CN107511551B - Tin ball laser welding method - Google Patents
Tin ball laser welding method Download PDFInfo
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- CN107511551B CN107511551B CN201710769447.9A CN201710769447A CN107511551B CN 107511551 B CN107511551 B CN 107511551B CN 201710769447 A CN201710769447 A CN 201710769447A CN 107511551 B CN107511551 B CN 107511551B
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- solder ball
- track
- power density
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/005—Soldering by means of radiant energy
- B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/04—Heating appliances
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- Optics & Photonics (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Laser Beam Processing (AREA)
Abstract
The embodiment of the invention discloses a solder ball laser welding method, which comprises the following steps: moving a laser beam with a first power density along a welding track to irradiate a tin ball arranged on a bonding pad so as to soften the tin ball, wherein the welding track surrounds the tin ball; moving a laser beam with a second power density along the welding track, and irradiating the softened solder ball to melt the softened solder ball, wherein the welding track falls on the softened solder ball, and the second power density is greater than the first power density; and moving a laser beam with a third power density along the welding track, and irradiating the melted solder ball to assist the melted solder ball to solidify, wherein the third power density is smaller than the first power density. The tin ball laser welding method provided by the embodiment of the invention solves the technical problems that the tin ball welding technology in the prior art is easy to burn to a bonding pad in the welding process and has poor welding quality.
Description
Technical Field
The invention belongs to the technical field of welding, and particularly relates to a solder ball laser welding method.
Background
The solder ball laser welding technology is a high-efficiency precise welding method which uses a laser beam with high energy density as a heat source to melt solder balls. Due to the unique advantages, the welding method is successfully applied to the precise welding of micro and small parts.
The solder ball laser welding technology at the present stage mostly uses laser with constant power density to irradiate the solder ball, so that the solder ball is quickly melted, and then the laser irradiation is removed, so that the melted solder ball is solidified, and further the welding is completed. However, when the solder ball placed on the bonding pad is suddenly irradiated by laser with higher power density, the solder ball is easy to splash, and the laser is easy to burn to the bonding pad; in addition, when the solder ball is irradiated by laser with larger power density, the solder ball is easy to burn through, and the laser is easy to burn to the bonding pad; moreover, after the laser is suddenly removed from the melted solder ball, bubbles are easily generated in the solder bump in the cooling and solidifying process, and the soldering quality of the product is further influenced.
In short, the current solder ball soldering technology has the technical problems of easy burning to the pad during soldering and poor soldering quality.
Disclosure of Invention
In view of this, the embodiment of the present invention provides a solder ball laser welding method, which is used to solve the technical problems that the existing solder ball welding technology is easy to burn to a pad in the welding process and has poor welding quality.
The embodiment of the invention provides a solder ball laser welding method, which comprises the following steps:
moving a laser beam with a first power density along a welding track to irradiate a tin ball arranged on a bonding pad so as to soften the tin ball, wherein the welding track surrounds the tin ball;
moving a laser beam with a second power density along the welding track, and irradiating the softened solder ball to melt the softened solder ball, wherein the welding track falls on the softened solder ball, and the second power density is greater than the first power density;
and moving a laser beam with a third power density along the welding track, and irradiating the melted solder ball to assist the melted solder ball to solidify, wherein the third power density is smaller than the first power density.
Further, the welding track comprises a first track and a second track; the starting point of the first track is the second track end point, and the end point of the first track is the first track starting point; the laser beam moves along the first track and the second track in opposite directions.
Further, the method for softening the solder ball by irradiating the solder ball placed on the pad by moving the laser beam with the first power density along a soldering track includes:
and using a laser beam with a first power density to alternately move along the first track and the second track, and irradiating the solder ball placed on the bonding pad to soften the solder ball.
Further, the time for irradiating the solder ball placed on the pad is equal to the time for irradiating the solder ball placed on the pad by moving the laser beam with the first power density along the first track.
Further, moving the laser beam with a second power density along the welding track, and irradiating the softened solder ball to melt the softened solder ball, specifically comprising:
and using a laser beam with a second power density to alternately move along the first track and the second track, and irradiating the softened solder ball to melt the softened solder ball.
Furthermore, the time for irradiating the softened solder ball by moving the laser beam with the first power density along the first track is equal to the time for irradiating the softened solder ball by moving the laser beam along the second track.
