CN107634012B - Packaging substrate, preparation method thereof, display panel and display device - Google Patents
Packaging substrate, preparation method thereof, display panel and display device Download PDFInfo
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- CN107634012B CN107634012B CN201710824260.4A CN201710824260A CN107634012B CN 107634012 B CN107634012 B CN 107634012B CN 201710824260 A CN201710824260 A CN 201710824260A CN 107634012 B CN107634012 B CN 107634012B
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Abstract
The embodiment of the disclosure provides a packaging substrate, a preparation method of the packaging substrate, a display panel and a display device. The preparation method of the packaging substrate comprises the following steps: forming a film layer composed of a conductive solution on a substrate base plate with at least one spacer; the conductive solution includes conductive particles and a solvent, and the solvent of the conductive solution is evaporated to attach the conductive particles to the substrate base plate to form a first auxiliary electrode layer.
Description
Technical Field
The invention relates to the technical field of display, in particular to a packaging substrate, a preparation method of the packaging substrate, a display panel and a display device.
Background
At present, an OLED (Organic Electro-luminescent Display) has a light weight, a low power consumption, a high response, a high resolution, and the like, and is exposed in the Display field.
The Active-matrix organic light emitting diode (AMOLED) can effectively solve the problems of aperture ratio reduction and display screen brightness reduction caused by a complex Thin Film Transistor (TFT) compensation circuit, and meanwhile, due to a microcavity effect existing in the top-emitting AMOLED structure, the color gamut of the AMOLED display screen can be improved, the display effect is improved, and thus the top-emitting structure is widely applied at present.
As a top emission type OLED, the transmittance and conductivity of a cathode are very important, and commonly used cathode materials such as Al (aluminum), Mg (magnesium) -Ag (silver), and Ag have good transmittance only when they are very thin, but the cathode layer is too thin, which may cause open circuit or metal oxidation, and may not form effective ohmic contact, thereby causing uneven brightness of a display screen.
Disclosure of Invention
In a first aspect, an embodiment of the present disclosure provides a method for manufacturing a package substrate, including: forming a film layer composed of a conductive solution on a substrate base plate with at least one spacer; the conductive solution includes conductive particles and a solvent, and the solvent of the conductive solution is evaporated to attach the conductive particles to the substrate base plate to form a first auxiliary electrode layer.
In one embodiment of the present disclosure, before forming the film layer composed of the conductive solution on the base substrate having the at least one spacer, the method further includes: heating the base substrate with at least one spacer to bring the base substrate to a selected temperature.
In one embodiment of the present disclosure, before forming the film layer composed of the conductive solution on the base substrate having at least one spacer, the method further includes: and enabling the substrate base plate to be in a closed environment, and exhausting the closed environment where the substrate base plate is located to enable the air pressure of the closed environment to be smaller than that of air.
In one embodiment of the present disclosure, before forming the film layer composed of the conductive solution on the base substrate having at least one spacer, the method further includes: forming a second auxiliary electrode layer on the substrate base plate, wherein the second auxiliary electrode layer comprises a plurality of second auxiliary electrodes, and the projections of the second auxiliary electrodes on the substrate base plate are positioned in the non-light-transmitting forming areas of the substrate base plate; forming the spacer on the second auxiliary electrode, wherein an orthographic projection of the spacer on the second auxiliary electrode is surrounded by a boundary of the second auxiliary electrode.
In one embodiment of the present disclosure, the conductive particles are metal nanoparticles, inorganic conductive materials, or organic conductive materials, and the solvent is water or alcohols.
In one embodiment of the present disclosure, the metal nanoparticles are nanosilver conductive particles.
In one embodiment of the present disclosure, the selected temperature is 200-240 ℃.
In one embodiment of the present disclosure, the forming a film layer composed of a conductive solution on a substrate having at least one spacer includes: and printing or spin-coating a nano conductive solution on the substrate with at least one spacer to form the film layer.
