CN107484386B - The manufacturing method of heat conducting device - Google Patents
The manufacturing method of heat conducting device Download PDFInfo
- Publication number
- CN107484386B CN107484386B CN201710377130.0A CN201710377130A CN107484386B CN 107484386 B CN107484386 B CN 107484386B CN 201710377130 A CN201710377130 A CN 201710377130A CN 107484386 B CN107484386 B CN 107484386B
- Authority
- CN
- China
- Prior art keywords
- plate
- heat conducting
- manufacturing
- conducting element
- capillary structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The disclosure provides a kind of manufacturing method of heat conducting device, comprising the following steps: provides the first plate, wherein the first plate includes plate body and heat conducting element, plate body has the insertion end of opposite heat conducting element setting, and insertion end defines siphunculus, and heat conducting element covers on-tube；The second plate is provided, wherein the second plate has the first open end；First capillary structure is set in the inner wall of heat conducting element and the lower surface of plate body；Second capillary structure is set in the inner wall of the second plate；And connection plate body connect the first plate with the second plate and forms a cavity in the first open end.The present invention can make heat conducting device heat conduction efficiency with higher.
Description
Technical field
The present invention relates to a kind of manufacturing methods, especially in regard to a kind of manufacturing method of heat conducting device.
Background technique
Heat pipe (Heat Pipe) and temperature-uniforming plate or vaporium (Vapor Chamber) etc. are dynamical heat transfer dresses
It sets, it is characterized in that high heat transfer efficiency, light-weight, structure is simple, and is not required to expend electric energy, therefore, heat pipe and vaporium institute group
At heat conducting device be widely used in a variety of high performance heat dissipation element markets, such as server, communication equipment, height
Rank drafting card or high-effect LED heat dissipation element etc..
It is that first capillary structure (Wick Structure) is respectively set in the manufacturing method of existing heat conducting device
It is inserted in the opening of steam chamber after the inner wall of heat pipe and vaporium, then by heat pipe, then is welded heat pipe by electric welding mode
It is assembled in the upper surface of steam chamber.However, this manufacturing method by make heat pipe and steam chamber weld capillary structure not
Continuously, it causes inner vapor space discontinuous, and makes the wall surfaces of the connections such as scolding tin, vaporium, heat pipe there are thermal resistances
(Thermal Resistance), causes the reduction of heat conduction efficiency.
Summary of the invention
It is an object of the present invention to provide a kind of manufacturing methods of heat conducting device, can make heat conducting device heat with higher
Conduction efficiency.
The present invention provides a kind of manufacturing method of heat conducting device, comprising the following steps: one first plate is provided, wherein the
One plate includes a plate body and an at least heat conducting element, and plate body has the insertion end of opposite heat conducting element setting, insertion end definition
One siphunculus, heat conducting element cover on-tube, provide one second plate, wherein the second plate has one first open end, setting one the
One capillary structure in heat conducting element inner wall and plate body lower surface, setting one second capillary structure in the second plate inner wall,
And connection plate body connect the first plate with the second plate and forms a cavity in the first open end.
In one embodiment, heat conducting element can be a heat pipe or a thermal conduction plate.In addition, the first plate can be integrally formed.
In addition, the inside dimensions of the first open end of the second plate and the size of plate body are substantially identical.In addition, heat conducting element is to pass through burning
Knot or welding manner connect plate body.In addition, the first plate with the second plate is connect by sintering or welding manner.
In one embodiment, heat conducting element has one second open end, and manufacturing method is further comprising the steps of: making thermally conductive member
Second open end of part is inserted on the inside of the siphunculus of plate body.
In one embodiment, heat conducting element has one second open end, and manufacturing method is further comprising the steps of: making thermally conductive member
Second open end of part is inserted on the outside of the siphunculus of plate body.
In one embodiment, manufacturing method is further comprising the steps of: providing a jig, wherein the shape of jig and the first plate
Part is corresponding, the first capillary structure of setting in jig surface, leading for the first plate will be inserted into the jig of the first capillary structure
Lower surface and the removing fixture of thermal element, the inner wall that the first capillary structure is set to heat conducting element by jig and plate body.
In one embodiment, the thickness and the first open end of plate body and the first capillary structure and the second capillary structure away from
From substantially identical, therefore, when the plate body of the first plate connects the first open end of the second plate, the first capillary structure and second
Capillary structure connection, to form successional capillary structure.
In one embodiment, before the step of making the first plate and the second plate link and form cavity, further include with
Lower step: an at least supporting element and setting supporting element are provided in the plate of the second capillary structure and the first plate on the second plate
Between the first capillary structure on body, collapsed to avoid the first plate.Wherein, the structure of supporting element and the first capillary structure or the
Two capillary structures are identical.
