CN104267858A - Sensing chip, manufacturing method thereof and electronic device provided with sensing chip - Google Patents
Sensing chip, manufacturing method thereof and electronic device provided with sensing chip Download PDFInfo
- Publication number
- CN104267858A CN104267858A CN201410278621.6A CN201410278621A CN104267858A CN 104267858 A CN104267858 A CN 104267858A CN 201410278621 A CN201410278621 A CN 201410278621A CN 104267858 A CN104267858 A CN 104267858A
- Authority
- CN
- China
- Prior art keywords
- wiring layer
- group
- sensor chip
- contact
- wall
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 23
- 239000000758 substrate Substances 0.000 claims abstract description 24
- 238000001514 detection method Methods 0.000 claims description 66
- 238000000034 method Methods 0.000 claims description 46
- 238000009434 installation Methods 0.000 claims description 33
- 239000004744 fabric Substances 0.000 claims description 16
- 238000005538 encapsulation Methods 0.000 claims description 14
- 230000000392 somatic effect Effects 0.000 claims description 7
- 239000004020 conductor Substances 0.000 claims description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 3
- 238000001312 dry etching Methods 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 238000001039 wet etching Methods 0.000 claims description 3
- 239000010410 layer Substances 0.000 abstract 9
- 239000011229 interlayer Substances 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 14
- 239000011800 void material Substances 0.000 description 8
- 238000010295 mobile communication Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000008520 organization Effects 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000012780 transparent material Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F21/00—Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
- G06F21/30—Authentication, i.e. establishing the identity or authorisation of security principals
- G06F21/31—User authentication
- G06F21/32—User authentication using biometric data, e.g. fingerprints, iris scans or voiceprints
Landscapes
- Engineering & Computer Science (AREA)
- Computer Security & Cryptography (AREA)
- Theoretical Computer Science (AREA)
- Image Input (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
- Computer Hardware Design (AREA)
- Software Systems (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
Abstract
The invention provides a sensing chip for detecting human body biological characteristic information, a manufacturing method thereof and an electronic device provided with the sensing chip. The sensing chip comprises a substrate, a spacing layer, a wiring layer and a rewiring layer. N groups of contact groups used for electrically connecting the main control unit are further arranged on the spacing layer, and the N groups of contact groups are not covered by the wiring layer or the rewiring layer by arranging a groove structure on the rewiring layer. And a sensing device is encapsulated in the rewiring layer. And the wiring layer is internally packaged with a connecting pad and a connecting piece. The connection pads and the connection points of the group of connection points are electrically connected with the ground sensing signal processing circuit packaged in the interlayer. The invention realizes the electric connection with the FPC outside the sensing chip by the contact points arranged in the groove, avoids the arrangement of connecting wires above the sensing chip as in the prior art, ensures the close fit between the cover plate and the sensing chip and ensures the information acquisition capability of the sensing chip.
Description
Technical field
The present invention relates to detecting information and be converted to device and the manufacture method thereof of electric signal, and using the device of this device, particularly relating to sensor chip and the manufacture method thereof of detecting human body biological characteristic information, and use the electronic installation of this sensor chip.
Background technology
Prior art is for detecting the sensor chip of human body biological characteristic information, such as fingerprint sensing chip, a normally cube structure, this sensor chip is placed on below the cover plate as button use of electronic installation setting usually, and described electronic installation is such as often called as individual mobile communication terminal, the palm panel computer of mobile phone.The main screen key being commonly called Home key that the normally above-mentioned electronic installation of described cover plate is arranged.The top of described sensor chip attached to cover plate.Described electronic installation is usually also provided with main control unit and can bends the flexible printed wiring board (Flexible Printed Circuit, FPC) of use.Make main screen key both realize keypress function by sensor chip, realize again the function of sensing human body biological characteristic information.But, usually need to offer above prior art sensor chip to make the window that in this sensor chip, metal electrical contact contact is exposed, connection wire by pass through window makes metal electrical contact contact and realizes between FPC being electrically connected, because described connection wire is through above sensor chip, and above sensor chip, attached to cover plate, cause can not fitting tightly between cover plate and sensor chip, effect is installed in impact, also impacts the information collecting capacity of sensor chip.
Summary of the invention
The technical problem to be solved in the present invention is to avoid the deficiencies in the prior art part and proposes can be the sensor chip that fits tightly of cover plate and sensor chip and manufacture method thereof, and configures the electronic installation of this sensor chip.
The present invention solve the technical problem can by realizing by the following technical solutions:
Design, manufacture a kind of sensor chip, for detecting human body biological characteristic information, comprise substrate, encapsulation wall on the substrate, is encapsulated in the wiring layer at this wall top, and encapsulation and at least cover the re-wiring layer at described wiring layer top; Wall is also provided with and was not both covered also not by the N group contact group that re-wiring layer covers by wiring layer, N be not less than 1 natural number; Often organize contact group and comprise at least one contact separately.At least one detection sensor part is packaged with in described re-wiring layer.At least one connection gasket is packaged with in described wiring layer, and at least one web member of longitudinal feed throughs layer, the top of described web member and bottom are electrically connected a detection sensor part and a connection gasket respectively.Sensing signal treatment circuit is packaged with in described wall; Each connection gasket in described wiring layer and the contact of each group of contact group are all electrically connected this sensing signal treatment circuit.
In order to make each group of contact group do not covered by wiring layer, the cross-sectional area of described wiring layer is less than the cross-sectional area of wall, thus described N group contact group is arranged in the region that wall end face do not cover by wiring layer.Further, described wiring layer is arranged on the central region of wall end face; With wall end face central point for symmetric points, point-symmetric two groups of contact groups are not mutually set by wiring layer overlay area at wall top.
Do not covered by re-wiring layer to make each group of contact group, described re-wiring layer covers whole wiring layer and wall, the side elevation of re-wiring layer is provided with the groove of N number of through re-wiring layer top and bottom, and the position of each groove is corresponding with the position of each group of contact group respectively to be arranged, thus each group of contact group of wall end face is not covered by re-wiring layer.
