CN107634012A - A kind of package substrate and preparation method thereof, display panel, display device - Google Patents
A kind of package substrate and preparation method thereof, display panel, display device Download PDFInfo
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- CN107634012A CN107634012A CN201710824260.4A CN201710824260A CN107634012A CN 107634012 A CN107634012 A CN 107634012A CN 201710824260 A CN201710824260 A CN 201710824260A CN 107634012 A CN107634012 A CN 107634012A
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- underlay substrate
- auxiliary electrode
- spacer material
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Abstract
The embodiment of the present disclosure provides a kind of package substrate and preparation method thereof, display panel, display device.The preparation method of package substrate includes：The film layer being made up of conducting solution is formed on the underlay substrate with least one spacer material；The conducting solution includes conductive particle and solvent, and evaporating the solvent of the conducting solution makes the conductive particle be attached on the underlay substrate, to form the first auxiliary electrode layer.
Description
Technical field
The present invention relates to display technology field, more particularly to a kind of package substrate and preparation method thereof, display panel, display
Device.
Background technology
At present, OLED (Organic Electro-luminescent Display, organic electroluminescence display device and method of manufacturing same) with
The features such as frivolous, low-power consumption, high response, high-resolution are just come onto stage in display field, and its market potential prospect is seen by industry
It is good.
Due to top emitting AMOLED (Active-matrix organic light emitting diode, it is active to have
Organic electro luminescent diode) can effectively solve because complicated TFT (Thin Film Transistor, thin film transistor (TFT)) compensates electricity
The problem of aperture opening ratio caused by road reduces and brightness of display screen reduces, while microcavity present in top emitting AMOLED structures is imitated
Should, the colour gamut of AMOLED display screens can also be improved, improve display effect, therefore emission structure at top obtains extensively at present
Using.
As top-emitting OLED, the transmitance and conductance of negative electrode are particularly important, conventional cathode material such as Al
(aluminium), Mg (magnesium)-Ag (silver), Ag only just have preferable transmitance when very thin, but cathode layer is excessively thin can cause open circuit
Or metal oxidation, it is impossible to form effectively Ohmic contact, so as to cause brightness of display screen uneven, therefore cathode material is usually used
Transparent material such as ITO (Indium tin oxide, tin indium oxide), but ITO conductance is relatively low, it is necessary to be set on package substrate
Putting the mode of auxiliary electrode layer increases conductance.
The content of the invention
In a first aspect, embodiment of the disclosure provides a kind of preparation method of package substrate, including：With at least one
The film layer being made up of conducting solution is formed on the underlay substrate of spacer material；The conducting solution includes conductive particle and solvent, steams
The solvent for sending out conducting solution described makes the conductive particle be attached on the underlay substrate, to form the first auxiliary electrode layer.
In one embodiment of the disclosure, formed on the underlay substrate with least one spacer material by conducting solution
The film layer of composition is so that before, methods described also includes：Underlay substrate with least one spacer material is heated, made described
Underlay substrate reaches selected temperature.
In one embodiment of the disclosure, formed on the underlay substrate with least one spacer material by conducting solution
Before the film layer of composition, methods described also includes：The underlay substrate is set to be in closed environment, to residing for the underlay substrate
Closed environment is evacuated, and the air pressure of the closed environment is less than the air pressure of air.
In one embodiment of the disclosure, formed on the underlay substrate with least one spacer material by conducting solution
Before the film layer of composition, methods described also includes：The second auxiliary electrode layer, second auxiliary are formed on the underlay substrate
Electrode layer includes multiple second auxiliary electrodes, and projection of second auxiliary electrode on the underlay substrate is located at the substrate
The non-transparent formation area of substrate；The spacer material is formed on second auxiliary electrode, the spacer material is auxiliary described second
The orthographic projection helped on electrode is surrounded by the border of second auxiliary electrode.
In one embodiment of the disclosure, the conductive particle is metal nanoparticle, inorganic conductive material or had
Machine conductive material, the solvent are water or alcohols.
In one embodiment of the disclosure, the metal nanoparticle is nano-silver conductive particle.
In one embodiment of the disclosure, the selected temperature is 200~240 DEG C.
