CN107507898B - 一种led照明cob封装结构 - Google Patents

一种led照明cob封装结构 Download PDF

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CN107507898B
CN107507898B CN201710700873.7A CN201710700873A CN107507898B CN 107507898 B CN107507898 B CN 107507898B CN 201710700873 A CN201710700873 A CN 201710700873A CN 107507898 B CN107507898 B CN 107507898B
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pcb
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CN107507898A (zh
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王俊华
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Guangdong Tianji Optoelectronics Co ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/641—Heat extraction or cooling elements characterized by the materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

本发明公开了一种LED照明COB封装结构，包括铝基的PCB板、LED晶片和驱动组件，其特征在于：所述PCB板上侧设有外形、深度均与LED晶片适配的凹槽，LED晶片通过固晶胶粘接在凹槽内，PCB板下侧对应凹槽处固定有用于聚光的球面反光杯，凹槽中部与PCB板下侧贯通，反光杯顶部开有与贯通处对应的通孔，LED晶片下侧连接有LED灯珠，LED灯珠嵌入通孔并置于反光杯内，LED晶片以及其与驱动组件的键合引线通过采用硅胶的粘胶层封装在PCB板上，PCB板上对应LED晶片处还装有散热器，散热器为一向外抽风冷却的小型抽风机。通过采用铝基的PCB板并应用具有高粘结度、低吸水性、高导热的硅胶封装LED晶片，降低了***热阻大幅度提高了LED的寿命，提高了导热率，便于散热。

Description

一种LED照明COB封装结构
技术领域
本发明涉及照明灯具技术领域，特别是涉及一种用于LED灯具的COB封装结构。
背景技术
现有的LED灯具COB封装一般采用PPA支架，须与封装硅胶有很高的粘结力，然而高粘结力的硅胶吸水性也是与粘结力成正比，因此封装出来的产品容易回潮，需要烘干，***热阻也大，导热率低，不利于散热，使COB产品工序较长，成本较高，影响了成品率和品质可靠性。因此，有必要对现有的LED庭院灯做进一步改进和优化。
发明内容
为克服现有技术的不足，本发明提供一种LED照明灯具的COB封装结构，以提高成品率和品质可靠性。
本发明解决其技术问题所采用的技术方案是：
一种LED照明COB封装结构，包括铝基的PCB板、LED晶片和驱动组件，其特征在于：所述PCB板上侧设有外形、深度均与LED晶片适配的凹槽，LED晶片通过固晶胶粘接在凹槽内，PCB板下侧对应凹槽处固定有用于聚光的球面反光杯，凹槽中部与PCB板下侧贯通，反光杯顶部开有与贯通处对应的通孔，LED晶片下侧连接有LED灯珠，LED灯珠嵌入通孔并置于反光杯内，LED晶片以及其与驱动组件的键合引线通过采用硅胶的粘胶层封装在PCB板上，PCB板上对应LED晶片处还装有散热器，散热器为一向外抽风冷却的小型抽风机。
所述粘胶层包括荧光胶层和封装胶层，荧光胶层覆于LED晶片上，封装胶层覆于荧光胶层外。
所述反光杯内侧为二次贝塞尔曲线拟合而成的曲面，其上贴有柔性反光膜。
所述反光杯杯口设有透明的透光盖，透光盖设为平面镜或凸面镜。
所述透光盖边缘与反光杯杯口通过AB胶粘接或铆接。
本发明的有益效果：通过采用铝基的PCB板并应用具有高粘结度、低吸水性、高导热的硅胶封装LED晶片，降低了***热阻大幅度提高了LED的寿命，提高了导热率，便于散热，使COB产品在应用前无需烘烤除湿，减少了工序，降低了成本，提高了成品率和品质可靠性；LED灯珠置于反光杯内，最大程度地把光源通过聚光凹部反射，减少光的损耗；通过小型抽风机抽风散热，大大加快了散热速度，最大程度地将光源的温度带走，保证散热效率，提高使用寿命。
附图说明
以下结合附图对本发明的具体实施方式作进一步的详细说明，其中：
图1为本发明的结构图。
具体实施方式
参照图1，一种LED照明COB封装结构，包括铝基的PCB板1、LED晶片2和驱动组件3，其特征在于：所述PCB板1上侧设有外形、深度均与LED晶片2适配的凹槽，LED晶片2通过固晶胶粘接在凹槽内，PCB板1下侧对应凹槽处固定有用于聚光的球面反光杯4，凹槽中部与PCB板1下侧贯通，反光杯4顶部开有与贯通处对应的通孔，LED晶片2下侧连接有LED灯珠5，LED灯珠5嵌入通孔并置于反光杯4内，LED晶片2以及其与驱动组件3的键合引线通过采用硅胶的粘胶层6封装在PCB板1上，PCB板1上对应LED晶片2处还装有散热器7，散热器7为一向外抽风冷却的小型抽风机。通过采用铝基的PCB板并应用具有高粘结度、低吸水性、高导热的硅胶封装LED晶片，降低了***热阻大幅度提高了LED的寿命，提高了导热率，便于散热，使COB产品在应用前无需烘烤除湿，减少了工序，降低了成本，提高了成品率和品质可靠性；LED灯珠5置于反光杯4内，最大程度地把光源通过聚光凹部反射，减少光的损耗；通过小型抽风机抽风散热，大大加快了散热速度，最大程度地将光源的温度带走，保证散热效率，提高使用寿命。
优选地，所述粘胶层6包括荧光胶层和封装胶层，荧光胶层覆于LED晶片2上，有效提升LED的显色性，封装胶层覆于荧光胶层外。
作为上述技术方案的进一步改进，所述反光杯4内侧为二次贝塞尔曲线拟合而成的曲面，这种多曲面拟合的设计结构使得LED光源所发出的光被最大限度的收集利用，使不同方向的光被有效地叠加在一起，大大提高了出射光线的亮度和光效；其上还贴有柔性反光膜。
进一步地，所述反光杯4杯口设有透明的透光盖8，以防止杂质进入，透光盖8设为平面镜或凸面镜。
进一步，所述透光盖8边缘与反光杯4杯口通过AB胶粘接或铆接，以便有效的防水。
以上实施例仅用以说明本发明的技术方案而并非对其进行限制，凡未脱离本发明精神和范围的任何修改或者等同替换，其均应涵盖在本发明技术方案的范围内。