Particularly, described detection sensor part is set as array structure by row, column cloth in re-wiring layer, described connection gasket in wiring layer also corresponding described detection sensor part be set as array structure by row, column cloth.
Described wiring layer is arranged on the central region of wall end face; With wall end face central point for symmetric points, point-symmetric two groups of contact groups are not mutually set by wiring layer overlay area at wall top.
Specifically, by web member and connection gasket, the human body biological characteristic information detected is inputed to sensing signal treatment circuit and carries out signal transacting by detection sensor part, and the sensitive information formed after signal transacting exports from described sensor chip by the contact of each group of contact group.
More specifically, the volume of described detection sensor is greater than the volume of connection gasket.
Described sensor chip is the fingerprint sensing chip for sensing somatic fingerprint characteristic information, and described detection sensor part is fingerprint sensing devices, and described sensing signal treatment circuit is fingerprint sensing signal treatment circuit.In addition, described sensor chip can also be the pulse sensor chip for sensing human pulse characteristic information, and described detection sensor part is pulse transducer part, and described sensing signal treatment circuit is pulse sensing signal treatment circuit.
The present invention solve the technical problem can also by realizing by the following technical solutions:
Design, manufacture a kind of electronic installation, comprise cover plate, flexible printed wiring board, and main control unit.Described electronic installation also comprise be arranged on below described cover plate, for detecting the sensor chip of human body biological characteristic information.Described sensor chip comprises substrate, and encapsulation wall on the substrate, is encapsulated in the wiring layer on this wall end face, and encapsulation and at least cover the re-wiring layer at described wiring layer top; Wall is also provided with and was not both covered also not by the N group contact group that re-wiring layer covers by wiring layer, N be not less than 1 natural number; Often organize contact group and comprise at least one contact separately.At least one detection sensor part is packaged with in described re-wiring layer.At least one connection gasket is packaged with in described wiring layer, and the web member of longitudinal feed throughs layer, the top of described web member and bottom are electrically connected a detection sensor part and a connection gasket respectively.Be packaged with sensing signal treatment circuit in described wall, each connection gasket in described wiring layer and the contact of each group of contact group are all electrically connected described sensing signal treatment circuit.The contact of described N group contact group is electrically connected described main control unit by flexible printed wiring board.
In order to make each group of contact group do not covered by wiring layer, the cross-sectional area of described wiring layer is less than the cross-sectional area of wall, thus described N group contact group is arranged in the region that wall end face do not cover by wiring layer.Further, described wiring layer is arranged on the central region of wall end face; With wall end face central point for symmetric points, point-symmetric two groups of contact groups are not mutually set by wiring layer overlay area at wall top.
Do not covered by re-wiring layer to make each group of contact group, described re-wiring layer covers whole wiring layer and wall, the side elevation of re-wiring layer is provided with the groove of N number of through re-wiring layer top and bottom, and the position of each groove is corresponding with the position of each group of contact group respectively to be arranged, thus each group of contact group of wall end face is not covered by re-wiring layer.
Particularly, described detection sensor part is set as array structure by row, column cloth in re-wiring layer, described connection gasket in wiring layer also corresponding described detection sensor part be set as array structure by row, column cloth.
Described wiring layer is arranged on the central region of wall end face.With wall end face central point for symmetric points, point-symmetric two groups of contact groups are not mutually set by wiring layer overlay area at wall top.
Specifically, by web member and connection gasket, the human body biological characteristic information detected is inputed to sensing signal treatment circuit and carries out signal transacting by detection sensor part, the sensitive information formed after signal transacting exports from described sensor chip by the contact of each group of contact group, and described main control unit receives the sensitive information exported from described sensor chip by flexible printed wiring board.
More specifically, the volume of described detection sensor is greater than the volume of connection gasket.
Described sensor chip is the fingerprint sensing chip for sensing somatic fingerprint characteristic information, and described detection sensor part is fingerprint sensing devices, and described sensing signal treatment circuit is fingerprint sensing signal treatment circuit.In addition, described sensor chip also can be the pulse sensor chip for sensing human pulse characteristic information, thus described detection sensor part is pulse transducer part, and described sensing signal treatment circuit is pulse sensing signal treatment circuit.
The present invention solve the technical problem and can by realizing by the following technical solutions:
Propose a kind of sensor chip manufacture method, comprise the steps:
A., one substrate is provided;
B. the wall that is packaged with sensing signal treatment circuit and connecting line in it is processed on the substrate;
C. at least one connection gasket is set at wall top, makes each connection gasket by connecting line electrical connection sensing signal treatment circuit; Encapsulate all connection gaskets with megohmite insulant and form wiring layer, and connection gasket is not covered by megohmite insulant, thus formed at each connection gasket top surrounded by megohmite insulant run through through hole; Conductive materials is packed into and respectively runs through through hole, form web member;
N group contact group is not set by wiring layer overlay area at wall top surface, N be not less than 1 natural number, often organize contact group and comprise at least one contact separately, make each contact by sensing signal treatment circuit in connecting line electrical connection wall; Contact group top is respectively organized with photoresistance capping;
D. at least one detection sensor part is set at wiring layer top, makes each detection sensor part be electrically connected each web member respectively; Encapsulate all detection sensor parts with megohmite insulant, described megohmite insulant at least covers described wiring layer, but does not cover each photoresistance, thus forms re-wiring layer;
E. remove described photoresistance, thus each group of contact group is neither covered by wiring layer, also do not covered by re-wiring layer.
Particularly, substrate described in steps A is silicon substrate.
In order to make each group of contact group do not covered by wiring layer, in step B, described wiring layer is arranged on the central region of wall top surface, and the cross-sectional area of wiring layer is less than the cross-sectional area of wall.And then, with wall end face central point for symmetric points, point-symmetric two groups of contact groups are not mutually set by wiring layer overlay area at wall top.