In one embodiment, manufacturing method is further comprising the steps of: providing multiple radiating fins and by the radiating fin
It is combined in heat conducting element.
In one embodiment, manufacturing method is further comprising the steps of: a working fluid is vacuumized and filled to cavity in chamber
In vivo.
From the above, the manufacturing method of heat conducting device through the invention can make heat conducting element and steam chamber (cavity)
Between inner wall formed successional capillary structure without thermal resistance exist, therefore, gaseous working fluid can not hinder
Ground is quickly transferred to each heat conducting element from steam chamber, moreover, can also lead to through the condensed gaseous working fluid of heat conducting element
It crosses capillary structure and is unobstructedly back to steam chamber.Therefore, the manufacturing method of the present invention can be such that heat conducting device has higher
Heat conduction efficiency.
Detailed description of the invention
Fig. 1 is a kind of flow diagram of the manufacturing method of heat conducting device of the preferred embodiment of the present invention.
Fig. 2A to Fig. 2 I is respectively the manufacturing process schematic diagram of the heat conducting device of one embodiment of the invention.
Fig. 3 is the stereoscopic schematic diagram of the heat conducting device of the embodiment of Fig. 2 I.
Fig. 4 is the stereoscopic schematic diagram of the heat conducting device of another embodiment of Fig. 2 I.
Fig. 5 to Fig. 7 is respectively the schematic cross-sectional view of the heat conducting device of different embodiments of the present invention.
Description of symbols:
1,1a~1d: heat conducting device
11: the first plates
111,111c: plate body
1111: siphunculus
112,112a, 112c: heat conducting element
1121,121: inner wall
12: the second plates
13: capillary structure
131: the first capillary structures
132: the second capillary structures
14,14b: supporting element
15: radiating fin
16: cavity
2: jig
A: region
D1: thickness
D2: distance
E1: the first open end
E2: the second open end
H: heat
I1: insertion end
P1: arrow (direction of travel for being vaporized into gaseous working fluid)
P2: arrow (direction of travel for being condensed into the working fluid of liquid)
S01 is to S05: step
S1: upper surface
S2: lower surface
Specific embodiment
Hereinafter with reference to relevant drawings, illustrate the manufacturing method of the heat conducting device according to the preferred embodiment of the present invention, wherein
Identical element will be illustrated with identical reference marks.
It please refers to shown in Fig. 1, the process for a kind of manufacturing method of heat conducting device of the preferred embodiment of the present invention is shown
It is intended to.
The manufacturing method of heat conducting device is the following steps are included: provide one first plate, wherein the first plate includes a plate
Body and at least a heat conducting element, plate body have an at least insertion end for opposite heat conducting element setting, and insertion end defines a siphunculus, leads
Thermal element covers on-tube；(step S01), one second plate is provided, wherein the second plate has one first open end (step
S02), one first capillary structure of setting is in the inner wall of heat conducting element and lower surface (step S03), one second capillary of setting of plate body
Structure connects the first plate and the second plate in the first open end in the inner wall (step S04) of the second plate, and connection plate body
It connects and forms a cavity (step S05).
Hereinafter, please referring to Fig. 1 and cooperating the embodiment of Fig. 2A to Fig. 2 I, to illustrate that above-mentioned steps S01's to step S05 is detailed
Thin content.Wherein, Fig. 2A to Fig. 2 F is respectively the manufacturing process schematic diagram of the heat conducting device 1 of one embodiment of the invention.
In step S01, as shown in Fig. 2A and Fig. 2 B, it is to provide the first plate 11, wherein the first plate 11 includes plate body
111 and at least one heat conducting element 112, plate body 111 there is opposite upper surface S1 and lower surface S2.Meanwhile plate body 111 has phase
To at least insertion end I1 that 112 quantity of heat conducting element, shape, position are arranged, each insertion end 11 surrounds a ring of plate body 111
Shape region simultaneously towards the upper surface direction S1 extend, therefore can on plate body 111 each customized logical tubular structure (siphunculus 1111), it is thermally conductive
Element 112 is then corresponding to cover on-tube 1111.In addition, heat conducting element 112 is connected to the side of relatively close upper surface S1, and plate body
111 from lower surface S2 sight be closed state.
