CN107580411B - Golden finger lead structure and manufacturing method - Google Patents
Golden finger lead structure and manufacturing method Download PDFInfo
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- CN107580411B CN107580411B CN201710771539.0A CN201710771539A CN107580411B CN 107580411 B CN107580411 B CN 107580411B CN 201710771539 A CN201710771539 A CN 201710771539A CN 107580411 B CN107580411 B CN 107580411B
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Abstract
The invention relates to a golden finger lead structure and a manufacturing method thereof. The end part of the main lead is electrically connected with the board edge conductor, and the main lead comprises a first copper layer, a first gold layer and a first solder mask layer. The first copper layer is used for covering the circuit board base material, and the first gold layer and the first solder mask layer are covered on the first copper layer. One end of the sub-lead is used for being electrically connected with the golden finger, and the other end of the sub-lead is connected with the first golden layer. According to the gold finger lead structure, the first gold layer is electroplated on one partial area of the surface of the first copper layer instead of being completely electroplated with gold, and the first solder mask layer is electroplated on the other partial area of the surface of the first copper layer, so that the area of a gold-plated area on the first copper layer can be reduced, and gold salt can be saved.
Description
Technical Field
The invention relates to the technical field of golden finger manufacturing, in particular to a golden finger lead structure and a manufacturing method thereof.
Background
In the traditional gold finger manufacturing process, before the step of electroplating hard gold to form the gold finger, sub-leads and main leads connected with the sub-leads need to be added. The main lead is connected to the plate edge copper conductor in an extending mode, and current is transmitted to the position of the golden finger from the plate edge copper conductor through the main lead and the sub lead, so that the purpose of gold plating is achieved. However, after the gold finger is electroplated, the main lead and the sub-leads are torn off by hand, which greatly wastes gold salt and increases the manufacturing cost of the gold finger.
Disclosure of Invention
Therefore, it is necessary to overcome the defects of the prior art and provide a gold finger lead structure and a manufacturing method thereof, which can reduce the waste of gold salt and reduce the manufacturing cost of the gold finger.
The technical scheme is as follows: a gold finger lead structure comprising: the main lead comprises a first copper layer, a first gold layer and a first solder resist layer, wherein the first copper layer is covered on a circuit board base material, and the first gold layer and the first solder resist layer are both covered on the first copper layer; and one end of the sub-lead is electrically connected with the golden finger, and the other end of the sub-lead is connected with the first golden layer.
A manufacturing method of the golden finger lead structure comprises the following steps: after the resistance welding treatment is carried out on the circuit board with the manufactured outer layer circuit pattern, windowing treatment is carried out on a resistance welding area corresponding to a gold finger, a resistance welding area corresponding to a first gold layer and a resistance welding area corresponding to a sub-lead, meanwhile, windowing treatment is also carried out on adjacent peripheral areas of the main lead and the sub-lead, and the windowing width D of the adjacent peripheral areas of the main lead and the sub-lead is 4-8 mil; and carrying out gold plating treatment on the windowed circuit board.
According to the gold finger lead structure and the manufacturing method thereof, the first gold layer is electroplated on one part of the surface of the first copper layer instead of being completely electroplated with gold, and the first solder mask is electroplated on the other part of the surface of the first copper layer, so that the area of a gold-plated area on the first copper layer can be reduced, and gold salt can be saved. The first copper layer and the first gold layer can normally guide current to the golden finger area, and the golden finger can be normally electroplated. In addition, because the first gold layer is connected with the sub-leads, when the main lead is pulled up, the main lead can still normally take up the sub-leads, and the manual tearing of the leads can also be normally carried out.
In one embodiment, the first gold layer extends from one end of the first copper layer covering the other end of the first copper layer. Therefore, in the process of pulling up the main lead, the main lead is not easy to break, and the lead of the screwdriver can be well taken to be separated from the substrate of the circuit board.
In one embodiment, the first gold layer includes a first gold layer section and a second gold layer section connected to each other, the first gold layer section is used for being connected to the board edge conductor, the width of the first gold layer section is greater than that of the second gold layer section, and the second gold layer section is connected to the sub-lead. So, because first gold section width is greater than second gold section width, the setting position in first gold section that can be convenient for the manual work found the connection plate edge conductor like this to can be convenient for play and cut the main lead wire, carry out the hand and tear the operation.
In one embodiment, the width of the first gold layer segment is adapted to the width of the first copper layer; the length L of the first gold layer section is 5mm to 15 mm. Therefore, the width of the first gold layer section is adaptive to the width of the first copper layer, so that the first gold layer section and the first copper layer which are connected with the board edge conductor can be conveniently and accurately cut off manually. In addition, the length L of first gold layer section is 5mm to 15mm, so play the sword and can peel the length of opening main lead tip and be 5mm to 15mm, can conveniently carry out the hand and tear main lead operation. Preferably, the length L of the first gold layer section is 10mm, the first gold layer section of the length can be convenient for the operation of tearing the main lead by hand, and the gold salt is not wasted due to overlong length.
