CN107613718A - A kind of conductive structure and electronic equipment - Google Patents
A kind of conductive structure and electronic equipment Download PDFInfo
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- CN107613718A CN107613718A CN201710704685.1A CN201710704685A CN107613718A CN 107613718 A CN107613718 A CN 107613718A CN 201710704685 A CN201710704685 A CN 201710704685A CN 107613718 A CN107613718 A CN 107613718A
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- heat
- conducting layer
- conductive structure
- articulamentum
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Abstract
The invention discloses a kind of conductive structure and electronic equipment, the conductive structure includes：First heat-conducting layer and the second heat-conducting layer, the first heat-conducting layer are stacked with the second heat-conducting layer；The thermal conductivity factor of first heat-conducting layer is more than the thermal conductivity factor of the second heat-conducting layer；Conductive structure is used to be arranged on heater element by the first heat-conducting layer, is preferentially scattered with the heat for enabling heater element to be sent on the first heat-conducting layer of conductive structure；Wherein, the area of the first heat-conducting layer is not less than first threshold.By the above-mentioned means, the present invention can uniform heat conduction, avoid heat concentrate conduction and caused by the too high situation of local temperature occur.
Description
Technical field
The present invention relates to electronic equipment heat conduction technical field, more particularly to a kind of conductive structure and electronic equipment.
Background technology
With the development of science and technology, electronic equipment such as mobile phone, has become people's work indispensable in work, life
Tool.
With the lasting enhancing of the performance of mobile phone, and user is to the lightening requirement more and more higher of mobile phone, mobile phone hair
The problem of heat becomes more concerned with as user.Currently, in order to mitigate the heating of mobile phone, set between CPU and handset shell
Put heat conductive silica gel, by CPU work caused by heat be directly conducted to mobile phone shell and shed, and then reduce the temperature of interior of mobile phone
Degree.
However, present inventor has found in long-term R＆D process, current heat dissipation design can cause in mobile phone
Heat caused by portion has little time the region more concentrated to mobile phone shell of scattering and be passed directly to, and then produces the local temperature of mobile phone shell
Spend the problem of high.
The content of the invention
The present invention solves the technical problem of providing a kind of conductive structure and electronic equipment, can uniform heat conduction, keep away
Exempt from heat concentrate conduction and caused by the too high situation of local temperature occur.
In order to solve the above technical problems, one aspect of the present invention is：A kind of conductive structure is provided, it is described to lead
Heat structure includes：First heat-conducting layer and the second heat-conducting layer, first heat-conducting layer are stacked with second heat-conducting layer；It is described
The thermal conductivity factor of first heat-conducting layer is more than the thermal conductivity factor of second heat-conducting layer；The conductive structure is used to pass through described first
Heat-conducting layer is arranged on heater element, to enable the heat that the heater element is sent preferentially in the conductive structure
Scattered on first heat-conducting layer；Wherein, the area of first heat-conducting layer is not less than first threshold.
In order to solve the above technical problems, another technical solution used in the present invention is：A kind of electronic equipment, institute's electricity are provided
Sub- equipment includes：Conductive structure, heater element and housing；The conductive structure includes：First heat-conducting layer and the second heat-conducting layer, institute
State the first heat-conducting layer to be stacked with second heat-conducting layer, the thermal conductivity factor of first heat-conducting layer is more than second heat conduction
The thermal conductivity factor of layer；The conductive structure is between the heater element and the housing, and the heater element is positioned at described
First heat-conducting layer deviates from the second heat-conducting layer side, to enable the heat that the heater element is sent preferentially described
Scattered on first heat-conducting layer；Wherein, the area of first heat-conducting layer is not less than first threshold.
