CN107567244A - The electric-controlled box and air conditioner of a kind of circuit board assemblies, air conditioner - Google Patents
The electric-controlled box and air conditioner of a kind of circuit board assemblies, air conditioner Download PDFInfo
- Publication number
- CN107567244A CN107567244A CN201710761507.2A CN201710761507A CN107567244A CN 107567244 A CN107567244 A CN 107567244A CN 201710761507 A CN201710761507 A CN 201710761507A CN 107567244 A CN107567244 A CN 107567244A
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- CN
- China
- Prior art keywords
- circuit board
- power component
- metal cooling
- conductive insulating
- board assemblies
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The present invention discloses a kind of circuit board assemblies,The electric-controlled box and air conditioner of air conditioner,Wherein,The circuit board assemblies include circuit board,Power component,Metal cooling board and thermally conductive insulating layer,The power component is on the circuit board,The metal cooling board offers the holding tank of cooling matchmaker cooling line installation,The thermally conductive insulating layer is arranged between the metal cooling board and the power component,The metal cooling board and the power component to be insulated,And the metal cooling board and the power component thermal conductivity are connect,The thermally conductive insulating layer includes at least two layers of heat conductive insulating soft layer,And the heat conduction hard layer between two layers of heat conductive insulating soft layer,The circuit board assemblies can be taken into account efficiently to be radiated to the power component,The power component is insulated again simultaneously,And the structural strength of thermally conductive insulating layer is good and not easily damaged.
Description
Technical field
The present invention relates to air conditioner technical field, more particularly to a kind of circuit board assemblies, the electric-controlled box and sky of air conditioner
Adjust device.
Background technology
The use of convertible frequency air-conditioner is more and more extensive at present, and the popularization of particularly high-power frequency conversion air-conditioning is more and more wider, still
The power component of convertible frequency air-conditioner such as IGBT device (English full name:Insulated Gate Bipolar Transistor,
Chinese:Insulated gate bipolar transistor) and diode etc. due to the limitation of technique, be all to use at present to reliably radiate
Nonisulated design, thus brings a stubborn problem, because power component is all to carry high pressure at work,
It is again simultaneously to be operated in high current pattern, heating is very severe, so having to reliably be radiated, takes into account again reliable
Insulation.
The content of the invention
The main object of the present invention is to propose a kind of circuit board assemblies, the electric-controlled box and air conditioner of air conditioner, it is intended to energy
It is enough that power component is preferably cooled down, while ensure again and power component is preferably insulated.
To achieve the above object, the present invention provides a kind of circuit board assemblies, for the electric-controlled box of air conditioner, the circuit board
Component includes:
Circuit board;
Power component, on the circuit board;
Metal cooling board, on the power component, the metal cooling board offers cooling matchmaker cooling line peace
The holding tank of dress;And
Thermally conductive insulating layer, it is arranged between the metal cooling board and the power component, to the metal is cold
But plate and power component insulation, and the metal cooling board and the power component thermal conductivity are connect, the heat conduction is exhausted
Edge layer includes at least two layers of heat conductive insulating soft layer and the heat conduction hard between two layers of heat conductive insulating soft layer
Layer.
Preferably, the material of the heat conductive insulating soft layer is heat conductive silica gel or heat-conducting silicone grease.
Preferably, the material of the heat conduction hard layer is metal.
Preferably, the material of the metal cooling board is aluminium.
Preferably, a surface of the metal cooling board back to the circuit board offers a plurality of holding tank.
Preferably, the metal cooling board is provided with mounting groove back to a surface of circuit board, is provided with the mounting groove exhausted
Edge block;
The circuit board assemblies also include the first spiro connecting piece, and first spiro connecting piece passes through the collets and the heat conduction
Insulating barrier connects with the power component.
