CN107567244A - The electric-controlled box and air conditioner of a kind of circuit board assemblies, air conditioner - Google Patents

The electric-controlled box and air conditioner of a kind of circuit board assemblies, air conditioner Download PDF

Info

Publication number
CN107567244A
CN107567244A CN201710761507.2A CN201710761507A CN107567244A CN 107567244 A CN107567244 A CN 107567244A CN 201710761507 A CN201710761507 A CN 201710761507A CN 107567244 A CN107567244 A CN 107567244A
Authority
CN
China
Prior art keywords
circuit board
power component
metal cooling
conductive insulating
board assemblies
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201710761507.2A
Other languages
Chinese (zh)
Inventor
鲍殿生
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GD Midea Air Conditioning Equipment Co Ltd
Original Assignee
Guangdong Midea Refrigeration Equipment Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Guangdong Midea Refrigeration Equipment Co Ltd filed Critical Guangdong Midea Refrigeration Equipment Co Ltd
Priority to CN201710761507.2A priority Critical patent/CN107567244A/en
Publication of CN107567244A publication Critical patent/CN107567244A/en
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The present invention discloses a kind of circuit board assemblies,The electric-controlled box and air conditioner of air conditioner,Wherein,The circuit board assemblies include circuit board,Power component,Metal cooling board and thermally conductive insulating layer,The power component is on the circuit board,The metal cooling board offers the holding tank of cooling matchmaker cooling line installation,The thermally conductive insulating layer is arranged between the metal cooling board and the power component,The metal cooling board and the power component to be insulated,And the metal cooling board and the power component thermal conductivity are connect,The thermally conductive insulating layer includes at least two layers of heat conductive insulating soft layer,And the heat conduction hard layer between two layers of heat conductive insulating soft layer,The circuit board assemblies can be taken into account efficiently to be radiated to the power component,The power component is insulated again simultaneously,And the structural strength of thermally conductive insulating layer is good and not easily damaged.