Further, moving a laser beam with a third power density along the soldering track, and irradiating the melted solder ball to assist the melted solder ball to solidify, specifically comprising:
and using a laser beam with a third power density to alternately move along the first track and the second track, and irradiating the melted solder ball to assist the melted solder ball to solidify.
Furthermore, the time for irradiating the melted solder ball by using the laser beam with the third power density along the first track is equal to the time for irradiating the melted solder ball by moving along the second track.
Further, the start and end points of the soldering trajectory fall on the solder ball before softening.
Further, the welding track is elliptical.
According to the tin ball laser welding method provided by the embodiment of the invention, the tin balls placed on the bonding pad are irradiated by the lasers with three power densities along the welding track respectively, and the tin balls are softened when the tin balls are irradiated by the lasers with the smaller first power density, so that the tin balls are prevented from splashing and being easily burnt to the bonding pad when the tin balls are irradiated by the lasers with the high power density; the softened solder ball is melted when irradiated by laser with larger second power density, so that the solder ball is prevented from being easily burnt through and further burnt to a bonding pad when irradiated by the laser with high power density; and then, the melted solder ball is irradiated by laser with smaller third power density to assist the solidification of the solder ball, so that the phenomenon that bubbles appear in the solder bump easily in the cooling solidification process of suddenly removing the laser is avoided.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and those skilled in the art can also obtain other drawings according to the drawings without creative efforts.
FIG. 1 is a flowchart of a solder ball laser welding method according to a first embodiment of the present invention;
FIG. 2 is a flowchart of a solder ball laser welding method according to a second embodiment of the present invention;
FIG. 3 is a schematic diagram of a bonding trace of a solder ball laser welding method according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of a first trace of a solder ball laser welding method according to an embodiment of the present invention;
fig. 5 is a second trace diagram of a soldering trace of the solder ball laser welding method according to the embodiment of the invention.
Detailed Description
The following detailed description of the embodiments of the present invention will be provided with reference to the accompanying drawings and examples, so that how to implement the embodiments of the present invention by using technical means to solve the technical problems and achieve the technical effects can be fully understood and implemented.
As used in the specification and in the claims, certain terms are used to refer to particular components. As one skilled in the art will appreciate, manufacturers may refer to a component by different names. This specification and claims do not intend to distinguish between components that differ in name but not function. In the following description and in the claims, the terms "include" and "comprise" are used in an open-ended fashion, and thus should be interpreted to mean "include, but not limited to. "substantially" means within an acceptable error range, and a person skilled in the art can solve the technical problem within a certain error range to achieve the technical effect basically. Furthermore, the terms "coupled" or "electrically connected" are intended to encompass any direct or indirect electrical coupling. Thus, if a first device couples to a second device, that connection may be through a direct electrical connection, or through an indirect electrical connection via other devices and connections. The following description is of the preferred embodiment for carrying out the invention, but is made for the purpose of illustrating the general principles of the invention and not for the purpose of limiting the scope of the invention. The scope of the present invention is defined by the appended claims.
It should also be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or system that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or system. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or system that comprises the element.
DETAILED DESCRIPTION OF EMBODIMENT (S) OF INVENTION
Example one
Referring to fig. 1, a flowchart of a solder ball laser welding method according to a first embodiment of the present invention is shown, where the solder ball laser welding method includes:
step S100, moving a laser beam with a first power density along a welding track, and irradiating a tin ball arranged on a bonding pad to soften the tin ball, wherein the welding track surrounds the tin ball;
step S200, moving a laser beam with a second power density along the welding track, and irradiating the softened solder ball to melt the softened solder ball, wherein the welding track falls on the softened solder ball, and the second power density is greater than the first power density;
step S300, moving a laser beam with a third power density along the welding track, and irradiating the melted solder ball to assist the melted solder ball to solidify, wherein the third power density is smaller than the first power density.
And, with reference to fig. 3-5, respectively, a schematic welding diagram of the solder ball laser welding method according to the embodiment of the present invention is shown.