In order to make each group of contact group do not covered by re-wiring layer, in step D, re-wiring layer covers wiring layer, and wall top is not by all regions that wiring layer and photoresistance cover; So in step e, after removing described photoresistance, the side elevation of re-wiring layer forms N number of groove running through this re-wiring layer top and bottom, thus each group of contact group is neither covered by wiring layer, also do not covered by re-wiring layer.
Specifically, in step C, connection gasket is set as array structure by row, column cloth in wiring layer, and so in step D, detection sensor part is set as array structure by row, column cloth in re-wiring layer.
In step e, remove each photoresistance with dry etching process or wet etching process etching, expose each group of contact group.
Compared with the existing technology comparatively, the technique effect of the present invention " sensor chip and manufacture method thereof, and the electronic installation configuring this sensor chip " is:
Realize being electrically connected with the flexible printer circuit FPC of sensor chip outside with contact, avoid as prior art arranges connection wire above sensor chip, guarantee can fit tightly between cover plate and sensor chip, make the information collecting capacity of sensor chip be protected, optimize sensor chip to the detecting effect of human body biological characteristic information.
Accompanying drawing explanation
Fig. 1 is the sensor chip orthogonal projection schematic top plan view of the present invention's " sensor chip and manufacture method thereof, and the electronic installation configuring this sensor chip " preferred embodiment;
Fig. 2 is the cross-sectional schematic of J-J shown in Fig. 1;
Fig. 3 is the axonometric projection schematic diagram of described preferred embodiment;
Fig. 4 is the device scheme of installation of described preferred embodiment when being arranged in electronic installation by sensor chip;
Fig. 5 is the orthogonal projection schematic top plan view of the electronic installation of described preferred embodiment;
Fig. 6 is the process flow diagram of sensor chip manufacture method of the present invention.
Embodiment
Be described in further detail below in conjunction with preferred embodiment shown in accompanying drawing.
The present invention proposes for detecting the sensor chip 1 of human body biological characteristic information and being provided with the electronic installation 2 of this sensor chip 1.
As shown in Figure 4 and Figure 5, except sensor chip 1, described electronic installation 2 comprises cover plate 21, flexible printed wiring board (Flexible Printed circuit, FPC) 22 and main control unit 23.In actual applications, described electronic installation 2 can be the daily individual mobile communication terminal being called as " mobile phone ", also can be palm flat computer, or even any electronic installation being configured with button.The preferred embodiment of the present invention, as shown in Figure 5, the example using individual mobile communication terminal as electronic installation 2, so this electronic installation 2 also comprises display screen 24, and this display screen 24 is for display frame.In other embodiments, this electronic installation 2 can comprise further for performing the touch-screen detecting touch operation.Wherein, described touch-screen can be external hanging type touch-screen, be attached on described display screen 24, described touch-screen also can be a part for described display screen 24, such as: for screen, above touch sensing unit (on cell) or described touch-screen are embedded touch sensing unit (in cell) to described touch-screen.
The button effect that described cover plate 21 had both realized bearing pressing force and realized set-up function, is embodied as again sensor chip 1 and obtains the effect that human body biological characteristic information provides information acquisition window.Namely, when pressing cover clamp 21, described cover plate 21 can realize keypress function.In addition, when described sensor chip 1 performs sensing human body biological characteristic information function, the tested position of human body is by contact cover plate 21, described sensor chip 1 is made to detect human body biological characteristic information by cover plate 21, such as, when sensor chip 1 is for detecting somatic fingerprint characteristic information, when finger contact cover plate 21, described sensor chip 1 just detects the fingerprint feature information of this finger, and the function of electronic installation 2 setting is realized by the fingerprint feature information of detecting, such as realize identity authentication function with finger print information.The preferred embodiment of the present invention, as shown in Figure 5, described cover plate 21 is arranged on the frame of display screen 24 periphery, has both realized the effect of main screen Home button, and has realized again the effect of sensor chip 1 output window.
The preferred embodiment of the present invention, as shown in Figures 1 to 4, sensor chip 1 is cubic generally, by hereinafter describing, sensor chip 1 is manufactured any column structure to be all suitable for and to realize the present invention, such as, sensor chip is made cylindric, oval column, prism-shaped etc.
As shown in Figures 2 to 4, sensor chip 1 comprises substrate 11, is encapsulated in the wall 12 on this substrate 11, is encapsulated in the wiring layer 13 at this wall 12 top, and encapsulation and at least cover the re-wiring layer 14 at described wiring layer 13 top.Wall 12 is also provided with and was not both covered also not by the N group contact group that re-wiring layer 14 covers by wiring layer 13, N be not less than 1 natural number.The preferred embodiment of the present invention, is provided with two groups of contact groups, i.e. N=2, obviously, arranges more than one any amount of contact group as required and can both realize technique effect of the present invention.As shown in Figure 1, two contact groups comprise ten contacts 15 separately, so according to actual needs, contact group can arrange a minimum contact 15, and often organizing contact 15 quantity arranged in contact group need not be identical, namely the quantity of contact 15 and the mode divided by contact 15 in groups all can not affect the present invention and realize its technique effect.
Be packaged with at least one detection sensor part 141 in described re-wiring layer 14, the preferred embodiment of the present invention, as shown in Figure 1, because detection sensor part 141 is packed and can not be directly visible, be therefore shown in broken lines its profile.Certainly, with transparent material encapsulation re-wiring layer 14, detection sensor part 141 is just visible.In addition, the transparent light transmissive material of detection sensor part 141 is made, and namely uses transparent material encapsulation re-wiring layer 14, detection sensor part 141 or invisible.Thus, the present invention does not limit shape, the material of detection sensor part 141, and detection sensor part 141 is the direct devices for gathering human body biological characteristic information.The preferred embodiment of the present invention, as shown in figures 1 and 3, be packaged with 35 detection sensor parts 141 in re-wiring layer 14, the mode cloth that detection sensor part 141 arranges by the five-element seven is set as array structure.
