CN107622814B - A kind of composite mortar of carbon nano-fiber load copper powder - Google Patents
A kind of composite mortar of carbon nano-fiber load copper powder Download PDFInfo
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- CN107622814B CN107622814B CN201710924531.3A CN201710924531A CN107622814B CN 107622814 B CN107622814 B CN 107622814B CN 201710924531 A CN201710924531 A CN 201710924531A CN 107622814 B CN107622814 B CN 107622814B
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Abstract
The invention discloses a kind of composite mortars of carbon nano-fiber load copper powder, the composite mortar includes following component by weight: 30-50 parts of copper nanoparticle, 12-24 parts of carbon nano-fiber, 20-28 parts of glass powder, 20-30 parts of organic solvent, 2-8 parts of dimethylbenzene, 22-28 parts of hydrophilic macromolecular compounds, 8-12 parts of auxiliary agent；Described 20-30 μm of carbon nano-fiber partial size, porosity of=65%；The organic solvent is mixed by dopamine solution, chitosan, isopropanol, and the weight ratio of dopamine solution, chitosan and isopropanol is 2-5:1-2:1.Compared with prior art, a kind of adhesive force of the composite mortar of carbon nano-fiber load copper powder of the present invention is strong, and good conductivity, ageing resistance is strong, and is less prone to copper ion diffusion with the copper electrode that this slurry is prepared.
Description
Technical field
The invention belongs to electrocondution slurry fields, and in particular to a kind of composite mortar of carbon nano-fiber load copper powder.
Background technique
Electrode slurry is suitable for the electronic components such as resistance, capacitor.Existing electrode slurry is mostly noble metal silver paste, ohm
Slurry.Since such cost of sizing agent is high, and preparation process is cumbersome, and more harmful substance is contained in slurry, is not suitable for industrialization
It utilizes.
CN101136261B discloses a kind of copper electrode paste and preparation method thereof, although the cost of sizing agent is low, to leading
It is electrically poor, be not suitable for industrialization production.
Application number 201510706257.3, entitled a kind of copper electrocondution slurry and preparation method thereof, the copper electrocondution slurry packet
Include the phosphatization copper powder 70~90% of weight percent, glass powder 1~10%, high viscosity organic carrier 1~10%, organic additive 0.1~
1.5%, inorganic additive 0.1~1.5%, diluent 5~20%；Complicated heavy doping technique is eliminated, in the shape of metallic electrode
At heavy doping is done directly in the process, simple process is not required to introduce complicated heavily doped miscellaneous equipment, reduces costs, improves light
Electrotransformation rate.When the adhesive force of the slurry is limited, it is not easy to substrate perfect combination.
Summary of the invention
In view of the deficiencies of the prior art, the purpose of the present invention is to provide a kind of composite pulps of carbon nano-fiber load copper powder
Material, the compound copper electrode paste adhesive force is strong, good conductivity, and weatherability is strong.
To solve prior art problem, the technical scheme adopted by the invention is as follows:
A kind of composite mortar of carbon nano-fiber load copper powder, including following component by weight: copper nanoparticle 30-
50 parts, 12-24 parts of carbon nano-fiber, 20-28 parts of glass powder, 20-30 parts of organic solvent, 2-8 parts of dimethylbenzene, hydrophilic macromolecule
22-28 parts of compound, 8-12 parts of auxiliary agent；Described 20-30 μm of carbon nano-fiber partial size, porosity of=65%；The organic solvent by
Dopamine solution, chitosan, isopropanol mix, and the weight ratio of dopamine solution, chitosan and isopropanol is 2-5:1-2:
1。
Preferably, the composite mortar of above-mentioned a kind of carbon nano-fiber load copper powder, including following component by weight:
45 parts of copper nanoparticle, 22 parts of carbon nano-fiber, 25 parts of glass powder, 26 parts of organic solvent, 6 parts of dimethylbenzene, hydrophilic macromolecule
Close 25 parts of object, 10 parts of auxiliary agent.
Preferably, the hydrophilic macromolecular compounds are the condensation product of polyvinyl alcohol, ethylene oxide, glycerine, are put down
Average molecular weight is 4000-6000, molar ratio 3:2:1.
Preferably, the specific surface area of the copper nanoparticle is 25-40m2/g。
Preferably, the auxiliary agent is mixed by silane coupling agent KH792, levelling agent and rilanit special.
Preferably, the concentration of the dopamine solution is 1-2mol/L.