In one embodiment of the present disclosure, before forming the film layer composed of the conductive solution on the base substrate having at least one spacer, the method further includes: forming a color filter pattern in a light-transmitting forming region of a substrate base plate, and forming a black matrix pattern for spacing the color filter pattern in a non-light-transmitting forming region of the substrate base plate; and forming the spacer on the black matrix pattern.
In one embodiment of the present disclosure, before forming the film layer composed of the conductive solution on the base substrate having at least one spacer, the method further includes: forming a color filter pattern in a light-transmitting forming region of a substrate base plate, and forming a black matrix pattern for spacing the color filter pattern in a non-light-transmitting forming region of the substrate base plate; forming a flat layer covering the color filter pattern and the black matrix pattern; and forming the spacer on the flat layer, wherein the projection of the spacer on the substrate base plate is positioned in the projection of the black matrix pattern on the substrate base plate.
In a second aspect, an embodiment of the present disclosure provides a package substrate, including a substrate, at least one spacer disposed on the substrate, and a first auxiliary electrode layer covering the spacer, where the first auxiliary electrode layer is obtained by the above preparation method.
In one embodiment of the present disclosure, the package substrate further includes a second auxiliary electrode disposed between the spacer and the substrate, the second auxiliary electrode being electrically connected to the first auxiliary electrode layer.
In a third aspect, an embodiment of the present disclosure provides a display panel, which includes the package substrate and the array substrate described above.
In one embodiment of the present disclosure, the array substrate includes an OLED light emitting element; the cathode or the anode of the OLED light-emitting element is in contact with the first auxiliary electrode layer.
In a fourth aspect, an embodiment of the present disclosure provides a display device, including the display panel described above.
Drawings
In order to more clearly illustrate the embodiments of the present disclosure or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a schematic structural diagram of an OLED packaging substrate provided in the prior art;
fig. 2 is a schematic flow chart illustrating a method for manufacturing a package substrate according to an embodiment of the disclosure;
fig. 3 is a first schematic structural diagram of a package substrate according to an embodiment of the present disclosure;
fig. 4 is a schematic structural diagram illustrating a second auxiliary electrode formed on a substrate according to an embodiment of the disclosure;
fig. 5 is a schematic structural diagram of forming a spacer on a second auxiliary electrode according to an embodiment of the disclosure;
fig. 6(a) is a second schematic structural diagram of a package substrate according to an embodiment of the disclosure;
fig. 6(b) is a schematic structural diagram of a package substrate according to an embodiment of the disclosure;
fig. 7(a) is a fourth schematic structural diagram of a package substrate according to an embodiment of the disclosure;
fig. 7(b) is a schematic structural diagram of a package substrate according to an embodiment of the disclosure;
fig. 8(a) is a schematic structural diagram of a display panel according to an embodiment of the present disclosure;
fig. 8(b) is a schematic structural diagram of a display panel according to an embodiment of the present disclosure.
Reference numerals:
10(100) -a substrate base plate; 20-spacer; 301-a first auxiliary electrode layer; 302-a second auxiliary cathode; 40-a color filter pattern; 50-black matrix pattern; 60-a planar layer; 70-a first electrode layer; 701-a first electrode; 80-a light-emitting functional layer; 90-a second electrode layer; 110-pixel definition layer.
Detailed Description
The technical solutions in the embodiments of the present disclosure will be clearly and completely described below with reference to the drawings in the embodiments of the present disclosure, and it is obvious that the described embodiments are only a part of the embodiments of the present disclosure, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1, an OLED display panel of a top emission structure in the related art is provided. In the package substrate of the display panel, a second auxiliary electrode 302 is disposed between a Spacer (PS) 20 and a substrate 10, a first auxiliary electrode layer 301 covering the Spacer 20 is disposed on the Spacer 20, and the first auxiliary electrode layer 301 is in contact with the second auxiliary electrode 302, so that when the OLED package substrate and the array substrate are aligned, the second auxiliary electrode 302 is electrically connected to a cathode layer to reduce the resistance of the cathode layer. However, since the material of the first auxiliary electrode layer 301 is generally a transparent material such as ITO, and the stress of ITO is large, the first auxiliary electrode layer 301 formed on the spacer 20 is easily broken, eventually resulting in that the second auxiliary electrode 302 cannot be electrically connected to the cathode layer.