Preferably, the metal cooling board is respectively equipped with the installation back to two surfaces in face of the circuit board
Groove, the mounting groove on described two surfaces is in being oppositely arranged and the collets being equipped with it, to form a pair of collets
First spiro connecting piece passes through the pair of collets, connects with the thermally conductive insulating layer and the power component
Connect.
Preferably, the material of the collets is ceramics.
Preferably, the collets are spirally connected by the second spiro connecting piece is fixed to the bottom wall of the mounting groove.
Preferably, the circuit board is provided with insulating mounting frame, and the power component is located at the insulating mounting inframe,
The insulating mounting inframe is also equipped with multiple control chips;
The metal cooling board is on the insulating mounting frame.
Preferably, the power component includes at least one of IGBT device and diode.
The present invention also provides a kind of electric-controlled box of air conditioner, including box body and the circuit board assemblies in the box body,
The circuit board assemblies include:
Circuit board;
Power component, on the circuit board;
Metal cooling board, on the power component, the metal cooling board offers cooling matchmaker cooling line peace
The holding tank of dress;And
Thermally conductive insulating layer, it is arranged between the metal cooling board and the power component, to the metal is cold
But plate and power component insulation, and the metal cooling board and the power component thermal conductivity are connect, the heat conduction is exhausted
Edge layer includes at least two layers of heat conductive insulating soft layer and the heat conduction hard between two layers of heat conductive insulating soft layer
Layer.
The present invention provides a kind of air conditioner again, including:
The electric-controlled box of air conditioner, the electric-controlled box of the air conditioner include box body and the circuit board group in the box body
Part, the circuit board assemblies include circuit board, power component, metal cooling board and thermally conductive insulating layer;The power member device
Part is on the circuit board, and the metal cooling board is on the power component, and the metal cooling board offers
The holding tank of cooling matchmaker cooling line installation, the thermally conductive insulating layer are arranged on the metal cooling board and the power component
Between, the metal cooling board and the power component to be insulated, and the metal cooling board and the power is first
Device thermal conductivity connects, and the thermally conductive insulating layer includes at least two layers of heat conductive insulating soft layer and positioned at two layers of heat conductive insulating
Heat conduction hard layer between soft layer;And
The refrigerant cooling line, is connected in the refrigerant pipeline system of the air conditioner, the refrigerant cooling tube appearance of a street
It is located at the holding tank.
In technical scheme provided by the invention, refrigerant cooling line passes through metal cooling board and thermally conductive insulating layer and the work(
Rate component thermal connects, and efficiently to be cooled down to the power component, while the thermally conductive insulating layer can be by the work(
Rate component insulate with the metal cooling board, the power component is efficiently radiated it is thus possible to take into account, simultaneously
Again the power component is insulated, also, the thermally conductive insulating layer include at least two layers of heat conductive insulating soft layer and
Heat conduction hard layer between two layers of heat conductive insulating soft layer, it is hard that the heat conduction hard layer can be pointed to the heat conduction
Heat conductive insulating soft layer between matter layer and the metal cooling board is protected and avoids it impaired.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is the required accompanying drawing used in technology description to be briefly described, it should be apparent that, drawings in the following description are only this
Some embodiments of invention, for those of ordinary skill in the art, on the premise of not paying creative work, can be with
Structure according to these accompanying drawings obtains other accompanying drawings.
Fig. 1 is the perspective exploded view of an embodiment of circuit board assemblies provided by the invention;
Fig. 2 is the combination diagram for the circuit board assemblies that Fig. 1 is provided;
Fig. 3 is Fig. 2 schematic cross-sectional view.