The beneficial effects of the invention are as follows：The situation of prior art is different from, conductive structure of the present invention includes：First heat-conducting layer
With the second heat-conducting layer, the first heat-conducting layer is stacked with the second heat-conducting layer；The thermal conductivity factor of first heat-conducting layer is more than the second heat conduction
The thermal conductivity factor of layer；Conductive structure is used to be arranged on heater element by the first heat-conducting layer, to cause heater element to be sent
Heat preferentially can be scattered on the face of the first heat-conducting layer of conductive structure；Wherein, the area of the first heat-conducting layer is not less than the
One threshold value.By the above-mentioned means, heat caused by heater element can be preferentially on the face of the first heat-conducting layer of conductive structure
Large area is scattered, and then causes heat by can uniformly be spread out of after the second heat-conducting layer, avoid heat concentrate conduction and caused by
The too high situation of local temperature occurs.
Brief description of the drawings
Technical scheme in order to illustrate the embodiments of the present invention more clearly, make required in being described below to embodiment
Accompanying drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the present invention, for
For those of ordinary skill in the art, on the premise of not paying creative work, other can also be obtained according to these accompanying drawings
Accompanying drawing.Wherein：
Fig. 1 is the structural representation of the embodiment of conductive structure one of the present invention；
Fig. 2 is the structural representation of the embodiment of electronic equipment one of the present invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, rather than whole embodiments.Based on this
Embodiment in invention, those of ordinary skill in the art are obtained every other under the premise of performing creative labour is not made
Embodiment, belong to the scope of protection of the invention.
Refering to Fig. 1, Fig. 1 is the structural representation of the embodiment of conductive structure 10 1 of the present invention.The conductive structure 10 includes：
First heat-conducting layer 11 and the second heat-conducting layer 12, the first heat-conducting layer 11 are stacked with the second heat-conducting layer 12.
Wherein, the thermal conductivity factor of the first heat-conducting layer 11 is more than the thermal conductivity factor of the second heat-conducting layer 12.For example, the first heat-conducting layer
11 can be high by thermal conductivity factor, and the good material of heat conductivility is made；And the second heat-conducting layer 12 then can be by thermal conductivity factor
Low, the poor material of heat conductivility is made.
The conductive structure 10 is used to be arranged on heater element by the first heat-conducting layer 11, to cause heater element to be sent
Heat preferentially can be scattered on the first heat-conducting layer 11 of conductive structure 10；Wherein, the area of the first heat-conducting layer 11 is not less than
First threshold.
Heater element in present embodiment can be the heater element in electronic equipment such as mobile phone, tablet personal computer, such as
CPU, FLASH memory etc., these elements produce heat in electronic device works, if conducting not in time, electronic equipment can be fast
Speed heating, and then the performance of internal components is influenceed, reduce Consumer's Experience.
Because the thermal conductivity factor of the first heat-conducting layer 11 is more than the thermal conductivity factor of the second heat-conducting layer 12, therefore, heater element passes
Heat to the first heat-conducting layer 11 is more than the conduction of velocity on the second heat-conducting layer 12 in the conduction of velocity of the first heat-conducting layer 11；Together
When, because the area of the first heat-conducting layer 11 is not less than first threshold, therefore, conduct most of to the heat on the first heat-conducting layer 11
It can be scatter on the first heat-conducting layer 11 so that heat large area is disperseed, and then avoids causing office because heat concentrates conduction
Temperature too high situation in portion's occurs.
Wherein, the area of the first heat-conducting layer 11 refers to not less than first threshold, and the area of the first heat-conducting layer 11 is sufficiently large, energy
Heat is enough avoided to concentrate conduction.The usually not less than area for the one side that heater element contacts with the first heat-conducting layer 11, but simultaneously
Do not limit specifically.
Conductive structure 10 includes in present embodiment：First heat-conducting layer 11 and the second heat-conducting layer 12, the first heat-conducting layer 11 with
Second heat-conducting layer 12 is stacked；The thermal conductivity factor of first heat-conducting layer 11 is more than the thermal conductivity factor of the second heat-conducting layer 12；Heat conduction knot
Structure 10 is used to be arranged on heater element by the first heat-conducting layer 11, is preferentially existed with the heat for enabling heater element to be sent
Scattered on the face of first heat-conducting layer 11 of conductive structure 10；Wherein, the area of the first heat-conducting layer 11 is not less than first threshold.Pass through
Aforesaid way, heat caused by heater element can preferentially large area dissipates on the face of the first heat-conducting layer 11 of conductive structure 10
Open, and then cause heat by can uniformly be spread out of after the second heat-conducting layer 12, avoid heat concentrate conduction and caused by local temperature
High situation is spent to occur.
