CN107683033A - A kind of preparation method of the multilayer printed circuit board based on blind buried via hole - Google Patents
A kind of preparation method of the multilayer printed circuit board based on blind buried via hole Download PDFInfo
- Publication number
- CN107683033A CN107683033A CN201710987413.7A CN201710987413A CN107683033A CN 107683033 A CN107683033 A CN 107683033A CN 201710987413 A CN201710987413 A CN 201710987413A CN 107683033 A CN107683033 A CN 107683033A
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- CN
- China
- Prior art keywords
- circuit board
- buried via
- via hole
- blind buried
- gong
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The present invention relates to a kind of preparation method of the multilayer printed circuit board based on blind buried via hole, comprise the following steps：Some printed substrate through-thickness are stacked, to form multiple superposed wiring board；First layer PCB surface gong at the top of multiple superposed wiring board goes out some mixed pressure grooves；In addition to the sandwich circuit board of top first, some blind buried via holes are gone out to remaining wiring board gong；Gong has a projection in each mixed pressure groove, and a groove is provided with corresponding each high frequency daughter board；The multilayer circuit board for going out mixed pressure groove and blind buried via hole to gong carries out baking sheet and plasma removing glue；After assist side hot melt, molded high frequency daughter board and copper billet are put into mixed pressure groove and blind buried via hole respectively, and copper foil is stacked in bottom, is then pressed, makes high frequency daughter board, copper billet, copper foil together with wiring board secure bond；The multilayer circuit board being bonded together is cooled down, and removes the cull of multilayer line plate surface.
Description
Technical field
The invention belongs to wiring board manufacture field, and in particular to a kind of making of the multilayer printed circuit board based on blind buried via hole
Method.
Background technology
With the continuous progress of Electronic Design and manufacturing process, electronic product is also progressively to multifunction, densification
And the trend development of high transfer rate.Simultaneously again due to the developing rapidly of chip miniaturization, data transfer quantity increases, be
Working frequency of uniting also more and more higher.
But at present, produced using lamination method in the technique of blind hole (or buried via hole) PCB, it is necessary to enter to blind hole
The multiple copper plating treatment of row, to ensure the conducting of blind hole.But while to blind hole copper facing, PCB part surface also can be same
When be coated with copper, cause the layers of copper in pcb board face blocked up, be unfavorable for the making of plate face circuit.Copper facing meeting especially is carried out to blind hole
The layers of copper of core material is thickeied, and copper electroplating layer can have the defects of concave point, salient point, pin hole and uneven coating, in internal layer figure
The problems such as circuit breach, open circuit, short circuit are easily produced when shape is made.It is conventional especially for the wiring board that internal layer circuit is intensive
The qualification rate of technique productions is than relatively low.
In consideration of it, propose a kind of preparation method of the multilayer printed circuit board based on blind buried via hole.
The content of the invention
To solve the etching of prior art internal layer circuit by blind buried via hole copper-plated the defects of influenceing, so as to improve wiring board production
Qualification rate, the present invention provides a kind of preparation method of the multilayer printed circuit board based on blind buried via hole, prepares following material in advance：
The material includes some printed substrates, high frequency daughter board, copper billet and copper foil, and follows the steps below behaviour
Make：
The first step, some printed substrate through-thickness are stacked, to form multiple superposed wiring board；
Second step, the first layer PCB surface gong at the top of multiple superposed wiring board go out some mixed pressure grooves；
3rd step, in addition to the sandwich circuit board of top first, some blind buried via holes are gone out to remaining wiring board gong, and filled in blind hole
Resin；
4th step, gong has a projection in each mixed pressure groove, and a groove is provided with corresponding each high frequency daughter board；
5th step, the multilayer circuit board that mixed pressure groove and blind buried via hole are gone out to gong carry out baking sheet and plasma removing glue；
6th step, after assist side heats, molded high frequency daughter board and copper billet are put into mixed pressure groove and blind buried via hole respectively,
And copper foil is stacked in bottom, then pressed, make high frequency daughter board, copper billet, copper foil together with wiring board secure bond；
7th step, the multilayer circuit board being bonded together is cooled down, and remove the cull of multilayer line plate surface.
Further, the 3rd step, in the process of the blind buried via hole of gong, roughness in the hole of blind buried via hole is controlled to be less than or equal to 15
μm。
Further, the insulating barrier that the insulative resin mixed liquor containing insulating properties filler is formed is covered in each printing
On wiring board, the insulating barrier is formed around each printed substrate electric conductivity salient point.
Further, in addition to the 8th step, the flatness of the multilayer circuit board after measurement is made and outward appearance full inspection is carried out.
Further, the 6th step, in the bonding processes, heating rate control is in 2.5 DEG C/min~2.8 DEG C/min, directly
190 DEG C are raised to temperature.
Further, mannitol is coated in the PCB surface, continues 25min；Afterwards again using dry ice to the line
Road plate is cooled to 6-7 DEG C.
Further, the dosage of the mannitol is 1.7g/m2 wiring boards.
Further, the AlN ceramic for insulating heat-conductive plated by PVD methods is additionally provided with above the wiring board to apply
Layer.
Beneficial effect：Good reliability of the present invention, thermal conductivity are high, insulating properties is good, heat resistance is strong, and can protect internal layer
Circuit etching is not influenceed by blind buried via hole is copper-plated, improves the qualification rate of wiring board production.
Brief description of the drawings
Accompanying drawing 1 is the flow chart of procedure of processing in the present embodiment.
Embodiment
Embodiment：A kind of preparation method of the multilayer printed circuit board based on blind buried via hole
Such as Fig. 1, following material is prepared in advance：
The material includes some printed substrates, high frequency daughter board, copper billet and copper foil, and follows the steps below behaviour
Make：
The first step, some printed substrate through-thickness are stacked, to form multiple superposed wiring board.Insulation will be contained
Property filler insulative resin mixed liquor form insulating barrier be covered on each printed substrate, the insulating barrier formed each
Around printed substrate electric conductivity salient point.
Second step, the first layer PCB surface gong at the top of multiple superposed wiring board go out some mixed pressure grooves.
3rd step, in addition to the sandwich circuit board of top first, some blind buried via holes are gone out to remaining wiring board gong, and filled in blind hole
Resin.Wherein, in the process of the blind buried via hole of gong, roughness in the hole of blind buried via hole is controlled to be less than or equal to 15 μm.
4th step, gong has a projection in each mixed pressure groove, and a groove is provided with corresponding each high frequency daughter board.
5th step, the multilayer circuit board that mixed pressure groove and blind buried via hole are gone out to gong carry out baking sheet and plasma removing glue.
6th step, after assist side heats, molded high frequency daughter board and copper billet are put into mixed pressure groove and blind buried via hole respectively,
And copper foil is stacked in bottom, then pressed, make high frequency daughter board, copper billet, copper foil together with wiring board secure bond.It is described
In bonding processes, heating rate control is in 2.5 DEG C/min~2.8 DEG C/min, until temperature is raised to 190 DEG C.In the wiring board
Surface coats mannitol, continues 25min；6-7 DEG C is cooled to the wiring board using dry ice again afterwards, the use of the mannitol
Measure as 1.7g/m2 wiring boards.
7th step, the multilayer circuit board being bonded together is cooled down, and remove the cull of multilayer line plate surface.
8th step, measure the flatness of the multilayer circuit board after being made and carry out outward appearance full inspection.
The present invention is described in detail above, described above, only the preferred embodiments of the invention, when can not
Limit the scope of the present invention, i.e., it is all to make equivalent changes and modifications according to the application scope, it all should still belong to covering scope of the present invention
It is interior.