Drawing reference numeral explanation:
Label | Title | Label | Title |
100 | Circuit board assemblies | 41 | Heat conductive insulating soft layer |
1 | Circuit board | 42 | Heat conduction hard layer |
2 | Power component | 5 | Collets |
3 | Metal cooling board | 6 | First spiro connecting piece |
31 | Holding tank | 7 | Second spiro connecting piece |
32 | Mounting groove | 8 | Insulating mounting frame |
4 | Thermally conductive insulating layer |
The realization, functional characteristics and advantage of the object of the invention will be described further referring to the drawings in conjunction with the embodiments.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only the part of the embodiment of the present invention, rather than whole embodiments.Base
Embodiment in the present invention, those of ordinary skill in the art obtained under the premise of creative work is not made it is all its
His embodiment, belongs to the scope of protection of the invention.
If it is to be appreciated that related in the embodiment of the present invention directionality instruction (such as up, down, left, right, before and after ...),
Then directionality instruction be only used for explaining relative position relation under a certain particular pose (as shown in drawings) between each part,
Motion conditions etc., if the particular pose changes, directionality instruction also correspondingly changes therewith.
If in addition, relating to the description of " first ", " second " etc. in the embodiment of the present invention, " first ", " second " etc. are somebody's turn to do
Description be only used for describing purpose, and it is not intended that instruction or implying its relative importance or implicit indicating indicated skill
The quantity of art feature.Thus, " first " is defined, the feature of " second " can be expressed or implicitly includes at least one spy
Sign.In addition, the technical scheme between each embodiment can be combined with each other, but must be with those of ordinary skill in the art's energy
Based on enough realizations, the knot of this technical scheme is will be understood that when the combination appearance of technical scheme is conflicting or can not realize
Conjunction is not present, also not within the protection domain of application claims.
The present invention provides a kind of air conditioner, and in particular transducer air conditioning, air conditioner includes the electric-controlled box of air conditioner, air-conditioning
The electric-controlled box of device includes box body and the circuit board assemblies in the box body, the power component as transducer air conditioning
(including at least one of IGBT device, diode etc.) is all adopted at present due to the limitation of technique in order to reliably radiate
A metallic heat radiating plate is provided with the outer face of nonisulated design, such as IGBT device, by the power component
The heat derives of inner member, cooling and insulation accordingly, for power component are particularly important.
In consideration of it, the present invention provides a kind of circuit board assemblies, Fig. 1 to Fig. 3 is the one of circuit board assemblies provided by the invention
Embodiment, refers to Fig. 1 to Fig. 3, the circuit board assemblies 100 include circuit board 1, power component 2, metal cooling board 3 with
And thermally conductive insulating layer 4.
The power component 2 specifically, other electronics is additionally provided with the circuit board 1 on the circuit board 1
Device such as electric capacity, resistance and some control chips etc..
The metal cooling board 3 offers cooling matchmaker cooling line, and (the refrigerant cooling line is connected to the cold of air conditioner
In matchmaker's pipe-line system) holding tank 31 of installation, the metal cooling board 3 is on the circuit board 1, and positioned at power member
On device 2, specifically, the circuit board 1 is provided with insulating mounting frame 8, and the power component 2 is located at the insulating mounting frame
In 8, multiple control chips are also equipped with the insulating mounting frame 8, the metal cooling board 3 is located at the insulating mounting frame 8
On.
The thermally conductive insulating layer 4 is arranged between the metal cooling board 3 and the power component 2, to by described in
Metal cooling board 3 and the power component 2 are insulated, and the metal cooling board 3 and the thermal conductivity of the power component 2 are connect,
The thermally conductive insulating layer 4 includes at least two layers of heat conductive insulating soft layer 41 and positioned at two layers of heat conductive insulating soft layer 41
Between heat conduction hard layer 42.
In technical scheme provided by the invention, refrigerant cooling line by metal cooling board 3 and thermally conductive insulating layer 4 with it is described
The thermal conductivity of power component 2 connects, and efficiently to be cooled down to the power component 2, while the thermally conductive insulating layer 4 can be by institute
State power component 2 to insulate with the metal cooling board 3, the power component 2 is efficiently dissipated it is thus possible to take into account
Heat, while the power component 2 is insulated again.