At least one connection gasket 131 is packaged with in described wiring layer 13, and at least one web member 132 of longitudinal feed throughs layer 13.The preferred embodiment of the present invention, as shown in Figure 2, described connection gasket 131 is arranged one to one for detection sensor part 141, arranges connection gasket 131 below detection sensor part 141.Therefore, the preferred embodiment of the present invention, is packaged with 35 connection gaskets 131 in wiring layer 13, and connection gasket 131 is also that the mode cloth arranged by the five-element seven is set as array structure.Be that each contraposition is set up the detection sensor part 141 of lower correspondence and connection gasket 131 configures at described web member 132, the top of web member 132 and bottom are electrically connected detection sensor part 141 and a connection gasket 131 respectively.
The preferred embodiment of the present invention, as shown in Figure 2 to Figure 3, wiring layer 13 and re-wiring layer 14 are all complete encapsulation with megohmite insulant 16.
Sensing signal treatment circuit 121 is packaged with in described wall 12.The preferred embodiment of the present invention, as shown in Figure 2 and Figure 4, described sense process circuit 121 is only drawn with block schematic, and physical circuit is chosen depending on embody rule environment and function, repeats no more herein.Each connection gasket 131 in described wiring layer 13 and the contact 15 of each group of contact group are all electrically connected this sensing signal treatment circuit 121.The preferred embodiment of the present invention, as shown in Figure 2 and Figure 4, is also packaged with connecting line 122 in described wall 12, and the contact 15 realizing each connection gasket 131 in wiring layer 13 and each group of contact group by connecting line 122 is electrically connected sensing signal treatment circuit 121.
The preferred embodiment of the present invention, as shown in Figure 2 and Figure 4, the volume of described detection sensor 141 is greater than the volume of connection gasket 131.
By web member 132 and connection gasket 131, the human body biological characteristic information detected is inputed to sensing signal treatment circuit 121 and carries out signal transacting by detection sensor part 141, and the sensitive information formed after signal transacting exports from described sensor chip 1 by the contact 15 of each group of contact group.
In electronic installation 2, by FPC 22, the contact 15 of described N group contact group is electrically connected to main control unit 23.Described FPC 22 plays to set up between sensor chip 1 with main control unit 23 and is electrically connected, thus the output information of concentration of transmissions sensor chip 1 is to the effect of main control unit 23.Node 15 due to each contact group is arranged on wall 12, wall is coated with wiring layer 13 and re-wiring layer 14, cover plate 21 is above re-wiring layer 14, and the contact 15 of contact group had not both been covered by wiring layer 13 and had not been covered by re-wiring layer 14 yet, said structure just forms void space between contact 15 and cover plate 21, FPC 22 is electrically connected contact 15 in this void space, thus avoid FPC 22 to be sandwiched between cover plate 21 and sensor chip 1, overcoming prior art FPC 22 affects the problem that cover plate 21 fits with sensor chip 1.The present invention can make between cover plate 21 and sensor chip 1, reaches seamless applying between the re-wiring layer 14 of especially cover plate 21 and sensor chip 1, and then optimizes the detecting effect of sensor chip 1 pair of human body biological characteristic information.Described main control unit 23 possesses transceiving data and steering order, carry out the effect of data processing, described main control unit 23 can be the circuit that discrete component is formed, and can be integrated circuit (IC) chip, can be data processor, can also be the coprocessor coordinating primary processor.
Wall 12 is provided with and was not both had multiple by the concrete mode that wiring layer 13 covers the N group contact group also do not covered by re-wiring layer 14.Such as previously mentioned, wall 12 is made column, N group contact group is arranged on the cylinder of wall 12, or wiring layer 13 and re-wiring layer 14 are all made cross-sectional area and is less than wall 12 cross-sectional area, thus just formed not by the region that wiring layer 13 and re-wiring layer 14 cover at wall 12 top, N group contact group is just arranged in this region.
The preferred embodiment of the present invention, as shown in Figures 1 to 4, realize arranging on wall 12 both do not covered also not by the N group contact group that re-wiring layer 14 covers by wiring layer 13 by arranging groove 142, thus utilize groove 142 between cover plate 21 and the wall 12 of sensor chip 1, build the void space realizing contact 15 and be electrically connected with FPC 22.Concrete structure is, described re-wiring layer 14 covers whole wiring layer 13 and wall 12, the side elevation of re-wiring layer 14 is provided with the groove 142 of N number of through re-wiring layer 14 top and bottom, and the position of each groove 142 is corresponding with the position of each group of contact group respectively to be arranged, thus each group of contact group of wall 12 end face is not covered by re-wiring layer 14.Contact 15 due to each contact group is arranged on wall 12, by groove 142, the contact 15 of contact group had not both been covered by wiring layer 13 and had not been covered by re-wiring layer 14 yet, groove 142 becomes the void space between contact 15 and cover plate 21, FPC 22 is electrically connected contact 15 in this void space, thus avoid FPC 22 to be sandwiched between cover plate 21 and sensor chip 1, overcoming prior art FPC 22 affects the problem that cover plate 21 fits with sensor chip 1.Described groove 142 structure can make between cover plate 21 and sensor chip 1, reaches seamless applying between the re-wiring layer 14 of especially cover plate 21 and sensor chip 1, and then optimizes the detecting effect of sensor chip 1 pair of human body biological characteristic information.
The present invention by not arranged by the region that wiring layer 13 and re-wiring layer 14 cover the contact group be made up of contact 15 on wall 12, by realizing the electrical connection of sensor chip 1 and external devices round the contact 15 of wiring layer 13 and re-wiring layer 14, externally device exports data.FPC 22 as external devices is set up by each contact 15 with the electrical connection of sensor chip 1.Build by groove 142 void space that contact 15 is electrically connected with FPC 22, the situation avoiding prior art to go between above sensor chip 1 occurs, guarantees can fit tightly between cover plate 21 and sensor chip 1.Meanwhile, avoid going between above sensor chip 1, eliminate the impact that detection sensor part 141 is caused, the information collecting capacity of sensor chip 1 is protected.
