CN107607594A - Compound humidity-sensitive material and transducer production method for capacitance type humidity sensor - Google Patents
Compound humidity-sensitive material and transducer production method for capacitance type humidity sensor Download PDFInfo
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- CN107607594A CN107607594A CN201710800145.3A CN201710800145A CN107607594A CN 107607594 A CN107607594 A CN 107607594A CN 201710800145 A CN201710800145 A CN 201710800145A CN 107607594 A CN107607594 A CN 107607594A
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Abstract
The present invention provides a kind of compound humidity-sensitive material and transducer production method for capacitance type humidity sensor, compound humidity-sensitive material, is formulated as follows：Titanium oxide or barium titanate and barium strontium titanate are according to 1:1‑1:3 mass ratioes mix, referred to as Elementary Function ceramic material, polyamide or polytetrafluoroethylene (PTFE) mix with described Elementary Function ceramic material according to 0.3wt% 0.5wt% mass ratio, referred to as mixture, and inert metal mixes with described mixture according to 15wt% 25wt% mass ratio.Compound humidity sensing film is made using aerosol deposition technique in the compound humidity-sensitive material, capacitance type humidity sensor is made by semiconducter process in the film.Sensor of the invention has high precision, high stability, heat-resisting, anti-pollution, high reliability.
Description
Technical field
The present invention relates to a kind of compound humidity-sensitive material and transducer production method for capacitance type humidity sensor.
Background technology
The advantages of capacitance type humidity sensor, is that fast response time, small volume, the linearity are good, relatively stable, but reaches
The product of above-mentioned performance is mostly foreign brand name, and price is all sufficiently expensive.Some the low price condenser type humidity sold on domestic market
Sensor does not often reach above-mentioned level, its linearity, uniformity and repeatability all not satisfactory, below 30%RH, 80%RH
It is serious that wet section of deformation is felt above.And no matter high-grade or low-grade capacitance type humidity sensor, long-time stability are not
Ideal, certain delay can be produced in moisture absorption and drying after long-term use, reduces the accuracy of moisture measurement.It is and most
After capacitance type humidity sensor can not ensure same batch production and processing, there is stable capacitance, different applications is to electric capacity in addition
The demand for being worth size is also not very identical.And the preparation of humidity-sensitive film material is the difficult point place in humidity sensor production process, because
The polymorphic type composite that this research and development is prepared using function ceramics class material as matrix is becoming for the wet functional material research and development of sense of future generation
Where gesture.Different types of ceramic material is embodied due to different material categorys, crystal structure, material shape
Unordered system it is also each variant.It is to be resolved problems to be present in traditional ceramic-like humidity-sensitive material, such as in complex environment
The degeneration of lower behavior of hysteresis, detection drift and pore space structure, aperture are irregularly and due to distribution at a high temperature and high humidity
The problems such as detection sensitivity declines with low humidity accuracy of detection difference caused by defect.
Currently manufactured compound humidity-sensitive material generally uses sol-gel process, compound humidity-sensitive material prepared by sol-gel process
By the mixing of different materials, the homogeneous multicomponent system of needs can be obtained, and synthesis temperature is relatively low, and the stream of colloidal sol or gel
Change nature is advantageous to by the required humidity sensor humidity-sensitive film of the spin coating technique preparation commonly used in semiconductor micro-nano technology, but
Find that the technology has that some are to be resolved in process：Firstth, preparation method is cumbersome, need to be carried out using plurality of devices
The complicated processing procedure such as the configuration of solution and multiple heating, cause it is longer the time required to whole sol-gel process, it is short then
Several days, long then several weeks；Secondth, the gel configured can not store steadily in the long term, and property easily changes, so as to cause material
The uniformity and composition proportion of composing on there is deviation；3rd, the heating for multiple times processing in operating process is unfavorable for maintaining mixing
The stabilization of macromolecule polymer material performance in material；4th, required raw material (metal alkoxide) is expensive and recovery skill of alcohol
Art difficulty is high, virtually adds to equipment and the investment of operation in preparation process, because its equipment cost height is so be difficult to
Industrialization.How to improve sensitivity and reduce the influence of hysteretic characteristic, be the difficult point of humidity sensor research, never go it
Effective method.
The content of the invention
Based on above weak point, the present invention provide a kind of compound humidity-sensitive material for capacitance type humidity sensor and its
Transducer production method.
The technology used in the present invention is as follows：A kind of compound humidity-sensitive material for capacitance type humidity sensor, formula is such as
Under：Titanium oxide or barium titanate and barium strontium titanate are according to 1:1-1:3 mass ratioes mix, referred to as Elementary Function ceramic material, polyamide
Or polytetrafluoroethylene (PTFE) mixes with described Elementary Function ceramic material according to 0.3wt%-0.5wt% mass ratio, referred to as mixes
Thing, inert metal mix with described mixture according to 15wt%-25wt% mass ratio.
The present invention also has following feature：
1st, a kind of preparation method of compound humidity-sensitive material film for capacitance type humidity sensor, it is characterised in that method
It is as follows：By titanium oxide or barium titanate with barium strontium titanate according to 1:1~1:3 mass ratioes are full and uniform to be mixed and made into Elementary Function ceramics
Material, the then matter by polyamide or polytetrafluoroethylene (PTFE) with described Elementary Function ceramic material according to 0.3wt%-0.5wt%
Amount is mixed and made into mixture than full and uniform, the mass ratio by inert metal with described mixture according to 15wt%~25wt%
It is full and uniform again to be mixed and made into compound humidity-sensitive material, then deposited using aerosol deposition technique on bottom plate one layer it is compound wet
Quick film, last hot baked remove the moisture in compound humidity sensing film.
2nd, a kind of preparation method of compound humidity-sensitive material film for capacitance type humidity sensor as described above, raw material are adopted
Mixed with ball grinding method.
3rd, the preparation method of a kind of compound humidity-sensitive material film for capacitance type humidity sensor as described above, it is described
Inert metal is silver or copper.
4th, the preparation method of a kind of compound humidity-sensitive material film for capacitance type humidity sensor as described above, use
Various raw material average particle size particle sizes are less than 100 nanometers.
5th, prepared by a kind of preparation method of compound humidity-sensitive material film for capacitance type humidity sensor as described above
A kind of compound humidity-sensitive material film for capacitance type humidity sensor.
