirow and more
The sensor array of row.
Embodiments of the invention additionally provide a kind of method for manufacturing sensor device, it is characterised in that methods described bag
Include：Flexible print circuit is arranged on the first side of the first flexible membrane；Multiple sensors are arranged on first side simultaneously
And between first flexible membrane and the second flexible membrane；The multiple sensor and the flexible print circuit are electrically connected
Connect.
According to one embodiment of present invention, it is characterised in that the flexible print circuit includes a plurality of wire and multiple
Electrode, wherein, the quantity of a plurality of wire is identical with the quantity of the multiple electrode, and a wire is electrically connected with an electrode
Connect.
According to one embodiment of present invention, it is characterised in that the flexible print circuit also includes multiple position marks,
One sensor is set in each position mark, the multiple electrode occurs in the form of paired, each sensor and
A pair of electrodes electrically connects.
According to one embodiment of present invention, it is characterised in that the pair of electrode is respectively high-potential electrode and low electricity
Position electrode.
According to one embodiment of present invention, it is characterised in that methods described also includes：The multiple sensor is set
It is the sensor array for including rows and columns.
Sensor device according to an embodiment of the invention and its manufacture method can effectively improve the integrated of sensing network
Degree, simplify measuring system, transmission network, and between being integrated in flexible membrane due to sensor and circuit, can be fine with structure
It is conformal, sensor output accuracy is improved, while reduce engineering construction difficulty and later maintenance cost.
Brief description of the drawings
When reading in conjunction with the accompanying drawings, each side that the present invention may be better understood according to the following detailed description
Face.
Fig. 1 shows blank flexible membrane according to an embodiment of the invention.
Fig. 2 shows printed circuit film according to an embodiment of the invention.
Fig. 3 shows the flow chart for the method for manufacturing sensor device according to an embodiment of the invention.
Embodiment
Disclosure below provides many different embodiments or examples, and the different characteristic of theme is provided for realizing.
The particular instance of component explained below and arrangement is of the invention to simplify.Certainly, these are only example and are not intended to limit this
Invention.In addition, the present invention can in multiple examples repeat reference numerals and/or character.This repetition is in order to simplified and clear
The purpose of Chu, and itself do not indicate the relation between each embodiment for being discussed and/or configuration.
Fig. 1 is blank flexible membrane according to an embodiment of the invention.Blank flexible membrane is used in printed IC thereon,
So as to can be described as flexible printed circuit film again.Flexible printed circuit film can be used for computer hard disc driver, floppy disk, answer
Print machine and printer etc..Flexible printed circuit film is made up of the polymer of such as polyimides.Polyimides is flexible and resistance to
It is hot good.The material of flexible printed circuit film and size can be selected according to actual design needs.Merely to the mesh of explanation
And exemplary materials that provide above-mentioned flexible printed circuit film.Also, what it is according to the present invention is that flexible membrane can meet difference
The demand of application, and there is good heat resistance and pliability.
Fig. 2 is printed circuit film according to an embodiment of the invention.Printed circuit be arranged on shown in Fig. 1 it is first soft
On property film the second flexible membrane of identical, wherein, printed circuit is arranged on the first side of the second flexible membrane, and the printed circuit
For flexible print circuit.Alternatively, the second flexible membrane can be different from the first flexible membrane.In the embodiment illustrated in figure 2, it is multiple
Sensor (label is respectively 1-1,1-2,1-3,2-1,2-2,2-3,3-1,3-2,3-3) is arranged on the first side of the second flexible membrane
It is upper and between being shown in Fig. 1 between the first flexible membrane and the second flexible membrane, wherein, multiple sensors are electrically connected to printing electricity
Road.According to an embodiment of the invention, traditional wiring circuit is replaced using flexible print circuit, makes network distribution simpler, clear
It is clear, meanwhile, it can effectively reduce number of sensors by optimizing sensor placement.
Although show that (that is, label is respectively 1-1,1-2,1-3,2-1,2-2,2-3,3-1,3- to 9 sensors in Fig. 2
2nd, 3-3 sensor), but the quantity of the sensor is only example, it is limitation of the present invention that should not be construed.In this hair
Any amount of sensor under bright design is all in the desired extent of the present invention.9 sensor arrangements shown in Fig. 2 are
The array of 3 rows 3 row, wherein, sensor 1-1,1-2 and 1-3 are laterally aligned, and sensor 2-1,2-2 and 2-3 are laterally aligned, sensing
Device 3-1,3-2 and 3-3 are laterally aligned, and sensor 1-1,2-1 and 3-1 are longitudinally-aligned, and sensor 1-2,2-2 and 3-2 are longitudinally-aligned,
And sensor 1-3,2-3 and 3-3 are longitudinally-aligned.