Description

The electric-controlled box and air conditioner of a kind of circuit board assemblies, air conditioner
Technical field
The present invention relates to air conditioner technical field, more particularly to a kind of circuit board assemblies, the electric-controlled box and sky of air conditioner Adjust device.
Background technology
The use of convertible frequency air-conditioner is more and more extensive at present, and the popularization of particularly high-power frequency conversion air-conditioning is more and more wider, still The power component of convertible frequency air-conditioner such as IGBT device (English full name:Insulated Gate Bipolar Transistor, Chinese:Insulated gate bipolar transistor) and diode etc. due to the limitation of technique, be all to use at present to reliably radiate Nonisulated design, thus brings a stubborn problem, because power component is all to carry high pressure at work, It is again simultaneously to be operated in high current pattern, heating is very severe, so having to reliably be radiated, takes into account again reliable Insulation.
The content of the invention
The main object of the present invention is to propose a kind of circuit board assemblies, the electric-controlled box and air conditioner of air conditioner, it is intended to energy It is enough that power component is preferably cooled down, while ensure again and power component is preferably insulated.
To achieve the above object, the present invention provides a kind of circuit board assemblies, for the electric-controlled box of air conditioner, the circuit board Component includes:
Circuit board;
Power component, on the circuit board;
Metal cooling board, on the power component, the metal cooling board offers cooling matchmaker cooling line peace The holding tank of dress;And
Thermally conductive insulating layer, it is arranged between the metal cooling board and the power component, to the metal is cold But plate and power component insulation, and the metal cooling board and the power component thermal conductivity are connect, the heat conduction is exhausted Edge layer includes at least two layers of heat conductive insulating soft layer and the heat conduction hard between two layers of heat conductive insulating soft layer Layer.
Preferably, the material of the heat conductive insulating soft layer is heat conductive silica gel or heat-conducting silicone grease.
Preferably, the material of the heat conduction hard layer is metal.
Preferably, the material of the metal cooling board is aluminium.
Preferably, a surface of the metal cooling board back to the circuit board offers a plurality of holding tank.
Preferably, the metal cooling board is provided with mounting groove back to a surface of circuit board, is provided with the mounting groove exhausted Edge block;
The circuit board assemblies also include the first spiro connecting piece, and first spiro connecting piece passes through the collets and the heat conduction Insulating barrier connects with the power component.
Preferably, the metal cooling board is respectively equipped with the installation back to two surfaces in face of the circuit board Groove, the mounting groove on described two surfaces is in being oppositely arranged and the collets being equipped with it, to form a pair of collets
First spiro connecting piece passes through the pair of collets, connects with the thermally conductive insulating layer and the power component Connect.
Preferably, the material of the collets is ceramics.
Preferably, the collets are spirally connected by the second spiro connecting piece is fixed to the bottom wall of the mounting groove.
Preferably, the circuit board is provided with insulating mounting frame, and the power component is located at the insulating mounting inframe, The insulating mounting inframe is also equipped with multiple control chips;
The metal cooling board is on the insulating mounting frame.
Preferably, the power component includes at least one of IGBT device and diode.
The present invention also provides a kind of electric-controlled box of air conditioner, including box body and the circuit board assemblies in the box body, The circuit board assemblies include:
Circuit board;
Power component, on the circuit board;
Metal cooling board, on the power component, the metal cooling board offers cooling matchmaker cooling line peace The holding tank of dress;And
Thermally conductive insulating layer, it is arranged between the metal cooling board and the power component, to the metal is cold But plate and power component insulation, and the metal cooling board and the power component thermal conductivity are connect, the heat conduction is exhausted Edge layer includes at least two layers of heat conductive insulating soft layer and the heat conduction hard between two layers of heat conductive insulating soft layer Layer.
The present invention provides a kind of air conditioner again, including:
The electric-controlled box of air conditioner, the electric-controlled box of the air conditioner include box body and the circuit board group in the box body Part, the circuit board assemblies include circuit board, power component, metal cooling board and thermally conductive insulating layer;The power member device Part is on the circuit board, and the metal cooling board is on the power component, and the metal cooling board offers The holding tank of cooling matchmaker cooling line installation, the thermally conductive insulating layer are arranged on the metal cooling board and the power component Between, the metal cooling board and the power component to be insulated, and the metal cooling board and the power is first Device thermal conductivity connects, and the thermally conductive insulating layer includes at least two layers of heat conductive insulating soft layer and positioned at two layers of heat conductive insulating Heat conduction hard layer between soft layer;And