In step S100, the laser transmitter is adjusted to emit laser outwards according to a first power density, and the laser transmitter is moved according to a bonding trace 20 to irradiate the solder ball 10 so as to soften the solder ball 10. Here, the solder traces 20 generally surround the solder ball 10. Generally, a corresponding preparation is also needed, such as fixing the solder ball 10 on the pad through a fixing tool, and arranging a core wire at a corresponding position of the pad, wherein the core wire is located between the solder ball 10 and the pad, and it is conceivable that the core wire is fixed on the pad through soldering, wherein the pad is generally a circuit board, and the core wire is connected with an electrical contact of the circuit board.
In addition, the shape of the welding track 20 includes, but is not limited to, an ellipse, and it is conceivable to resemble an ellipse as shown in fig. 3-5, inclusive; the starting point and the end point of the soldering trace 20 are located on the solder ball 10 before softening, it is emphasized that the starting point and the end point of the soldering trace 20 are required to be located on the solder ball 10, and the positions of other irradiation points except the starting point and the end point are not emphasized, because the soldering trace 20 surrounds the solder ball 10, on one hand, the heat of the irradiation points is expanded to the periphery, and the irradiation points surrounding the solder ball 10 can also heat the solder ball 10 although not located on the surface of the solder ball 10, so that the solder ball 10 is softened; on the other hand, the energy of the laser beam with the first power density is small, and the laser beam does not damage the bonding pad even if directly irradiating the bonding pad. Specifically, the welding track 20 includes a first track 210 and a second track 220; the starting point of the first track 210 is the end point of the second track 220, and the end point of the first track 210 is the starting point of the first track 210; the laser beam moves along the first track 210 in the opposite direction to the second track 220. As shown in fig. 3-5, the arrows respectively indicate the moving directions of the first track 210 and the second track 220, wherein the moving direction of the first track 210 is a clockwise-like direction, and the moving direction of the second track 220 is a counterclockwise-like direction.
Specifically, in step S100, a laser beam with a first power density is used to irradiate the solder ball 10 placed on the pad along the first track 210 and/or the second track 220 to soften the solder ball 10, and then the following steps are performed.
In step S200, in connection with the step S100, the laser transmitter is adjusted to continuously irradiate the softened solder ball 10 with a laser beam having a second power density, wherein the soldering trace 20 falls on the softened solder ball 10, and the second power density is greater than the first power density. Specifically, the emission power density of the laser transmitter is increased, and the softened solder ball 10 is continuously irradiated with the laser beam with the second power density, so that the softened solder ball 10 is melted, where the melting of the solder ball 10 means that the solder ball 10 is changed from a solid to a liquid, and the effect of boiling on the pad is achieved.
Here, it should be noted that, since the temperature of the laser beam irradiated to the softened solder ball 10 is higher, the soldering trace 20 is required to fall on the softened solder ball 10, so as to avoid the damage of the pad caused by the direct irradiation of the laser beam with higher temperature to the pad.
Specifically, in step S200, the softened solder ball 10 is irradiated with a laser beam with a second power density along the first tracks 210 and/or the second tracks 220 to melt the solder ball 10, and then the following steps are performed.
In step S300, in connection with the above step S200, for the melted solder ball 10, the laser emitter is adjusted to continue the irradiation with the laser beam with the third power density, where the third power density is smaller than the first power density. Specifically, the emission power density of the laser transmitter is reduced, the melted solder ball 10 is continuously irradiated by the laser beam with the third power density, and the temperature of the laser beam with the third power density is low, so that the boiling solder ball 10 is not enough to continuously keep a boiling state, that is, the melted solder ball 10 is solidified, and the melted solder ball 10 can be slowly solidified by the irradiation of the laser beam with the third power density in the solidification process.
Here, it should be noted that, because the temperature of the laser beam irradiating the solidified solder ball 10 is low, it is not emphasized too much whether the soldering trace 20 falls on the melted solder ball 10, and it may be directly irradiated on the melted solder ball 10 or irradiated around the melted solder ball 10, which may also have the effect of heat retention to assist the melted solder ball 10 to solidify slowly.
Specifically, in step S300, a laser beam with a third power density is used to irradiate the melted solder ball 10 along the first track 210 and/or the second track 220 to assist the melted solder ball 10 to solidify, so as to obtain a welded workpiece.
