CN107641822A - 电镀铜用高填平酸铜光亮剂 - Google Patents
电镀铜用高填平酸铜光亮剂 Download PDFInfo
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- CN107641822A CN107641822A CN201710897422.7A CN201710897422A CN107641822A CN 107641822 A CN107641822 A CN 107641822A CN 201710897422 A CN201710897422 A CN 201710897422A CN 107641822 A CN107641822 A CN 107641822A
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- 239000010949 copper Substances 0.000 title claims abstract description 102
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 102
- 238000009713 electroplating Methods 0.000 title claims abstract description 84
- 238000005282 brightening Methods 0.000 title claims abstract description 66
- 239000002253 acid Substances 0.000 title claims abstract description 65
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- 239000002994 raw material Substances 0.000 claims abstract description 17
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- PDQAZBWRQCGBEV-UHFFFAOYSA-N Ethylenethiourea Chemical compound S=C1NCCN1 PDQAZBWRQCGBEV-UHFFFAOYSA-N 0.000 claims description 30
- -1 poly- Aziridine alkyl compound Chemical class 0.000 claims description 26
- 239000000203 mixture Substances 0.000 claims description 24
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- DNJIEGIFACGWOD-UHFFFAOYSA-N ethanethiol Chemical compound CCS DNJIEGIFACGWOD-UHFFFAOYSA-N 0.000 claims description 10
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- Electroplating And Plating Baths Therefor (AREA)
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
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CN108130565A (zh) * | 2018-02-01 | 2018-06-08 | 广东埃德伟控汽车部件有限公司 | 一种稳定性电镀液 |
CN108642534A (zh) * | 2018-05-29 | 2018-10-12 | 韶关硕成化工有限公司 | Vcp垂直连续镀铜添加剂 |
CN110117801A (zh) * | 2019-06-21 | 2019-08-13 | 郑州知淘信息科技有限责任公司 | 一种印制电路板盲孔填铜用镀铜添加剂及其制备方法 |
CN111118558A (zh) * | 2019-12-27 | 2020-05-08 | 江苏赛夫特半导体材料检测技术有限公司 | 一种半导体用镀铜添加剂 |
CN113445086A (zh) * | 2021-04-17 | 2021-09-28 | 珠海松柏科技有限公司 | 适用于印制线路板的镀铜添加剂及电镀铜镀液 |
CN113881984A (zh) * | 2021-10-21 | 2022-01-04 | 深圳市励高表面处理材料有限公司 | 一种脉冲电镀整平剂及制备方法和应用该整平液的电镀液 |
CN115787007A (zh) * | 2022-11-03 | 2023-03-14 | 厦门大学 | 一种酸性硫酸盐电子电镀铜添加剂组合物及其应用 |
Citations (2)
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US20150159288A1 (en) * | 2013-12-06 | 2015-06-11 | Rohm And Haas Electronic Materials Llc | Additives for electroplating baths |
CN103572335B (zh) * | 2013-11-20 | 2016-04-13 | 东莞市富默克化工有限公司 | 一种pcb通孔电镀铜溶液及其制备方法和电镀方法 |
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Patent Citations (2)
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CN103572335B (zh) * | 2013-11-20 | 2016-04-13 | 东莞市富默克化工有限公司 | 一种pcb通孔电镀铜溶液及其制备方法和电镀方法 |
US20150159288A1 (en) * | 2013-12-06 | 2015-06-11 | Rohm And Haas Electronic Materials Llc | Additives for electroplating baths |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
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CN108130565A (zh) * | 2018-02-01 | 2018-06-08 | 广东埃德伟控汽车部件有限公司 | 一种稳定性电镀液 |
CN108642534A (zh) * | 2018-05-29 | 2018-10-12 | 韶关硕成化工有限公司 | Vcp垂直连续镀铜添加剂 |
CN110117801A (zh) * | 2019-06-21 | 2019-08-13 | 郑州知淘信息科技有限责任公司 | 一种印制电路板盲孔填铜用镀铜添加剂及其制备方法 |
CN111118558A (zh) * | 2019-12-27 | 2020-05-08 | 江苏赛夫特半导体材料检测技术有限公司 | 一种半导体用镀铜添加剂 |
CN111118558B (zh) * | 2019-12-27 | 2021-06-04 | 江苏赛夫特半导体材料检测技术有限公司 | 一种半导体用镀铜添加剂 |
CN113445086A (zh) * | 2021-04-17 | 2021-09-28 | 珠海松柏科技有限公司 | 适用于印制线路板的镀铜添加剂及电镀铜镀液 |
CN113881984A (zh) * | 2021-10-21 | 2022-01-04 | 深圳市励高表面处理材料有限公司 | 一种脉冲电镀整平剂及制备方法和应用该整平液的电镀液 |
CN115787007A (zh) * | 2022-11-03 | 2023-03-14 | 厦门大学 | 一种酸性硫酸盐电子电镀铜添加剂组合物及其应用 |
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