In the preferred embodiment of the present invention, human body biological characteristic information refers to somatic fingerprint characteristic information, and namely described sensor chip 1 is the fingerprint sensing chip for sensing somatic fingerprint characteristic information; Thus described detection sensor part 141 is fingerprint sensing devices, described sensing signal treatment circuit 121 is fingerprint sensing signal treatment circuits.Implementation as the detection sensor part 141 of fingerprint sensing devices is relevant to sensing principle, the preferred embodiment of the present invention, described detection sensor part 141 is the battery lead plates based on capacitive sensing device, by the capacitive differential that battery lead plate detecting is formed because of fingerprint concave convex texture, and then reflect fingerprint feature information by the signal transacting electric signal of sensing signal treatment circuit 121.
In addition, described human body biological characteristic information is human pulse characteristic information, and so described sensor chip 1 is exactly the pulse sensor chip for sensing human pulse characteristic information; Described detection sensor part 141 is pulse transducer parts, and described sensing signal treatment circuit 121 is pulse sensing signal treatment circuits.
The present invention also proposes the manufacture method manufacturing described sensor chip 1, as shown in Figure 6, comprises the steps:
A. a substrate 11 is provided, i.e. flow process 51 shown in Fig. 6;
B. flow process 52 as shown in Figure 6, encapsulates wall 12 on the substrate 11, particularly, described substrate 11 is processed the wall 12 that is packaged with sensing signal treatment circuit 121 and connecting line 122 in it;
C. flow process 53 as shown in Figure 6, arranges connection gasket 131 at wall 12 top, and encapsulation connection gasket 131 forms wiring layer 13, and makes to be formed above connection gasket 131 to run through through hole (sign), makes web member 132 running through filled conductive material in through hole; Contact group is not set by the region that wiring layer 13 covers at wall 12 top, with photoresistance capping contact group.
Particularly, in wiring layer formation process, at least one connection gasket 131 is set at wall 12 top, makes each connection gasket 131 be electrically connected sensing signal treatment circuit 121 by connecting line 122; Encapsulate all connection gaskets 131 with megohmite insulant 16 and form wiring layer 13, and connection gasket 131 is not covered by megohmite insulant 16, thus formed at each connection gasket 131 top surrounded by megohmite insulant run through through hole; Conductive materials is packed into and respectively runs through through hole, form web member 132.
For contact group formation process, N group contact group is not set by wiring layer overlay area at wall 12 top surface, N be not less than 1 natural number, often organize contact group and comprise at least one contact 15 separately, make each contact 15 be electrically connected sensing signal treatment circuit 121 in wall 12 by connecting line 122; Contact group top is respectively organized with photoresistance capping.
Said process does not limit process sequence, first can form wiring layer 13 and arrange contact group again and capping photoresistance, also first can arrange contact group and form the last capping photoresistance of wiring layer 13 again, can also first arrange contact group and capping photoresistance forms wiring layer 13 again.Namely in step C, all technique can be carried out simultaneously, also can carry out according to setting order, and setting order and unrestricted, to form wiring layer 13, arrange contact group, capping photoresistance is the net result of this steps flow chart;
D. flow process 54 as shown in Figure 6, arranges detection sensor part 141 at wiring layer 13 top, forms re-wiring layer 14, make re-wiring layer 14 at least cover wiring layer 13 but not cover photoresistance with megohmite insulant encapsulation detection sensor part 141.
Particularly, at least one detection sensor part 141 is set at wiring layer 13 top, makes each detection sensor part 141 be electrically connected each web member 132 respectively.Encapsulate all detection sensor parts 141 with megohmite insulant 16, described megohmite insulant 16 at least covers described wiring layer 13, but does not cover each photoresistance, thus forms re-wiring layer 14.
E. flow process 55 as shown in Figure 6, removes each photoresistance, makes outside each contact group is exposed to, and is formed and is neither covered also not by contact group that re-wiring layer 14 covers by wiring layer 13.
The preferred embodiment of the present invention, described in steps A, substrate 11 is silicon substrates.In step C, as previously shown, connection gasket 131 is set as array structure by row, column cloth in wiring layer 13, and so in step D, detection sensor part 141 is set as array structure by row, column cloth in re-wiring layer 14.
The preferred embodiment of the present invention adopt the scheme of " N group contact group is not covered by wiring layer 13 ", as shown in Figures 1 to 4, the cross-sectional area of described wiring layer 13 is less than the cross-sectional area of wall 12, thus described N group contact group is arranged in the region that wall 12 end face do not cover by wiring layer 13.Particularly, described wiring layer 13 is arranged on the central region of wall 12 end face.With wall 12 end face central point O for symmetric points, point-symmetric two groups of contact groups are not mutually set by wiring layer 13 overlay area at wall 12 top.Described point symmetry structure relation is embodied in, and for the arbitrary contact 15 in one group of contact group, has a contact in another contact group 15 and its point symmetry.On this scheme basis, the further scheme of preferred embodiment of the present invention employing " N group contact group is not covered by re-wiring layer 14 " is, described re-wiring layer 14 is except covering whole wiring layer 13, also cover wall 12, more specifically, re-wiring layer 14 covers the top of wall 12, and on the side elevation of re-wiring layer 14, be provided with the groove 142 of N number of through re-wiring layer 14 top and bottom, and the position of each groove 142 is corresponding with the position of each group of contact group respectively to be arranged, thus each group of contact group of wall 12 end face is not covered by re-wiring layer 14.Namely, by arranging groove 142 structure on the cylinder of re-wiring layer 14, provide window for exposing each contact group.The preferred embodiment of the present invention adopts " N group contact group is not covered by re-wiring layer 14 ", and further scheme can also be applied in the scheme that any realization except preferred embodiment of the present invention institute employing scheme " makes N group contact group do not covered by wiring layer 13 ".