It is described to be formed on the underlay substrate with least one spacer material by conduction in one embodiment of the disclosure
The film layer that solution is formed, including：On the underlay substrate with least one spacer material, printing or spin coating conductive nano solution,
To form the film layer.
In one embodiment of the disclosure, formed on the underlay substrate with least one spacer material by conducting solution
Before the film layer of composition, methods described also includes：Area is formed in the printing opacity of underlay substrate and forms color filter patterns, in substrate base
The non-transparent formation area of plate forms the black matrix pattern for being spaced the color filter patterns；The shape on the black matrix pattern
Into the spacer material.
In one embodiment of the disclosure, formed on the underlay substrate with least one spacer material by conducting solution
Before the film layer of composition, methods described also includes：Area is formed in the printing opacity of underlay substrate and forms color filter patterns, in substrate base
The non-transparent formation area of plate forms the black matrix pattern for being spaced the color filter patterns；Formed and cover the colorized optical filtering
The flatness layer of pattern and the black matrix pattern；The spacer material is formed on the flatness layer, the spacer material is in the lining
Projection on substrate is positioned at the black matrix pattern in the projection on the underlay substrate.
Second aspect, embodiment of the disclosure provide a kind of package substrate, including underlay substrate and are arranged on the lining
At least one spacer material on substrate, include the first auxiliary electrode layer of the covering spacer material, the first auxiliary electricity
Pole layer is obtained by above-mentioned preparation method.
In one embodiment of the disclosure, the package substrate also includes being arranged on the spacer material and the substrate base
The second auxiliary electrode between plate, second auxiliary electrode electrically connect with first auxiliary electrode layer.
The third aspect, embodiment of the disclosure provide a kind of display panel, including above-mentioned package substrate and array base palte.
In one embodiment of the disclosure, the array base palte includes OLED light-emitting components；The OLED light-emitting components
Negative electrode or anode contacted with the first auxiliary electrode layer.
Fourth aspect, embodiment of the disclosure provide a kind of display device, including above-mentioned display panel.
Brief description of the drawings
, below will be to embodiment or existing in order to illustrate more clearly of the embodiment of the present disclosure or technical scheme of the prior art
There is the required accompanying drawing used in technology description to be briefly described, it should be apparent that, drawings in the following description are only this
Some embodiments of invention, for those of ordinary skill in the art, on the premise of not paying creative work, can be with
Other accompanying drawings are obtained according to these accompanying drawings.
Fig. 1 is a kind of structural representation of OLED package substrates of existing offer；
Fig. 2 is a kind of schematic flow sheet of the preparation method for package substrate that the embodiment of the present disclosure provides；
Fig. 3 is a kind of structural representation one for package substrate that the embodiment of the present disclosure provides；
Fig. 4 is a kind of structural representation that the second auxiliary electrode is formed on underlay substrate that the embodiment of the present disclosure provides；
Fig. 5 is a kind of structural representation that spacer material is formed on the second auxiliary electrode that the embodiment of the present disclosure provides；
Fig. 6 (a) is a kind of structural representation two for package substrate that the embodiment of the present disclosure provides；
Fig. 6 (b) is a kind of structural representation three for package substrate that the embodiment of the present disclosure provides；
Fig. 7 (a) is a kind of structural representation four for package substrate that the embodiment of the present disclosure provides；
Fig. 7 (b) is a kind of structural representation five for package substrate that the embodiment of the present disclosure provides；
Fig. 8 (a) is a kind of structural representation one for display panel that the embodiment of the present disclosure provides；
Fig. 8 (b) is a kind of structural representation two for display panel that the embodiment of the present disclosure provides.
Reference：
10 (100)-underlay substrate；20- spacer materials；The auxiliary electrode layers of 301- first；The auxiliary cathodes of 302- second；40- is color
Color filter pattern；50- black matrix patterns；60- flatness layers；70- first electrode layers；701- first electrodes；80- light emitting functional layers；
90- the second electrode lays；110- pixel defining layers.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present disclosure, the technical scheme in the embodiment of the present disclosure is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, rather than whole embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other under the premise of creative work is not made
Embodiment, belong to the scope of protection of the invention.