The printed circuit shown in Fig. 2 alternatively include a plurality of wire (label be respectively 1-1 ', 1-2 ', 1-3 ', 2-1 ',
2-2 ', 2-3 ', 3-1 ', 3-2 ', 3-3 ', 1,2,3) and multiple electrodes (label be respectively 1-1a, 1-2a, 1-3a, 2-1a, 2-2a,
2-3a, 3-1a, 3-2a, 3-3a, 1-1b, 1-2b, 1-3b, 2-1b, 2-2b, 2-3b, 3-1b, 3-2b, 3-3b), wherein, electrode 1-
1a and electrode 1-1b is a pair, and electrode 1-2a and electrode 1-2b is a pair, by that analogy.Alternatively, label includes a electrode
It is connected to the high-potential electrode of respective sensor, the electrode that label includes b is connected to the low-potential electrode of respective sensor.Such as
Shown in Fig. 2, electrode 1-1a is connected to output signal Integration Bus by wire 1-1 ', and electrode 1-2a is connected to by wire 1-2 '
Output signal Integration Bus, electrode 1-3a are connected to output signal Integration Bus by wire 1-3 ', by that analogy.Such as Fig. 2 institutes
Showing, electrode 1-1b, 1-2b, 1-3b are connected to wire 1, and electrode 2-1b, 2-2b, 2-3b are connected to wire 2, electrode 3-1b, 3-2b,
3-3b is connected to wire 3, and wire 1,2 and 3 is connected to earth terminal.According to an embodiment of the invention, by flexible sensor
System integrating on the flexible film, effectively realizes sensing network modularization, integrated, lightweight, is easy to syntype integrated with component.
Alternatively, printed circuit is included with 9 one-to-one position marks of sensor being shown in Fig. 2 (not in figure
Show), by 9 sensor relative sets on its corresponding position mark, wherein, a biography is set in each position mark
Sensor, so that 9 sensor arrangements are the array of 3 rows 3 row.Alternatively, position mark can include the shape with sensor
The adaptable indicia framing of shape.
Fig. 3 shows the flow chart for the method for manufacturing sensor device according to an embodiment of the invention.Method starts from walking
Rapid 301, wherein, according to (the distribution of the quantity, circuit of type, sensor e.g., including for sensor of Practical Project demand
Deng), sensor arrangement position, printed circuit cable position distribution etc. are determined on the first flexible membrane, that is, the position mark of sensor is set
The position mark etc. of note, wire.Method is carried out to step 302, using flexible printing technology on the same side of the first flexible membrane
Printed conductor, and the profile being consistent with sensor shape is printed on the position mark of sensor according to the shape of sensor,
Sensing station indicia framing is such as printed, wherein, sensing station indicia framing is arranged as the array that horizontal, longitudinal direction is alignd respectively.
Step 302 also includes the operation for making sensor output electrode (e.g., including high-potential electrode, low-potential electrode), wherein, profit
The output electrode of sensor is made of welding technique.Method is carried out to step 303, and sensor is fixed on into sensing station mark
To form sensor array on frame, a sensor is set, and for example, passes through strength electricity in each of which position mark frame
Insulating cement continues for some time sensor and the smooth fixation of flexible membrane, such as about 10 minutes to about 15 minutes.It is optional
Ground, the sensor in embodiments of the invention is flexible sensor.Step 303 is also included by sensor electrode and in step 302
The operation of the output electrode electrical connection of middle making, wherein, by conducting resinl by sensor electrode and corresponding high-potential electrode, low electricity
Position electrode electrical connection, and continue for some time, such as about 15 minutes to about 20 minutes, or alternatively implement drying operation.
Step 303 can also alternatively include the operation with universal meter ohms range detection circuit turn-on situation, to ensure that circuit is intact.Side
Method is carried out to step 304, and the second blank flexible membrane is engaged with the first flexible membrane, wherein, by setting sensor array
Electric insulating cement is coated on side, makes the second blank flexible membrane and the smooth gluing of the first flexible membrane, and is continued for some time, such as
About 10 minutes to about 20 minutes.Afterwards, required, unnecessary flexible membrane is cut off, to complete sensor device according to actual installation
Manufacturing process.
The overall package technique of flexible sensor according to an embodiment of the invention, it greatly simplify sensor array arrangement
Process, improve sensor output accuracy.It is using flexible print circuit, sensor and sensing circuit is integrated on the flexible film,
Realize sensing network and treat the conformal of geodesic structure, realize structure-integrated sensor.Replaced using flexible print circuit
Traditional wiring circuit, make network distribution simpler, clear, meanwhile, it can effectively reduce sensing by optimizing sensor placement
Device quantity.
According to an embodiment of the invention, by flexible sensor system integrating on the flexible film, sensing network mould is effectively realized
Block, integrated, lightweight, it is easy to syntype integrated with component.
The part of some embodiments is discussed above so that the present invention may be better understood in those of ordinary skill in the art
Various aspects.It will be understood by those skilled in the art that can easily using based on the present invention designing or
Change other processing and structures for being used to reaching with embodiment identical purpose described herein and/or realizing same advantage.This
Field those of ordinary skill it should also be appreciated that this equivalent constructions without departing from the spirit and scope of the present invention, and not
In the case of the spirit and scope of the present invention, a variety of changes can be carried out, replaces and changes.