The refrigerant cooling line, is connected in the refrigerant pipeline system of the air conditioner, the refrigerant cooling tube appearance of a street It is located at the holding tank.
In technical scheme provided by the invention, refrigerant cooling line passes through metal cooling board and thermally conductive insulating layer and the work( Rate component thermal connects, and efficiently to be cooled down to the power component, while the thermally conductive insulating layer can be by the work( Rate component insulate with the metal cooling board, the power component is efficiently radiated it is thus possible to take into account, simultaneously Again the power component is insulated, also, the thermally conductive insulating layer include at least two layers of heat conductive insulating soft layer and Heat conduction hard layer between two layers of heat conductive insulating soft layer, it is hard that the heat conduction hard layer can be pointed to the heat conduction Heat conductive insulating soft layer between matter layer and the metal cooling board is protected and avoids it impaired.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing There is the required accompanying drawing used in technology description to be briefly described, it should be apparent that, drawings in the following description are only this Some embodiments of invention, for those of ordinary skill in the art, on the premise of not paying creative work, can be with Structure according to these accompanying drawings obtains other accompanying drawings.
Fig. 1 is the perspective exploded view of an embodiment of circuit board assemblies provided by the invention;
Fig. 2 is the combination diagram for the circuit board assemblies that Fig. 1 is provided;
Fig. 3 is Fig. 2 schematic cross-sectional view.
Drawing reference numeral explanation:
Label Title Label Title
100 Circuit board assemblies 41 Heat conductive insulating soft layer
1 Circuit board 42 Heat conduction hard layer
2 Power component 5 Collets
3 Metal cooling board 6 First spiro connecting piece
31 Holding tank 7 Second spiro connecting piece
32 Mounting groove 8 Insulating mounting frame
4 Thermally conductive insulating layer
The realization, functional characteristics and advantage of the object of the invention will be described further referring to the drawings in conjunction with the embodiments.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete Site preparation describes, it is clear that described embodiment is only the part of the embodiment of the present invention, rather than whole embodiments.Base Embodiment in the present invention, those of ordinary skill in the art obtained under the premise of creative work is not made it is all its His embodiment, belongs to the scope of protection of the invention.
If it is to be appreciated that related in the embodiment of the present invention directionality instruction (such as up, down, left, right, before and after ...), Then directionality instruction be only used for explaining relative position relation under a certain particular pose (as shown in drawings) between each part, Motion conditions etc., if the particular pose changes, directionality instruction also correspondingly changes therewith.
If in addition, relating to the description of " first ", " second " etc. in the embodiment of the present invention, " first ", " second " etc. are somebody's turn to do Description be only used for describing purpose, and it is not intended that instruction or implying its relative importance or implicit indicating indicated skill The quantity of art feature.Thus, " first " is defined, the feature of " second " can be expressed or implicitly includes at least one spy Sign.In addition, the technical scheme between each embodiment can be combined with each other, but must be with those of ordinary skill in the art's energy Based on enough realizations, the knot of this technical scheme is will be understood that when the combination appearance of technical scheme is conflicting or can not realize Conjunction is not present, also not within the protection domain of application claims.
The present invention provides a kind of air conditioner, and in particular transducer air conditioning, air conditioner includes the electric-controlled box of air conditioner, air-conditioning The electric-controlled box of device includes box body and the circuit board assemblies in the box body, the power component as transducer air conditioning (including at least one of IGBT device, diode etc.) is all adopted at present due to the limitation of technique in order to reliably radiate A metallic heat radiating plate is provided with the outer face of nonisulated design, such as IGBT device, by the power component The heat derives of inner member, cooling and insulation accordingly, for power component are particularly important.
In consideration of it, the present invention provides a kind of circuit board assemblies, Fig. 1 to Fig. 3 is the one of circuit board assemblies provided by the invention Embodiment, refers to Fig. 1 to Fig. 3, the circuit board assemblies 100 include circuit board 1, power component 2, metal cooling board 3 with And thermally conductive insulating layer 4.
The power component 2 specifically, other electronics is additionally provided with the circuit board 1 on the circuit board 1 Device such as electric capacity, resistance and some control chips etc..
The metal cooling board 3 offers cooling matchmaker cooling line, and (the refrigerant cooling line is connected to the cold of air conditioner In matchmaker's pipe-line system) holding tank 31 of installation, the metal cooling board 3 is on the circuit board 1, and positioned at power member On device 2, specifically, the circuit board 1 is provided with insulating mounting frame 8, and the power component 2 is located at the insulating mounting frame In 8, multiple control chips are also equipped with the insulating mounting frame 8, the metal cooling board 3 is located at the insulating mounting frame 8 On.