6th, using a kind of the adjustable of compound humidity-sensitive material film preparation for capacitance type humidity sensor as described above
Type capacitance type humidity sensor, preparation method are as follows：
Step 1: using surface cleaning and the semiconductor substrate of free from admixture, one layer is grown by the method for electron beam evaporation
The lower metal layer of titanium, platinum, gold or chromium that thickness is 300~500 nanometers；
Step 2: one layer 1.2~1.6 microns thick answer then is deposited in lower metal layer using aerosol deposition technique
Humidity sensing film is closed, then carries out the moisture in the compound humidity sensing film of hot baked removal；
Step 3: coating photoresist on compound humidity sensing film surface, using photomask exposure, developer solution processing obtains photoresist
Model, the inductively coupled plasma etching method of fluorine-based compound, oxygen and argon gas are realized to enter compound humidity sensing film
Row etching, so as to obtain desired compound humidity sensing film moulding；
Step 4: upper metal layers are formed by the method for sputtering, it is swollen using stress and heat between the film in sputter procedure
The difference of swollen coefficient utilizes wet-etching technology, forms upper electrode afterwards with hallrcuts structure；
Step 5: the size for changing upper electrode area, which is adjusted, to be required to the difference of capacitance size according to different application
Economize on electricity capacitance, to meet different application demands；
Step 6: making sensor outer housing, the encapsulation of sensor is finally completed.
7th, using a kind of preparation of the adjustable type capacitance type humidity sensor based on compound humidity-sensitive material as described above
Capacitance type humidity sensor prepared by method.
Advantage for present invention and beneficial effect：It is proposed by the present invention using aerosol deposition technique carry out ceramics with
Ceramic material, ceramics and macromolecule polymer material and ceramics, the compound gesture of macromolecule polymer material and metallic additionses
Can must well solve a series of relevant issues caused by sol-gel technique.Aerosol deposition technique ADM (Aerosol
Deposition Method) it is that one kind deposition growing dielectric material, metal material and mixed type can answer at ambient temperature
The novel semi-conductor processing technology of condensation material, its maximum feature are to be used as raw material by the use of nano particle, it is possible to achieve 200 nanometers
The growth of~10 microns of thickness controllable, fine and close, flat film and thick film.Because the processing technology is sunk at ambient temperature
Product, therefore the chemical composition of material can be avoided damage in preparation process, especially have in terms of nanocomposite deposition
Advantageous advantage, the same eutectic of multiple functions ceramic material can be realized by the mixing of the raw nanoparticle of different proportion
Point metal even high molecular polymer and the composite deposition of metallic additionses at room temperature, and be easy to reasonably control each composition
Material mixing ratio.Firstth, aerosol deposition techniques only to the ground and mixed and aerosol of different materials in vacuum chamber
The step of deposition two operation, be not related to any solution allocation, operating process is simple, and required time is short, can be greatly cost-effective；
Secondth, the mixing of different materials uses solid powder ball milling method in the technology, configure completion mixed-powder uniformly and property
It is stable, it is easy to store for a long time.Therefore the structure and performance of the compound humidity-sensitive material prepared will more be stablized, and reliability is higher；The
3rd, whole preparation process are completed based on room temperature condition, makes the material of part high temperature mutability to participate in preparing, add original
The range of choice of material；4th, raw material and the cost that equipment uses are controllable in preparation process, except basic aerosol deposition equipment
Outside, it is only necessary to plasma dry etch equipment and high temperature furnace as auxiliary equipment, processing technology it is succinct and required limited
Equipment high degree controls cost, is advantageous to quickly realize industrialized production.
Compound humidity-sensitive material is the mixture of high molecular polymerization material, Nano-functional Ceramics and metallic additionses, is had resistance to
The characteristic goods such as hot, mechanical strength, resistance to chemical reagents, higher reliability can be still kept in extreme environment；
By the hallrcuts construction and surface nanotopology structure of upper electrode, ensure the moisture in air with humidity sensing layer most
The contact of limits, to obtain the humidity sensor with high sensitivity, short reaction time, low latency characteristic；
The upper electrode of adjustable condenser value can realize that most of capacitance type humidity sensors can not ensure same batch life
After production processing, still there is stable capacitance, or different applications has the solution of different demands to capacitance size；
Pattern is formed using macromolecule humidity-sensitive film on the substrates such as glass, quartz, silicon, is increased by adding ceramic material
Add its durability.Glass substrate etc. has the features such as cheap, high intensity, is suitable as humidity sensor substrate；Macromolecule
Polymeric material easily forms nanostructured, has fabulous hydrophily, is suitable as humidity-sensitive film；Ceramic material is then because of tool
There are outstanding stability and the durability and reliability of environment resistant and suitable enhancing humidity sensor humidity-sensitive film；And metal adds
Thing can further optimize humidity-sensitive film, it is obtained optimal Unordered system.It can be produced by this semiconductor machining mode
High precision, high stability, heat-resisting, anti-pollution, high reliability product sensor.
Brief description of the drawings
The structure chart of Fig. 1 capacitance type humidity sensors；
The profile of Fig. 2 lower electrodes；
The coating of Fig. 3 humidity-sensitive films；
Photoresist model on Fig. 4 humidity-sensitive films；
The humidity-sensitive film left after Fig. 5 etchings；
The photoresist model of Fig. 6 upper electrodes；
The profile of Fig. 7 upper electrodes；
The top view and profile of Fig. 8 upper electrode hallrcuts structures；
The profile of Fig. 9 upper electrode hallrcuts structures；
Figure 10 is adjustable condenser partial schematic diagram in capacitance type humidity sensor upper electrode；
Figure 11 is the electric capacity of humidity sensor and the graph of a relation of relative humidity.
Wherein 1 substrate；2 lower electrodes；3 humidity-sensitive films；4 photoresists；5 upper electrodes.
Embodiment
Below according to accompanying drawing citing, the present invention will be further described.