Also, the thermally conductive insulating layer 4 includes at least two layers of heat conductive insulating soft layer 41 and positioned at two layers of the heat conduction
Heat conduction hard layer 42 between insulation soft layer 41, the effect of the heat conduction hard layer 42 are to play to protect the heat conductive insulating soft
The effect of matter layer 41, the especially heat conduction of the protection between the heat conduction hard layer 42 and the metal cooling board 3 are exhausted
Edge soft layer 41, according to the heat conductive insulating soft layer of the individual layer of routine, the heat conductive insulating soft layer of the individual layer is easily by hard
Structure, such as structure on circuit board 1 damages and damaged, and then can influence insulating properties, in the present embodiment, positioned at institute
The heat conductive insulating soft layer 41 between heat conduction hard layer 42 and the metal cooling board 3 is stated, it is hard to be protected in the heat conduction
Between matter layer 42 and the metal cooling board 3, and be not easy by extraneous adamant breakage.
The metal cooling board 3 is the preferable metal material of heat conductivility, for example, copper, iron, aluminium etc., in the present embodiment
In, the material of the metal cooling board 3 is aluminium, because aluminium has the advantages that light, cheap and thermal conductivity factor is high.
The one side of heat conductive insulating soft layer 41 plays a part of heat conduction, also will the metal cooling board 3 and described
The thermal conductivity of power component 2 connects, and on the other hand plays a part of insulation, also will the power component 2 and metal cooling
Plate 3 insulate, and the material of the heat conductive insulating soft layer 41 is heat conductive silica gel or heat-conducting silicone grease, it is clear that the heat conductive insulating soft layer
41 can also use other materials.
The heat conduction hard layer 42 necessarily requires have enough intensity, is at least required to heat conduction in addition, therefore, at this
In embodiment, the material of the heat conduction hard layer 42 is metal, for example, copper, iron, aluminium etc..
In the present embodiment, a surface of the metal cooling board 3 back to the circuit board 1 offers a plurality of receiving
Groove 31, can be installed with for more refrigerant cooling tubes or a refrigerant cooling tube is installed with back and forth, and then can improve metal
Heat exchange area between coldplate 3 and the refrigerant cooling tube, and improve cooling effect.
In the present embodiment, the metal cooling board 3 is provided with mounting groove 32, the installation back to a surface of circuit board 1
Collets 5 are provided with groove 32, the circuit board assemblies 100 also include the first spiro connecting piece 6, and first spiro connecting piece passes through described exhausted
Edge block 5 is connected with the thermally conductive insulating layer 4 and the power component 2, the collets 5 avoid the power component 2 with
The metal cooling board 3 is connected by first spiro connecting piece 6.
Further, in the present embodiment, the metal cooling board 3 back to in face of two surfaces of the circuit board 1
The mounting groove 32 is respectively equipped with, the mounting groove 32 on described two surfaces is in be oppositely arranged and the collets 5 are equipped with it,
To form a pair of collets 5;First spiro connecting piece 6 passes through a pair of collets 5, with the thermally conductive insulating layer 4 and
The power component 2 connects.So as to which two collets 5 can lift the power component 2 and be cooled down with the metal
Insulating properties between plate 3.
The material of the collets 5 be can be, but not limited to as ceramics, it is clear that other insulating materials are also suitable.
In the present embodiment, the collets 5 are spirally connected by the second spiro connecting piece 7 is fixed to the bottom wall of the mounting groove 32,
Obviously, the design not limited to this, can also be that holding is consolidated between the mounting groove 32 of the collets 5 and the metal cooling board 3
Fixed, viscose glue fixation etc..
The preferred embodiments of the present invention are these are only, are not intended to limit the scope of the invention, it is every to utilize this hair
The equivalent structure or equivalent flow conversion that bright specification and accompanying drawing content are made, or directly or indirectly it is used in other related skills
Art field is included in the scope of patent protection of the present invention.