The thermally conductive insulating layer 4 is arranged between the metal cooling board 3 and the power component 2, to by described in Metal cooling board 3 and the power component 2 are insulated, and the metal cooling board 3 and the thermal conductivity of the power component 2 are connect, The thermally conductive insulating layer 4 includes at least two layers of heat conductive insulating soft layer 41 and positioned at two layers of heat conductive insulating soft layer 41 Between heat conduction hard layer 42.
In technical scheme provided by the invention, refrigerant cooling line by metal cooling board 3 and thermally conductive insulating layer 4 with it is described The thermal conductivity of power component 2 connects, and efficiently to be cooled down to the power component 2, while the thermally conductive insulating layer 4 can be by institute State power component 2 to insulate with the metal cooling board 3, the power component 2 is efficiently dissipated it is thus possible to take into account Heat, while the power component 2 is insulated again.
Also, the thermally conductive insulating layer 4 includes at least two layers of heat conductive insulating soft layer 41 and positioned at two layers of the heat conduction Heat conduction hard layer 42 between insulation soft layer 41, the effect of the heat conduction hard layer 42 are to play to protect the heat conductive insulating soft The effect of matter layer 41, the especially heat conduction of the protection between the heat conduction hard layer 42 and the metal cooling board 3 are exhausted Edge soft layer 41, according to the heat conductive insulating soft layer of the individual layer of routine, the heat conductive insulating soft layer of the individual layer is easily by hard Structure, such as structure on circuit board 1 damages and damaged, and then can influence insulating properties, in the present embodiment, positioned at institute The heat conductive insulating soft layer 41 between heat conduction hard layer 42 and the metal cooling board 3 is stated, it is hard to be protected in the heat conduction Between matter layer 42 and the metal cooling board 3, and be not easy by extraneous adamant breakage.
The metal cooling board 3 is the preferable metal material of heat conductivility, for example, copper, iron, aluminium etc., in the present embodiment In, the material of the metal cooling board 3 is aluminium, because aluminium has the advantages that light, cheap and thermal conductivity factor is high.
The one side of heat conductive insulating soft layer 41 plays a part of heat conduction, also will the metal cooling board 3 and described The thermal conductivity of power component 2 connects, and on the other hand plays a part of insulation, also will the power component 2 and metal cooling Plate 3 insulate, and the material of the heat conductive insulating soft layer 41 is heat conductive silica gel or heat-conducting silicone grease, it is clear that the heat conductive insulating soft layer 41 can also use other materials.
The heat conduction hard layer 42 necessarily requires have enough intensity, is at least required to heat conduction in addition, therefore, at this In embodiment, the material of the heat conduction hard layer 42 is metal, for example, copper, iron, aluminium etc..
In the present embodiment, a surface of the metal cooling board 3 back to the circuit board 1 offers a plurality of receiving Groove 31, can be installed with for more refrigerant cooling tubes or a refrigerant cooling tube is installed with back and forth, and then can improve metal Heat exchange area between coldplate 3 and the refrigerant cooling tube, and improve cooling effect.
In the present embodiment, the metal cooling board 3 is provided with mounting groove 32, the installation back to a surface of circuit board 1 Collets 5 are provided with groove 32, the circuit board assemblies 100 also include the first spiro connecting piece 6, and first spiro connecting piece passes through described exhausted Edge block 5 is connected with the thermally conductive insulating layer 4 and the power component 2, the collets 5 avoid the power component 2 with The metal cooling board 3 is connected by first spiro connecting piece 6.
Further, in the present embodiment, the metal cooling board 3 back to in face of two surfaces of the circuit board 1 The mounting groove 32 is respectively equipped with, the mounting groove 32 on described two surfaces is in be oppositely arranged and the collets 5 are equipped with it, To form a pair of collets 5;First spiro connecting piece 6 passes through a pair of collets 5, with the thermally conductive insulating layer 4 and The power component 2 connects.So as to which two collets 5 can lift the power component 2 and be cooled down with the metal Insulating properties between plate 3.
The material of the collets 5 be can be, but not limited to as ceramics, it is clear that other insulating materials are also suitable.
In the present embodiment, the collets 5 are spirally connected by the second spiro connecting piece 7 is fixed to the bottom wall of the mounting groove 32, Obviously, the design not limited to this, can also be that holding is consolidated between the mounting groove 32 of the collets 5 and the metal cooling board 3 Fixed, viscose glue fixation etc..
The preferred embodiments of the present invention are these are only, are not intended to limit the scope of the invention, it is every to utilize this hair The equivalent structure or equivalent flow conversion that bright specification and accompanying drawing content are made, or directly or indirectly it is used in other related skills Art field is included in the scope of patent protection of the present invention.