The embodiment of the disclosure provides a preparation method of a packaging substrate, which comprises the following steps: forming a film layer composed of a conductive solution on a substrate base plate with at least one spacer; the conductive solution includes conductive particles and a solvent, and the solvent of the conductive solution is evaporated to attach the conductive particles to the substrate base plate to form the first auxiliary electrode layer.
And forming a first auxiliary electrode layer by evaporating the solvent to enable the conductive particles in the conductive solution to be attached to the substrate base plate. Because the conductive particles can effectively wrap the spacer, and compared with electrode materials such as ITO (indium tin oxide), the conductive particles have better flexibility, thereby preventing the first auxiliary electrode layer formed on the spacer from being broken.
Evaporating the solvent of the conductive solution refers to removing the solvent from the solution in a gaseous or critical gaseous state by heating, air drying, or the like. Alternatively, the evaporation may be performed by drying the package substrate in a hot environment, or may be performed by blowing hot air to the package substrate, or may be performed by heating a solvent by light irradiation.
In an embodiment of the present disclosure, a method for manufacturing a package substrate is disclosed, as shown in fig. 2, including:
s100, heating the substrate with at least one spacer to enable the substrate to reach a selected temperature.
The method of heating the substrate base is not limited, and for example, resistance heating, electromagnetic heating, or the like may be used.
Here, the selected temperature is not limited, and may be appropriately set according to the temperature required when the solvent of the conductive solution is evaporated. In addition, the temperature is selected so as not to thermally deform the spacer 20.
Optionally, the temperature is selected to be not less than 100 ℃, e.g., 120 ℃.
Optionally, the temperature is 200-240 deg.C, such as 200 deg.C, to increase the evaporation rate and to form a film rapidly.
S101, forming a film layer composed of a conductive solution on a substrate base plate with at least one spacer; the conductive solution includes conductive particles and a solvent, and the solvent is evaporated at a temperature of the base substrate to attach (leave) the conductive particles on the base substrate to form the first auxiliary electrode layer.
The term "solution" as used herein is a broad concept, and may be, for example, a liquid environment in which a solute is dissolved in a solvent, such as a dispersion system in which particles are uniformly dispersed in a solvent.
Here, the first auxiliary electrode layer formed of the conductive particles is in a light-transmitting state in a certain range of thickness according to the physical microscopic properties of the substance in a particle state, and the thickness of the light-transmitting first auxiliary electrode layer formed of the conductive particles is larger than that of the macroscopic solid metal material.
Here, the method of forming the conductive solution on the substrate is not limited. Alternatively, the conductive solution may be printed or spin-coated on the substrate base plate on which the at least one spacer is formed to form the film layer.
Here, the type of the conductive solution is not limited, and for example, the conductive particles may be metal nanoparticles, inorganic conductive materials, or organic conductive materials, and the solvent may be water or alcohols (e.g., ethanol). The metal nanoparticles may be, for example, silver nanoparticles, gold nanoparticles, or platinum nanoparticles.
By nanoparticle, it is meant herein that the geometric morphology of the particle is on the order of nanometers in at least one dimension. For example, a particle diameter (radius) of not more than 100 nm, for example, a particle diameter (radius) of not more than 50 nm, for example, a particle diameter (radius) of not more than 10 nm, and the like.
In one embodiment of the present disclosure, nano silver particles are used in the conductive solution, which has advantages of low price, low resistivity, and easy preparation.
In one embodiment of the present disclosure, the conductive solution may further include an auxiliary agent such as a surfactant and a dispersion stabilizer.
Referring to fig. 3, when the conductive solution is formed on the substrate base plate 10, the solvent in the conductive solution is rapidly evaporated in a short time by heating, thereby leaving the conductive particles in the conductive solution, and the conductive particles at the spacers 20 can better wrap the spacers 20.