Embodiment 1
A kind of preparation method of adjustable type capacitance type humidity sensor is as follows：
Step 1: once being cleaned using glass substrate, and using isopropyl amine aqueous solution, then carried out with deionized water solution
Secondary cleaning, ensure surface cleaning and free from admixture；
Step 2: it is 300~500 ran titaniums, platinum, gold or chromium to grow a layer thickness by the method for electron beam evaporation
Lower metal layer as humidity sensor；
Step 3: with ball-milling technology by titanium oxide and barium strontium titanate according to 1:1 mass ratio carries out being mixed into function ceramics
Material, and ensure to be well mixed, so as to obtain higher high moisture performance；
It is Step 4: polyamide (Polyamide) is further according to 0.3wt% mass ratio with above-mentioned ceramic material
Full and uniform mixing is carried out by ball grinding method, so as to obtain best behavior of hysteresis, this had not only included low humidity but also had included height
Moisture performance, while improve the durability and reliability of wet sensory material；
Step 5: by mixture made of inertia easy conductive metal and step 4 according to 15wt% mass ratio again by
Ball grinding method carries out full and uniform mixing, obtains optimal Unordered system；
Step 6 deposits one layer 1.2~1.6 microns thick compound wet using aerosol deposition technique in lower metal layer
Quick film.Then hot baked is carried out under 100~150 degrees Celsius 10~20 minutes, hot baked is carried out under 200~300 degrees Celsius
30~40 minutes, this was to remove the moisture in compound humidity sensing film；
Step 7 coats 4~6 microns of thick photoresists on compound humidity sensing film surface, using photomask exposure, at developer solution
Reason obtains photoresist model.And then mixed using G＆Os such as fluorine-based, chloro, sulfenyl carbide, utilize inductive etc.
Plasma etching method performs etching to compound humidity sensing film, so as to obtain desired moulding；
Step 8 forms upper metal layers by the method for sputtering, utilizes stress and thermal expansion between the film in sputter procedure
For the difference of coefficient with hallrcuts structure, upper electrode is compound wet for the ease of vapor infiltration with hallrcuts structure
Quick film, improve the sensitivity to humidity and reaction time.Upper electrode composition can be a variety of different metals such as nickel, chromium, thickness
For 150~500 nanometers.Wet-etching technology is utilized afterwards, upper electrode is formed, so as to complete the preparation of humidity sensor；
Step 9 is required the difference of capacitance size according to different application, changes upper strata electricity by the method for laser cutting
The size of pole-face product carrys out capacitance value, to meet different application demands；
Step 10 application 3D printing technique or molded technology make sensor outer housing, are finally completed the encapsulation of sensor；
The materials such as titanium oxide, barium titanate possess excellent moisture-absorption characteristics, and the material such as strontium oxide strontia, barium strontium titanate is special in dehumidification
It is with the obvious advantage in property, thus the humidity-sensitive material prepared by above Material cladding be bound on behavior of hysteresis it is more excellent than homogenous material
Gesture is obvious.First, use aerosol deposition technique auxiliary to carry out the mixing of difference in functionality ceramic material with ball-milling technology, ensure just
Beginning material is well mixed, stable performance；Secondly, film inside aperture structure, hole are checked using the micro- Electronic Speculum profile of focused ion beam
The changing rule such as footpath and distribution defect, and the information such as cell parameter, crystallite dimension, crystallinity are analyzed, explained from microcosmic angle thin
The improvement of film defect simultaneously quantifies to optimize material mixture ratio；Then the different ceramics of film consistency model comprehensive verification of fitting are utilized
Improvement mechanism of the material to defect.
Embodiment 2
A kind of preparation method of adjustable type capacitance type humidity sensor is as follows：
Step 1 uses quartz base plate, and is once cleaned using isopropyl amine aqueous solution, then is carried out with deionized water solution
Secondary cleaning, ensure surface cleaning and free from admixture；
It is 300~500 ran titaniums, platinum, gold or chromium that step 2 grows a layer thickness by the method for electron beam evaporation
Lower metal layer as humidity sensor；
Step 3 is with ball-milling technology by titanium oxide and barium strontium titanate according to 1:1 mass ratio is mixed, and ensures initial power
Energy ceramic material is well mixed, stable performance, so as to obtain higher high moisture performance；
Step 4 is by high molecular polymer polyamide (Polyamide) and above-mentioned ceramic material according to 0.3wt%'s
Mass ratio further it is carried out with ceramic material by ball grinding method it is full and uniform mix, so as to obtain best humidity hysteresis
Characteristic, this had not only included low humidity but also had included high moisture performance, while improved the durability and reliability of wet sensory material；
Step 5 by copper and above-mentioned ceramic material and high polymer mixtures according to 25wt% mass ratio again
It is secondary to be obtained it most preferably with ceramic material with full and uniform mix of high polymer mixtures progress by ball grinding method
Unordered system；
Step 6 deposits one layer 1.2~1.6 microns thick compound wet using aerosol deposition technique in lower metal layer
Quick film.Then hot baked is carried out under 100~150 degrees Celsius 10~20 minutes, hot baked is carried out under 200~300 degrees Celsius
30~40 minutes, this was to remove the moisture in compound humidity sensing film；
Step 7 coats 4~6 microns of thick photoresists on compound humidity sensing film surface, using photomask exposure, at developer solution
Reason obtains photoresist model.And then mixed using G＆Os such as fluorine-based, chloro, sulfenyl carbide, utilize inductive etc.
Plasma etching method performs etching to compound humidity sensing film, so as to obtain desired moulding；
Step 8 forms upper metal layers by the method for sputtering, utilizes stress and thermal expansion between the film in sputter procedure
The difference of coefficient can be a variety of different metals such as nickel, chromium with hallrcuts structure, composition, and thickness is received for 150~500
Rice.Wet-etching technology is utilized afterwards, upper electrode is formed, so as to complete the preparation of humidity sensor；
Step 9 is required the difference of capacitance size according to different application, changes upper strata electricity by the method for laser cutting
The size of pole-face product carrys out capacitance value, to meet different application demands；
Step 10 application 3D printing technique or molded technology make sensor outer housing, are finally completed the encapsulation of sensor.