As shown in Figure 1, there is provided a kind of OLED display panel of emission structure at top in correlation technique.In the display panel
Package substrate in, in spacer material (Photo Spacer, abbreviation PS), the second auxiliary electrode is set between 20 and underlay substrate 10
302, one layer of first auxiliary electrode layer 301 of covering spacer material 20, the first auxiliary electrode layer 301 and the are set on spacer material 20
Two auxiliary electrodes 302 contact, for when OLED package substrates and array base palte are to box, by the second auxiliary electrode 302 and negative electrode
Layer electrical connection, to reduce the resistance of cathode layer.However, because the material of the first auxiliary electrode layer 301 is generally transparent material such as
ITO, and ITO stress is larger, thus the first auxiliary electrode layer 301 formed on spacer material 20 is easily broken off, and is ultimately resulted in
Second auxiliary electrode 302 can not electrically connect with cathode layer.
The embodiment of the present disclosure provides a kind of preparation method of package substrate, including：With at least one spacer material
The film layer being made up of conducting solution is formed on underlay substrate；Conducting solution includes conductive particle and solvent, evaporates conducting solution
Solvent makes conductive particle be attached on underlay substrate, to form the first auxiliary electrode layer.
By way of evaporation solvent so that it is auxiliary that the conductive particle in conducting solution is attached to formation first on underlay substrate
Help electrode layer.Because conductive particle can effectively wrap up spacer material, and relative to the electrode materials such as ITO, the flexibility of conductive particle
Preferably, so as to preventing from being formed the first auxiliary electrode fault rupture on spacer material.
The solvent of evaporation conducting solution is referred to by the mode solvent such as heating, air-drying with gaseous state or critical gaseous
Mode departs from from solution.It is alternatively possible to be evaporated by way of package substrate, which is placed in thermal environment, dries, or
It can be evaporated, or can be steamed heated solvent by way of light irradiation by way of to package substrate blowing hot-air
Hair.
In one embodiment of the disclosure, a kind of preparation method of package substrate is disclosed, as shown in Fig. 2 including：
S100, the underlay substrate with least one spacer material is heated, so that underlay substrate reaches selected
Temperature.
Wherein, the mode heated to underlay substrate is without restriction, such as resistance heating or electromagnetism can be used to add
Heat etc..
Herein, for selected temperature without limiting, required temperature when can be evaporated according to the solvent of conducting solution
Degree is rationally set.In addition, selected temperature would not make the temperature distortion of spacer material 20.
Alternatively, selected temperature is such as 120 DEG C not less than 100 DEG C.
Alternatively, in order to improve evaporation rate, fast filming, selected temperature is 200~240 DEG C, such as 200 DEG C.
S101, the film layer being made up of conducting solution is formed on the underlay substrate with least one spacer material；It is conductive molten
Liquid includes conductive particle and solvent, and solvent is evaporated at a temperature of underlay substrate so that conductive particle adheres to and (stayed) in underlay substrate
On, to form the first auxiliary electrode layer.
Herein, alleged solution is a sensu lato concept, such as can be solute for the lysigenous liquid of solvent
Body environment, such as can be the dispersion that even particulate dispersion is formed in a solvent.
Herein, according to the physics microscopic property of material under particle state, the first auxiliary electrode layer formed by conductive particle,
Thickness is light transmission state in certain limit, and the first of the printing opacity formed relative to macroscopical solid-state metallic material, conductive particle
The thickness of auxiliary electrode layer is larger.
Herein, for being formed conducting solution on underlay substrate without limiting using which kind of mode.It is alternatively possible to
On the underlay substrate formed with least one spacer material, printing or spin coating conducting solution, to form film layer.
Herein, for conducting solution type without limiting, such as conductive particle can be metal nanoparticle, inorganic
Conductive material or organic conductive material, solvent can be water or alcohols (such as ethanol).Wherein, metal nanoparticle for example may be used
To be nano-Ag particles, nanogold particle or nano-platinum particle.
Herein, alleged nano particle, refer to that the geometric shape of particle is in nanometer scale at least one dimension.
Such as particle diameter (radius) is not higher than 100 nanometers, such as particle diameter (radius) is not higher than 50 nanometers, such as particle diameter (radius) is not higher than 10
Nanometer etc..