In the method for manufacturing a package substrate according to the embodiment of the present disclosure, since the solvent in the conductive solution is evaporated at a high temperature, after the substrate 10 having the at least one spacer 20 is heated to a selected temperature, when the conductive solution film layer is formed on the substrate 10 having the at least one spacer 20 formed thereon, the solvent in the conductive solution is evaporated, and thus, the conductive particles in the conductive solution are attached to the substrate 10 to form the first auxiliary electrode layer 301. Since the conductive particles can effectively wrap the spacer 20 and the flexibility of the conductive particles is better than that of ITO, the first auxiliary electrode layer 301 formed on the spacer 20 can be prevented from being broken.
Optionally, before forming the film layer made of the conductive solution on the base substrate 10 having at least one spacer, the method further includes: the substrate 10 is placed in a closed environment, and the closed environment where the substrate 10 is placed is evacuated so that the air pressure of the closed environment is less than that of air.
The air pressure of the air referred to herein may be, for example, a standard atmospheric pressure.
It will be appreciated by those skilled in the art that the lower the gas pressure, the lower the temperature required for solvent evaporation.
Here, when the air is evacuated from the sealed environment in which the substrate base 10 is placed, the air pressure in the sealed environment is reduced. Alternatively, the pressure of the closed environment in which the substrate base plate 10 is placed may be reduced to a vacuum environment. The temperature required for solvent evaporation in a vacuum environment is the lowest.
Optionally, before forming the film layer made of the conductive solution on the substrate 10 having at least one spacer, the hermetic environment in which the substrate 10 is located may be evacuated; the substrate base plate 10 with at least one spacer 20 can also be heated first; it is of course also possible to simultaneously evacuate the closed environment in which the substrate base plate 10 is located and to heat the substrate base plate 10 with the at least one spacer 20.
In the embodiment of the present disclosure, before the film layer formed by the conductive solution is formed on the substrate 10 having at least one spacer, the hermetic environment in which the substrate 10 is located is also evacuated, so that at a higher temperature and a lower pressure, the evaporation of the solvent in the conductive solution can be further accelerated, and further, the conductive particles can be more uniformly attached to the spacer 20, thereby preventing the first auxiliary electrode layer 301 formed by the conductive particles from being broken.
Optionally, before forming the film layer composed of the conductive solution on the base substrate 10 having at least one spacer 20, the method further includes:
s200, as shown in fig. 4, a second auxiliary electrode layer is formed on the substrate 10, the second auxiliary electrode layer includes a plurality of second auxiliary electrodes 302, and a projection of the second auxiliary electrodes 302 on the substrate is located in the non-light-transmitting formation region of the substrate.
Here, the non-light-transmitting formation region corresponds to a pixel defining region on the array substrate when the package substrate and the array substrate are aligned.
Here, the material of the second auxiliary electrode 302 is not limited, and since the second auxiliary electrode 302 is located in the non-light-transmitting formation region of the package substrate, the second auxiliary electrode 302 may be non-transparent as long as the second auxiliary electrode 302 has a smaller resistivity. For example, the material of the second auxiliary electrode 302 may be a simple metal such as Ag, Cu, Al, Mg, an alloy thereof, and the like.
Here, the forming process of the second auxiliary electrode 302 may be: a conductive film is formed on the base substrate 10, and then a plurality of auxiliary electrodes 302 are formed by exposure, development and etching processes.
S201, as shown in fig. 5, a spacer 20 is formed on the second auxiliary electrode 302, and an orthogonal projection of the spacer 20 on the second auxiliary electrode 302 is surrounded by a boundary of the second auxiliary electrode 302.
Note that, since the projection of the spacer 20 on the second auxiliary electrode 302 is surrounded by the boundary of the second auxiliary electrode 302, when a film layer made of a conductive solution is formed on the spacer 20 to form the first auxiliary electrode layer 301, as shown in fig. 1, the first auxiliary electrode layer 301 is electrically connected to the second auxiliary electrode 302.