In one embodiment, the second gold layer segment is disposed adjacent to the first solder mask layer, and the width of the second gold layer segment is 3-9 mil. In the process of tearing the lead by hand, the second gold layer section with the width of 3-9 mil can be provided with a screwdriver lead. Preferably, the width of the second gold layer segment is 4 mil. So, main lead wire can take the bottle opener lead wire, and the hand tears the less lead wire condition of splitting that takes place of lead wire in-process.
In one embodiment, the gold finger lead structure further comprises a connecting pad arranged between the main lead and the sub-lead, and the main lead is connected with the sub-lead through the connecting pad; the connection pad includes second copper layer, second gold layer and second solder mask, the second copper layer is used for covering on the circuit board base material, the second gold layer with the second solder mask all covers on the second copper layer, the second gold layer with the sub-lead links to each other, the second solder mask with first solder mask is even as an organic whole. So, the connection pad that sets up between main lead and sub-lead can strengthen the joint strength between main lead and the sub-lead, avoids violently tearing the lead wire in-process, takes place the phenomenon of splitting between main lead and the sub-lead. In addition, the second copper layer is not completely covered with the gold layer, but is partially covered with the gold layer, and the second solder resist layer is covered with the other part, so that the area of a gold-plated area on the second copper layer can be reduced, and gold salt can be saved.
In one embodiment, the second gold layer is annular, and the width of the second gold layer is adapted to the width of the first gold layer; the end of the second gold layer is connected to the first gold layer in a smooth mode, and the end of the sub-lead is connected to the second gold layer in a smooth mode. Therefore, in the process of pulling up the main lead, the second gold layer, the first gold layer and the end part of the sub-lead are not easy to break, and the lead tearing effect by hand is good.
In one embodiment, the sub-lead comprises a first lead section and a second lead section, one end of the first lead section is connected with one end of the second lead section, the other end of the first lead section is used for being connected with the golden finger, the other end of the second lead section is connected with the main lead, and the width of the second lead section is larger than that of the first lead section.
In one embodiment, the first lead segment end is rounded to the second lead segment; the width of the first lead segment is 4-7 mils, and the width of the second lead segment is 6-9 mils.
Drawings
Fig. 1 is a schematic structural diagram of a gold finger lead structure according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a gold finger lead structure according to another embodiment of the present invention;
fig. 3 is a schematic structural diagram of a gold finger lead structure according to another embodiment of the invention;
fig. 4 is a schematic structural diagram of a gold finger lead structure according to yet another embodiment of the present invention.
10. The lead comprises a main lead 11, a first gold layer 111, a first gold layer section 112, a second gold layer section 12, a first solder mask layer 20, a sub-lead 21, a first lead section 22, a second lead section 30, a connecting pad 31, a second gold layer 32, a second solder mask layer 40, a peripheral area 100 and a gold finger.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.
In the description of the present invention, it is to be understood that the terms "first", "second" and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the description of the present invention, it should be understood that when an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly connected" to another element, there are no intervening elements present.
As shown in fig. 1, a gold finger lead structure includes a main lead 10 and a sub-lead 20. The end of the main lead 10 is used for electrically connecting with a board edge conductor, and the main lead 10 includes a first copper layer, a first gold layer 11 and a first solder resist layer 12. The first copper layer is used for covering a circuit board substrate, and the first gold layer 11 and the first solder resist layer 12 both cover the first copper layer. One end of the sub-lead 20 is used for electrically connecting with the gold finger 100, and the other end of the sub-lead 20 is connected with the first gold layer 11.
In the gold finger lead structure, the first gold layer 11 is electroplated on one partial area of the surface of the first copper layer instead of completely electroplating gold on the first copper layer, and the first solder resist layer 12 is electroplated on the other partial area of the surface of the first copper layer, so that the area of a gold-plated area on the first copper layer can be reduced, and gold salt can be saved. The first copper layer and the first gold layer 11 can normally guide the current to the area of the gold finger 100, and the gold finger 100 can be normally electroplated. In addition, since the first gold layer 11 is connected to the sub-lead 20, when the main lead 10 is pulled up, the main lead 10 can still normally take up the sub-lead 20, and the wire tearing by hand can also be normally performed.
In this embodiment, the first gold layer 11 extends from one end of the first copper layer to cover the other end of the first copper layer. In this way, the main lead 10 is not easily broken during the process of pulling up the main lead 10, and the driver lead 20 can be well detached from the circuit board substrate.