In one embodiment of the disclosure, nano-Ag particles are used in conducting solution, it has cheap, resistivity
The advantage such as small and easily prepared.
It can also include surfactant, dispersion stabilizer etc. in one embodiment of the disclosure, in conducting solution to help
Agent.
With reference to figure 3, formed when by conducting solution when on underlay substrate 10, the solvent heat in conducting solution is in the short time
Interior can rapid evaporation, so as to leave the conductive particle in conducting solution, the conductive particle at spacer material 20 can be with preferable
Wrap up spacer material 20 in ground.
The preparation method for the package substrate that the embodiment of the present disclosure provides, because the solvent in conducting solution can steam at high temperature
Hair, thus after selected temperature is heated to the underlay substrate 10 with least one spacer material 20, when formed with least
When conducting solution film layer is formed on the underlay substrate 10 of one spacer material 20, the solvent in conducting solution can evaporate, so,
Conductive particle in conducting solution, which can be attached on underlay substrate 10, forms the first auxiliary electrode layer 301.Because conductive particle can
Effectively to wrap up spacer material 20, and relative to ITO, the flexibility of conductive particle is preferable, so as to prevent from being formed in spacer material 20
On the first auxiliary electrode layer 301 be broken.
Alternatively, formed on the underlay substrate 10 with least one spacer material the film layer that is made up of conducting solution it
Before, the above method also includes：Underlay substrate 10 is placed in closed environment, the closed environment residing for underlay substrate 10 is taken out
Gas, so that the air pressure of closed environment is less than the air pressure of air.
The air pressure of air referred to herein, such as can be standard atmospheric pressure.
It will be understood by those skilled in the art that air pressure is smaller, the temperature needed for solvent evaporation will be lower.
Herein, the closed environment residing for underlay substrate 10 is evacuated, the air pressure of closed environment will reduce.It is optional
Ground, the air pressure of the closed environment residing for underlay substrate 10 can be decreased to vacuum environment.Solvent evaporation institute under vacuum conditions
The temperature needed is minimum.
Alternatively, formed on the underlay substrate 10 with least one spacer material the film layer that is made up of conducting solution it
Before, first the closed environment residing for underlay substrate 10 can be evacuated；Can also be first to at least one spacer material 20
Underlay substrate 10 is heated；Certainly the closed environment residing for underlay substrate 10 can also be evacuated and to extremely simultaneously
The underlay substrate 10 of a few spacer material 20 is heated.
The embodiment of the present disclosure, it is made up of due to being formed on the underlay substrate 10 with least one spacer material conducting solution
Film layer before, also the closed environment residing for underlay substrate 10 is evacuated, can be with so in higher temperature and compared with low pressure
The evaporation of solvent in conducting solution is further speeded up, and then conductive particle can be made more uniformly to be attached on spacer material 20, is prevented
The first auxiliary electrode layer 301 only formed by conductive particle is broken.
Alternatively, formed on the underlay substrate 10 with least one spacer material 20 film layer that is made up of conducting solution it
Before, the above method also includes：
S200, as shown in figure 4, form the second auxiliary electrode layer on underlay substrate 10, the second auxiliary electrode layer includes more
Individual second auxiliary electrode 302, non-transparent formation of projection of second auxiliary electrode 302 on underlay substrate positioned at underlay substrate
Area.
Herein, non-transparent formation area, when package substrate and array base palte are to box, corresponding to pixel circle on array base palte
Determine region.
Wherein, for the second auxiliary electrode 302 material without limit, due to the second auxiliary electrode 302 positioned at encapsulation
The non-transparent formation area of substrate, thus the second auxiliary electrode 302 can be nontransparent, as long as the second auxiliary electrode 302 has
Less resistivity.Such as second the material of auxiliary electrode 302 can be metal simple-substance such as Ag, Cu, Al, Mg and its alloy
Deng.
Herein, the forming process of the second auxiliary electrode 302 can be：Conductive film is first formed on underlay substrate 10, then
By exposing, developing and etching technics forms multiple auxiliary electrodes 302.
S201, as shown in figure 5, on the second auxiliary electrode 302 formed spacer material 20, spacer material 20 is in the second auxiliary electrode
Orthographic projection on 302 is surrounded by the border of the second auxiliary electrode 302.