The organization plan that the preferred embodiment of the present invention " makes N group contact group do not covered by wiring layer 13 ", be presented as in the manufacture method of sensor chip 1, in step B, described wiring layer 13 is arranged on the central region of wall 12 top surface, and the cross-sectional area of wiring layer 13 is less than the cross-sectional area of wall 12.The preferred embodiment of the present invention, the technique forming N group contact group specifically, with wall 12 end face central point O for symmetric points, is not arranged point-symmetric two groups of contact groups mutually by wiring layer 13 overlay area at wall 12 top.So, " N group contact group is not covered by re-wiring layer 14 " scheme that the preferred embodiment of the present invention is formed on the organization plan basis of " making N group contact group do not covered by wiring layer 13 ", be presented as in the manufacture method of sensor chip 1, in step D, re-wiring layer 14 covers wiring layer 13, and wall 12 top is not by all regions that wiring layer 13 and photoresistance cover; So in step e, after removing described photoresistance, the side elevation of re-wiring layer 14 forms N number of groove 142 running through this re-wiring layer 14 top and bottom, thus each group of contact group is neither covered by wiring layer 13, also do not covered by re-wiring layer 14.In like manner, the preferred embodiment of the present invention adopt " N group contact group is not covered by re-wiring layer 14 " specific embodiment be embodied in method can also be applied in except the preferred embodiment of the present invention any realization except the technological process that adopts " N group contact group is not covered " by wiring layer 13 technological process on.
In step e, the technique removing photoresistance is carved and is specially, remove each photoresistance with dry etching process or wet etching process etching, expose each group of contact group.
Described method builds the groove 142 that each for contact group contact 15 can be exposed to outside sensor chip 1 by photoresistance, by groove 142 structure, the contact 15 of contact group had not both been covered by wiring layer 13 and had not been covered by re-wiring layer 14 yet, and between contact 15 and cover plate 21, form void space, FPC 22 is electrically connected contact 15 in this void space, thus avoid FPC 22 to be sandwiched between cover plate 21 and sensor chip 1, overcoming prior art FPC 22 affects the problem that cover plate 21 fits with sensor chip 1.Described groove 142 structure that said method utilizes photoresistance to build, make between cover plate 21 and sensor chip 1, reach seamless applying between the re-wiring layer 14 of especially cover plate 21 and sensor chip 1, and then optimize the detecting effect of sensor chip 1 pair of human body biological characteristic information.
Claims (25)
1. a sensor chip, for detecting human body biological characteristic information, is characterized in that:
Comprise substrate, encapsulation wall on the substrate, is encapsulated in the wiring layer at this wall top, and encapsulation and at least cover the re-wiring layer at described wiring layer top; Wall is also provided with and was not both covered also not by the N group contact group that re-wiring layer covers by wiring layer, N be not less than 1 natural number; Often organize contact group and comprise at least one contact separately;
At least one detection sensor part is packaged with in described re-wiring layer;
At least one connection gasket is packaged with in described wiring layer, and at least one web member of longitudinal feed throughs layer, the top of described web member and bottom are electrically connected a detection sensor part and a connection gasket respectively;
Sensing signal treatment circuit is packaged with in described wall; Each connection gasket in described wiring layer and the contact of each group of contact group are all electrically connected this sensing signal treatment circuit.
2. sensor chip according to claim 1, is characterized in that:
The cross-sectional area of described wiring layer is less than the cross-sectional area of wall, thus described N group contact group is arranged in the region that wall end face do not cover by wiring layer.
3. the sensor chip according to claims 1 or 2, is characterized in that:
Described re-wiring layer covers whole wiring layer and wall, the side elevation of re-wiring layer is provided with the groove of N number of through re-wiring layer top and bottom, and the position of each groove is corresponding with the position of each group of contact group respectively to be arranged, thus each group of contact group of wall end face is not covered by re-wiring layer.
4. sensor chip according to claim 1, is characterized in that:
Described detection sensor part is set as array structure by row, column cloth in re-wiring layer, described connection gasket in wiring layer also corresponding described detection sensor part be set as array structure by row, column cloth.
5. sensor chip according to claim 2, is characterized in that:
Described wiring layer is arranged on the central region of wall end face; With wall end face central point for symmetric points, point-symmetric two groups of contact groups are not mutually set by wiring layer overlay area at wall top.
6. sensor chip according to claim 1, is characterized in that:
By web member and connection gasket, the human body biological characteristic information detected is inputed to sensing signal treatment circuit and carries out signal transacting by detection sensor part, and the sensitive information formed after signal transacting exports from described sensor chip by the contact of each group of contact group.
7. sensor chip according to claim 1, is characterized in that:
The volume of described detection sensor is greater than the volume of connection gasket.
8., according to arbitrary described sensor chip of claim 1 to 7, it is characterized in that:
Described sensor chip is the fingerprint sensing chip for sensing somatic fingerprint characteristic information, and described detection sensor part is fingerprint sensing devices, and described sensing signal treatment circuit is fingerprint sensing signal treatment circuit.
9., according to arbitrary described sensor chip of claim 1 to 7, it is characterized in that:
Described sensor chip is the pulse sensor chip for sensing human pulse characteristic information, and described detection sensor part is pulse transducer part, and described sensing signal treatment circuit is pulse sensing signal treatment circuit.
10. an electronic installation, comprises cover plate, flexible printed wiring board and main control unit; It is characterized in that:
Described electronic installation also comprise be arranged on below described cover plate, for detecting the sensor chip of human body biological characteristic information;
Described sensor chip comprises substrate, and encapsulation wall on the substrate, is encapsulated in the wiring layer on this wall end face, and encapsulation and at least cover the re-wiring layer at described wiring layer top; Wall is also provided with and was not both covered also not by the N group contact group that re-wiring layer covers by wiring layer, N be not less than 1 natural number; Often organize contact group and comprise at least one contact separately;
At least one detection sensor part is packaged with in described re-wiring layer;
At least one connection gasket is packaged with in described wiring layer, and the web member of longitudinal feed throughs layer, the top of described web member and bottom are electrically connected a detection sensor part and a connection gasket respectively;
Be packaged with sensing signal treatment circuit in described wall, each connection gasket in described wiring layer and the contact of each group of contact group are all electrically connected described sensing signal treatment circuit;
Wherein, the contact of described N group contact group is electrically connected described main control unit by flexible printed wiring board.