Claims (10)
1. a kind of sensor device, it is characterised in that the sensor device includes：
First flexible membrane and the second flexible membrane；
Flexible print circuit, the flexible print circuit are arranged on the first side of first flexible membrane；
Multiple sensors, it is arranged on first side and between first flexible membrane and second flexible membrane；
Wherein, the multiple sensor electrically connects with the flexible print circuit.
2. sensor device according to claim 1, it is characterised in that the flexible print circuit include a plurality of wire and
Multiple electrodes, wherein, the quantity of a plurality of wire is identical with the quantity of the multiple electrode, and a wire and an electrode
Electrical connection.
3. sensor device according to claim 2, it is characterised in that the flexible print circuit also includes multiple positions
Mark, a sensor is set in each position mark, the multiple electrode occurs in the form of paired, each sensing
Device electrically connects with a pair of electrodes.
4. sensor device according to claim 3, it is characterised in that the pair of electrode be respectively high-potential electrode and
Low-potential electrode.
5. sensor device according to claim 1, it is characterised in that the multiple sensor is arranged to include multirow
With the sensor array of multiple row.
A kind of 6. method for manufacturing sensor device, it is characterised in that methods described includes：
Flexible print circuit is arranged on the first side of the first flexible membrane；
Multiple sensors are arranged on first side and between first flexible membrane and the second flexible membrane；
The multiple sensor is electrically connected with the flexible print circuit.
7. the method for manufacture sensor device according to claim 6, it is characterised in that the flexible print circuit includes
A plurality of wire and multiple electrodes, wherein, the quantity of a plurality of wire is identical with the quantity of the multiple electrode, and a wire
Electrically connected with an electrode.
8. the method for manufacture sensor device according to claim 7, it is characterised in that the flexible print circuit also wraps
Multiple position marks are included, a sensor is set in each position mark, the multiple electrode occurs in the form of paired,
Each sensor electrically connects with a pair of electrodes.
9. the method for manufacture sensor device according to claim 8, it is characterised in that the pair of electrode is respectively height
Potential electrode and low-potential electrode.
10. the method for manufacture sensor device according to claim 6, it is characterised in that methods described also includes：By institute
State the sensor array that multiple sensors are arranged to include rows and columns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610635635.8A CN107686090A (en) | 2016-08-04 | 2016-08-04 | Sensor device and its manufacture method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610635635.8A CN107686090A (en) | 2016-08-04 | 2016-08-04 | Sensor device and its manufacture method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107686090A true CN107686090A (en) | 2018-02-13 |
Family
ID=61151665
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610635635.8A Pending CN107686090A (en) | 2016-08-04 | 2016-08-04 | Sensor device and its manufacture method |
Country Status (1)
| Country | Link |
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| CN (1) | CN107686090A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111175352A (en) * | 2020-01-08 | 2020-05-19 | 沈阳航空航天大学 | Micro-nano sensor structure health monitoring method combined with flexible circuit |
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| US20110226069A1 (en) * | 2010-03-18 | 2011-09-22 | Korea Research Institute Of Standards And Science | Flexible force or pressure sensor array using semiconductor strain gauge, fabrication method thereof and measurement method thereof |
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| CN103411710A (en) * | 2013-08-12 | 2013-11-27 | 国家纳米科学中心 | Pressure sensor, electronic skin and touch screen equipment |
| CN104662800A (en) * | 2012-06-26 | 2015-05-27 | 奥兰治公司 | Tactile control arrangement for electrical or electronic devices integrated in a textile support |
| CN105595959A (en) * | 2014-10-16 | 2016-05-25 | 王洪超 | Elastic pressure sensor matrix and probe for detecting tissue elasticity |
| CN105793795A (en) * | 2013-12-17 | 2016-07-20 | 勒克斯维科技公司 | Display module and system applications |
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2016
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Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070206655A1 (en) * | 2006-03-03 | 2007-09-06 | Haslett James W | Bandage with sensors |
| US20110226069A1 (en) * | 2010-03-18 | 2011-09-22 | Korea Research Institute Of Standards And Science | Flexible force or pressure sensor array using semiconductor strain gauge, fabrication method thereof and measurement method thereof |
| CN102207415A (en) * | 2011-03-11 | 2011-10-05 | 西安交通大学 | Conductive-rubber-based flexible array clip pressure sensor and manufacturing method |
| CN104662800A (en) * | 2012-06-26 | 2015-05-27 | 奥兰治公司 | Tactile control arrangement for electrical or electronic devices integrated in a textile support |
| CN103385699A (en) * | 2013-07-30 | 2013-11-13 | 上海交通大学 | Flexible resistance-type MEMS (micro-electro-mechanical systems) temperature sensor array and preparation method thereof |
| CN103411710A (en) * | 2013-08-12 | 2013-11-27 | 国家纳米科学中心 | Pressure sensor, electronic skin and touch screen equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111175352A (en) * | 2020-01-08 | 2020-05-19 | 沈阳航空航天大学 | Micro-nano sensor structure health monitoring method combined with flexible circuit |
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Application publication date: 20180213 |
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