It should be noted that because projection of the spacer material 20 on the second auxiliary electrode 302 is by the second auxiliary electrode 302
Border surrounds, thus when the film layer that formation is made up of conducting solution on spacer material 20, to form the first auxiliary electrode layer 301
When, as shown in figure 1, the first auxiliary electrode layer 301 can electrically connect with the second auxiliary electrode 302.
The embodiment of the present disclosure, due to the second auxiliary electrode 302 formed below in spacer material 20, in the top of spacer material 20
The first auxiliary electrode layer 301 of covering spacer material 20 is formed, the first auxiliary electrode layer 301 and the second auxiliary electrode 302 electrically connect.
When package substrate and array base palte are to box, the electrode layer of the first auxiliary electrode layer 301 and the light-emitting component on array base palte surface
Contact, and the first auxiliary electrode layer 301 and the second auxiliary electrode 302 electrically connect, thus the first auxiliary electrode layer 301 can be by the
Two auxiliary electrodes 302 and electrode layer electrical connection, so as to further reduce the resistance of electrode layer.
Based on the foregoing, it is desirable to explanation, when the resistance of conductive particle is smaller, then first formed by conductive particle is auxiliary
Help the resistance of electrode layer 301 smaller, thus the first auxiliary electrode layer 301 can be only set, using the first auxiliary electrode layer 301 with
The electrode layer contact of array base palte, to reduce its resistance；When the resistance of conductive particle is larger, then formed by conductive particle
The resistance of one auxiliary electrode layer 301 is larger, thus can set the first auxiliary electrode layer 301 and the second auxiliary electrode 302, and first
Auxiliary electrode layer 301 is used to electrically connect the second auxiliary electrode 302 and cathode layer, and the first auxiliary electrode layer 301 has been used to connect
Effect, the resistance of the second auxiliary electrode 302 is smaller, for reducing the resistance of electrode layer.
Alternatively, when package substrate is used for the array base palte to box using light-emitting components such as W OLED (OLED emits white light)
When, in order to realize colored display, form what is be made up of conducting solution on the underlay substrate 10 with least one spacer material 20
Before film layer, the above method also includes：As shown in Fig. 6 (a) and Fig. 6 (b), color filter patterns 40 are formed on underlay substrate 10
(it forms area in the projection of underlay substrate positioned at the printing opacity of underlay substrate, and the printing opacity forms area and corresponds to the luminous of array base palte
Element) and for spaced-apart circular filter pattern (Colour Filter, abbreviation CF) 40 black matrix pattern (Black Matrix,
Abbreviation BM) 50 (it is located at the non-transparent formation area of underlay substrate in the projection of underlay substrate)；Formed on black matrix pattern 50
Spacer material 20.
Wherein, color filter patterns 40 can be red filter pattern, green filter pattern or blue filter pattern etc..
Herein, black matrix pattern 50 can be initially formed, re-forms color filter patterns 40.On this basis, can first lead to
The mode for crossing spin coating (Spin coating) coats colored light filter membrane layer, then passes through front baking, exposure, development, rear baking and figure
The techniques such as change form color filter patterns 40.The thickness of color filter patterns 40 is, for example, 2.0 μm or so.
It should be noted that when package substrate is also formed with the second auxiliary electrode 302, colorized optical filtering figure can be initially formed
Case 40 and the black matrix pattern 50 for spaced-apart circular filter pattern 40；The second auxiliary electrode is formed on black matrix pattern 50 again
302；Afterwards, spacer material 20 is formed on the second auxiliary electrode 302.
Based on above-mentioned, formed on underlay substrate 10 after black matrix pattern 50 and color filter patterns 40, in black matrix
Formed on pattern 50 before spacer material 20, the above method also includes：As shown in Fig. 7 (a) and Fig. 7 (b), the shape on underlay substrate 10
Into flatness layer 60.
Wherein, the material of flatness layer 60 can be SiNx(silicon nitride), SiOx(silica) or SiOxNyIn (silicon oxynitride)
At least one.On this basis, the thickness of flatness layer 60 is preferably 2.0 μm or so.