In this embodiment, the solder ball 10 placed on the pad is irradiated along the first trace 210 and/or the second trace 220 by using three kinds of laser with power density, respectively. The solder ball 10 is softened when the solder ball 10 is irradiated by the laser with the smaller first power density, so that the solder ball 10 is prevented from being easily splashed and burnt to a bonding pad when the solder ball 10 is irradiated by the laser with the high power density; the softened solder ball 10 is melted when irradiated by laser with larger second power density, so that the solder ball 10 is prevented from being easily burnt through and to the bonding pad by directly irradiating the solder ball 10 by the laser with high power density; then, the melted solder ball 10 is irradiated by laser with a smaller third power density to assist the solidification thereof, so that bubbles in the solder bump are prevented from being easily generated in the cooling solidification process by suddenly removing the laser, and the safety of the welding operation and the welding quality are improved.
Example two
Referring to fig. 2, a flowchart of a solder ball laser welding method according to a second embodiment of the present invention is shown.
The step S100 of moving a laser beam with a first power density along a bonding trace 20 to irradiate the solder ball 10 disposed on the pad so as to soften the solder ball 10 specifically includes:
in step S110, a laser beam with a first power density is alternately moved along the first trace 210 and the second trace 220 to irradiate the solder ball 10 disposed on the pad, so as to soften the solder ball 10.
Specifically, the laser emitter is adjusted to emit laser outwards according to a first power density, and the solder ball 10 is irradiated by moving alternately according to the first track 210 and the second track 220, so that the solder ball 10 is softened. Here, the first trace 210 and the second trace 220 are not sequentially arranged, and the number of turns of the solder ball 10 irradiated each time is not limited, for example, the solder ball 105 is irradiated according to the first trace 210, and then the solder ball 105 is irradiated according to the second trace 220; alternatively, the cycle may be performed in a single-turn cycle, that is, the solder ball is irradiated for 101 turns according to the first trace 210, and then the solder ball is irradiated for 101 turns according to the second trace 220, and this is performed for a plurality of times, however, the number of turns of the solder ball 10 irradiated according to the first trace 210 and the number of turns of the solder ball 10 irradiated according to the second trace 220 are kept equal.
It should be noted that, since the moving speed of the laser beam emitted by the laser machine on the pad is generally uniform, and the number of the irradiation turns of the solder ball 10 according to the first track 210 and the number of the irradiation turns of the solder ball 10 according to the second track 220 are kept equal, the time for irradiating the solder ball 10 placed on the pad by moving the laser beam with the first power density along the first track 210 and the time for irradiating the solder ball 10 placed on the pad by moving the laser beam along the second track 220 are equal.
In this way, the heat obtained by the solder ball 10 by irradiating the solder ball 10 through the first trace 210 is equal to the heat obtained by the solder ball 10 by irradiating the solder ball 10 through the second trace 220, so that the solder ball 10 is heated more uniformly, the shape of the softened solder ball 10 is closer to the shape of the soldering trace 20, and the solder ball 10 can be melted later.
Step S200 of moving the laser beam with the second power density along the soldering trace 20, and irradiating the softened solder ball 10 to melt the softened solder ball 10, specifically including:
step S210, alternately moving the laser beam with a second power density along the first trace 210 and the second trace 220, and irradiating the softened solder ball 10 to melt the softened solder ball 10.
Specifically, the laser emitter is adjusted to emit laser outwards according to a second power density, and the laser emitter is alternately moved according to the first track 210 and the second track 220 to irradiate the softened solder ball 10, so that the softened solder ball 10 is melted. Here, the first trace 210 and the second trace 220 are generally not sequentially arranged, and the number of turns of the softened solder ball 10 irradiated each time is not limited, for example, the softened solder ball 105 is irradiated according to the first trace 210, and then the softened solder ball 105 is irradiated according to the second trace 220; or in a single-turn circulation manner, namely irradiating the softened solder ball 101 turns according to the first trace 210, and irradiating the softened solder ball 101 turns according to the second trace 220, and so on, but the number of turns of irradiating the softened solder ball 10 according to the first trace 210 and the number of turns of irradiating the softened solder ball 10 according to the second trace 220 are kept equal.
It should be noted that, since the moving speed of the laser beam emitted by the laser machine on the pad is generally uniform motion, and the number of irradiation turns of the softened solder ball 10 according to the first track 210 and the number of irradiation turns of the softened solder ball 10 according to the second track 220 are kept equal, the time for moving the laser beam with the first power density along the first track 210 to irradiate the softened solder ball 10 and the time for moving the laser beam with the second track 220 to irradiate the softened solder ball 10 are equal.
