CN107493086A - 温度补偿声表面波谐振器及其制备方法 - Google Patents
温度补偿声表面波谐振器及其制备方法 Download PDFInfo
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- CN107493086A CN107493086A CN201710784976.6A CN201710784976A CN107493086A CN 107493086 A CN107493086 A CN 107493086A CN 201710784976 A CN201710784976 A CN 201710784976A CN 107493086 A CN107493086 A CN 107493086A
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Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02543—Characteristics of substrate, e.g. cutting angles
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02818—Means for compensation or elimination of undesirable effects
- H03H9/02834—Means for compensation or elimination of undesirable effects of temperature influence
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/125—Driving means, e.g. electrodes, coils
- H03H9/145—Driving means, e.g. electrodes, coils for networks using surface acoustic waves
- H03H9/14538—Formation
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/125—Driving means, e.g. electrodes, coils
- H03H9/145—Driving means, e.g. electrodes, coils for networks using surface acoustic waves
- H03H9/14544—Transducers of particular shape or position
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D30/00—Reducing energy consumption in communication networks
- Y02D30/70—Reducing energy consumption in communication networks in wireless communication networks
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
Description
Claims (10)
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Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108539006A (zh) * | 2018-04-17 | 2018-09-14 | 杭州左蓝微电子技术有限公司 | 一种温度补偿声表面波滤波器及其制备方法 |
CN109245742A (zh) * | 2018-11-27 | 2019-01-18 | 杭州左蓝微电子技术有限公司 | 一种基于声表面波和固体反射层薄膜体声波组合谐振器 |
CN109245741A (zh) * | 2018-07-10 | 2019-01-18 | 深圳市眼景科技有限公司 | 一种红外探测器 |
CN110113025A (zh) * | 2019-04-28 | 2019-08-09 | 清华大学 | 一种便于射频前端集成的温度补偿声表面波器件及其制备方法与应用 |
CN110535451A (zh) * | 2019-09-22 | 2019-12-03 | 电子科技大学 | 一种新型电极结构的声表面波谐振器 |
CN111697943A (zh) * | 2020-07-02 | 2020-09-22 | 电子科技大学 | 一种高频高耦合系数压电薄膜体声波谐振器 |
CN112436815A (zh) * | 2020-11-19 | 2021-03-02 | 广东广纳芯科技有限公司 | 温度补偿型声表面波器件及其制造方法 |
CN112448687A (zh) * | 2020-11-23 | 2021-03-05 | 广东广纳芯科技有限公司 | 一种tc-saw滤波器制造方法 |
WO2022028080A1 (zh) * | 2020-08-07 | 2022-02-10 | 展讯通信(上海)有限公司 | 晶圆级声表面波滤波器与封装方法 |
WO2022121958A1 (zh) * | 2020-12-10 | 2022-06-16 | 诺思(天津)微***有限责任公司 | 带有温补层的声波谐振器和滤波器以及电子设备 |
Citations (8)
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US5446330A (en) * | 1993-03-15 | 1995-08-29 | Matsushita Electric Industrial Co., Ltd. | Surface acoustic wave device having a lamination structure |
US20090085437A1 (en) * | 2007-09-28 | 2009-04-02 | Cole Melanie W | Hybrid thin film heterostructure modular vibration control apparatus and methods for fabrication thereof |
US20140139075A1 (en) * | 2011-07-29 | 2014-05-22 | Murata Manufacturing Co., Ltd. | Piezoelectric device and method for producing piezoelectric device |