Claims (13)

1. a kind of circuit board assemblies, the electric-controlled box for air conditioner, it is characterised in that the circuit board assemblies include:
Circuit board;
Power component, on the circuit board;
Metal cooling board, on the power component, the metal cooling board offers the installation of cooling matchmaker cooling line Holding tank;And
Thermally conductive insulating layer, it is arranged between the metal cooling board and the power component, to by the metal cooling board Insulate, and the metal cooling board and the power component thermal conductivity are connect, the thermally conductive insulating layer with the power component Including at least two layers of heat conductive insulating soft layer and the heat conduction hard layer between two layers of heat conductive insulating soft layer.
2. circuit board assemblies according to claim 1, it is characterised in that the material of the heat conductive insulating soft layer is heat conduction Silica gel or heat-conducting silicone grease.
3. circuit board assemblies according to claim 1, it is characterised in that the material of the heat conduction hard layer is metal.
4. circuit board assemblies according to claim 1, it is characterised in that the material of the metal cooling board is aluminium.
5. circuit board assemblies according to claim 1, it is characterised in that the metal cooling board is back to the circuit board One surface offers a plurality of holding tank.
6. circuit board assemblies according to claim 1 a, it is characterised in that table of the metal cooling board back to circuit board Face is provided with mounting groove, and collets are provided with the mounting groove;
The circuit board assemblies also include the first spiro connecting piece, and first spiro connecting piece passes through the collets and the heat conductive insulating Layer connects with the power component.
7. circuit board assemblies according to claim 6, it is characterised in that the metal cooling board back to in face of the electricity Two surfaces of road plate are respectively equipped with the mounting groove, and the mounting groove on described two surfaces is in be oppositely arranged and be all provided with it Collets are stated, to form a pair of collets
First spiro connecting piece passes through the pair of collets, is connected with the thermally conductive insulating layer and the power component.
8. the circuit board assemblies according to claim 6 or 7, it is characterised in that the material of the collets is ceramics.
9. the circuit board assemblies according to claim 6 or 7, it is characterised in that the collets pass through the second spiro connecting piece spiral shell Connect the bottom wall for being fixed to the mounting groove.
10. circuit board assemblies according to claim 1, it is characterised in that the circuit board is provided with insulating mounting frame, institute State power component and be located at the insulating mounting inframe, the insulating mounting inframe is also equipped with multiple control chips;
The metal cooling board is on the insulating mounting frame.
11. circuit board assemblies according to claim 1, it is characterised in that the power component include IGBT device and At least one of diode.
12. a kind of electric-controlled box of air conditioner, it is characterised in that the circuit board assemblies including box body and in the box body, institute Circuit board assemblies are stated as the circuit board assemblies as described in claim 1 to 11 any one.
A kind of 13. air conditioner, it is characterised in that including:
The electric-controlled box of air conditioner as claimed in claim 12;And
Refrigerant cooling line, it is connected in the refrigerant pipeline system of the air conditioner, the refrigerant cooling line is installed with described Holding tank.
CN201710761507.2A 2017-08-29 2017-08-29 The electric-controlled box and air conditioner of a kind of circuit board assemblies, air conditioner Pending CN107567244A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201710761507.2A CN107567244A (en) 2017-08-29 2017-08-29 The electric-controlled box and air conditioner of a kind of circuit board assemblies, air conditioner

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201710761507.2A CN107567244A (en) 2017-08-29 2017-08-29 The electric-controlled box and air conditioner of a kind of circuit board assemblies, air conditioner

Publications (1)

Publication Number Publication Date
CN107567244A true CN107567244A (en) 2018-01-09

Family

ID=60977759

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710761507.2A Pending CN107567244A (en) 2017-08-29 2017-08-29 The electric-controlled box and air conditioner of a kind of circuit board assemblies, air conditioner

Country Status (1)

Country Link
CN (1) CN107567244A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110779105A (en) * 2019-10-22 2020-02-11 四川长虹空调有限公司 Waterproof assembly process for electric control box

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101155498A (en) * 2006-09-29 2008-04-02 台达电子工业股份有限公司 Combination structure of electronic component and heat radiating device
JP2008101862A (en) * 2006-10-20 2008-05-01 Daikin Ind Ltd Electrical equipment box
CN101373744A (en) * 2007-08-24 2009-02-25 奇美电子股份有限公司 Chip module and display apparatus with the same
CN201541362U (en) * 2009-05-15 2010-08-04 宋光� Power supply structure for high-power LED lamp
US20100321895A1 (en) * 2009-06-17 2010-12-23 Laird Technologies, Inc. Memory modules including compliant multilayered thermally-conductive interface assemblies
CN201733387U (en) * 2010-07-13 2011-02-02 深圳Tcl新技术有限公司 Liquid crystal screen machine core plate heat radiation module group
CN102412214A (en) * 2010-09-25 2012-04-11 台达电子工业股份有限公司 Combination structure of electronic component and heat dissipation device, and insulation component thereof
CN202189775U (en) * 2011-08-23 2012-04-11 山亿新能源股份有限公司 Solar energy transistor radiating fixing structure
CN203912441U (en) * 2014-06-12 2014-10-29 东莞市万丰纳米材料有限公司 Composite heat conduction material
CN104219932A (en) * 2013-06-03 2014-12-17 联想(北京)有限公司 Electronic equipment
CN204084659U (en) * 2014-06-19 2015-01-07 美的集团武汉制冷设备有限公司 Air-conditioning electric control box, air-conditioner outdoor unit and air-conditioning system
CN207099540U (en) * 2017-08-29 2018-03-13 广东美的制冷设备有限公司 The electric-controlled box and air conditioner of a kind of circuit board assemblies, air conditioner