In the embodiment of the present disclosure, since the second auxiliary electrode 302 is formed below the spacer 20, the first auxiliary electrode layer 301 covering the spacer 20 is formed above the spacer 20, and the first auxiliary electrode layer 301 and the second auxiliary electrode 302 are electrically connected. When the package substrate is aligned with the array substrate, the first auxiliary electrode layer 301 is in contact with the electrode layer of the light emitting element on the surface of the array substrate, and the first auxiliary electrode layer 301 and the second auxiliary electrode 302 are electrically connected, so that the first auxiliary electrode layer 301 can electrically connect the second auxiliary electrode 302 and the electrode layer, and the resistance of the electrode layer can be further reduced.
Based on the above, it should be noted that, when the resistance of the conductive particles is small, the resistance of the first auxiliary electrode layer 301 formed by the conductive particles is small, so that only the first auxiliary electrode layer 301 may be provided, and the first auxiliary electrode layer 301 may be in contact with the electrode layer of the array substrate to reduce the resistance; when the resistance of the conductive particles is large, the resistance of the first auxiliary electrode layer 301 formed of the conductive particles is large, and thus the first auxiliary electrode layer 301 and the second auxiliary electrode 302 may be provided, the first auxiliary electrode layer 301 for electrically connecting the second auxiliary electrode 302 and the cathode layer, the first auxiliary electrode layer 301 for connection, and the second auxiliary electrode 302 having a small resistance for reducing the resistance of the electrode layers.
Alternatively, when the encapsulation substrate is used for an array substrate employing a light emitting element such as a W OLED (OLED white light emitting) for a cell, the above method further includes, before forming a film layer composed of a conductive solution on the base substrate 10 having at least one spacer 20 in order to realize color display: as shown in fig. 6(a) and 6(b), a color Filter pattern 40 (whose projection on the base substrate is located in a light-transmitting formation region of the base substrate, which corresponds to a light-emitting element of the array substrate) and a Black Matrix pattern (BM) 50 (whose projection on the base substrate is located in a non-light-transmitting formation region of the base substrate) for spacing the color Filter pattern (CF) 40 are formed on the base substrate 10; spacers 20 are formed on the black matrix pattern 50.
The color filter pattern 40 may be a red filter pattern, a green filter pattern, a blue filter pattern, or the like.
Here, the black matrix pattern 50 may be formed first, and then the color filter pattern 40 may be formed. On this basis, the color filter layer may be coated by Spin coating (Spin coating), and then the color filter pattern 40 may be formed by pre-baking, exposing, developing, post-baking, and patterning. The thickness of the color filter pattern 40 is, for example, about 2.0 μm.
When the second auxiliary electrode 302 is further formed on the package substrate, the color filter pattern 40 and the black matrix pattern 50 for spacing the color filter pattern 40 may be formed first; forming a second auxiliary electrode 302 on the black matrix pattern 50; after that, the spacer 20 is formed on the second auxiliary electrode 302.
Based on the above, after the black matrix pattern 50 and the color filter pattern 40 are formed on the base substrate 10, and before the spacers 20 are formed on the black matrix pattern 50, the method further includes: as shown in fig. 7(a) and 7(b), a planarization layer 60 is formed on the base substrate 10.
Wherein the material of the planarization layer 60 may be SiNx(silicon nitride), SiOx(silicon oxide) or SiOxNy(silicon oxynitride). In addition, the thickness of the planarization layer 60 is preferably about 2.0 μm.
The spacers 20 may be formed on the black matrix pattern 50 by forming a spacer film on the base substrate 10, and then forming the spacers 20 through processes such as pre-baking, exposure, development, post-baking, and patterning. The thickness of the spacer 20 is, for example, 2.5 to 3.0 μm.
In the embodiment of the present disclosure, the color filter pattern 40 is formed on the base substrate 10, so that color display may be realized.
Alternatively, when the encapsulation substrate is used for an array substrate employing light emitting elements such as RGB OLEDs for the cell, since it is not necessary to use a color filter pattern to form colors, an insulating light transmissive filler layer or an insulating light transmissive material layer may be formed in a vacuum or formed in a light transmissive formation region of the base substrate at this time. For the rest, reference may be made to the above-mentioned package substrate for the array substrate pair box using the light emitting elements such as the W OLED, and details thereof are not repeated herein.