In addition, referring to fig. 2, the first gold layer 11 includes a first gold layer segment 111 and a second gold layer segment 112 connected to each other. The first gold layer segments 111 are used to connect to the board edge conductors, and the width of the first gold layer segments 111 is greater than the width of the second gold layer segments 112. The second gold layer segment 112 is connected to the sub-lead 20. Like this, because first gold layer section 111 width is greater than second gold layer section 112 width, can be convenient for like this the manual work find the position that sets up of first gold layer section 111 of connecting plate edge conductor to can be convenient for play and cut main lead wire 10, carry out the operation of tearing by hand.
In addition, the width of the first gold layer segment 111 is adapted to the width of the first copper layer. The length L of the first gold layer segment 111 is 5mm to 15 mm. Therefore, the width of the first gold layer section 111 is adapted to the width of the first copper layer, so that the first gold layer section 111 and the first copper layer connected with the board edge conductor can be conveniently and accurately cut off manually. In addition, the length L of the first gold layer section 111 is 5mm to 15mm, so the length that the sword can be peeled off the end of the main lead 10 is 5mm to 15mm, and the operation of manually tearing the main lead 10 can be conveniently carried out. Preferably, the length L of the first gold layer section 111 is 10mm, and the first gold layer section 111 with the length can facilitate the operation of tearing the main lead 10 by hand, and the gold salt is not wasted due to overlong length. In other embodiments, referring to fig. 3, the width of the first gold layer segment 111 may also be slightly smaller than the width of the first copper layer, and a part of the area of the end of the first copper layer may be exposed without completely covering the end of the first copper layer.
In this embodiment, the second gold layer segment 112 is disposed adjacent to the first solder resist layer 12, and the width of the second gold layer segment 112 is 3mil to 9 mil. In the hand-tearing lead process, the second gold layer segment 112 with a width of 3mil to 9mil can carry the driver lead 20. Preferably, the second gold layer segment 112 has a width of 4 mils. Thus, the main lead 10 can be provided with the screwdriver lead 20, and lead fracture is less generated in the process of tearing the lead by hands.
In addition, the gold finger lead structure further includes a land 30 disposed between the main lead 10 and the sub-lead 20. The main lead 10 is connected to the sub-lead 20 through the land 30. The land 30 includes a second copper layer, a second gold layer 31, and a second solder resist layer 32. The second copper layer is used for covering the circuit board base material. The second gold layer 31 and the second solder resist layer 32 are covered on the second copper layer, and the second gold layer 31 is connected to the sub-lead 20. The second solder resist layer 32 is integrated with the first solder resist layer 12. In this way, the land 30 provided between the main lead 10 and the sub-lead 20 can enhance the connection strength between the main lead 10 and the sub-lead 20, and prevent the main lead 10 and the sub-lead 20 from being broken during the process of strongly tearing the leads. In addition, the second copper layer is not completely covered with the gold layer, but is partially covered with the gold layer, and the other part is covered with the second solder resist layer 32, so that the area of the gold-plated area on the second copper layer can be reduced, and the gold salt can be saved.
Further, the second au layer 31 is ring-shaped, and the width of the second au layer 31 is adapted to the width of the first au layer 11. The end of the second au layer 31 is smoothly connected to the first au layer 11, and the end of the sub-lead 20 is smoothly connected to the second au layer 31. Therefore, in the process of pulling up the main lead 10, the second gold layer 31 and the end parts of the first gold layer 11 and the sub-lead 20 are not easy to break, and the lead tearing effect is good.
In this embodiment, the sub-lead 20 includes a first lead segment 21 and a second lead segment 22. One end of the first lead segment 21 is connected to one end of the second lead segment 22, and the other end of the first lead segment 21 is used for being connected to the gold finger 100. The other end of the second lead segment 22 is connected to the main lead 10. The width of the second lead segment 22 is greater than the width of the first lead segment 21. Specifically, the end of the first lead segment 21 is smoothly connected to the second lead segment 22. The width of the first lead segment 21 is 4-7 mil, and the width of the second lead segment 22 is 6-9 mil.
Referring to fig. 4, a method for fabricating a gold finger lead structure includes the following steps: after performing solder mask treatment on a circuit board with a manufactured outer layer circuit pattern, performing windowing treatment on a solder mask area corresponding to a gold finger 100, a solder mask area corresponding to a first gold layer 11 and a solder mask area corresponding to a sub-lead 20, and simultaneously performing windowing treatment on solder masks of adjacent peripheral areas 40 of the main lead 10 and the sub-lead 20, wherein the windowing width D of the adjacent peripheral areas 40 of the main lead 10 and the sub-lead 20 is 4-8 mil; because the adjacent peripheral area 40 of main lead 10 and sub-lead 20 hinders the welding and also carries out windowing and handles, so make the lead wire keep apart with circuit board green oil, and the hand tears the lead wire in-process, and the lead wire can not receive circuit board green oil influence, can carry out the hand smoothly and tear the lead wire operation.