Wherein, in one embodiment, conductive structure 10 also includes：First articulamentum 13；First articulamentum 13 is arranged on
Between first heat-conducting layer 11 and the second heat-conducting layer 12, for by the first heat-conducting layer 11 and the second heat-conducting layer 12 is compound is integral knot
Structure.
First articulamentum 13 can be the material with attachment function, for example, can be gum etc., by the first heat-conducting layer 11
Bonded together with the second heat-conducting layer 12, turn into an overall structure.
First articulamentum 13 can be made from a material that be thermally conductive, and then heat is conducted to from the first heat-conducting layer 11
Two heat-conducting layers 12.
Present embodiment kind, the first heat-conducting layer 11 and the second heat-conducting layer 12 can be connected to one by the first articulamentum 13
Rise, be combined into and be integral structure, operation process when in electronic equipment is assembled to so as to reduce conductive structure 10, it is convenient
Use.
Wherein, in one embodiment, the first articulamentum 13 is anisotropic gum.
Anisotropy in present embodiment is the heat conduction for material, can be specifically that the gum is led parallel to first
Thermal conductivity factor on the direction of the heat-conducting layer 12 of thermosphere 11 and second is larger, has good heat conductivility, and in the first heat-conducting layer
11 and second heat-conducting layer 12 be laminated direction on thermal conductivity factor it is smaller, heat conductivility is relatively poor.So can further it make
The heat obtained from heater element outflow preferentially can conduct on the first heat-conducting layer 11 to scatter, then slowly to the second heat-conducting layer 12
Conduction.
In an application scenarios, the first articulamentum 13 is made up of two layers of the gum together being bonded, and first layer gum leans on
Nearly first heat-conducting layer 11 is set, and has good heat conductivility, and second layer gum is set close to the second heat-conducting layer 12, is had relative
Poor heat conductivility.Similarly, such set-up mode can be further ensured that heat can be excellent after heater element outflow
First conduct and scatter on the first heat-conducting layer 11, and then conducted again to the second heat-conducting layer 12.
Wherein, in one embodiment, conductive structure 10 also includes：Second articulamentum 14；Second articulamentum 14 is arranged on
First heat-conducting layer 11 deviates from the side of the second heat-conducting layer 12, for conductive structure 10 to be fixed on into heating by the second articulamentum 14
On element；And/or second articulamentum 14 be arranged on the second heat-conducting layer 12 deviate from the first heat-conducting layer 11 side, for passing through second
Articulamentum 14 fixes conductive structure 10.
In present embodiment, the first heat-conducting layer 11 is arranged on away from the side of the second heat-conducting layer 12 in the second articulamentum 14
When, the size of the second articulamentum 14 meets conductive structure 10 can be bonded on heater element, specifically can be correspondingly small
In or equal to the area of one side that is contacted with conductive structure 10 of heat conducting element.
When the second articulamentum 14 is arranged on the second heat-conducting layer 12 and deviates from the side of the first heat-conducting layer 11, such as conductive structure
10 are used in mobile phone, for conducting heat caused by CPU work, at this point it is possible to be led by the second articulamentum 14 and second
Conductive structure 10 is arranged in mobile phone shell by thermosphere 12, and conductive structure 10 is fixed between CPU and mobile phone shell.
Second articulamentum 14 can be the material with attachment function, for example, can be gum, etc., for first to be led
Thermosphere 11 bonds together with heater element, and then forms more firm structure.
In an application scenarios, the second articulamentum 14 is heat conduction gum so that heat can caused by heater element
Conducted through the second articulamentum 14 to the first heat-conducting layer 11 and/or by the heat on the second heat-conducting layer 12 conduct to the second heat-conducting layer
On the part of 12 connections.
Wherein, in one embodiment, the first heat-conducting layer 11 is made up of graphite.