The heat obtained by the solder ball 10 by irradiating the solder ball 10 through the first tracks 210 is equal to the heat obtained by the solder ball 10 by irradiating the solder ball 10 through the second tracks 220, so that the solder ball 10 is heated more uniformly, and the solder ball 10 is melted more sufficiently, that is, the solder ball 10 is completely changed from solid to liquid, so as to reach a boiling state.
Step S300, moving the laser beam with a third power density along the soldering track 20, and irradiating the melted solder ball 10 to assist the melted solder ball 10 to solidify, specifically including:
step S310, using a laser beam with a third power density to alternately move along the first trace 210 and the second trace 220, and irradiating the melted solder ball 10 to assist the melted solder ball 10 to solidify.
Specifically, the laser emitter is adjusted to emit laser outwards according to a third power density, and the laser emitter is alternately moved according to the first track 210 and the second track 220 to irradiate the melted solder ball 10, so as to assist the melted solder ball 10 to solidify. Here, the first trace 210 and the second trace 220 are generally not sequentially arranged, and the number of turns of the solder ball 10 after being melted by each irradiation is not limited, for example, the solder ball 105 after being melted is irradiated according to the first trace 210, and then the solder ball 105 after being melted is irradiated according to the second trace 220; or in a single-turn circulation manner, namely irradiating the melted solder ball 101 turns according to the first trace 210, and irradiating the melted solder ball 101 turns according to the second trace 220, and so on, but the number of turns of irradiating the melted solder ball 10 according to the first trace 210 and the number of turns of irradiating the melted solder ball 10 according to the second trace 220 are kept equal.
It should be noted that, since the moving speed of the laser beam emitted by the laser machine on the pad is generally uniform motion, and the number of the irradiation turns of the melted solder ball 10 according to the first track 210 and the number of the irradiation turns of the melted solder ball 10 according to the second track 220 are equal, the time for moving the laser beam with the first power density along the first track 210 to irradiate the melted solder ball 10 and the time for moving the laser beam with the second track 220 to irradiate the melted solder ball 10 are equal.
The heat obtained by the solder ball 10 by irradiating the solder ball 10 through the first tracks 210 and the heat obtained by the solder ball 10 by irradiating the solder ball 10 through the second tracks 220 can be equal, so that the solder ball 10 is heated more uniformly, the heat of the solder ball 10 is kept more uniformly in the cooling process after melting, and the melted solder ball 10 can be slowly changed into a solid from a liquid.
Through the above description of the embodiments, those skilled in the art will clearly understand that each embodiment can be implemented by software plus a necessary general hardware platform, and certainly can also be implemented by hardware. With this understanding in mind, the above-described technical solutions may be embodied in the form of a software product, which can be stored in a computer-readable storage medium, such as ROM/RAM, magnetic disk, optical disk, etc., and includes instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to execute the methods of the various embodiments or some parts of the embodiments.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (9)
1. A solder ball laser welding method is characterized by comprising the following steps:
moving a laser beam with a first power density along a welding track to irradiate a solder ball placed on a bonding pad so as to soften the solder ball, wherein the welding track surrounds the solder ball, and the starting point and the end point of the welding track fall on the solder ball before softening;
moving a laser beam with a second power density along the welding track, and irradiating the softened solder ball to melt the softened solder ball, wherein the welding track falls on the softened solder ball, and the second power density is greater than the first power density;
and moving a laser beam with a third power density along the welding track, and irradiating the melted solder ball to assist the melted solder ball to solidify, wherein the third power density is smaller than the first power density.
2. The solder ball laser welding method according to claim 1, wherein the solder tracks include a first track and a second track; the starting point of the first track is the end point of the second track, and the end point of the first track is the starting point of the second track; the laser beam moves along the first track and the second track in opposite directions.
3. The solder ball laser welding method according to claim 2, wherein the solder ball placed on the pad is irradiated with the laser beam of the first power density along a welding trace to soften the solder ball, and the method comprises:
and using a laser beam with a first power density to alternately move along the first track and the second track, and irradiating the solder ball placed on the bonding pad to soften the solder ball.