The embodiment of the present disclosure provides a package substrate, as shown in fig. 3, including a substrate 10, at least one spacer 20 disposed on the substrate 10, and a first auxiliary electrode layer 301 covering the spacer 20.
Here, since the first auxiliary electrode layer 301 covers the spacer 20, the first auxiliary electrode layer 301 is transparent, and in order to ensure that the first auxiliary electrode layer 301 contacts with the electrode layer on the surface of the array substrate when the package substrate and the array substrate are aligned, the first auxiliary electrode layer 301 can effectively reduce the resistance of the electrode layer, so that the resistance of the first auxiliary electrode layer 301 in the embodiment of the present disclosure is small.
In the embodiment of the present disclosure, since the package substrate includes the first auxiliary electrode layer 301 covering the spacer 20, when the package substrate and the array substrate are aligned, the first auxiliary electrode layer 301 is in contact with the electrode layer on the surface of the array substrate, so that the resistance thereof can be reduced.
Alternatively, the first auxiliary electrode layer 301 is obtained by the above-described preparation method.
Here, since the first auxiliary electrode layer 301 is obtained by the above-described preparation method, it has the corresponding technical effects as described above.
Since the first auxiliary electrode layer 301 is prepared, the conductive particles in the conductive solution are attached to the base substrate 10 by evaporating the solvent in the conductive solution to form the first auxiliary electrode layer 301. Since the conductive particles can effectively wrap the spacer 20 and the flexibility of the conductive particles is better than that of ITO, the first auxiliary electrode layer 301 formed on the spacer 20 can be prevented from being broken.
Optionally, as shown in fig. 1 and fig. 6(b), the package substrate further includes a plurality of second auxiliary electrodes 302 disposed between the spacer 20 and the substrate 10, and the second auxiliary electrodes 302 are electrically connected to the first auxiliary electrode layer 301.
Here, since the second auxiliary electrode 302 is located between the spacer 20 and the base substrate 10, and the spacer 20 corresponds to a pixel defining layer of the array substrate, the second auxiliary electrode 302 corresponds to the pixel defining layer, and thus the second auxiliary electrode 302 may be non-light-transmissive as long as the second auxiliary electrode 302 has a small resistivity. For example, the material of the second auxiliary electrode 302 may be a simple metal such as Ag, Cu, Al, Mg, an alloy thereof, and the like.
It should be noted that, when the package substrate and the array substrate are paired, the first auxiliary electrode layer 301 is in contact with the electrode layer on the surface of the array substrate, and the package substrate further includes the second auxiliary electrode 302, and the second auxiliary electrode 302 is in contact with the first auxiliary electrode layer 301, so that the first auxiliary electrode layer 301 can electrically connect the second auxiliary electrode 302 and the electrode layer on the surface of the array substrate, and in this case, the first auxiliary electrode layer 301 corresponds to a connection electrode.
In the embodiment of the present disclosure, since the package substrate further includes the second auxiliary electrode 302, when the package substrate and the array substrate are aligned, the second auxiliary electrode 302 is electrically connected to the electrode layer on the surface of the array substrate through the first auxiliary electrode layer 301, so that the resistance of the package substrate can be further reduced.
An embodiment of the present disclosure provides a display panel, as shown in fig. 8(a) and 8(b), including the package substrate and the array substrate described above.
Here, the package substrate is used to package the array substrate.
Here, the light emitting element on the array substrate may be an OLED, such as a PMOLED, or an AMOLED; for example, a QLED, such as a blue-excited QLED or an electroluminescent QLED; for example, Micro LEDs.
In one embodiment of the present disclosure, the array substrate includes an OLED light emitting element; the cathode or anode of the OLED light emitting element is in contact with the first auxiliary electrode layer 301.
Alternatively, as shown in fig. 8(a) and 8(b), the array substrate includes a first electrode layer 70, a light emitting function layer 80, and a second electrode layer 90, which are sequentially disposed; the second electrode layer 90 is in contact with the first auxiliary electrode layer 301.