Can be specifically first to form dottle pin on underlay substrate 10 in addition, forming spacer material 20 on black matrix pattern 50
Thing film, then by front baking, exposure, development, rear dry and the technique such as graphical forms spacer material 20.The thickness example of spacer material 20
Such as it is 2.5~3.0 μm.
The embodiment of the present disclosure, color filter patterns 40 are formed on underlay substrate 10, so as to realize colored display.
Alternatively, when package substrate be used for box using the light-emitting component such as RGB OLED array base palte when, due to need not
Using color filter patterns to form colour, now vacuum can be formed or formed with exhausted in the printing opacity formation area of underlay substrate
The light transmitting filler layer of edge or the transparent material layer of insulation.Remaining refers to the above-mentioned battle array with using light-emitting components such as W OLED
Row substrate is to the package substrate of box, and here is omitted.
The embodiment of the present disclosure provides a kind of package substrate, as shown in figure 3, including underlay substrate 10 and being arranged on substrate base
At least one spacer material 20 on plate 10, include the first auxiliary electrode layer 301 of covering spacer material 20.
Herein, because the first auxiliary electrode layer 301 covers spacer material 20, thus the first auxiliary electrode layer 301 is printing opacity,
And in order to ensure package substrate and array base palte to box when, the first auxiliary electrode layer 301 and the electrode layer on array base palte surface connect
After touch, the first auxiliary electrode layer 301 can effectively reduce the resistance of electrode layer, therefore the auxiliary electrode layer of the embodiment of the present disclosure first
301 resistance is smaller.
The embodiment of the present disclosure, because package substrate includes the first auxiliary electrode layer 301 of covering spacer material 20, thus when envelope
When filling substrate and array base palte to box, the first auxiliary electrode layer 301 contacts with the electrode layer on array base palte surface, so as to drop
Its low resistance.
Alternatively, the first auxiliary electrode layer 301 is obtained by above-mentioned preparation method.
Herein, because the first auxiliary electrode layer 301 is obtained by above-mentioned preparation method, it has above-mentioned alleged
Relevant art effect.
The embodiment of the present disclosure in the preparation, by evaporating the solvent in conducting solution, is led due to the first auxiliary electrode layer 301
Conductive particle in electric solution, which can be attached on underlay substrate 10, forms the first auxiliary electrode layer 301.Because conductive particle can be with
Effectively parcel spacer material 20, and relative to ITO, the flexibility of conductive particle is preferable, so as to prevent from being formed on spacer material 20
The first auxiliary electrode layer 301 be broken.
Alternatively, as shown in Fig. 1 and Fig. 6 (b), package substrate also includes being arranged between spacer material 20 and underlay substrate 10
Multiple second auxiliary electrodes 302, the second auxiliary electrode 302 electrically connects with the first auxiliary electrode layer 301.
Herein, because the second auxiliary electrode 302 is between spacer material 20 and underlay substrate 10, and spacer material 20 corresponds to
The pixel defining layer of array base palte, thus the second auxiliary electrode 302 corresponds to pixel defining layer, therefore the second auxiliary electrode 302
Can be non-transparent, as long as the second auxiliary electrode 302 has less resistivity.Such as second auxiliary electrode 302
Material can be metal simple-substance such as Ag, Cu, Al, Mg and its alloy etc..
It should be noted that when package substrate and array base palte are to box, the first auxiliary electrode layer 301 and array base palte table
The electrode layer contact in face, because package substrate also includes the second auxiliary electrode 302, the second auxiliary electrode 302 and the first auxiliary electricity
Pole layer 301 contacts, thus the first auxiliary electrode layer 301 can be by the second auxiliary electrode 302 and the electrode layer on array base palte surface
Electrical connection, now the first auxiliary electrode layer 301 is equivalent to connection electrode.
The embodiment of the present disclosure, because package substrate also includes the second auxiliary electrode 302, in package substrate and array base palte pair
During box, the second auxiliary electrode 302 is electrically connected by the first auxiliary electrode layer 301 with the electrode layer on array base palte surface, thus can
Further to reduce its resistance.
The embodiment of the present disclosure provides a kind of display panel, as shown in Fig. 8 (a) and Fig. 8 (b), including above-mentioned package substrate
And array base palte.