Embodiment 3
A kind of preparation method of adjustable type capacitance type humidity sensor is as follows：
Step 1 uses silicon substrate, and is once cleaned using isopropyl amine aqueous solution, then carries out two with deionized water solution
Secondary cleaning, ensure surface cleaning and free from admixture；
It is 300~500 ran titaniums, platinum, gold or chromium that step 2 grows a layer thickness by the method for electron beam evaporation
Lower metal layer as humidity sensor；
Step 3 is with ball-milling technology by titanium oxide and barium strontium titanate according to 1:1 mass ratio is mixed, and ensures initial power
Energy ceramic material is well mixed, stable performance, so as to obtain higher high moisture performance；
Matter of the step 4 by high molecular polymer polytetrafluoroethylene (PTFE) (PTFE) with above-mentioned ceramic material according to 0.5wt%
Amount than further it is carried out with ceramic material by ball grinding method it is full and uniform mix, so as to obtain best humidity hysteresis spy
Property, this had not only included low humidity but also had included high moisture performance, while improved the durability and reliability of wet sensory material；
Step 5 by inert metal it is silver-colored with above-mentioned ceramic material with high polymer mixtures according to 15wt%'s
Mass ratio it is carried out with ceramic material with high polymer mixtures again by ball grinding method it is full and uniform mix,
Obtain optimal Unordered system；
Step 6 deposits one layer 1.2~1.6 microns thick compound wet using aerosol deposition technique in lower metal layer
Quick film.Then hot baked is carried out under 100~150 degrees Celsius 10~20 minutes, hot baked is carried out under 200~300 degrees Celsius
30~40 minutes, this was to remove the moisture in compound humidity sensing film；
Step 7 coats 4~6 microns of thickness on the compound compound humidity sensing film surface of function ceramics/polymer/metal additive
Photoresist, use photomask exposure, developer solution processing obtain photoresist model.And then use fluorine-based, chloro, sulfenyl carbide
Mix, compound humidity sensing film is performed etching using inductively coupled plasma etching method, so as to be thought Deng G＆O
The moulding wanted；
Step 8 forms upper metal layers by the method for sputtering, utilizes stress and thermal expansion between the film in sputter procedure
The difference of coefficient can be a variety of different metals such as nickel, chromium with hallrcuts structure, composition, and thickness is received for 150~500
Rice.Wet-etching technology is utilized afterwards, upper electrode is formed, so as to complete the preparation of humidity sensor；
Step 9 is required the difference of capacitance size according to different application, changes upper strata electricity by the method for laser cutting
The size of pole-face product carrys out capacitance value, to meet different application demands；
Step 10 application 3D printing technique or molded technology make sensor outer housing, are finally completed the encapsulation of sensor.
Embodiment 4
A kind of preparation method of the adjustable type capacitance type humidity sensor based on compound humidity-sensitive material is as follows：
Step 1 uses semiconductor substrate, and is once cleaned using isopropyl amine aqueous solution, then is entered with deionized water solution
Row secondary cleaning, ensure surface cleaning and free from admixture；
It is 300~500 ran titaniums, platinum, gold or chromium that step 2 grows a layer thickness by the method for electron beam evaporation
Lower metal layer as humidity sensor；
Step 3 is with ball-milling technology by titanium oxide and barium strontium titanate according to 1:1 mass ratio is mixed, and ensures initial power
Energy ceramic material is well mixed, stable performance, so as to obtain higher high moisture performance；
Matter of the step 4 by high molecular polymer polytetrafluoroethylene (PTFE) (PTFE) with above-mentioned ceramic material according to 0.5wt%
Amount than further it is carried out with ceramic material by ball grinding method it is full and uniform mix, so as to obtain best humidity hysteresis spy
Property, this had not only included low humidity but also had included high moisture performance, while improved the durability and reliability of wet sensory material；
Step 5 by copper and above-mentioned ceramic material and high polymer mixtures according to 25wt% mass ratio again
It is secondary it is carried out with ceramic material with high polymer mixtures by ball grinding method it is full and uniform mix, obtain optimal
Unordered system；
Step 6 deposits one layer 1.2~1.6 microns thick compound wet using aerosol deposition technique in lower metal layer
Quick film.Then hot baked is carried out under 100~150 degrees Celsius 10~20 minutes, hot baked is carried out under 200~300 degrees Celsius
30~40 minutes, this was to remove the moisture in compound humidity sensing film；
Step 7 coats 4~6 microns of thickness on the compound compound humidity sensing film surface of function ceramics/polymer/metal additive
Photoresist, use photomask exposure, developer solution processing obtain photoresist model.And then use fluorine-based, chloro, sulfenyl carbide
Mix, compound humidity sensing film is performed etching using inductively coupled plasma etching method, so as to be thought Deng G＆O
The moulding wanted；
Step 8 forms upper metal layers by the method for sputtering, utilizes stress and thermal expansion between the film in sputter procedure
The difference of coefficient can be a variety of different metals such as nickel, chromium with hallrcuts structure, composition, and thickness is received for 150~500
Rice.Wet-etching technology is utilized afterwards, upper electrode is formed, so as to complete the preparation of humidity sensor；
Step 9 is required the difference of capacitance size according to different application, changes upper strata electricity by the method for laser cutting
The size of pole-face product carrys out capacitance value, to meet different application demands；
Step 10 application 3D printing technique or molded technology make sensor outer housing, are finally completed the encapsulation of sensor.
Embodiment 5
A kind of preparation method of adjustable type capacitance type humidity sensor is as follows：
Step 1 uses silicon substrate, and is once cleaned using isopropyl amine aqueous solution, then carries out two with deionized water solution
Secondary cleaning, ensure surface cleaning and free from admixture；
It is 300~500 ran titaniums, platinum, gold or chromium that step 2 grows a layer thickness by the method for electron beam evaporation
Lower metal layer as humidity sensor；
Step 3 is with ball-milling technology by barium titanate and barium strontium titanate according to 1:3 mass ratio is mixed, and ensures initial power
Energy ceramic material is well mixed, stable performance, so as to obtain higher high moisture performance；
Step 4 is by high molecular polymer polyamide (Polyamide) and above-mentioned ceramic material according to 0.3wt%'s
Mass ratio further it is carried out with ceramic material by ball grinding method it is full and uniform mix, so as to obtain best humidity hysteresis
Characteristic, this had not only included low humidity but also had included high moisture performance, while improved the durability and reliability of wet sensory material；
Step 5 by inert metal it is silver-colored with above-mentioned ceramic material with high polymer mixtures according to 15wt%'s
Mass ratio it is carried out with ceramic material with high polymer mixtures again by ball grinding method it is full and uniform mix,
Obtain optimal Unordered system；
Step 6 deposits one layer 1.2~1.6 microns thick compound using aerosol deposition technique in lower metal layer
Compound humidity sensing film.Then hot baked is carried out under 100~150 degrees Celsius 10~20 minutes, is carried out under 200~300 degrees Celsius
Hot baked 30~40 minutes, this is to remove the moisture in compound humidity sensing film；
Step 7 coats 4~6 microns of thickness on the compound compound humidity sensing film surface of function ceramics/polymer/metal additive
Photoresist, use photomask exposure, developer solution processing obtain photoresist model.And then use fluorine-based, chloro, sulfenyl carbide
Mix, compound humidity sensing film is performed etching using inductively coupled plasma etching method, so as to be thought Deng G＆O
The moulding wanted；
Step 8 forms upper metal layers by the method for sputtering, utilizes stress and thermal expansion between the film in sputter procedure
The difference of coefficient can be a variety of different metals such as nickel, chromium with hallrcuts structure, composition, and thickness is received for 150~500
Rice.Wet-etching technology is utilized afterwards, upper electrode is formed, so as to complete the preparation of humidity sensor；
Step 9 is required the difference of capacitance size according to different application, changes upper strata electricity by the method for laser cutting
The size of pole-face product carrys out capacitance value, to meet different application demands；
Step 10 application 3D printing technique or molded technology make sensor outer housing, are finally completed the encapsulation of sensor.