Here, referring to fig. 8(a) and 8(b), the first electrode layer 70, the light emitting function layer 80, and the second electrode layer 90 may be disposed on the base substrate 100. The first electrode layer 70 includes a plurality of first electrodes 701 that are disconnected from each other, and the first electrodes 701 are electrically connected to the drain of the thin film transistor. The first electrode 701 and the light emitting function layer 80 are disposed between the pixel defining layers 110.
Based on the above, the preparation process of the array substrate is specifically as follows: firstly, cleaning a substrate 100, and forming a thin film transistor on the substrate 100; coating (for example, by spin coating) a layer of light-cured material on the substrate 100, wherein the thickness of the light-cured material is preferably 1.6-2.0 μm, and forming a pixel defining layer 110 by pre-baking, exposing, developing, post-baking, patterning and other processes; thereafter, the first electrode 701 and the light emitting function layer 80 are formed in this order between the pixel defining layers 110; finally, the second electrode layer 90 is formed by sputtering (Sputtet), vapor deposition, or the like.
The light-emitting functional layer 80 may include at least one of a hole-transporting layer, a hole-injecting layer, an electron-transporting layer, and an electron-injecting layer in addition to the light-emitting layer.
In addition, the first electrode 701 may be an anode, and the second electrode layer 90 may be a cathode, where the array substrate shares a cathode; the first electrode 701 may be a cathode, and the second electrode layer 90 may be an anode, in which case the array substrate is common-anode.
In the embodiment of the present disclosure, the second electrode layer 90 on the surface of the array substrate is in contact with the first auxiliary electrode layer 301 on the package substrate, so that the resistance of the second electrode layer 90 can be reduced, and the image refresh frequency can be increased.
Optionally, the material of the second electrode layer 90 is at least one of ITO and IZO (Indium Zinc Oxide).
Here, since ITO and IZO are both transparent materials, when the material of the second electrode layer 90 is at least one of ITO and IZO, the transmittance of light can be increased, and the second electrode layer 90 can be made thicker than metals Ag, Al, Mg, and the like, thereby preventing the second electrode layer 90 from being broken.
When the OLED light-emitting element is a PMOLED, the electrode layer on the surface of the array substrate can be a cathode or an anode of the OLED; when the OLED light emitting element is an AMOLED, the electrode layer on the surface of the array substrate is usually the cathode of the OLED.
An embodiment of the invention provides a display device, which includes the display panel.
Among other things, the display device provided by embodiments of the present disclosure may be any device that displays an image, whether in motion (e.g., video) or stationary (e.g., still image), and whether textual or pictorial. More particularly, it is contemplated that the embodiments may be implemented in or associated with a variety of electronic devices such as, but not limited to, mobile telephones, wireless devices, Personal Data Assistants (PDAs), hand-held or portable computers, GPS receivers/navigators, cameras, MP4 video players, camcorders, game consoles, wrist watches, clocks, calculators, television monitors, flat panel displays, computer monitors, auto displays (e.g., odometer display, etc.), navigators, cockpit controls and/or displays, displays of camera views (e.g., of a rear view camera in a vehicle), electronic photographs, electronic billboards or signs, projectors, architectural structures, packaging, and aesthetic structures (e.g., a display of images for a piece of jewelry), and so forth.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (11)
1. A method for manufacturing a package substrate includes:
forming a film layer of a conductive solution on a substrate base plate having at least one spacer, comprising: printing or spin-coating a nano conductive solution on a substrate base plate with at least one spacer to form the film layer; the conductive solution comprises conductive particles and a solvent, and the solvent of the conductive solution is evaporated to enable the conductive particles to be attached to the substrate base plate so as to form a first auxiliary electrode layer, and the first auxiliary electrode layer covers the spacer;
the conductive particles have flexibility and can prevent the first auxiliary electrode layer formed on the spacer from being broken;
before forming a film layer composed of a conductive solution on a base substrate having at least one spacer, the method further includes: heating a base substrate having at least one spacer to a selected temperature; enabling the substrate base plate to be in a closed environment, and exhausting the closed environment where the substrate base plate is located to enable the air pressure of the closed environment to be smaller than that of air; the selected temperature is 200-240 ℃.
