CN107507898B - 一种led照明cob封装结构 - Google Patents
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 15
- 238000005286 illumination Methods 0.000 title claims abstract description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000003292 glue Substances 0.000 claims abstract description 9
- 239000000741 silica gel Substances 0.000 claims abstract description 9
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 9
- 239000011324 bead Substances 0.000 claims abstract description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 7
- 238000001816 cooling Methods 0.000 claims abstract description 4
- 239000012790 adhesive layer Substances 0.000 claims description 19
- 239000004411 aluminium Substances 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 abstract description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 5
- 238000010521 absorption reaction Methods 0.000 abstract description 4
- 230000002035 prolonged effect Effects 0.000 abstract description 3
- 101150038956 cup-4 gene Proteins 0.000 description 7
- 206010010904 Convulsion Diseases 0.000 description 3
- 230000036461 convulsion Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000007791 dehumidification Methods 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 229920000297 Rayon Polymers 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
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Abstract
本发明公开了一种LED照明COB封装结构,包括铝基的PCB板、LED晶片和驱动组件,其特征在于:所述PCB板上侧设有外形、深度均与LED晶片适配的凹槽,LED晶片通过固晶胶粘接在凹槽内,PCB板下侧对应凹槽处固定有用于聚光的球面反光杯,凹槽中部与PCB板下侧贯通,反光杯顶部开有与贯通处对应的通孔,LED晶片下侧连接有LED灯珠,LED灯珠嵌入通孔并置于反光杯内,LED晶片以及其与驱动组件的键合引线通过采用硅胶的粘胶层封装在PCB板上,PCB板上对应LED晶片处还装有散热器,散热器为一向外抽风冷却的小型抽风机。通过采用铝基的PCB板并应用具有高粘结度、低吸水性、高导热的硅胶封装LED晶片,降低了***热阻大幅度提高了LED的寿命,提高了导热率,便于散热。
Description
技术领域
本发明涉及照明灯具技术领域,特别是涉及一种用于LED灯具的COB封装结构。
背景技术
现有的LED灯具COB封装一般采用PPA支架,须与封装硅胶有很高的粘结力,然而高粘结力的硅胶吸水性也是与粘结力成正比,因此封装出来的产品容易回潮,需要烘干,***热阻也大,导热率低,不利于散热,使COB产品工序较长,成本较高,影响了成品率和品质可靠性。因此,有必要对现有的LED庭院灯做进一步改进和优化。
发明内容
为克服现有技术的不足,本发明提供一种LED照明灯具的COB封装结构,以提高成品率和品质可靠性。
本发明解决其技术问题所采用的技术方案是:
一种LED照明COB封装结构,包括铝基的PCB板、LED晶片和驱动组件,其特征在于:所述PCB板上侧设有外形、深度均与LED晶片适配的凹槽,LED晶片通过固晶胶粘接在凹槽内,PCB板下侧对应凹槽处固定有用于聚光的球面反光杯,凹槽中部与PCB板下侧贯通,反光杯顶部开有与贯通处对应的通孔,LED晶片下侧连接有LED灯珠,LED灯珠嵌入通孔并置于反光杯内,LED晶片以及其与驱动组件的键合引线通过采用硅胶的粘胶层封装在PCB板上,PCB板上对应LED晶片处还装有散热器,散热器为一向外抽风冷却的小型抽风机。