Embodiment 6
A kind of preparation method of adjustable type capacitance type humidity sensor is as follows：
Step 1 uses glass substrate, and is once cleaned using isopropyl amine aqueous solution, then is carried out with deionized water solution
Secondary cleaning, ensure surface cleaning and free from admixture；
It is 300~500 ran titaniums, platinum, gold or chromium that step 2 grows a layer thickness by the method for electron beam evaporation
Lower metal layer as humidity sensor；
Step 3 is with ball-milling technology by barium titanate and barium strontium titanate according to 1:3 mass ratio is mixed, and ensures initial power
Energy ceramic material is well mixed, stable performance, so as to obtain higher high moisture performance；
Step 4 is by high molecular polymer polyamide (Polyamide) and above-mentioned ceramic material according to 0.3wt%'s
Mass ratio further it is carried out with ceramic material by ball grinding method it is full and uniform mix, so as to obtain best humidity hysteresis
Characteristic, this had not only included low humidity but also had included high moisture performance, while improved the durability and reliability of wet sensory material；
Step 5 by copper and above-mentioned ceramic material and high polymer mixtures according to 25wt% mass ratio again
It is secondary it is carried out with ceramic material with high polymer mixtures by ball grinding method it is full and uniform mix, obtain optimal
Unordered system；
Step 6 deposits one layer 1.2~1.6 microns thick compound wet using aerosol deposition technique in lower metal layer
Quick film.Then hot baked is carried out under 100~150 degrees Celsius 10~20 minutes, hot baked is carried out under 200~300 degrees Celsius
30~40 minutes, this was to remove the moisture in compound humidity sensing film；
Step 7 coats 4~6 microns of thickness on the compound compound humidity sensing film surface of function ceramics/polymer/metal additive
Photoresist, use photomask exposure, developer solution processing obtain photoresist model.And then use fluorine-based, chloro, sulfenyl carbide
Mix, compound humidity sensing film is performed etching using inductively coupled plasma etching method, so as to be thought Deng G＆O
The moulding wanted；
Step 8 forms upper metal layers by the method for sputtering, utilizes stress and thermal expansion between the film in sputter procedure
The difference of coefficient can be a variety of different metals such as nickel, chromium with hallrcuts structure, composition, and thickness is received for 150~500
Rice.Wet-etching technology is utilized afterwards, upper electrode is formed, so as to complete the preparation of humidity sensor；
Step 9 is required the difference of capacitance size according to different application, changes upper strata electricity by the method for laser cutting
The size of pole-face product carrys out capacitance value, to meet different application demands；
Step 10 application 3D printing technique or molded technology make sensor outer housing, are finally completed the encapsulation of sensor.
Embodiment 7
A kind of preparation method of adjustable type capacitance type humidity sensor is as follows：
Step 1 uses glass substrate, and is once cleaned using isopropyl amine aqueous solution, then is carried out with deionized water solution
Secondary cleaning, ensure surface cleaning and free from admixture；
It is 300~500 ran titaniums, platinum, gold or chromium that step 2 grows a layer thickness by the method for electron beam evaporation
Lower metal layer as humidity sensor；
Step 3 is with ball-milling technology by barium titanate and barium strontium titanate according to 1:3 mass ratio is mixed, and ensures initial power
Energy ceramic material is well mixed, stable performance, so as to obtain higher high moisture performance；
Matter of the step 4 by high molecular polymer polytetrafluoroethylene (PTFE) (PTFE) with above-mentioned ceramic material according to 0.5wt%
Amount than further it is carried out with ceramic material by ball grinding method it is full and uniform mix, so as to obtain best humidity hysteresis spy
Property, this had not only included low humidity but also had included high moisture performance, while improved the durability and reliability of wet sensory material；
Step 5 by inert metal it is silver-colored with above-mentioned ceramic material with high polymer mixtures according to 15wt%'s
Mass ratio it is carried out with ceramic material with high polymer mixtures again by ball grinding method it is full and uniform mix,
Obtain optimal Unordered system；
Step 6 deposits one layer 1.2~1.6 microns thick compound wet using aerosol deposition technique in lower metal layer
Quick film.Then hot baked is carried out under 100~150 degrees Celsius 10~20 minutes, hot baked is carried out under 200~300 degrees Celsius
30~40 minutes, this was to remove the moisture in compound humidity sensing film；
Step 7 coats 4~6 microns of thickness on the compound compound humidity sensing film surface of function ceramics/polymer/metal additive
Photoresist, use photomask exposure, developer solution processing obtain photoresist model.And then use fluorine-based, chloro, sulfenyl carbide
Mix, compound humidity sensing film is performed etching using inductively coupled plasma etching method, so as to be thought Deng G＆O
The moulding wanted；
Step 8 forms upper metal layers by the method for sputtering, utilizes stress and thermal expansion between the film in sputter procedure
The difference of coefficient can be a variety of different metals such as nickel, chromium with hallrcuts structure, composition, and thickness is received for 150~500
Rice.Wet-etching technology is utilized afterwards, upper electrode is formed, so as to complete the preparation of humidity sensor；
Step 9 is required the difference of capacitance size according to different application, changes upper strata electricity by the method for laser cutting
The size of pole-face product carrys out capacitance value, to meet different application demands；
Step 10 application 3D printing technique or molded technology make sensor outer housing, are finally completed the encapsulation of sensor.