The thermal conductivity factor of graphite is big, has good heat conductivility, can be rapidly by heat after heater element produces heat
Amount is transmitted on the first heat-conducting layer 11 to come, and then reduces the temperature of regional area.Specifically, the first heat-conducting layer 11 can be stone
Ink sheet.
Certainly, the first heat-conducting layer 11 can also be made up of other materials, such as heat conductive silica gel, heat conduction mica sheet etc., herein
Do not limit.
Wherein, in one embodiment, the second heat-conducting layer 12 is made up of asbestos.
The thermal conductivity factor of asbestos is 0.02W/ (m DEG C), and heat conductivility is poor, enables to the heat spread out of by heater element
It can relatively slowly be spread out of by the second heat-conducting layer 12, further realize the conduction pattern of " being led after first even " of heat, and then kept away
Exempting from heat concentrates conduction to cause local temperature too high.
Wherein, the second heat-conducting layer 12 can also be polyethylene terephthalate (Polyethylene
At least one of terephthalate, PET) sheet such as piece, makrolon (Polycarbonate, PC) piece.This implementation
The cost of the second heat-conducting layer 12 in mode is relatively low, is capable of the cost of the whole conductive structure 10 of relative reduction.
It is pointed out that in present embodiment, can according to demand, by selecting different thickness or different heat conduction
Second heat-conducting layer 12 of coefficient realizes distribution of the heat in the first heat-conducting layer 11 and the second heat-conducting layer 12.For example, needing
By higher proportion of heat precedence partition when on the first heat-conducting layer 11, the thickness of the second heat-conducting layer 12 can be adjusted to thickness, or
Using less second heat-conducting layer 12 of thermal conductivity factor, conversely, then can be thin by the thickness tune of the second heat-conducting layer 12, or use and lead
The second larger heat-conducting layer 12 of hot coefficient, change so as to dynamic according to demand on flow direction and the different directions of heat
The allocation proportion of heat.
Referring to Fig. 2, Fig. 2 is the structural representation of the embodiment of electronic equipment one of the present invention.Electronic equipment of the present invention can
Think mobile phone, tablet personal computer, MP3, MP4 etc..
The electronic equipment includes：Conductive structure 10, heater element 20 and housing 30；
Conductive structure 10 includes：First heat-conducting layer 11 and the second heat-conducting layer 12, the first heat-conducting layer 11 and the second heat-conducting layer 12
It is stacked, the thermal conductivity factor of the first heat-conducting layer 11 is more than the thermal conductivity factor of the second heat-conducting layer 12.
For conductive structure 10 between heater element 20 and housing 30, heater element 20 is located at the first heat-conducting layer 11 away from the
The side of two heat-conducting layer 12, preferentially scattered with the heat for enabling heater element 20 to be sent on the face of the first heat-conducting layer 11.
The area of first heat-conducting layer 11 is not less than first threshold.
Wherein, in the first heat-conducting layer 11 and the second heat-conducting layer 12, with the embodiment of the invention described above conductive structure 10
It is identical, related detailed content refers to above-mentioned embodiment, and here is omitted.
It is pointed out that the heater element 20 in present embodiment can be CPU, FLASH storage in electronic equipment
Device etc. can produce the element of heat at work.
The housing 30 of electronic equipment generally includes fore shell and rear shell.In present embodiment, the quantity of conductive structure 10 can be with
For one, can now be arranged between heater element 20 and rear shell.It is in an application scenarios, such as in heater element 20
During CPU, it will usually screening cover is set on CPU and between rear shell, now, can to prevent extraneous and internal electromagnetic interference
So that CPU and screening cover are integrally then arranged between screening cover and rear shell as heater element 20, conductive structure 10, CPU work
Caused heat is conducted to conductive structure 10 by screening cover, and is further conducted to housing 30, and then is shed to the external world, real
Existing heat conduction and radiating.
In addition, conductive structure 10 can also be arranged between CPU and fore shell.Now, set because CPU is generally arranged at electronics
On flexible PCB (Printed Circuit Board, PCB) in standby, at this point it is possible to using CPU and PCB integrally as heating
Element 20, the opening position corresponded to where CPU that conductive structure 10 can be specifically arranged between PCB and fore shell, Jin Erneng
Enough so that heat caused by CPU work is conducted to conductive structure 10 by PCB, through " being led after first even " conduction of conductive structure 10
To fore shell, and distribute to the external world.