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101155498A (en) * 2006-09-29 2008-04-02 台达电子工业股份有限公司 Combination structure of electronic component and heat radiating device
JP2008101862A (en) * 2006-10-20 2008-05-01 Daikin Ind Ltd Electrical equipment box
CN101373744A (en) * 2007-08-24 2009-02-25 奇美电子股份有限公司 Chip module and display apparatus with the same
CN201541362U (en) * 2009-05-15 2010-08-04 宋光� Power supply structure for high-power LED lamp
US20100321895A1 (en) * 2009-06-17 2010-12-23 Laird Technologies, Inc. Memory modules including compliant multilayered thermally-conductive interface assemblies
CN201733387U (en) * 2010-07-13 2011-02-02 深圳Tcl新技术有限公司 Liquid crystal screen machine core plate heat radiation module group
CN102412214A (en) * 2010-09-25 2012-04-11 台达电子工业股份有限公司 Combination structure of electronic component and heat dissipation device, and insulation component thereof
CN202189775U (en) * 2011-08-23 2012-04-11 山亿新能源股份有限公司 Solar energy transistor radiating fixing structure
CN104219932A (en) * 2013-06-03 2014-12-17 联想(北京)有限公司 Electronic equipment
CN203912441U (en) * 2014-06-12 2014-10-29 东莞市万丰纳米材料有限公司 Composite heat conduction material
CN204084659U (en) * 2014-06-19 2015-01-07 美的集团武汉制冷设备有限公司 Air-conditioning electric control box, air-conditioner outdoor unit and air-conditioning system
CN207099540U (en) * 2017-08-29 2018-03-13 广东美的制冷设备有限公司 The electric-controlled box and air conditioner of a kind of circuit board assemblies, air conditioner

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110779105A (en) * 2019-10-22 2020-02-11 四川长虹空调有限公司 Waterproof assembly process for electric control box

Similar Documents

Publication Publication Date Title
WO2017215143A1 (en) Electric controller based on thermally superconductive heat dissipating plate and air conditioner outdoor unit
CN109300883A (en) Highly integrated electric-controlled plate and electric appliance
CN107371356A (en) The electric-controlled box and air conditioner of a kind of circuit board assemblies, air conditioner
CN109245556A (en) A kind of diesel locomotive high-power loop circuit heat pipe power module and its mirror-image structure
CN207099540U (en) The electric-controlled box and air conditioner of a kind of circuit board assemblies, air conditioner
CN208285207U (en) A kind of shell for Switching Power Supply
CN107567244A (en) The electric-controlled box and air conditioner of a kind of circuit board assemblies, air conditioner
CN207099539U (en) The electric-controlled box and air conditioner of a kind of circuit board assemblies, air conditioner
CN103868206B (en) Air-conditioner electric control box component and variable-frequency air conditioner with same
CN113115510A (en) Printed circuit board heat dissipation system using high-thermal-conductivity substrate
CN211177509U (en) Mixed rubber pipe cooling device
CN208317104U (en) The two-sided PCB circuit board radiator structure of multi-layered high-density
CN215571363U (en) Semiconductor refrigerating device and air-conditioning suit
CN211400079U (en) Heat radiation structure and have its air condensing units
CN214627824U (en) Heat conduction gasket with high electrical insulation
CN206099401U (en) Electric vehicle charging ware with refrigeration function
CN210432265U (en) Heat radiation structure of high-heating graphene
CN205355038U (en) Heat pipe cooling ware structure of IGBT module in converter
CN207116949U (en) A kind of high-power power distribution cabinet of easy heat radiation
CN209594178U (en) A kind of switching tube radiator structure and vehicle power supply
CN209877184U (en) Mainboard and air conditioner
CN208383146U (en) A kind of Novel navigator radiator
CN209462704U (en) A kind of single-clad board with radiator structure
CN208047149U (en) A kind of electric vehicle heating element radiator structure
CN111442419A (en) Electrical apparatus box structure and air condensing units

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination