CN107675140B - 基于微区阻隔法的金刚石刀具织构涂层的制备方法 - Google Patents
基于微区阻隔法的金刚石刀具织构涂层的制备方法 Download PDFInfo
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
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Abstract
一种基于微区阻隔法的金刚石刀具织构涂层的制备方法,其特征在于它主要包括以下步骤:首先,在金属薄膜上加工出微孔和/或微沟槽阵列作为掩膜;其次,将刀具基体进行预处理;第三,将所述掩膜固定于预处理后的刀具基体表面;第四,采用表面涂层技术在覆盖掩膜的刀具表面沉积微区阻隔薄膜,薄膜制备完成后去掉掩膜,在刀具表面形成抑制金刚石生长的具有织构特征的微区突起;第五,采用CVD方法在带有微区突起的刀具表面选择性生长金刚石织构涂层;第六,去掉第四步在刀具基体表面沉积形成的具有织构特征的微区突起。本发明方法简便快捷,成本相对较低,生长效率和成功率都比较高并且不会破坏刀具,不减小刀具本身的强度。
Description
技术领域
本发明涉及一种刀具制备技术,尤其是一种金刚石刀具制备技术,具体地说是一种基于微区阻隔法的金刚石刀具织构涂层的制备方法。
背景技术
众所周知,刀具表面微织构具有减摩耐磨,抗粘黏,降低刀具切削温度等作用,对增大切削效率和刀具寿命有着显著效果,如果将其运用在金刚石涂层刀具上会有更加优异的表现,但是金刚石的加工比较困难,技术不成熟,金刚石涂层织构刀具目前鲜有人研究,没有合适的方法制备出具有织构形貌的金刚石涂层。
发明内容
本发明的目的是针对以上研究领域的空白,提供一种基于微区阻隔法的金刚石刀具织构涂层的制备方法,它利用抑制金刚石生长的材料,在刀具表面制备织构纹路的阻隔凸起,用以制备金刚石刀具织构涂层。
本发明的技术方案是:
一种基于微区阻隔法的金刚石刀具织构涂层的制备方法,其特征在于它主要包括以下步骤:
首先,在金属薄膜上加工出微孔和/或微沟槽阵列作为掩膜;
其次,将刀具基体进行预处理;
第三,将所述掩膜固定于预处理后的刀具基体表面;
第四,采用表面涂层技术在覆盖掩膜的刀具表面沉积微区阻隔薄膜,薄膜制备完成后去掉掩膜,在刀具表面形成抑制金刚石生长的具有织构特征的微区突起;
第五,采用CVD方法在带有微区突起的刀具表面选择性生长金刚石织构涂层。
所述的掩膜采用具有较好的耐热和延展性的金属薄膜,金属薄膜的厚度小于0.1mm,掩膜上微孔和沟槽的形状和阵列方式与金刚石刀具织构涂层织构的形状(例如阵列凹坑,沟槽等)和阵列方式一致,微孔和沟槽等形状采用激光加工、微细电火花加工或离子束加工等技术加工。
所述的金属薄膜为铜箔或铝箔。
在预处理后的刀具表面固定掩膜时,掩膜上微孔和/或微沟槽镂空的位置和刀具上织构的位置保持一致,同时保持掩膜下表面与刀具上表面紧密贴合。
所述的表面涂层技术包括CVD或PVD沉积技术。
所述的微区阻隔薄膜为铁或钴类抑制金刚石生长的材料;必要时应在金刚石织构涂层生长结束后去掉微区凸起和形成的石墨。
所述的抑制金刚石生长的、覆盖在刀具表面的微区突起的高度不超过10微米。
所述的预处理包括研磨、抛光、酸碱两步法脱钴处理以及纳米金刚石粉的丙酮悬浮液超声波植晶。
由于抑制作用刀具表面有阻隔的微区无金刚石生长,刀具表面其他无阻隔区域则生长金刚石膜,阻隔微区金刚石选择性生长导致在刀具表面形成具有织构形貌的金刚石涂层。
所述的CVD方法包括HFCVD法或MPCVD法。
本发明的金刚石刀具织构涂层的微区阻隔法制备技术实际上是在掩膜上制备出微孔,微沟槽等不同织构形状镂空,将其覆盖于刀具上需要制备织构的区域,利用刀具表面涂层技术(例如CVD和PVD技术等),在掩膜上一定范围内涂镀一层阻隔薄膜(Co、Fe、Ni等抑制金刚石生长的材料),除去掩膜后,在刀具表面形成具有织构形状的微区阻隔凸起,通过HFCVD或MPCVD等方法在刀具表面生长金刚石涂层,由于微区阻隔凸起的催化抑制作用,使其周围生成石墨,生长完毕后去除掉阻隔凸起和石墨,生成具有织构形貌的金刚石刀具织构涂层。
本发明的优点与效果是:
本发明利用对金刚石生长有抑制作用的材料,在刀具基体上选择性生长金刚石织构涂层,方法简便快捷,成本相对较低而且掩膜的制备以及金刚石涂层的生长都是比较成熟的技术,生长效率和成功率都比较高并且不会破坏刀具,不减小刀具本身的强度,能满足各种形貌的金刚石织构涂层的制备,以刀具涂层的方式生长织构是制备金刚石织构涂层刀具的最佳选择之一。
附图说明
图1是本发明的工艺流程示意图。
图2是本发明的不同镂空形状的掩膜示意图。
具体实施方式
下面结合附图和实施例对本发明作进一步的说明。
图1中显示的是刀具基体、掩膜、阻隔凸起,金刚石涂层以及形成的具有金刚石织构涂层的刀具。图2显示的是不同织构镂空的掩膜。
一种基于微区阻隔法的金刚石刀具织构涂层的制备方法,它包括以下步骤:
第一步,刀具基体采用硬质合金等常见的刀具材料,经过去酸碱两步法脱钴处理或添加过渡层等前处理,使表面易于生长金刚石涂层。粗化刀具表面,使表面粗糙度大于6.3微米,粗化的刀具表面有利于金刚石粉末的附着,增加生长的金刚石涂层的附着力。用丙酮金刚石粉末悬浮液超声波处理粗化后的刀具表面,在刀具表面植晶,使其易于生长金刚石涂层。掩膜上可以用激光刻蚀、微细电火花和离子束刻蚀等技术在掩膜上制备不同的织构纹路镂空,镂空的位置位于容易产生月牙洼的区域。
第二步,利用掩膜(如铜片,铝片等)覆盖于刀具表面,然后利用涂层技术在掩膜表面涂镀一层抑制金刚石生长的材料。例如将其放入PVD设备,利用物理气相沉积技术,在掩膜表面沉积一层均匀的抑制金刚石生长的材料(Co、Fe、Ni等)。
第三步,去掉掩膜,形成织构形状的阻隔凸起。用放大镜仔细观察凸起的质量,检查形状是否规整,有无裂纹等问题。
第四步,将处理好的刀具放入反应釜中,用HFCVD或MPCVD等方法生长金刚石涂层,涂层的厚度在10微米左右,尽量减小金刚石晶粒大小,有利于控制织构形貌并且可以减小刀-屑之间摩擦系数,减小刀具温度和切削力。经过数个小时后沉积后形成金刚石涂层。由于Co、Fe、Ni等材料对金刚石生长的抑制作用,存在阻生隔断的区域金刚石不能生长,催化形成石墨。必要时可用腐蚀方法或用刻蚀技术清除阻隔凸起,用超声波丙酮清洗去除石墨和杂质残留,获得具有织构形貌的金刚石涂层刀具。如果所生长的金刚石涂层厚度远大于阻隔凸起的高度,也可不对阻隔凸起进行清理而直接使用。
图2中是不同镂空形状的掩膜示例,利用不同的掩膜可以生成不同结构形式的金刚石织构。
详述如下:
首先,要准备好抑制金刚石生长的材料(靶材),光学显微镜,制备阻隔凸起的设备(如物理气相沉积设备),掩膜(如Cu片等),刀具基体,超声波清洗机,金刚石粉末,金刚石生长设备如HFCVD,MPCVD等。
刀具基体一般采用硬质合金等常见材料,经过去酸碱两步法脱钴处理或添加过渡层等前处理。粗化刀具表面,使表面粗糙度大于6.3微米,有利于植晶,再用丙酮金刚石粉末悬浮液超声波处理刀具表面,使金刚石粉均匀分布,易于生长金刚石涂层和增强涂层的附着性。