Embodiment 8
A kind of preparation method of adjustable type capacitance type humidity sensor is as follows：
Step 1 uses semiconductor substrate, and is once cleaned using isopropyl amine aqueous solution, then is entered with deionized water solution
Row secondary cleaning, ensure surface cleaning and free from admixture；
It is 300~500 ran titaniums, platinum, gold or chromium that step 2 grows a layer thickness by the method for electron beam evaporation
Lower metal layer as humidity sensor；
Step 3 is with ball-milling technology by barium titanate and barium strontium titanate according to 1:3 mass ratio is mixed, and ensures initial power
Energy ceramic material is well mixed, stable performance, so as to obtain higher high moisture performance；
Matter of the step 4 by high molecular polymer polytetrafluoroethylene (PTFE) (PTFE) with above-mentioned ceramic material according to 0.5wt%
Amount than further it is carried out with ceramic material by ball grinding method it is full and uniform mix, so as to obtain best humidity hysteresis spy
Property, this had not only included low humidity but also had included high moisture performance, while improved the durability and reliability of wet sensory material；
Step 5 by copper and above-mentioned ceramic material and high polymer mixtures according to 25wt% mass ratio again
It is secondary it is carried out with ceramic material with high polymer mixtures by ball grinding method it is full and uniform mix, obtain optimal
Unordered system；
Step 6 deposits one layer 1.2~1.6 microns thick compound wet using aerosol deposition technique in lower metal layer
Quick film.Then hot baked is carried out under 100~150 degrees Celsius 10~20 minutes, hot baked is carried out under 200~300 degrees Celsius
30~40 minutes, this was to remove the moisture in compound humidity sensing film；
Step 7 coats 4~6 microns of thickness on the compound compound humidity sensing film surface of function ceramics/polymer/metal additive
Photoresist, use photomask exposure, developer solution processing obtain photoresist model.And then use fluorine-based, chloro, sulfenyl carbide
Mix, compound humidity sensing film is performed etching using inductively coupled plasma etching method, so as to be thought Deng G＆O
The compound humidity sensing film moulding wanted；
Step 8 forms upper metal layers by the method for sputtering, utilizes stress and thermal expansion between the film in sputter procedure
The difference of coefficient can be a variety of different metals such as nickel, chromium with hallrcuts structure, composition, and thickness is received for 150~500
Rice.Wet-etching technology is utilized afterwards, upper electrode is formed, so as to complete the preparation of humidity sensor；
Step 9 is required the difference of capacitance size according to different application, changes upper strata electricity by the method for laser cutting
The size of pole-face product carrys out capacitance value, to meet different application demands；
Step 10 application 3D printing technique or molded technology make sensor outer housing, are finally completed the encapsulation of sensor.
Embodiment 9
The present embodiment is proposed with function ceramics class material and macromolecule polymer material doping metals additives mixed system
Standby compound humidity-sensitive material is researches and develops the scheme of point of penetration, using advanced semiconductor micro-nano processing technology and treatment technology, to institute
The compound humidity sensing film prepared carries out the optimization processing of material surface and internal structural properties, to lift humidity inductive characteristic.Most
It is able to prepare the high-performance humidity sensor of the high accuracy based on electric capacity operation principle, high sensitivity, quick detection, high reliability eventually
Device.And it have found the method for etching this wet sensory material；Special capacitance type humidity sensor structure is designed, upper substrate does micro-
Slight crack structure can effectively improve the contact area of moisture and wet sensory material, postpone so as to increase substantially sensitivity and reduce
Characteristic.
The materials such as titanium oxide, barium titanate possess excellent moisture-absorption characteristics, and the material such as strontium oxide strontia, barium strontium titanate is special in dehumidification
It is with the obvious advantage in property, thus the humidity-sensitive material prepared by above Material cladding be bound on behavior of hysteresis it is more excellent than homogenous material
Gesture is obvious.First, use aerosol deposition technique auxiliary to carry out the mixing of difference in functionality ceramic material with ball-milling technology, ensure just
Beginning material is well mixed, stable performance；Secondly, film inside aperture structure, hole are checked using the micro- Electronic Speculum profile of focused ion beam
The changing rule such as footpath and distribution defect, and the information such as cell parameter, crystallite dimension, crystallinity are analyzed, explained from microcosmic angle thin
The improvement of film defect simultaneously quantifies to optimize material mixture ratio；Then the different ceramics of film consistency model comprehensive verification of fitting are utilized
Improvement mechanism of the material to defect.
It is final to determine titanium oxide or barium titanate with barium strontium titanate according to mass ratio 1:1~1:3 mixing when can obtain compared with
The good particularly high moisture performance of behavior of hysteresis, but the problem of certain be present in low humidity characteristic.
Then, high molecular polymer is because of its customizable hydrophilic functional group (such as-COOH ,-NO2Deng) and controllable hole
Hole structure and density, there is very superior Unordered system.Soft, the high molecular polymer of high-ductility by with function ceramics
Class humidity-sensitive material mixes the space impurity defect that can reduce ceramic membrane internal structure to a certain extent, is formed relatively uniform
Pore structure, compensation the latter aperture is uneven and the shortcomings of configuration of surface defect, but ratio regular meeting of the two mixing influence it is final
The external morphology structure of the compound humidity sensing film formed is so as to showing different Unordered systems.Therefore the optimization ratio of the two mixing
Example needs further to verify by testing.The high molecular polymer such as polytetrafluoroethylene (PTFE) dusty material and impulsive force caused by substrate
It is weaker, it is difficult to be adhered firmly to substrate, therefore with the compound middle proportion of function ceramics it is too high can cause it is final compound
The adhesion of material film and substrate deficiency, long-term use, which is easily caused, to come off, therefore generally polytetrafluoroethylene (PTFE) Polymer material
Mixed proportion to be less than 1.0wt%.Within the range by macromolecule polymer material in different proportions with function ceramics class
Material is mixed, and the mixed proportion of the two optimization is verified to produce different morphosis.
Final conclusion can obtain, using ceramic material titanium oxide or barium titanate with barium strontium titanate according to 1:1~1:3 mixing
Afterwards, further mixed with polyamide (Polyamide) or polytetrafluoroethylene (PTFE) (PTFE) according to mass ratio 0.3wt%~0.5wt%,
Finally again by the mixture of ceramic material and high molecular polymer and metallic additionses according to mass ratio 15wt%~
25wt% can obtain optimal Unordered system when mixing.