Claims (3)

1.一种LED照明COB封装结构，包括铝基的PCB板、LED晶片和驱动组件，其特征在于：所述PCB板上侧设有外形、深度均与LED晶片适配的凹槽，LED晶片通过固晶胶粘接在凹槽内，PCB板下侧对应凹槽处固定有用于聚光的球面反光杯，凹槽中部与PCB板下侧贯通，反光杯顶部开有与贯通处对应的通孔，LED晶片下侧连接有LED灯珠，LED灯珠嵌入通孔并置于反光杯内，LED晶片以及其与驱动组件的键合引线通过采用硅胶的粘胶层封装在PCB板上，PCB板上对应LED晶片处还装有散热器，散热器为一向外抽风冷却的小型抽风机，所述反光杯内侧为二次贝塞尔曲线拟合而成的曲面，其上贴有柔性反光膜，透光盖边缘与反光杯杯口通过AB胶粘接或铆接。
2.根据权利要求1所述的一种LED照明COB封装结构，其特征在于：所述粘胶层包括荧光胶层和封装胶层，荧光胶层覆于LED晶片上，封装胶层覆于荧光胶层外。
3.根据权利要求1或2所述的一种LED照明COB封装结构，其特征在于：所述反光杯杯口设有透明的透光盖，透光盖设为平面镜或凸面镜。
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CN109296997A (zh) * 2018-09-17 2019-02-01 盐城东紫光电科技有限公司 一种组合式的cob封装结构

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CN106369490A (zh) * 2016-10-17 2017-02-01 青岛海尔股份有限公司 冰箱及其照明部件
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CN203150616U (zh) * 2013-02-19 2013-08-21 厦门市朗星节能照明股份有限公司 Led光源的cob封装结构
CN203150541U (zh) * 2013-02-19 2013-08-21 厦门市朗星节能照明股份有限公司 一种基于cob封装的led光源
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CN203927665U (zh) * 2014-04-18 2014-11-05 唐益明 一种led植物生长灯
CN204033303U (zh) * 2014-09-09 2014-12-24 王敬华 一种口腔观察镜
CN204285212U (zh) * 2014-12-24 2015-04-22 河北光迪照明科技开发有限公司 一种led庭院灯
CN104990019A (zh) * 2015-07-23 2015-10-21 安徽卡澜特车灯科技有限公司 高效率led双芯片远近光一体化汽车前照大灯散热***
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CN205026539U (zh) * 2015-07-23 2016-02-10 安徽卡澜特车灯科技有限公司 高效率led双芯片远近光一体化汽车前照大灯模组
CN106369490A (zh) * 2016-10-17 2017-02-01 青岛海尔股份有限公司 冰箱及其照明部件
CN206130708U (zh) * 2016-10-17 2017-04-26 青岛海尔股份有限公司 冰箱及其照明部件

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