Herein, package substrate is packaged for array substrate.
Herein, the light-emitting component on array base palte can be OLED, such as PMOLED, or AMOLED；Such as can be
QLED, such as blue light activated QLED or electroluminescent QLED；Such as can be Micro LED.
In one embodiment of the disclosure, the array base palte includes OLED light-emitting components；The OLED light-emitting components
Negative electrode or anode contacted with the first auxiliary electrode layer 301.
Alternatively, as shown in Fig. 8 (a) and Fig. 8 (b), first electrode layer 70 that array base palte includes setting gradually, light work(
Ergosphere 80 and the second electrode lay 90；The second electrode lay 90 contacts with the first auxiliary electrode layer 301.
Herein, can be set with reference to figure 8 (a) and Fig. 8 (b), first electrode layer 70, light emitting functional layer 80 and the second electrode lay 90
Put on underlay substrate 100.Wherein, first electrode layer 70 includes the multiple first electrodes 701 mutually disconnected, first electrode 701
Electrically connected with the drain electrode of thin film transistor (TFT).First electrode 701 and light emitting functional layer 80 are arranged between pixel defining layer 110.
Based on above-mentioned, the preparation process of array base palte is specific as follows：First underlay substrate 100 is cleaned, and in substrate
Thin film transistor (TFT) is formed on substrate 100；(such as by way of spin coating) one layer of photocuring material is coated on underlay substrate 100 again
Material, the thickness of photo-curing material by front baking, exposure, development, rear dry and the technique shape such as graphical preferably at 1.6~2.0 μm
Pixel defines layer 110；Afterwards, formed between pixel defining layer 110 and sequentially form first electrode 701 and light emitting functional layer
80；Finally, the second electrode lay 90 is formed by sputtering the mode such as (Sputtet) or evaporation.
It should be noted that light emitting functional layer 80 in addition to including luminescent layer, can also include hole transmission layer, hole is injected
At least one of layer, electron transfer layer and electron injecting layer.
Furthermore, it is possible to it is that first electrode 701 is anode, the second electrode lay 90 is negative electrode, now array base palte common cathode；
Can be that first electrode 701 is negative electrode, the second electrode lay 90 is anode, now array base palte common-anode.
The embodiment of the present disclosure, the second electrode lay 90 and first auxiliary electrode layer on package substrate on array base palte surface
301 contacts, so as to reduce the resistance of the second electrode lay 90, improve image refreshing frequency.
Alternatively, the material of the second electrode lay 90 be ITO and IZO (Indium Zinc Oxide, indium zinc oxide) in extremely
Few one kind.
Herein, because ITO and IZO are transparent material, thus the material of the second electrode lay 90 be in ITO or IZO extremely
When few a kind of, the transmitance of light, and opposing metallic Ag, Al, Mg etc. can be improved, what can be made is thicker, prevents second electrode
Layer 90 is broken.
Wherein, when the OLED light-emitting components are PMOLED, the electrode layer positioned at array base palte surface can be OLED
Negative electrode or anode；When the OLED light-emitting components are AMOLED, the electrode layer positioned at array base palte surface is usually OLED
Negative electrode.
Embodiments of the invention provide a kind of display device, including above-mentioned display panel.
Wherein, no matter the display device that the embodiment of the present disclosure provides can be display motion (for example, video) or fix
(for example, rest image) no matter and the image of word or picture any device.More particularly, it is contemplated that the embodiment
It may be implemented in a variety of electronic installations or associated with a variety of electronic installations, a variety of electronic installations such as (but not limited to) move
Phone, wireless device, personal digital assistant (PDA), hand-held or portable computer, gps receiver/omniselector, camera,
MP4 video players, video camera, game console, wrist-watch, clock, calculator, televimonitor, flat-panel monitor, computer
Monitor, automotive displays (for example, odometer display etc.), navigator, Cockpit Control Unit and/or display, camera view
The display display of rear view camera (for example, in vehicle), electronic photographs, electronic bill-board or direction board, projecting apparatus, building
Structure, packaging and aesthetic structures (for example, display for the image of a jewelry) etc..