Embodiment 10
As shown in figure 1, a kind of adjustable type capacitance type humidity sensor based on compound humidity-sensitive material, including upper strata electricity
Pole, humidity sensing layer, lower electrode and substrate.The design of capacitance type humidity sensor depends on humidity sensing layer dielectric constant with dampening
Divide the change absorbed, so as to change total capacitance value.Polymeric dielectric has such as change in dielectric constant ratio and hydrone
The physical characteristics such as high dipole moment, therefore the change that humidity change can be directly by measuring electric capacity obtains.Under normal circumstances, electric capacity
The relative dielectric constant of the conventional polymer of formula humidity sensor at room temperature is about 5, and the value of pure water is higher, and about 80
(78.54), Polymer absorption vapor can increase dielectric constant values, and linearly change with capacitance.
Capacitance type humidity sensor is to judge that the humidity in surrounding environment changes according to the change of capacitance.The electricity of capacitor
Capacitance is according to following relationship change：
C=ε A/4 π kd
Wherein C is capacitance, and ε is the dielectric constant of compound wet sensitive membrane material, and A is the faying surface of capacitor upper/lower electrode
Product, k is electrostatic force constant, and d is the spacing of capacitor upper/lower electrode.Thus, the capacitance of capacitor is proportional to compound humidity sensing film
Dielectric constant, dielectric constant is higher, and capacitance is higher.Each compound wet sensitive membrane material has a specific dielectric constant, and dielectric is normal
Numerical value can change according to ambient humidity.Therefore, the change that humidity change can be directly by measuring electric capacity obtains.
The work flow of humidity sensor：Layer electrode is formed by the method for electron beam evaporation in figure 2 the lower, into
It is usually the metals such as titanium, platinum, gold or chromium to divide, and thickness range is 300~500 nanometers.In figure 3, the side of aerosol deposition is passed through
Function ceramics/polymer/metal additive that method deposits one layer 1.2~1.6 microns thick on lower electrode is compound compound wet
Quick film.Then hot baked is carried out under 100~150 degrees Celsius 10~20 minutes, hot baked is carried out under 200~300 degrees Celsius
30~40 minutes, this was to remove the moisture in compound humidity sensing film.In Fig. 4, in function ceramics/polymer/metal addition
4~6 microns of thick photoresists are coated on the compound compound humidity sensing film surface of thing, and using photomask exposure, developer solution processing obtains light
Photoresist model.In figure 5 it is possible to be mixed using G＆Os such as fluorine-based, chloro, sulfenyl carbide, inductive etc. is utilized
Plasma etching method performs etching to the compound compound humidity sensing film of function ceramics/polymer/metal additive, so as to be thought
The compound humidity sensing film moulding wanted.In figure 6, coated on the compound compound humidity sensing film of function ceramics/polymer/metal additive
1~2 micron of thick photoresist is used to prepare required upper electrode pattern.On Fig. 7, upper strata electricity is formed by the method for sputtering
Pole, the difference using stress between the film in sputter procedure and thermal coefficient of expansion can be with hallrcuts structure, composition
A variety of different metals such as nickel, chromium, thickness are 150~500 nanometers.During sputtering, basic air pressure (base presuure) needs to keep
10-6Below Torr.Ar gas flow is maintained in the range of 6~15sccm in sputter procedure and RF power needs to be maintained at
(process air pressure now is generally 1X10 between 45-95 watts-3~5X10-3Torr).Fig. 8 and Fig. 9 respectively illustrates upper strata electricity
The top view and profile of atomic slight crack structure；
Figure 10 shows adjustable condenser part in capacitance type humidity sensor upper electrode, one share 12 it is different can
Area module is adjusted, corresponding capacitance see the table below.The total capacitance value of target is 252.08pF, and adjustable part area capacitance is
52.08pF, tunable capacitor ratio are 20.66%.Each adjustable area module is by other area phases of lametta and upper electrode
Even, required area can be controlled by laser cutting method.
| Sequence number | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 |
| Capacitance (pF) | 13.71 | 8.57 | 1.71 | 3.42 | 1.02 | 0.45 | 0.11 | 0.06 | 0.23 | 0.85 | 6.85 | 15.08 |
Humidity sensor measurement environment：LCR meter are used to measure capacitance.Humidity sensor is fixed in measurement plate
It is put into humidity chamber, measurement plate is connected with LCR meter by the hole of humidity chamber side wall with coaxial line, LCR meter can
To be connected by USB line with computer, real-time measurement capacitance can be recorded directly by computer.Being needed before measurement will be wet
Processing is dried in degree sensor, reduces its initial humidity.Humidity chamber measurement range is from 10% to 90%, each measurement point test
More than half an hour to ensure the complete moisture absorption of sensor and dehumidification.
The encapsulation of direct insertion humidity sensor：By capacitance type humidity sensor chip, sensor outer housing and sensor pin
Composition.Sensor outer housing can utilize 3D printing technique or molded technology to be processed realization.
Figure 11 is the capacitance of humidity sensor and the graph of a relation of relative humidity.Rhombus solid line is represented in moisture absorption process, electric
Capacitance is linearly increasing with the increase of relative humidity.Range of humidity variation is 10%RH to 90%RH.Capacitance type sensor
Electric capacity from the about 200pF of 10% humidity change to 90% humidity when about 256pF.Square solid line represents drying, because stagnant
Effect afterwards, moisture curve is slightly different with moisture absorption during moisture releasing.The lag parameter that difference between the two passes through trigonometric curve
Embody.
Claims (8)
1. a kind of compound humidity-sensitive material for capacitance type humidity sensor, it is characterised in that formula is as follows：Titanium oxide or metatitanic acid
Barium is with barium strontium titanate according to 1:1-1:3 mass ratioes mix, referred to as Elementary Function ceramic material, polyamide or polytetrafluoroethylene (PTFE) and institute
The Elementary Function ceramic material stated mixes according to 0.3wt%-0.5wt% mass ratio, referred to as mixture, inert metal with it is described
Mixture according to 15wt%-25wt% mass ratio mix.
2. the preparation method of a kind of compound humidity-sensitive material film for capacitance type humidity sensor, it is characterised in that method is as follows：
By titanium oxide or barium titanate with barium strontium titanate according to 1:1~1:3 mass ratioes are full and uniform to be mixed and made into Elementary Function ceramic material,
Then polyamide or polytetrafluoroethylene (PTFE) are filled with described Elementary Function ceramic material according to 0.3wt%-0.5wt% mass ratio
Divide and be uniformly mixed and made into mixture, inert metal is filled again with described mixture according to 15wt%~25wt% mass ratio
Divide and be uniformly mixed and made into compound humidity-sensitive material, then deposit one layer of compound humidity sensing film on bottom plate using aerosol deposition technique,
Last hot baked removes the moisture in compound humidity sensing film.