11. electronic installations according to claim 10, is characterized in that:
The cross-sectional area of described wiring layer is less than the cross-sectional area of wall, thus described N group contact group is arranged in the region that wall end face do not cover by wiring layer.
12. electronic installations according to claim 10 or 11, is characterized in that:
Described re-wiring layer covers whole wiring layer and wall, the side elevation of re-wiring layer is provided with the groove of N number of through re-wiring layer top and bottom, and the position of each groove is corresponding with the position of each group of contact group respectively to be arranged, thus each group of contact group of wall end face is not covered by re-wiring layer.
13. electronic installations according to claim 10, is characterized in that:
Described detection sensor part is set as array structure by row, column cloth in re-wiring layer, and described connection gasket corresponding described detection sensor part in wiring layer is also set as array structure by row, column cloth.
14. electronic installations according to claim 11, is characterized in that:
Described wiring layer is arranged on the central region of wall end face; With wall end face central point for symmetric points, point-symmetric two groups of contact groups are not mutually set by wiring layer overlay area at wall top.
15. electronic installations according to claim 10, is characterized in that:
By web member and connection gasket, the human body biological characteristic information detected is inputed to sensing signal treatment circuit and carries out signal transacting by detection sensor part, the sensitive information formed after signal transacting exports from described sensor chip by the contact of each group of contact group, and described main control unit receives the sensitive information exported from described sensor chip by flexible printed wiring board.
16. electronic installations according to claim 10, is characterized in that:
The volume of described detection sensor is greater than the volume of connection gasket.
17. according to claim 10 to 16 to arbitrary described electronic installation, it is characterized in that:
Described sensor chip is the fingerprint sensing chip for sensing somatic fingerprint characteristic information, and described detection sensor part is fingerprint sensing devices, and described sensing signal treatment circuit is fingerprint sensing signal treatment circuit.
18. according to claim 10 to 16 arbitrary described electronic installation, it is characterized in that:
Described sensor chip is the pulse sensor chip for sensing human pulse characteristic information, and described detection sensor part is pulse transducer part, and described sensing signal treatment circuit is pulse sensing signal treatment circuit.
19. 1 kinds of sensor chip manufacture methods, is characterized in that comprising the steps:
A., one substrate is provided;
B. the wall that is packaged with sensing signal treatment circuit and connecting line in it is processed on the substrate;
C. at least one connection gasket is set at wall top, makes each connection gasket by connecting line electrical connection sensing signal treatment circuit; Encapsulate all connection gaskets with megohmite insulant and form wiring layer, and connection gasket is not covered by megohmite insulant, thus formed at each connection gasket top surrounded by megohmite insulant run through through hole; Conductive materials is packed into and respectively runs through through hole, form web member;
N group contact group is not set by wiring layer overlay area at wall top surface, N be not less than 1 natural number, often organize contact group and comprise at least one contact separately, make each contact by sensing signal treatment circuit in connecting line electrical connection wall; Contact group top is respectively organized with photoresistance capping;
D. at least one detection sensor part is set at wiring layer top, makes each detection sensor part be electrically connected each web member respectively; Encapsulate all detection sensor parts with megohmite insulant, described megohmite insulant at least covers described wiring layer, but does not cover each photoresistance, thus forms re-wiring layer;
E. remove described photoresistance, thus each group of contact group is neither covered by wiring layer, also do not covered by re-wiring layer.
20. sensor chip manufacture methods according to claim 19, is characterized in that:
Substrate described in steps A is silicon substrate.
21. sensor chip manufacture methods according to claim 19, is characterized in that:
In step B, described wiring layer is arranged on the central region of wall top surface, and the cross-sectional area of wiring layer is less than the cross-sectional area of wall.
22. sensor chip manufacture methods according to claim 21, is characterized in that:
With wall end face central point for symmetric points, point-symmetric two groups of contact groups are not mutually set by wiring layer overlay area at wall top.
23. sensor chip manufacture methods according to claim 19, is characterized in that:
In step C, connection gasket is set as array structure by row, column cloth in wiring layer, and so in step D, detection sensor part is set as array structure by row, column cloth in re-wiring layer.
24. sensor chip manufacture methods according to claim 19, is characterized in that:
In step D, re-wiring layer covers wiring layer, and wall top is not by all regions that wiring layer and photoresistance cover;
So in step e, after removing described photoresistance, the side elevation of re-wiring layer forms N number of groove running through this re-wiring layer top and bottom, thus each group of contact group is neither covered by wiring layer, also do not covered by re-wiring layer.