The foregoing is only a specific embodiment of the invention, but protection scope of the present invention is not limited thereto, any
Those familiar with the art the invention discloses technical scope in, change or replacement can be readily occurred in, should all be contained
Cover within protection scope of the present invention.Therefore, protection scope of the present invention should be based on the protection scope of the described claims.
Claims (15)
- A kind of 1. preparation method of package substrate, it is characterised in that including：The film layer being made up of conducting solution is formed on the underlay substrate with least one spacer material；The conducting solution includes Conductive particle and solvent, evaporating the solvent of the conducting solution makes the conductive particle be attached on the underlay substrate, with shape Into the first auxiliary electrode layer.
- 2. preparation method according to claim 1, it is characterised in that on the underlay substrate with least one spacer material Formed before the film layer being made up of conducting solution, methods described also includes：Underlay substrate with least one spacer material is entered Row heating, makes the underlay substrate reach selected temperature.
- 3. preparation method according to claim 1, it is characterised in that on the underlay substrate with least one spacer material Formed before the film layer being made up of conducting solution, methods described also includes：The underlay substrate is set to be in closed environment, to described Closed environment residing for underlay substrate is evacuated, and the air pressure of the closed environment is less than the air pressure of air.
- 4. preparation method according to claim 1, it is characterised in that on the underlay substrate with least one spacer material Formed before the film layer being made up of conducting solution, methods described also includes：The second auxiliary electrode layer is formed on the underlay substrate, second auxiliary electrode layer includes the multiple second auxiliary electricity Pole, projection of second auxiliary electrode on the underlay substrate is positioned at the non-transparent formation area of the underlay substrate；The spacer material, orthographic projection of the spacer material on second auxiliary electrode are formed on second auxiliary electrode Surrounded by the border of second auxiliary electrode.
- 5. preparation method according to claim 1, it is characterised in that the conductive particle is metal nanoparticle, inorganic Conductive material or organic conductive material, the solvent are water or alcohols.
- 6. preparation method according to claim 5, it is characterised in that the metal nanoparticle is nano-silver conductive Grain.
- 7. preparation method according to claim 2, it is characterised in that the selected temperature is 200~240 DEG C.
- 8. preparation method according to claim 1, it is characterised in that described in the substrate base with least one spacer material The film layer being made up of conducting solution is formed on plate, including：On the underlay substrate with least one spacer material, printing or spin coating conductive nano solution, to form the film layer.
- 9. preparation method according to claim 1, it is characterised in that on the underlay substrate with least one spacer material Formed before the film layer being made up of conducting solution, methods described also includes：Area is formed in the printing opacity of underlay substrate and forms color filter patterns, is formed in the non-transparent formation area of underlay substrate between being used for Every the black matrix pattern of the color filter patterns；The spacer material is formed on the black matrix pattern.
- 10. preparation method according to claim 1, it is characterised in that in the underlay substrate with least one spacer material Upper to be formed before the film layer being made up of conducting solution, methods described also includes：Area is formed in the printing opacity of underlay substrate and forms color filter patterns, is formed in the non-transparent formation area of underlay substrate between being used for Every the black matrix pattern of the color filter patterns；Form the flatness layer for covering the color filter patterns and the black matrix pattern；The spacer material is formed on the flatness layer, projection of the spacer material on the underlay substrate is located at the black square System of battle formations case is in the projection on the underlay substrate.
- 11. a kind of package substrate, including underlay substrate and at least one spacer material for being arranged on the underlay substrate, it is special Sign is, includes the first auxiliary electrode layer of the covering spacer material, and first auxiliary electrode layer passes through claim 1- Preparation method described in 10 any one obtains.
- 12. package substrate according to claim 11, it is characterised in that the package substrate also include being arranged on it is described every The second auxiliary electrode between underbed and the underlay substrate, second auxiliary electrode are electrically connected with first auxiliary electrode layer Connect.
- 13. a kind of display panel, it is characterised in that including the package substrate and array base palte described in claim 11 or 12.
- 14. display panel according to claim 13, it is characterised in that the array base palte includes OLED light-emitting components； The negative electrode or anode of the OLED light-emitting components contact with the first auxiliary electrode layer.
- 15. a kind of display device, it is characterised in that including the display panel described in claim 13 or 14.
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