4. The solder ball laser welding method according to claim 3, wherein the time for irradiating the solder ball placed on the pad is equal to the time for irradiating the solder ball placed on the pad along the second trajectory by moving the laser beam of the first power density along the first trajectory.
5. The solder ball laser welding method according to claim 2, wherein the softened solder ball is irradiated by moving a laser beam with a second power density along the welding trace to melt the softened solder ball, and the method comprises:
and using a laser beam with a second power density to alternately move along the first track and the second track, and irradiating the softened solder ball to melt the softened solder ball.
6. The method of claim 5, wherein the irradiation time of the softened solder ball is equal to the irradiation time of the softened solder ball along the second track by the laser beam of the second power density.
7. The solder ball laser welding method according to claim 2, wherein the melted solder ball is irradiated by a laser beam of a third power density along the welding track to assist the solidification of the melted solder ball, and the method comprises:
and using a laser beam with a third power density to alternately move along the first track and the second track, and irradiating the melted solder ball to assist the melted solder ball to solidify.
8. The solder ball laser welding method according to claim 7, wherein the irradiation time of the melted solder ball is equal to the irradiation time of the melted solder ball along the second track by moving the laser beam with a third power density along the first track.
9. The method of claim 1, wherein the bonding trace is elliptical.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710769447.9A CN107511551B (en) | 2017-08-31 | 2017-08-31 | Tin ball laser welding method |
| PCT/CN2017/116208 WO2019041638A1 (en) | 2017-08-31 | 2017-12-14 | Solder ball laser welding method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710769447.9A CN107511551B (en) | 2017-08-31 | 2017-08-31 | Tin ball laser welding method |
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| CN107511551B true CN107511551B (en) | 2020-02-18 |
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| CN111132459B (en) * | 2018-10-31 | 2021-08-03 | 台湾爱司帝科技股份有限公司 | Method and device for fixedly connecting light-emitting diode chip |
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| GB2582928A (en) * | 2019-04-08 | 2020-10-14 | Laser Wire Solutions Ltd | A laser apparatus for stripping and soldering wires |
| CN111203605B (en) * | 2020-01-16 | 2022-03-08 | 立讯智造(浙江)有限公司 | Laser welding method and soldering machine |
| CN111872511B (en) * | 2020-06-29 | 2022-03-22 | 江苏亚威艾欧斯激光科技有限公司 | Tin ball implanting device and tin ball welding device |
| CN111992833B (en) * | 2020-07-13 | 2022-05-03 | 武汉凌云光电科技有限责任公司 | Laser tin soldering method for preset tin |
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| KR101180481B1 (en) * | 2010-10-12 | 2012-09-06 | 주식회사 엘티에스 | In-line reflow apparatus using a laser module |
| CN102139412B (en) * | 2011-03-18 | 2014-10-01 | 宁波镭基光电技术有限公司 | Laser welding method |
| CN102554473B (en) * | 2012-01-12 | 2016-01-20 | 深圳市木森科技有限公司 | A kind of method and apparatus of removing solder balls by laser |
| CN202498276U (en) * | 2012-02-02 | 2012-10-24 | 深圳市联合创新实业有限公司 | Vibrating device used in laser soldering |
| CN204295087U (en) * | 2014-06-27 | 2015-04-29 | 武汉洛芙科技股份有限公司 | Laser soldering device |
| CN105057824A (en) * | 2015-08-27 | 2015-11-18 | 武汉比天科技有限责任公司 | Non-contact laser radiation solder ball welding device and method |
| CN105081574B (en) * | 2015-09-18 | 2017-03-01 | 大连理工大学 | A kind of layering pulse laser reduces the method that invar steel welds hot cracking tendency |
| CN106944705B (en) * | 2017-04-07 | 2019-02-19 | 武汉比天科技有限责任公司 | A kind of visual identity closed loop control method of tin cream precision welding |
-
2017
- 2017-08-31 CN CN201710769447.9A patent/CN107511551B/en active Active
- 2017-12-14 WO PCT/CN2017/116208 patent/WO2019041638A1/en active Application Filing
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| Publication number | Publication date |
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| WO2019041638A1 (en) | 2019-03-07 |
| CN107511551A (en) | 2017-12-26 |
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