Claims (13)
1. a kind of circuit board assemblies, the electric-controlled box for air conditioner, it is characterised in that the circuit board assemblies include:
Circuit board;
Power component, on the circuit board;
Metal cooling board, on the power component, the metal cooling board offers the installation of cooling matchmaker cooling line
Holding tank;And
Thermally conductive insulating layer, it is arranged between the metal cooling board and the power component, to by the metal cooling board
Insulate, and the metal cooling board and the power component thermal conductivity are connect, the thermally conductive insulating layer with the power component
Including at least two layers of heat conductive insulating soft layer and the heat conduction hard layer between two layers of heat conductive insulating soft layer.
2. circuit board assemblies according to claim 1, it is characterised in that the material of the heat conductive insulating soft layer is heat conduction
Silica gel or heat-conducting silicone grease.
3. circuit board assemblies according to claim 1, it is characterised in that the material of the heat conduction hard layer is metal.
4. circuit board assemblies according to claim 1, it is characterised in that the material of the metal cooling board is aluminium.
5. circuit board assemblies according to claim 1, it is characterised in that the metal cooling board is back to the circuit board
One surface offers a plurality of holding tank.
6. circuit board assemblies according to claim 1 a, it is characterised in that table of the metal cooling board back to circuit board
Face is provided with mounting groove, and collets are provided with the mounting groove;
The circuit board assemblies also include the first spiro connecting piece, and first spiro connecting piece passes through the collets and the heat conductive insulating
Layer connects with the power component.
7. circuit board assemblies according to claim 6, it is characterised in that the metal cooling board back to in face of the electricity
Two surfaces of road plate are respectively equipped with the mounting groove, and the mounting groove on described two surfaces is in be oppositely arranged and be all provided with it
Collets are stated, to form a pair of collets
First spiro connecting piece passes through the pair of collets, is connected with the thermally conductive insulating layer and the power component.
8. the circuit board assemblies according to claim 6 or 7, it is characterised in that the material of the collets is ceramics.
9. the circuit board assemblies according to claim 6 or 7, it is characterised in that the collets pass through the second spiro connecting piece spiral shell
Connect the bottom wall for being fixed to the mounting groove.
10. circuit board assemblies according to claim 1, it is characterised in that the circuit board is provided with insulating mounting frame, institute
State power component and be located at the insulating mounting inframe, the insulating mounting inframe is also equipped with multiple control chips;
The metal cooling board is on the insulating mounting frame.
11. circuit board assemblies according to claim 1, it is characterised in that the power component include IGBT device and
At least one of diode.
12. a kind of electric-controlled box of air conditioner, it is characterised in that the circuit board assemblies including box body and in the box body, institute
Circuit board assemblies are stated as the circuit board assemblies as described in claim 1 to 11 any one.
A kind of 13. air conditioner, it is characterised in that including:
The electric-controlled box of air conditioner as claimed in claim 12;And
Refrigerant cooling line, it is connected in the refrigerant pipeline system of the air conditioner, the refrigerant cooling line is installed with described
Holding tank.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201710761507.2A CN107567244A (en) | 2017-08-29 | 2017-08-29 | The electric-controlled box and air conditioner of a kind of circuit board assemblies, air conditioner |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201710761507.2A CN107567244A (en) | 2017-08-29 | 2017-08-29 | The electric-controlled box and air conditioner of a kind of circuit board assemblies, air conditioner |
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Publication Number | Publication Date |
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CN107567244A true CN107567244A (en) | 2018-01-09 |
Family
ID=60977759
Family Applications (1)
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CN201710761507.2A Pending CN107567244A (en) | 2017-08-29 | 2017-08-29 | The electric-controlled box and air conditioner of a kind of circuit board assemblies, air conditioner |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110779105A (en) * | 2019-10-22 | 2020-02-11 | 四川长虹空调有限公司 | Waterproof assembly process for electric control box |
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