所述粘胶层包括荧光胶层和封装胶层,荧光胶层覆于LED晶片上,封装胶层覆于荧光胶层外。
所述反光杯内侧为二次贝塞尔曲线拟合而成的曲面,其上贴有柔性反光膜。
所述反光杯杯口设有透明的透光盖,透光盖设为平面镜或凸面镜。
所述透光盖边缘与反光杯杯口通过AB胶粘接或铆接。
本发明的有益效果:通过采用铝基的PCB板并应用具有高粘结度、低吸水性、高导热的硅胶封装LED晶片,降低了***热阻大幅度提高了LED的寿命,提高了导热率,便于散热,使COB产品在应用前无需烘烤除湿,减少了工序,降低了成本,提高了成品率和品质可靠性;LED灯珠置于反光杯内,最大程度地把光源通过聚光凹部反射,减少光的损耗;通过小型抽风机抽风散热,大大加快了散热速度,最大程度地将光源的温度带走,保证散热效率,提高使用寿命。
附图说明
以下结合附图对本发明的具体实施方式作进一步的详细说明,其中:
图1为本发明的结构图。
具体实施方式
参照图1,一种LED照明COB封装结构,包括铝基的PCB板1、LED晶片2和驱动组件3,其特征在于:所述PCB板1上侧设有外形、深度均与LED晶片2适配的凹槽,LED晶片2通过固晶胶粘接在凹槽内,PCB板1下侧对应凹槽处固定有用于聚光的球面反光杯4,凹槽中部与PCB板1下侧贯通,反光杯4顶部开有与贯通处对应的通孔,LED晶片2下侧连接有LED灯珠5,LED灯珠5嵌入通孔并置于反光杯4内,LED晶片2以及其与驱动组件3的键合引线通过采用硅胶的粘胶层6封装在PCB板1上,PCB板1上对应LED晶片2处还装有散热器7,散热器7为一向外抽风冷却的小型抽风机。通过采用铝基的PCB板并应用具有高粘结度、低吸水性、高导热的硅胶封装LED晶片,降低了***热阻大幅度提高了LED的寿命,提高了导热率,便于散热,使COB产品在应用前无需烘烤除湿,减少了工序,降低了成本,提高了成品率和品质可靠性;LED灯珠5置于反光杯4内,最大程度地把光源通过聚光凹部反射,减少光的损耗;通过小型抽风机抽风散热,大大加快了散热速度,最大程度地将光源的温度带走,保证散热效率,提高使用寿命。
优选地,所述粘胶层6包括荧光胶层和封装胶层,荧光胶层覆于LED晶片2上,有效提升LED的显色性,封装胶层覆于荧光胶层外。
作为上述技术方案的进一步改进,所述反光杯4内侧为二次贝塞尔曲线拟合而成的曲面,这种多曲面拟合的设计结构使得LED光源所发出的光被最大限度的收集利用,使不同方向的光被有效地叠加在一起,大大提高了出射光线的亮度和光效;其上还贴有柔性反光膜。
进一步地,所述反光杯4杯口设有透明的透光盖8,以防止杂质进入,透光盖8设为平面镜或凸面镜。
进一步,所述透光盖8边缘与反光杯4杯口通过AB胶粘接或铆接,以便有效的防水。
以上实施例仅用以说明本发明的技术方案而并非对其进行限制,凡未脱离本发明精神和范围的任何修改或者等同替换,其均应涵盖在本发明技术方案的范围内。
Claims (3)
1.一种LED照明COB封装结构,包括铝基的PCB板、LED晶片和驱动组件,其特征在于:所述PCB板上侧设有外形、深度均与LED晶片适配的凹槽,LED晶片通过固晶胶粘接在凹槽内,PCB板下侧对应凹槽处固定有用于聚光的球面反光杯,凹槽中部与PCB板下侧贯通,反光杯顶部开有与贯通处对应的通孔,LED晶片下侧连接有LED灯珠,LED灯珠嵌入通孔并置于反光杯内,LED晶片以及其与驱动组件的键合引线通过采用硅胶的粘胶层封装在PCB板上,PCB板上对应LED晶片处还装有散热器,散热器为一向外抽风冷却的小型抽风机,所述反光杯内侧为二次贝塞尔曲线拟合而成的曲面,其上贴有柔性反光膜,透光盖边缘与反光杯杯口通过AB胶粘接或铆接。
2.根据权利要求1所述的一种LED照明COB封装结构,其特征在于:所述粘胶层包括荧光胶层和封装胶层,荧光胶层覆于LED晶片上,封装胶层覆于荧光胶层外。
3.根据权利要求1或2所述的一种LED照明COB封装结构,其特征在于:所述反光杯杯口设有透明的透光盖,透光盖设为平面镜或凸面镜。
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Effective date of registration: 20231008 Address after: 2nd Floor, No. 3 Meixing Street, Guzhen Town, Zhongshan City, Guangdong Province, 528400 Applicant after: Guangdong Tianji Optoelectronics Co.,Ltd. Address before: No. 223, jin'ou Road, Jianghai District, Jiangmen City, Guangdong Province 529000 Applicant before: GUANGDONG LCLED LIGHTING Co.,Ltd. |
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