Certainly, the facilities of two kinds of above-mentioned conductive structures 10 can exist simultaneously, and then realize that two sides is radiated, so as to
The heat dispersion of electronic equipment can be improved, reduces the bulk temperature of electronic equipment.
Wherein, in one embodiment, conductive structure 10 also includes：First articulamentum 13；First articulamentum 13 is arranged on
Between first heat-conducting layer 11 and the second heat-conducting layer 12, for by the first heat-conducting layer 11 and the second heat-conducting layer 12 is compound is integral knot
Structure.
Conductive structure 10 also includes：Second articulamentum 14；Second articulamentum 14 is arranged on the first heat-conducting layer 11 away from second
The side of heat-conducting layer 12, for conductive structure 10 to be fixed on into heater element 20 by the second articulamentum 14；And/or second connection
Layer 14 is arranged on the side that the second heat-conducting layer 12 deviates from the first heat-conducting layer 11, for by the second articulamentum 14 by conductive structure 10
It is fixed.
It is pointed out that the concrete structure of conductive structure 10 and the phase in the embodiment of the invention described above conductive structure 10
Together, related detailed content refers to above-mentioned embodiment, and here is omitted.
Embodiments of the present invention are the foregoing is only, are not intended to limit the scope of the invention, it is every to utilize this
The equivalent structure or equivalent flow conversion that description of the invention and accompanying drawing content are made, or directly or indirectly it is used in other correlations
Technical field, it is included within the scope of the present invention.
Claims (10)
1. a kind of conductive structure, it is characterised in that the conductive structure includes：
First heat-conducting layer and the second heat-conducting layer, first heat-conducting layer are stacked with second heat-conducting layer；
The thermal conductivity factor of first heat-conducting layer is more than the thermal conductivity factor of second heat-conducting layer；
The conductive structure is used to be arranged on heater element by first heat-conducting layer, make it that the heater element is sent out
The heat gone out preferentially can scatter on first heat-conducting layer of the conductive structure；
Wherein, the area of first heat-conducting layer is not less than first threshold.
2. conductive structure according to claim 1, it is characterised in that the conductive structure also includes：First articulamentum；
First articulamentum is arranged between first heat-conducting layer and second heat-conducting layer, for by first heat conduction
Layer is complex as an overall structure with second heat-conducting layer.
3. conductive structure according to claim 2, it is characterised in that
First articulamentum is anisotropic gum.
4. conductive structure according to claim 1, it is characterised in that the conductive structure also includes：Second articulamentum；
Second articulamentum is arranged on the side that first heat-conducting layer deviates from second heat-conducting layer, for passing through described the
The conductive structure is fixed on the heater element by two articulamentums；
And/or
Second articulamentum is arranged on the side that second heat-conducting layer deviates from first heat-conducting layer, for passing through described the
Two articulamentums fix the conductive structure.
5. conductive structure according to claim 4, it is characterised in that
Second articulamentum is heat conduction gum.
6. conductive structure according to claim 1, it is characterised in that
First heat-conducting layer is made up of graphite.
7. conductive structure according to claim 1, it is characterised in that
Second heat-conducting layer is made up of asbestos.
8. a kind of electronic equipment, it is characterised in that the electronic equipment includes：Conductive structure, heater element and housing；
The conductive structure includes：First heat-conducting layer and the second heat-conducting layer, first heat-conducting layer and second heat conduction are layer by layer
Folded to set, the thermal conductivity factor of first heat-conducting layer is more than the thermal conductivity factor of second heat-conducting layer；
For the conductive structure between the heater element and the housing, the heater element is located at first heat-conducting layer
Away from the second heat-conducting layer side, to enable the heat that the heater element is sent preferentially in first heat-conducting layer
On scatter；
Wherein, the area of first heat-conducting layer is not less than first threshold.