2. The method of manufacturing according to claim 1, wherein before forming the film layer composed of the conductive solution on the base substrate having at least one spacer, the method further comprises:
forming a second auxiliary electrode layer on the substrate base plate, wherein the second auxiliary electrode layer comprises a plurality of second auxiliary electrodes, and the projections of the second auxiliary electrodes on the substrate base plate are positioned in the non-light-transmitting forming areas of the substrate base plate;
forming the spacer on the second auxiliary electrode, wherein an orthographic projection of the spacer on the second auxiliary electrode is surrounded by a boundary of the second auxiliary electrode.
3. The method according to claim 1, wherein the conductive particles are metal nanoparticles, inorganic conductive materials or organic conductive materials, and the solvent is water or alcohols.
4. The production method according to claim 3, wherein the metal nanoparticles are nanosilver conductive particles.
5. The method of manufacturing according to claim 1, wherein before forming the film layer composed of the conductive solution on the base substrate having at least one spacer, the method further comprises:
forming a color filter pattern in a light-transmitting forming region of a substrate base plate, and forming a black matrix pattern for spacing the color filter pattern in a non-light-transmitting forming region of the substrate base plate;
and forming the spacer on the black matrix pattern.
6. The method of manufacturing according to claim 1, wherein before forming the film layer composed of the conductive solution on the base substrate having at least one spacer, the method further comprises:
forming a color filter pattern in a light-transmitting forming region of a substrate base plate, and forming a black matrix pattern for spacing the color filter pattern in a non-light-transmitting forming region of the substrate base plate;
forming a flat layer covering the color filter pattern and the black matrix pattern;
and forming the spacer on the flat layer, wherein the projection of the spacer on the substrate base plate is positioned in the projection of the black matrix pattern on the substrate base plate.
7. A package substrate comprising a substrate and at least one spacer disposed on the substrate, wherein the package substrate further comprises a first auxiliary electrode layer covering the spacer, and the first auxiliary electrode layer is obtained by the method according to any one of claims 1 to 6.
8. The package substrate according to claim 7, further comprising a second auxiliary electrode disposed between the spacer and the substrate, the second auxiliary electrode being electrically connected to the first auxiliary electrode layer.
9. A display panel comprising the package substrate and the array substrate of claim 7 or 8.
10. The display panel of claim 9, wherein the array substrate comprises OLED light emitting elements; the cathode or the anode of the OLED light-emitting element is in contact with the first auxiliary electrode layer.
11. A display device characterized by comprising the display panel according to claim 9 or 10.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710824260.4A CN107634012B (en) | 2017-09-13 | 2017-09-13 | Packaging substrate, preparation method thereof, display panel and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710824260.4A CN107634012B (en) | 2017-09-13 | 2017-09-13 | Packaging substrate, preparation method thereof, display panel and display device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107634012A CN107634012A (en) | 2018-01-26 |
| CN107634012B true CN107634012B (en) | 2021-05-07 |
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| EP3766100A4 (en) * | 2018-03-12 | 2021-11-03 | BOE Technology Group Co., Ltd. | Organic light emitting diode array substrate, display panel and display apparatus, and fabricating method thereof |
| CN108400155B (en) * | 2018-04-23 | 2020-06-05 | 京东方科技集团股份有限公司 | OLED double-sided display panel and preparation method thereof |
| CN108987608B (en) * | 2018-07-24 | 2021-01-05 | 京东方科技集团股份有限公司 | OLED display panel, manufacturing method thereof and display device |
| CN111276632B (en) * | 2020-02-19 | 2021-03-16 | 深圳市华星光电半导体显示技术有限公司 | Display panel and manufacturing method thereof |
| CN111509138A (en) * | 2020-04-27 | 2020-08-07 | 合肥鑫晟光电科技有限公司 | Display panel and manufacturing method thereof |
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