Compared with prior art, a kind of adhesive force of the composite mortar of carbon nano-fiber load copper powder of the present invention is strong, conductive
Property it is good, ageing resistance is strong, and with the copper electrode that this slurry is prepared be less prone to copper ion diffusion.
Specific embodiment
The present invention is further described in detail below by specific embodiment.
Embodiment 1
A kind of composite mortar of carbon nano-fiber load copper powder, including following component by weight: copper nanoparticle 30
Part, 12 parts of carbon nano-fiber, 20 parts of glass powder, 20 parts of organic solvent, 2 parts of dimethylbenzene, 22 parts of hydrophilic macromolecular compounds help
8 parts of agent；20 μm of the carbon nano-fiber partial size, porosity 65%；The organic solvent is by dopamine solution, chitosan, isopropanol
It mixes, the weight ratio of dopamine solution, chitosan and isopropanol is 2:1:1.
Wherein, the hydrophilic macromolecular compounds are the condensation product of polyvinyl alcohol, ethylene oxide, glycerine, are averaged
Molecular weight is 4000, molar ratio 3:2:1.
The specific surface area of the copper nanoparticle is 25m2/g。
The auxiliary agent is mixed by silane coupling agent KH792, levelling agent and rilanit special.
The concentration of the dopamine solution is 1mol/L.
Specifically, carbon nano-fiber is dissolved in organic solvent after low temperature immersion 20-40h, copper nanoparticle is added, stirring is equal
After be spray-dried to obtain reactant a；The reactant b that dimethylbenzene, glass powder, hydrophilic macromolecular compounds are mixed；It will be anti-
Object a, reactant b and auxiliary agent is answered to stir evenly.
Embodiment 2
A kind of composite mortar of carbon nano-fiber load copper powder, including following component by weight: copper nanoparticle 45
Part, 22 parts of carbon nano-fiber, 25 parts of glass powder, 26 parts of organic solvent, 6 parts of dimethylbenzene, 25 parts of hydrophilic macromolecular compounds help
10 parts of agent.
The hydrophilic macromolecular compounds are the condensation product of polyvinyl alcohol, ethylene oxide, glycerine, average molecular weight
It is 5000, molar ratio 3:2:1.
The specific surface area of the copper nanoparticle is 32m2/g。
The auxiliary agent is mixed by silane coupling agent KH792, levelling agent and rilanit special.
The concentration of the dopamine solution is 1.5mol/L.
Specifically, carbon nano-fiber is dissolved in organic solvent after low temperature immersion 20-40h, copper nanoparticle is added, stirring is equal
After be spray-dried to obtain reactant a；The reactant b that dimethylbenzene, glass powder, hydrophilic macromolecular compounds are mixed；It will be anti-
Object a, reactant b and auxiliary agent is answered to stir evenly.
Embodiment 3
A kind of composite mortar of carbon nano-fiber load copper powder, including following component by weight: copper nanoparticle 50
Part, 24 parts of carbon nano-fiber, 28 parts of glass powder, 30 parts of organic solvent, 8 parts of dimethylbenzene, 28 parts of hydrophilic macromolecular compounds help
12 parts of agent；30 μm of the carbon nano-fiber partial size, porosity of=65%；The organic solvent is by dopamine solution, chitosan, different
Propyl alcohol mixes, and the weight ratio of dopamine solution, chitosan and isopropanol is 5:2:1.
The hydrophilic macromolecular compounds are the condensation product of polyvinyl alcohol, ethylene oxide, glycerine, average molecular weight
It is 6000, molar ratio 3:2:1.
The specific surface area of the copper nanoparticle is 40m2/g。
The auxiliary agent is mixed by silane coupling agent KH792, levelling agent and rilanit special.
The concentration of the dopamine solution is 2mol/L.
Specifically, carbon nano-fiber is dissolved in organic solvent after low temperature immersion 20-40h, copper nanoparticle is added, stirring is equal
After be spray-dried to obtain reactant a；The reactant b that dimethylbenzene, glass powder, hydrophilic macromolecular compounds are mixed；It will be anti-
Object a, reactant b and auxiliary agent is answered to stir evenly.
Comparative example 1
In addition to without Nano carbon fibers peacekeeping organic solvent, remaining is the same as embodiment 2.
The performance of the composite mortar of a kind of carbon nano-fiber load copper powder of embodiment 1-3 and comparative example 1 is detected,
The data obtained is as shown in the table.