25. sensor chip manufacture methods according to claim 19 or 24, is characterized in that:
In step e, remove each photoresistance with dry etching process or wet etching process etching, expose each group of contact group.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410278621.6A CN104267858B (en) | 2014-06-20 | 2014-06-20 | Sensing chip, manufacturing method thereof and electronic device provided with sensing chip |
| TW104208987U TWM518407U (en) | 2014-06-20 | 2015-06-05 | Sensor chip and electronic device equipped with the sensor chip |
| TW104118263A TWI601273B (en) | 2014-06-20 | 2015-06-05 | A sensing wafer, a method of manufacturing the same, and an electronic device in which the sensing wafer is disposed |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410278621.6A CN104267858B (en) | 2014-06-20 | 2014-06-20 | Sensing chip, manufacturing method thereof and electronic device provided with sensing chip |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104267858A true CN104267858A (en) | 2015-01-07 |
| CN104267858B CN104267858B (en) | 2017-07-14 |
Family
ID=52159385
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410278621.6A Active CN104267858B (en) | 2014-06-20 | 2014-06-20 | Sensing chip, manufacturing method thereof and electronic device provided with sensing chip |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN104267858B (en) |
| TW (2) | TWI601273B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107066920A (en) * | 2016-12-23 | 2017-08-18 | 浙江大学 | Fingerprint recognition panel and device |
| CN109284716A (en) * | 2018-09-21 | 2019-01-29 | 京东方科技集团股份有限公司 | A kind of substrate, display panel and display device |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI623249B (en) * | 2016-02-23 | 2018-05-01 | 致伸科技股份有限公司 | Fingerprint recognition module and method for fabricating the same |
| US10424540B2 (en) * | 2016-10-06 | 2019-09-24 | Xintec Inc. | Chip package and method for forming the same |
| TWI762894B (en) * | 2019-11-05 | 2022-05-01 | 友達光電股份有限公司 | Circuit device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030063445A1 (en) * | 2000-03-24 | 2003-04-03 | Reinhard Fischbach | Housing for biometric sensor chips and method for producing the housing |
| CN103793689A (en) * | 2014-01-27 | 2014-05-14 | 南昌欧菲光科技有限公司 | Fingerprint recognition sensor packaging structure, electronic device and method for manufacturing fingerprint recognition sensor |
| CN203630794U (en) * | 2013-12-13 | 2014-06-04 | 深圳市汇顶科技股份有限公司 | Fingerprint identification device and mobile terminal |
| CN204143413U (en) * | 2014-06-20 | 2015-02-04 | 敦泰科技有限公司 | Sensor chip and configure the electronic installation of this sensor chip |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000067324A1 (en) * | 1999-04-30 | 2000-11-09 | Hitachi, Ltd. | Integrated circuit, method of manufacture thereof, and method of producing mask pattern |
-
2014
- 2014-06-20 CN CN201410278621.6A patent/CN104267858B/en active Active
-
2015
- 2015-06-05 TW TW104118263A patent/TWI601273B/en active
- 2015-06-05 TW TW104208987U patent/TWM518407U/en unknown
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030063445A1 (en) * | 2000-03-24 | 2003-04-03 | Reinhard Fischbach | Housing for biometric sensor chips and method for producing the housing |
| CN203630794U (en) * | 2013-12-13 | 2014-06-04 | 深圳市汇顶科技股份有限公司 | Fingerprint identification device and mobile terminal |
| CN103793689A (en) * | 2014-01-27 | 2014-05-14 | 南昌欧菲光科技有限公司 | Fingerprint recognition sensor packaging structure, electronic device and method for manufacturing fingerprint recognition sensor |
| CN204143413U (en) * | 2014-06-20 | 2015-02-04 | 敦泰科技有限公司 | Sensor chip and configure the electronic installation of this sensor chip |
Non-Patent Citations (1)
| Title |
|---|
| 陈伟元 等: "单芯片微小型指纹识别***设计与实现", 《计算机工程与应用》 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107066920A (en) * | 2016-12-23 | 2017-08-18 | 浙江大学 | Fingerprint recognition panel and device |
| CN109284716A (en) * | 2018-09-21 | 2019-01-29 | 京东方科技集团股份有限公司 | A kind of substrate, display panel and display device |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI601273B (en) | 2017-10-01 |
| TW201605027A (en) | 2016-02-01 |
| TWM518407U (en) | 2016-03-01 |
| CN104267858B (en) | 2017-07-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9881196B2 (en) | Integrated finger print sensor | |
| CN104267858A (en) | Sensing chip, manufacturing method thereof and electronic device provided with sensing chip | |
| CN102843122B (en) | Capacitive sensing button on chip | |
| JP2020503606A5 (en) | ||
| US10013596B2 (en) | Fingerprint recognition apparatus | |
| CN204143413U (en) | Sensor chip and configure the electronic installation of this sensor chip | |
| SE1750770A1 (en) | Fingerprint sensor module and method for manufacturing a fingerprint sensor module | |
| CN205384588U (en) | Pressure detection structure and touch device | |
| CN101853113A (en) | Capacitive touch pad with comb-shaped electrode | |
| KR20160032132A (en) | Surface sensor | |
| CN105824470A (en) | Touch display device and mobile terminal | |
| TWI616824B (en) | Fingerprint recognition device and touch-control device with fingerprint recognition function | |
| CN110300975A (en) | Fingerprint sensor module including fingerprint sensor arrangement He the substrate for being connected to the sensor device | |
| CN104951766B (en) | Fingerprint identification device, touch screen and mobile terminal | |
| CN107678217B (en) | Liquid crystal display panel and liquid crystal display device | |
| CN204406428U (en) | A kind of encapsulating structure of fingerprint Identification sensor | |
| CN107256106B (en) | Array substrate, liquid crystal display panel, touch display device and touch driving method | |
| TWI641980B (en) | Force sensing module, electronic device and timing control method | |
| CN107438855B (en) | Fingerprint chip packaging module, fingerprint identification module and packaging method | |
| TW201741831A (en) | Touch panel, electronic device and method of three-point touch measuring | |
| CN206292759U (en) | Touch-control sensing component | |
| CN102375578A (en) | Touch control panel structure and touch control display device with same | |
| KR20170071248A (en) | Finterprint sensing device and manufacturing method of the same | |
| CN103336643A (en) | Touch panel | |
| CN108089728A (en) | Electronic device and its triaxial stress sensor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20151029 Address after: Mailbox No. 2804 Cayman Islands cricket square Dakaiman KY1-1112, green willow four storey building Applicant after: Dun Tai Electronics Co., Ltd. Address before: Grand Cayman, Cayman Islands in George County, South Church Street agrand Mansion Applicant before: FocalTech Systems Co., Ltd. |
|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20220505 Address after: Room 2108, block B, building 9, zone 2, Shenzhen Bay science and technology ecological park, Yuehai street, Nanshan District, Shenzhen, Guangdong Patentee after: FOCALTECH ELECTRONICS (SHENZHEN) Co.,Ltd. Address before: Mailbox No. 2804 Cayman Islands cricket square Dakaiman KY1-1112, green willow four storey building Patentee before: FOCALTECH ELECTRONICS, Ltd. |
|
| TR01 | Transfer of patent right |