3. a kind of preparation method of compound humidity-sensitive material film for capacitance type humidity sensor according to claim 2,
Characterized in that, raw material is mixed using ball grinding method.
4. a kind of preparation method of compound humidity-sensitive material film for capacitance type humidity sensor according to claim 2,
Characterized in that, described inert metal is silver or copper.
5. a kind of preparation method of compound humidity-sensitive material film for capacitance type humidity sensor according to claim 2,
Characterized in that, the various raw material average particle size particle sizes used are less than 100 nanometers.
A kind of 6. system of compound humidity-sensitive material film for capacitance type humidity sensor according to claim any one of 2-5
A kind of compound humidity-sensitive material film for capacitance type humidity sensor prepared by Preparation Method.
7. using a kind of the adjustable of compound humidity-sensitive material film preparation for capacitance type humidity sensor as claimed in claim 6
Nodal pattern capacitance type humidity sensor, it is characterised in that preparation method is as follows：
Step 1: using surface cleaning and the semiconductor substrate of free from admixture, a layer thickness is grown by the method for electron beam evaporation
For the lower metal layer of 300~500 nanometers of titanium, platinum, gold or chromium；
Step 2: one layer 1.2~1.6 microns thick compound wet is then deposited in lower metal layer using aerosol deposition technique
Quick film, then carry out the moisture in the compound humidity sensing film of hot baked removal；
Step 3: coating photoresist on compound humidity sensing film surface, using photomask exposure, developer solution processing obtains photoetching rubber moulding
Type, the inductively coupled plasma etching method of fluorine-based compound, oxygen and argon gas is realized to be carried out to compound humidity sensing film
Etching, so as to obtain desired compound humidity sensing film moulding；
Step 4: forming upper metal layers by the method for sputtering, stress between the film in sputter procedure and thermal expansion system are utilized
Several is different with hallrcuts structure, afterwards using wet-etching technology, forms upper electrode；
Step 5: the size for changing upper electrode area, which adjusts electricity, to be required to the difference of capacitance size according to different application
Capacitance, to meet different application demands；
Step 6: making sensor outer housing, the encapsulation of sensor is finally completed.
A kind of 8. preparation of adjustable type capacitance type humidity sensor based on compound humidity-sensitive material according to claim 7
Capacitance type humidity sensor prepared by method.
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109444235A (en) * | 2018-10-23 | 2019-03-08 | 中国科学院微电子研究所 | Integrated humidity sensor and its manufacturing method |
| CN111044582A (en) * | 2019-12-04 | 2020-04-21 | 中国工程物理研究院化工材料研究所 | Fluorocarbon film/metal oxide gas-sensitive film composite laminated device and preparation method thereof |
| CN113063826A (en) * | 2021-03-18 | 2021-07-02 | 江南大学 | Wearable perspiration rate sensor and assembling method thereof |
| CN114034744A (en) * | 2021-11-05 | 2022-02-11 | 电子科技大学 | High-performance self-driven humidity sensor and preparation method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5658202A (en) * | 1979-10-17 | 1981-05-21 | Matsushita Electric Ind Co Ltd | Sensor and temperature moisture detector |
| CN1298962A (en) * | 1999-12-08 | 2001-06-13 | 中国科学院物理研究所 | Process for preparing La-Ca-Mn-O film with sequencial surface structure |
| CN101811867A (en) * | 2010-03-11 | 2010-08-25 | 西北工业大学 | Preparation method of barium strontium titanate-magnesium titanate ceramic |
| KR20150131466A (en) * | 2014-05-14 | 2015-11-25 | 광운대학교 산학협력단 | Method for forming micropattern of BTO film |
-
2017
- 2017-09-07 CN CN201710800145.3A patent/CN107607594A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5658202A (en) * | 1979-10-17 | 1981-05-21 | Matsushita Electric Ind Co Ltd | Sensor and temperature moisture detector |
| CN1298962A (en) * | 1999-12-08 | 2001-06-13 | 中国科学院物理研究所 | Process for preparing La-Ca-Mn-O film with sequencial surface structure |
| CN101811867A (en) * | 2010-03-11 | 2010-08-25 | 西北工业大学 | Preparation method of barium strontium titanate-magnesium titanate ceramic |
| KR20150131466A (en) * | 2014-05-14 | 2015-11-25 | 광운대학교 산학협력단 | Method for forming micropattern of BTO film |
Non-Patent Citations (5)
| Title |
|---|
| HAMID FARAHANI ET AL.: "Humidity Sensors Principle, Mechanism, and Fabrication Technologies: A Comprehensive Review", 《SENSORS》 * |
| MING-QING LIU ET AL.: "High-Sensitivity and Low-Hysteresis Porous MIM-Type Capacitive Humidity Sensor Using Functional Polymer Mixed with TiO2 Microparticles", 《SENSORS》 * |
| PI-GUEY SU AND YI-PO CHANG: "Low-humidity sensor based on a quartz-crystal microbalance coated with polypyrrole/Ag/TiO 2 nanoparticles composite thin films", 《SENSORS AND ACTUATORS B》 * |
| YOON-HYUN KIM ET AL.: "Fabrication of BaTiO3 -PTFE composite film for embedded capacitor employing aerosol deposition", 《CERAMICS INTERNATIONAL》 * |
| ZHI CHEN AND CHI LU: "Humidity Sensors: A Review of Materials and Mechanisms", 《SENSOR LETTERS》 * |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109444235A (en) * | 2018-10-23 | 2019-03-08 | 中国科学院微电子研究所 | Integrated humidity sensor and its manufacturing method |
| CN111044582A (en) * | 2019-12-04 | 2020-04-21 | 中国工程物理研究院化工材料研究所 | Fluorocarbon film/metal oxide gas-sensitive film composite laminated device and preparation method thereof |
| CN113063826A (en) * | 2021-03-18 | 2021-07-02 | 江南大学 | Wearable perspiration rate sensor and assembling method thereof |
| CN114034744A (en) * | 2021-11-05 | 2022-02-11 | 电子科技大学 | High-performance self-driven humidity sensor and preparation method thereof |
| CN114034744B (en) * | 2021-11-05 | 2023-03-17 | 电子科技大学 | High-performance self-driven humidity sensor and preparation method thereof |
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