CN104634772A (zh) * | 2015-02-10 | 2015-05-20 | 中国科学院上海应用物理研究所 | 一种制备表面增强拉曼光谱基底的方法及其基底 |
CN104734564A (zh) * | 2015-04-14 | 2015-06-24 | 大连理工大学 | 一种全叉指电极微型压电厚膜振动能量收集器及其制作方法 |
CN105978520A (zh) * | 2016-05-12 | 2016-09-28 | 电子科技大学 | 一种多层结构的saw器件及其制备方法 |
CN106961258A (zh) * | 2017-05-04 | 2017-07-18 | 杭州左蓝微电子技术有限公司 | 一种空腔型声表面波谐振器及其加工方法 |
CN207184433U (zh) * | 2017-09-04 | 2018-04-03 | 杭州左蓝微电子技术有限公司 | 温度补偿声表面波谐振器 |
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2017
- 2017-09-04 CN CN201710784976.6A patent/CN107493086B/zh active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
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US5446330A (en) * | 1993-03-15 | 1995-08-29 | Matsushita Electric Industrial Co., Ltd. | Surface acoustic wave device having a lamination structure |
US20090085437A1 (en) * | 2007-09-28 | 2009-04-02 | Cole Melanie W | Hybrid thin film heterostructure modular vibration control apparatus and methods for fabrication thereof |
US20140139075A1 (en) * | 2011-07-29 | 2014-05-22 | Murata Manufacturing Co., Ltd. | Piezoelectric device and method for producing piezoelectric device |
CN104634772A (zh) * | 2015-02-10 | 2015-05-20 | 中国科学院上海应用物理研究所 | 一种制备表面增强拉曼光谱基底的方法及其基底 |
CN104734564A (zh) * | 2015-04-14 | 2015-06-24 | 大连理工大学 | 一种全叉指电极微型压电厚膜振动能量收集器及其制作方法 |
CN105978520A (zh) * | 2016-05-12 | 2016-09-28 | 电子科技大学 | 一种多层结构的saw器件及其制备方法 |
CN106961258A (zh) * | 2017-05-04 | 2017-07-18 | 杭州左蓝微电子技术有限公司 | 一种空腔型声表面波谐振器及其加工方法 |
CN207184433U (zh) * | 2017-09-04 | 2018-04-03 | 杭州左蓝微电子技术有限公司 | 温度补偿声表面波谐振器 |
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108539006A (zh) * | 2018-04-17 | 2018-09-14 | 杭州左蓝微电子技术有限公司 | 一种温度补偿声表面波滤波器及其制备方法 |
CN109245741A (zh) * | 2018-07-10 | 2019-01-18 | 深圳市眼景科技有限公司 | 一种红外探测器 |
CN109245742A (zh) * | 2018-11-27 | 2019-01-18 | 杭州左蓝微电子技术有限公司 | 一种基于声表面波和固体反射层薄膜体声波组合谐振器 |
CN109245742B (zh) * | 2018-11-27 | 2024-03-01 | 杭州左蓝微电子技术有限公司 | 一种基于声表面波和固体反射层薄膜体声波组合谐振器 |
CN110113025A (zh) * | 2019-04-28 | 2019-08-09 | 清华大学 | 一种便于射频前端集成的温度补偿声表面波器件及其制备方法与应用 |
CN110535451A (zh) * | 2019-09-22 | 2019-12-03 | 电子科技大学 | 一种新型电极结构的声表面波谐振器 |
CN111697943A (zh) * | 2020-07-02 | 2020-09-22 | 电子科技大学 | 一种高频高耦合系数压电薄膜体声波谐振器 |
CN111697943B (zh) * | 2020-07-02 | 2023-09-22 | 电子科技大学 | 一种高频高耦合系数压电薄膜体声波谐振器 |
US11632095B2 (en) | 2020-08-07 | 2023-04-18 | Spreadtrum Communications (Shanghai) Co., Ltd. | Wafer level surface acoustic wave filter and package method |
WO2022028080A1 (zh) * | 2020-08-07 | 2022-02-10 | 展讯通信(上海)有限公司 | 晶圆级声表面波滤波器与封装方法 |
CN112436815A (zh) * | 2020-11-19 | 2021-03-02 | 广东广纳芯科技有限公司 | 温度补偿型声表面波器件及其制造方法 |
CN112436815B (zh) * | 2020-11-19 | 2024-03-15 | 广东广纳芯科技有限公司 | 温度补偿型声表面波器件及其制造方法 |
CN112448687A (zh) * | 2020-11-23 | 2021-03-05 | 广东广纳芯科技有限公司 | 一种tc-saw滤波器制造方法 |
CN112448687B (zh) * | 2020-11-23 | 2024-05-03 | 广东广纳芯科技有限公司 | 一种tc-saw滤波器制造方法 |
WO2022121958A1 (zh) * | 2020-12-10 | 2022-06-16 | 诺思(天津)微***有限责任公司 | 带有温补层的声波谐振器和滤波器以及电子设备 |
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