掩膜的微孔,微沟槽等不同织构形状镂空的宽度、深度为几十微米到几百微米不等。当用物理气相沉积技术(PVD)或化学气相沉积抑制金刚石生长的材料时,掩膜的厚度与微孔的直径和微沟槽的宽度存在一定关系,这是因为刀具基体的沉积面与靶材成一定角度,这导致如果宽深比过大,底部沉积不到抑制金刚石生长的材料,不能形成有效的阻隔凸起,这里根据经验和分子扩散模型,动力学模型得出粗略估算公式:。H是掩膜厚度,厚度为小于100微米,L为微沟槽的宽度或凹坑的截面直径。掩膜上的镂空对应需要制备织构的区域(如产生月牙洼的区域),将其覆盖于刀具表面,同时保证掩膜下表面与刀具上表面紧密贴合,掩膜采用铜箔、铝箔等具有较好的耐热和延展性的金属薄膜。抑制生长材料通过特定的方法(CVD、PVD等技术)附着于掩膜上,要确保形成阻隔凸起的质量以及其与硬质合金表面附着强度。掩膜去除后,会呈现出具有织构形状的阻隔凸起,用放大镜仔细观察凸起的质量,形状,有无裂纹,缺失等问题。阻隔凸起由Co、Fe、Ni等对金刚石沉积的材料组成,存在阻隔凸起的区域金刚石不能生长,周围金刚石石墨化。掩膜上的微孔,微沟槽等不同织构形状镂空可以控制阻隔凸起的形状,间接控制织构的形状。刀具处理好后放入反应釜内,用HFCVD或MPCVD等方法沉积金刚石,阻隔凸起在高温下会使其附近生成石墨,经过数小时的生长,形成厚度大约10微米的金刚石涂层。沉积完成后除掉阻隔凸起和石墨。用超声波丙酮清洗没有附着的金刚石和杂质后,获得具有不同织构纹路的刀具金刚石涂层。阻隔凸起可以去除,也可以不去除,当沉积厚度较大,阻隔凸起处形成凹陷时,可以不必去除。当需要去除时可用王水等腐蚀方法或用刻蚀技术刻蚀掉以防止刀具切削过程中产生高温使阻隔凸起的分子或原子扩散进入金刚石涂层,产生催化作用,破坏金刚石涂层,缩短涂层寿命。
本发明未涉及部分与现技术相同或可采用现有技术加以实现。
Claims (9)
1.一种基于微区阻隔法的金刚石刀具织构涂层的制备方法,其特征在于它主要包括以下步骤:
首先,在金属薄膜上加工出微孔或微沟槽阵列织构形状作为掩膜;
其次,将刀具基体进行预处理;
第三,将所述掩膜固定于预处理后的刀具基体表面;
第四,采用表面涂层技术在覆盖掩膜的刀具表面沉积微区阻隔薄膜,薄膜制备完成后去掉掩膜,在刀具表面形成抑制金刚石生长的具有织构特征的微区凸起;
第五,采用CVD方法在带有微区凸起的刀具表面选择性生长金刚石织构涂层。
2.根据权利要求1所述的方法,其特征在于,所述的掩膜采用金属薄膜,金属薄膜的厚度小于0.1mm,掩膜上微孔和沟槽的形状和阵列方式与金刚石刀具织构涂层织构的形状和阵列方式一致,微孔和沟槽形状采用激光加工、微细电火花加工或离子束加工技术加工。
3.根据权利要求1所述的方法,其特征在于,所述的金属薄膜为铜箔或铝箔。
4.根据权利要求1所述的方法,其特征在于,在预处理后的刀具表面固定掩膜时,掩膜上微孔和/或微沟槽镂空的位置和刀具上织构的位置保持一致,同时保持掩膜下表面与刀具上表面紧密贴合。
5.根据权利要求1所述的方法,其特征在于,所述的表面涂层技术包括CVD或PVD沉积技术。
6.根据权利要求1所述的方法,其特征在于,所述的微区阻隔薄膜为能抑制金刚石生长的铁或钴薄膜。
7.根据权利要求1所述的方法,其特征在于,所述的抑制金刚石生长的、覆盖在刀具表面的微区突起的高度不超过10微米;并在金刚石织构涂层生长结束后去掉微区凸起和形成的石墨。
8.根据权利要求1所述的方法,其特征在于,所述的预处理包括研磨、抛光、酸碱两步法脱钴处理以及纳米金刚石粉的丙酮悬浮液超声波植晶。
9.根据权利要求1所述的方法,其特征在于,所述的CVD方法包括HFCVD法或MPCVD法。
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