And carrying out gold plating treatment on the windowed circuit board.
The manufacturing method of the gold finger lead wire has the same beneficial effects as the gold finger lead wire structure, and the details are not repeated herein.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A gold finger lead structure, comprising:
the main lead comprises a first copper layer, a first gold layer and a first solder resist layer, wherein the first copper layer is covered on a circuit board base material, and the first gold layer and the first solder resist layer are both covered on the first copper layer; and
one end of the sub-lead is electrically connected with the golden finger, and the other end of the sub-lead is connected with the first golden layer;
a land disposed between the main lead and the sub-lead, the main lead being connected with the sub-lead through the land; the connection pad includes second copper layer, second gold layer and second solder mask, the second copper layer is used for covering on the circuit board base material, the second gold layer with the second solder mask all covers on the second copper layer, the second gold layer with the sub-lead links to each other, the second solder mask with first solder mask is even as an organic whole.
2. The gold finger lead structure of claim 1 wherein said first layer of gold extends from one end of said first layer of copper over to the other end of said first layer of copper.
3. The gold finger lead structure of claim 2, wherein the first gold layer comprises a first gold layer section and a second gold layer section which are connected, the first gold layer section is used for being connected with the board edge conductor, the width of the first gold layer section is larger than that of the second gold layer section, and the second gold layer section is connected with the sub-lead.
4. The gold finger lead structure of claim 3 wherein the width of said first gold layer segment is adapted to the width of said first copper layer; the length L of the first gold layer section is 5mm to 15 mm.
5. The gold finger lead structure of claim 3 wherein said second gold layer segment is disposed adjacent to said first solder mask layer.
6. The gold finger lead structure of claim 3 wherein the width of the second gold layer segment is 3-9 mil.
7. The golden finger lead structure of claim 1, wherein the second golden layer is annular, and the width of the second golden layer is adapted to the width of the first golden layer; the end of the second gold layer is connected to the first gold layer in a smooth mode, and the end of the sub-lead is connected to the second gold layer in a smooth mode.
8. The golden finger lead structure according to any one of claims 1 to 7, wherein the sub-lead comprises a first lead section and a second lead section, one end of the first lead section is connected with one end of the second lead section, the other end of the first lead section is used for being connected with the golden finger, the other end of the second lead section is connected with the main lead, and the width of the second lead section is larger than that of the first lead section.
9. The gold finger lead structure of claim 8, wherein the first lead segment end is rounded to the second lead segment; the width of the first lead segment is 4-7 mils, and the width of the second lead segment is 6-9 mils.
10. A method for fabricating a gold finger lead structure according to any one of claims 1 to 9, comprising the steps of:
after the resistance welding treatment is carried out on the circuit board with the manufactured outer layer circuit pattern, windowing treatment is carried out on a resistance welding area corresponding to a gold finger, a resistance welding area corresponding to a first gold layer and a resistance welding area corresponding to a sub-lead, meanwhile, windowing treatment is also carried out on adjacent peripheral areas of the main lead and the sub-lead, and the windowing width D of the adjacent peripheral areas of the main lead and the sub-lead is 4-8 mil;
and carrying out gold plating treatment on the windowed circuit board.
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| CN107580411B true CN107580411B (en) | 2019-12-24 |
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| CN109548319B (en) * | 2018-12-28 | 2021-06-25 | 广州兴森快捷电路科技有限公司 | Fingerprint identification carrier plate and manufacturing method for improving flatness of fingerprint identification carrier plate |
| CN111050491B (en) * | 2019-12-19 | 2021-07-20 | 广州兴森快捷电路科技有限公司 | Leadless four-side gold-coating process manufacturing method |
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| CN102045956B (en) * | 2010-12-28 | 2012-09-05 | 深南电路有限公司 | Method for plating gold on equilong connecting fingers |
| EP2860150B1 (en) * | 2013-10-11 | 2021-01-06 | Canon Production Printing Netherlands B.V. | Substrate plate for MEMS devices |
| CN104981097B (en) * | 2014-04-14 | 2018-04-20 | 深南电路有限公司 | The processing method and golden finger circuit board of golden finger |
| CN104411107A (en) * | 2014-11-05 | 2015-03-11 | 深圳恒宝士线路板有限公司 | PCB electrogilding technology |
| CN105960100B (en) * | 2016-06-30 | 2018-06-22 | 广州兴森快捷电路科技有限公司 | A kind of golden finger gold plated lead adding method |
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