The material of plate body 111 or heat conducting element 112 can be high for thermal coefficient (Heat Transfer Coefficient)
Metal (such as, but not limited to copper, aluminium) or alloy.The material of the plate body 111 of the present embodiment and heat conducting element 112 is all with copper, and the
One plate 11 is for having on the upper surface S1 for being connected to plate body 111 there are two heat conducting element 112.Wherein, thermally conductive member
Part 112 can be a heat pipe (Heat Pipe) or a thermal conduction plate (Temperature plate, also known as temperature-uniforming plate), be not intended to limit.
First plate 11 can be integrally formed, or be composed of two different components.First plate of the present embodiment
11 be so that two different components are composed as an example.In this, as aforementioned plate body 111 have corresponding to 112 quantity of heat conducting element,
The insertion end I1 that shape, position are arranged, and there is heat conducting element 112 the open end E2 corresponding to insertion end I1 (can be described as second
Open end E2), and in step S01, it is the insertion for first making the second open end E2 of heat conducting element 112 be socketed on plate body 111
Siphunculus 1111 defined in I1 is held, and heat conducting element 112 is made to be connected to the siphunculus 1111 that insertion end I1 is defined, forms first whereby
Plate 11.
It should be noted that Fig. 2 B illustrates that the embodiment that the second open end E2 is socketed from the inside of siphunculus 1111, and, warp
By the difference configuration of bore, the second open end E2 can also be socketed from the outside of siphunculus 1111, that is, the second open end E2 is arranged
In 1111 outside of siphunculus of insertion end I2.In this, using such as sintering (Sintering, such as open fire, laser light, infrared ray
Or the sintering of other heating methods), or the insertion end for making in a manner of welding (Welding) heat conducting element 112 be connected to plate body 111
I1 is not intended to limit.
Then, in step S02, as shown in Figure 2 C, it is to provide the second plate 12, wherein the second plate 12 has an opening
It holds E1 (can be described as the first open end E1).The second plate 12 substantially groove-like of the present embodiment and have the first open end E1,
It can be processed from strand by metal or alloy.In order to make in subsequent processing procedure, the first plate 11 can be combined with the second plate 12
Smoothly, the inside dimensions of the first open end E1 of the present embodiment restriction and the size of plate body 111 are substantially identical, therefore, make the two even
It can tight union when connecing.
In addition, the first capillary structure 131 is arranged in the inner wall 1121 and plate body 111 of heat conducting element 112 in step S03
Lower surface S2 on.In the present embodiment, in order to which the first capillary structure 131 is arranged on the first plate 11, as shown in Figure 2 D, this
The manufacturing method of embodiment, which can comprise the further steps of:, provides a jig 2, wherein the shape of jig 2 and the first plate 11 are (such as
Shown in Fig. 2 B) it is corresponding.In this, the shape of jig 2 is corresponding with the lower surface S2 of the inner wall 1121 of heat conducting element 112 and plate body 111
It is identical.Then, then the first capillary structure 131 is set in the surface of jig 2.In this, the first capillary structure 131 is set to jig
It (does not need to be arranged if having inner surface) on 2 outer surface, then, as shown in Figure 2 E, by controlling with the first capillary structure 131
Tool 2 is inserted into the heat conducting element 112 of the first plate 11 and the lower surface S2 of smooth plate body 111, to pass through jig 2 for the first capillary
Structure 131 is set on the inner wall 1121 of heat conducting element 112 and the lower surface S2 of plate body 111；And then removing fixture 2, such as scheme
Shown in 2F, the first capillary structure 131 is arranged on the inner wall 1121 of heat conducting element 112 and the lower surface S2 of plate body 111.By
It then passes through jig 2 and first capillary structure 131 is arranged in the inner wall 1121 of heat conducting element 112 and the lower surface S2 of plate body 111
On, therefore, in the junction of heat conducting element 112 and plate body 111, such as the region A of Fig. 2 F, the first capillary structure 131 is to connect
Continuous property structure does not have thermal resistance presence.
Then, step S04 is carried out, as shown in Figure 2 G, the second capillary structure 132 is set in the inner wall 121 of the second plate 12
On, the second capillary structure 132 is also continuity structure.In the present embodiment, in order to make the capillary structure inside heat conducting device 1
For continuous structure, as illustrated in figure 2h, the aggregation thickness d 1 and the first open end E1 of plate body 111 and the first capillary structure 131 with
The reserved distance d2 of second capillary structure 132 is substantially identical, therefore, as shown in figure 2i, connects the second plate in the first plate 11
When 12, the first capillary structure 131 can just connect with the second capillary structure 132 and form successional capillary structure 13.