The present invention is by immersing carbon nano-fiber in organic solvent after modification, in conjunction with copper nanoparticle, so that copper
It with the Adhesion enhancement of carbon fiber, is mixed finally by with hydrophilic macromolecular compounds, so that wrapping up outside copper nanoparticle by parent
Aqueous high molecular compound relies on the network of hydrogen bond building, effectively reduces the diffusion of copper, extends the service life of slurry.
In addition, the present invention is not limited to the above embodiments, as long as can take various in without departing from the scope of the present invention
Mode implements the present invention.
Claims (5)
1. a kind of composite mortar of carbon nano-fiber load copper powder, which is characterized in that including following component by weight: receiving
30-50 parts of copper powder of rice, 12-24 parts of carbon nano-fiber, 20-28 parts of glass powder, 20-30 parts of organic solvent, 2-8 parts of dimethylbenzene, parent
22-28 parts of aqueous high molecular compound, 8-12 parts of auxiliary agent；Described 20-30 μm of carbon nano-fiber partial size, porosity of=65%；Institute
It states organic solvent to be mixed by dopamine solution, chitosan, isopropanol, the weight of dopamine solution, chitosan and isopropanol
Than for 2-5:1-2:1；Wherein, the hydrophilic macromolecular compounds are the condensation product of polyvinyl alcohol, ethylene oxide, glycerine,
Its average molecular weight is 4000-6000, molar ratio 3:2:1.
2. a kind of composite mortar of carbon nano-fiber load copper powder according to claim 1, which is characterized in that including following
Component by weight: 45 parts of copper nanoparticle, 22 parts of carbon nano-fiber, 25 parts of glass powder, 26 parts of organic solvent, dimethylbenzene 6
Part, 25 parts of hydrophilic macromolecular compounds, 10 parts of auxiliary agent.
3. a kind of composite mortar of carbon nano-fiber load copper powder according to claim 1, which is characterized in that the nanometer
The specific surface area of copper powder is 25-40m2/g.
4. a kind of composite mortar of carbon nano-fiber load copper powder according to claim 1, which is characterized in that the auxiliary agent
It is mixed by silane coupling agent KH792, levelling agent and rilanit special.
5. a kind of composite mortar of carbon nano-fiber load copper powder according to claim 1, which is characterized in that the DOPA
The concentration of amine aqueous solution is 1-2mol/L.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710924531.3A CN107622814B (en) | 2017-09-30 | 2017-09-30 | A kind of composite mortar of carbon nano-fiber load copper powder |
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| CN201710924531.3A CN107622814B (en) | 2017-09-30 | 2017-09-30 | A kind of composite mortar of carbon nano-fiber load copper powder |
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| CN107622814A CN107622814A (en) | 2018-01-23 |
| CN107622814B true CN107622814B (en) | 2019-05-28 |
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| CN113192663B (en) * | 2021-04-25 | 2022-11-29 | 北京梦之墨科技有限公司 | Enhanced conductive paste and electronic device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101308710A (en) * | 2007-02-23 | 2008-11-19 | 国家淀粉及化学投资控股公司 | Conductive materials |
| CN105694596A (en) * | 2016-04-08 | 2016-06-22 | 苏州捷德瑞精密机械有限公司 | Low-silver copper-base conductive ink and preparation method thereof |
| CN106469582A (en) * | 2015-08-18 | 2017-03-01 | 中国科学院上海微***与信息技术研究所 | A kind of electrocondution slurry of graphene-containing and preparation method thereof |
| JP2017057443A (en) * | 2015-09-15 | 2017-03-23 | パナソニックＩｐマネジメント株式会社 | Composite modified metal nanoparticle, manufacturing method therefor, composite modified metal nano ink and wiring layer formation method |
-
2017
- 2017-09-30 CN CN201710924531.3A patent/CN107622814B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101308710A (en) * | 2007-02-23 | 2008-11-19 | 国家淀粉及化学投资控股公司 | Conductive materials |
| CN106469582A (en) * | 2015-08-18 | 2017-03-01 | 中国科学院上海微***与信息技术研究所 | A kind of electrocondution slurry of graphene-containing and preparation method thereof |
| JP2017057443A (en) * | 2015-09-15 | 2017-03-23 | パナソニックＩｐマネジメント株式会社 | Composite modified metal nanoparticle, manufacturing method therefor, composite modified metal nano ink and wiring layer formation method |
| CN105694596A (en) * | 2016-04-08 | 2016-06-22 | 苏州捷德瑞精密机械有限公司 | Low-silver copper-base conductive ink and preparation method thereof |
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