9. conductive structure according to claim 8, it is characterised in that the conductive structure also includes：First articulamentum；
First articulamentum is arranged between first heat-conducting layer and second heat-conducting layer, for by first heat conduction
Layer is complex as an overall structure with second heat-conducting layer.
10. conductive structure according to claim 8, it is characterised in that the conductive structure also includes：Second articulamentum；
Second articulamentum is arranged on first heat-conducting layer and deviates from the second heat-conducting layer side, for passing through described second
The conductive structure is fixed on the heater element by articulamentum；
And/or
Second articulamentum is arranged on the side that second heat-conducting layer deviates from first heat-conducting layer, for passing through described the
Two articulamentums fix the conductive structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710704685.1A CN107613718A (en) | 2017-08-15 | 2017-08-15 | A kind of conductive structure and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710704685.1A CN107613718A (en) | 2017-08-15 | 2017-08-15 | A kind of conductive structure and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107613718A true CN107613718A (en) | 2018-01-19 |
Family
ID=61064131
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710704685.1A Withdrawn CN107613718A (en) | 2017-08-15 | 2017-08-15 | A kind of conductive structure and electronic equipment |
Country Status (1)
| Country | Link |
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| CN (1) | CN107613718A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109668061A (en) * | 2019-01-23 | 2019-04-23 | 厦门大学 | A kind of laser lighting component and its manufacturing method using asbestos fibre |
| WO2021031114A1 (en) * | 2019-08-20 | 2021-02-25 | 矽统科技股份有限公司 | Heat dissipation patch, eletronic product, method for fabricating heat dissipation patch |
| CN112672604A (en) * | 2020-12-22 | 2021-04-16 | Oppo（重庆）智能科技有限公司 | Vapor chamber, case, and electronic device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103254830A (en) * | 2013-05-13 | 2013-08-21 | 3M创新有限公司 | Soaking adhesive tape |
| CN104470324A (en) * | 2013-09-17 | 2015-03-25 | 松下电器产业株式会社 | Composite sheet |
| CN105072868A (en) * | 2015-07-14 | 2015-11-18 | 广东欧珀移动通信有限公司 | Mobile terminal and method for heat radiation of mobile terminal |
| CN105283037A (en) * | 2014-07-18 | 2016-01-27 | 松下知识产权经营株式会社 | Composite sheet, production method thereof and electronic apparatus using the same |
| CN106659079A (en) * | 2016-12-23 | 2017-05-10 | 努比亚技术有限公司 | Composite heat dissipation film and mobile terminal |
-
2017
- 2017-08-15 CN CN201710704685.1A patent/CN107613718A/en not_active Withdrawn
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103254830A (en) * | 2013-05-13 | 2013-08-21 | 3M创新有限公司 | Soaking adhesive tape |
| CN104470324A (en) * | 2013-09-17 | 2015-03-25 | 松下电器产业株式会社 | Composite sheet |
| CN105283037A (en) * | 2014-07-18 | 2016-01-27 | 松下知识产权经营株式会社 | Composite sheet, production method thereof and electronic apparatus using the same |
| CN105072868A (en) * | 2015-07-14 | 2015-11-18 | 广东欧珀移动通信有限公司 | Mobile terminal and method for heat radiation of mobile terminal |
| CN106659079A (en) * | 2016-12-23 | 2017-05-10 | 努比亚技术有限公司 | Composite heat dissipation film and mobile terminal |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109668061A (en) * | 2019-01-23 | 2019-04-23 | 厦门大学 | A kind of laser lighting component and its manufacturing method using asbestos fibre |
| CN109668061B (en) * | 2019-01-23 | 2020-12-25 | 厦门大学 | Laser lighting assembly using asbestos fiber and manufacturing method thereof |
| WO2021031114A1 (en) * | 2019-08-20 | 2021-02-25 | 矽统科技股份有限公司 | Heat dissipation patch, eletronic product, method for fabricating heat dissipation patch |
| CN112672604A (en) * | 2020-12-22 | 2021-04-16 | Oppo（重庆）智能科技有限公司 | Vapor chamber, case, and electronic device |
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Application publication date: 20180119 |