It is noted that the first above-mentioned capillary structure 131 can have different structures to set from the second capillary structure 132
Meter, there are four types of common pacts, and be respectively: plough groove type, mesh-type (braiding), fiber type and sintered type, the present invention do not limit.Compared with
Good person is using sintered type capillary structure, and main cause is that, according to sintered type capillary structure, no matter heat conducting element 112 is with what
Kind shape, orientation, angle are placed, and condensed working fluid can all not made to carry out capillary reflux with hindering.
In addition, due to the substantially tabular of plate body 111, in order to collapse the first plate 11 after connection will not, such as Fig. 2 H
With shown in Fig. 2 I, the present embodiment can be also first provided to before the step S05 that the first plate 11 is connect with 12 the two of the second plate
A few supporting element 14, and the plate of second capillary structure 132 and first plate 11 of the setting supporting element 14 on the second plate 12
Between the first capillary structure 131 on body 111.It is to show 4 supporting elements 14 to be located at the first capillary structure in this embodiment
131 and second between capillary structure 132.In subsequent processing procedure, supporting element 14, which can be removed or not remove, all may be used.
Finally, carrying out step S05 again: connection plate body 111 makes the first plate 11 and second in the inside of the first open end E1
Plate 12 connects and forms cavity 16.Due to the inside dimensions of the first open end E1 of the second plate 12 and the size of plate body 111
It is substantially identical, therefore can combine closely when the two connection.Wherein, can by sintering (such as open fire, laser, infrared ray or other add
Hot mode sintering), or so that the first plate 11 is connected the second plate 12 with welding manner, it is not intended to limit.
Therefore, as shown in figure 2i, in heat conducting device 1, the first plate 11 connect with the second plate 12 and forms cavity
16 (can be described as vaporium), one working fluid of refilling (not shown go out) is in cavity 16.Wherein, the selection of working fluid can be with
It is refrigerant, such as freon (Freon), ammonia, acetone, methanol, ethyl alcohol, heptane or water etc., it can be according to the type or shape of heat source
For formula, as long as selected working fluid can be vaporized into gaseous state by heat source, it can be condensed into liquid again.Notably
It is, though example of the present embodiment using refrigerant as working fluid, and when selecting him to plant working fluid, working fluid is injected into heat
Before the cavity 16 of conduction device 1, first cavity 16 must be vacuumized, prevent in cavity 16 that there are the impurity other than working fluid
Gas (such as air) due to these foreign gases and is not involved in vaporization-condensation cycle, and is referred to as incondensable gas, does not coagulate
Knot gas, when heat conducting device 1 works, can occupy in the cavity 16 of certain volume other than it will cause vapourizing temperature and increase
Space influences heat conduction efficiency.Certainly, if can be not required to vacuumize cavity 16 if being working fluid using water.
It holds, the manufacturing method of heat conducting device 1 through this embodiment can make heat conducting element 112 and steam chamber (cavity
16) it is all successional capillary structure 13 between or in cavity 16, exists without thermal resistance, gaseous working fluid can have
Ground is hindered to be quickly transferred in each heat conducting element 112 from steam chamber, moreover, through the condensed liquid work of heat conducting element 112
Making fluid without hindering can also be back to steam chamber by capillary structure 13, and therefore, the manufacturing method of the present embodiment can make
The heat conduction efficiency with higher of heat conducting device 1.
In addition, please respectively refer to shown in Fig. 3 to Fig. 6, wherein Fig. 3 is the solid of the heat conducting device 1 of the embodiment of Fig. 2 I
Schematic diagram, Fig. 4 is the stereoscopic schematic diagram of the heat conducting device 1a of another embodiment of Fig. 2 I, and Fig. 5 and Fig. 6 is respectively the present invention
The schematic cross-sectional view of heat conducting device 1b, 1c of different embodiments.
As shown in figure 3, the heat conducting element 112 of the heat conducting device 1 of the present embodiment is the heat pipe of cylinder or cone.Not
With in embodiment, such as shown in Fig. 4, the heat conducting element 112a of heat conducting device 1a be the thermal conduction plate of a plate or bricked (
Warm plate).Wherein, temperature-uniforming plate is at least the vacuum cavity being welded to form by upper and lower two panels metal sheet, can be quick by local heat source
It is transmitted to the high performance heat radiating device of large-area flat-plate, therefore the more heat dissipation problem of critical conditions can be solved and had higher
Radiating efficiency.
In addition, as shown in figure 5, with the heat conducting device 1 of Fig. 2 I primary difference is that, the heat conducting device 1b's of Fig. 5
The structure of supporting element 14b is identical as the first capillary structure 131 or the second capillary structure 132.In other words, the material of supporting element 14b
It is also possible to capillary structure.So, it is possible to provide the more conducting paths of working fluid can also increase other than as structural support
Whole work efficiency.