Claims (8)
- A kind of 1. preparation method of the multilayer printed circuit board based on blind buried via hole, it is characterised in that：Prepare following material in advance：The material includes some printed substrates, high frequency daughter board, copper billet and copper foil, and follows the steps below operation：The first step, some printed substrate through-thickness are stacked, to form multiple superposed wiring board；Second step, the first layer PCB surface gong at the top of multiple superposed wiring board go out some mixed pressure grooves；3rd step, in addition to the sandwich circuit board of top first, some blind buried via holes are gone out to remaining wiring board gong, and tree is filled in blind hole Fat；4th step, gong has a projection in each mixed pressure groove, and a groove is provided with corresponding each high frequency daughter board；5th step, the multilayer circuit board that mixed pressure groove and blind buried via hole are gone out to gong carry out baking sheet and plasma removing glue；6th step, after assist side hot melt, it is put into molded high frequency daughter board and copper billet in mixed pressure groove and blind buried via hole respectively, and Bottom stacks copper foil, is then pressed, and makes high frequency daughter board, copper billet, copper foil together with wiring board secure bond；7th step, the multilayer circuit board being bonded together is cooled down, and remove the cull of multilayer line plate surface.
- 2. the preparation method of the multilayer printed circuit board according to claim 1 based on blind buried via hole, it is characterised in that：3rd Step, in the process of the blind buried via hole of gong, roughness in the hole of blind buried via hole is controlled to be less than or equal to 15 μm.
- 3. the preparation method of the multilayer printed circuit board according to claim 1 based on blind buried via hole, it is characterised in that：It will contain The insulating barrier that the insulative resin mixed liquor for having insulating properties filler is formed is covered on each printed substrate, and the insulating barrier is formed Around each printed substrate electric conductivity salient point.
- 4. the preparation method of the multilayer printed circuit board according to claim 1 based on blind buried via hole, it is characterised in that：Also wrap The 8th step is included, the flatness of the multilayer circuit board after being made is measured and carries out outward appearance full inspection.
- 5. the preparation method of the multilayer printed circuit board according to claim 1 based on blind buried via hole, it is characterised in that：6th Walk, in the bonding processes, heating rate control is in 2.5 DEG C/min~2.8 DEG C/min, until temperature is raised to 190 DEG C.
- 6. the preparation method of the multilayer printed circuit board according to claim 5 based on blind buried via hole, it is characterised in that：Institute PCB surface coating mannitol is stated, continues 25min；6-7 DEG C is cooled to the wiring board using dry ice again afterwards.
- 7. the preparation method of the multilayer printed circuit board according to claim 6 based on blind buried via hole, it is characterised in that：It is described The dosage of mannitol is 1.7g/m2 wiring boards.
- 8. the preparation method of the multilayer printed circuit board according to claim 7 based on blind buried via hole, it is characterised in that：It is described The AlN ceramic coating for insulating heat-conductive plated by PVD methods is additionally provided with above wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710987413.7A CN107683033A (en) | 2017-10-20 | 2017-10-20 | A kind of preparation method of the multilayer printed circuit board based on blind buried via hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710987413.7A CN107683033A (en) | 2017-10-20 | 2017-10-20 | A kind of preparation method of the multilayer printed circuit board based on blind buried via hole |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107683033A true CN107683033A (en) | 2018-02-09 |
Family
ID=61141290
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710987413.7A Pending CN107683033A (en) | 2017-10-20 | 2017-10-20 | A kind of preparation method of the multilayer printed circuit board based on blind buried via hole |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107683033A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112888171A (en) * | 2021-01-19 | 2021-06-01 | 中国电子科技集团公司第二十九研究所 | Method and device for processing blind slot of multilayer printed board |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100701353B1 (en) * | 2005-08-19 | 2007-03-29 | 주식회사 두산 | Multi-layer printed circuit board and manufacturing method thereof |
| CN104780702A (en) * | 2015-04-21 | 2015-07-15 | 深圳市博敏电子有限公司 | High-frequency mixed-compression circuit board capable of quick heat dissipation and forming method thereof |
-
2017
- 2017-10-20 CN CN201710987413.7A patent/CN107683033A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100701353B1 (en) * | 2005-08-19 | 2007-03-29 | 주식회사 두산 | Multi-layer printed circuit board and manufacturing method thereof |
| CN104780702A (en) * | 2015-04-21 | 2015-07-15 | 深圳市博敏电子有限公司 | High-frequency mixed-compression circuit board capable of quick heat dissipation and forming method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112888171A (en) * | 2021-01-19 | 2021-06-01 | 中国电子科技集团公司第二十九研究所 | Method and device for processing blind slot of multilayer printed board |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180209 |