In addition, as shown in fig. 6, the first plate 11c of the heat conducting device 1c of the present embodiment is for being integrally formed.It changes
Yan Zhi, plate body 111c and heat conducting element 112c are by solid memder bending, are process.
In addition, the other technical characteristics and its manufacturing method of heat conducting device 1a~1c can refer to Fig. 1, Fig. 2A to Fig. 2 I
The manufacturing process of heat conducting device 1, repeats no more in this.
In order to increase heat dissipation, in various embodiments, radiating fin can also be installed additional on heat conducting element, to mention again
Rise the heat transfer efficiency of heat conducting device.Hereinafter, illustrated so that the heat conducting device 1 of Fig. 2 I installs radiating fin additional as an example, when
So, radiating fin can also be installed on above-mentioned heat conducting device 1a~1c, and the present invention neither limits.
It please refers to shown in Fig. 7, it is more that the manufacturing method of the heat conducting device 1d of the present embodiment can comprise the further steps of: offer
The radiating fin 15 is combined on heat conducting element 112 by a radiating fin 15.It is by the radiating fin in this embodiment
15 are combined in a manner of being arranged parallel to each other on the outer surface of heat conducting element 112.The material of radiating fin 15 also can be thermal conductivity system
The high metals of number, and can be sintered, weld, socket or snap are connected to heat conducting element 112, thermally conductive member will be transmitted to
The thermal energy of part 112 is rapidly dispersed into the external world by radiating fin 15, to improve heat transfer efficiency.
Therefore, when the vaporium (cavity 16) of heat conducting device 1d is contacted with pyrotoxin, heat H can be conducted to vaporium
(cavity 16) makes vaporium (cavity 16) have higher temperature and make internal working fluid that can be vaporizated into gaseous state, gaseous
Working fluid up, and (will indicate that working fluid is vaporizated into gaseous state by heat toward the movement of the direction of heat conducting element 112 with arrow P1
Direction of travel afterwards), reaching heat possessed by the working fluid of heat conducting element 112 can dissipate toward the external of heat conducting element 112,
Certainly it can also assist to dissipate out heat by radiating fin 15, so that the condensable workflow at liquid of gaseous working fluid
Body, it is indoor that the working fluid of liquid can be back to steam along the first capillary structure 131 of the inner wall 1121 of heat conducting element 112
Second capillary structure 132 (with the direction of travel of the arrow P2 working fluid for indicating to be condensed into liquid), holds working fluid
Continuous circulating reflux is in heat conducting device 1d.
In conclusion the manufacturing method of heat conducting device through the invention, can make heat conducting element and steam chamber (cavity)
Between inner wall formed successional capillary structure without thermal resistance exist, therefore, gaseous working fluid can not hinder
Ground is quickly transferred to each heat conducting element from steam chamber, moreover, can also lead to through the condensed gaseous working fluid of heat conducting element
It crosses capillary structure and is unobstructedly back to steam chamber.Therefore, the manufacturing method of the present invention can be such that heat conducting device has higher
Heat conduction efficiency.
The foregoing is merely illustratives, rather than are restricted person.It is any without departing from design and range of the invention, and to it
The equivalent modifications or change of progress, are intended to be limited solely by claim.
Claims (15)
1. a kind of manufacturing method of heat conducting device, comprising the following steps:
One first plate is provided, wherein first plate includes a plate body and an at least heat conducting element, which has opposite be somebody's turn to do
An at least insertion end for heat conducting element setting, which defines a siphunculus, and the heat conducting element is socketed the siphunculus；
One second plate is provided, wherein second plate has one first open end；
One first capillary structure is set after first plate is provided in the lower surface of the inner wall of the heat conducting element and the plate body；
One second capillary structure is set in the inner wall of second plate；And
The plate body is connected in first open end, first plate is connect with second plate and forms a cavity.
2. manufacturing method as described in claim 1, wherein the heat conducting element is a heat pipe or a thermal conduction plate.
3. manufacturing method as described in claim 1, wherein first plate is integrally formed.
4. manufacturing method as described in claim 1, wherein the heat conducting element has one second open end, which also wraps
Include following steps:
It is inserted in second open end of the heat conducting element on the inside of the siphunculus of the plate body.
5. manufacturing method as described in claim 1, wherein the heat conducting element has one second open end, which also wraps
Include following steps:
It is inserted in second open end of the heat conducting element on the outside of the siphunculus of the plate body.
6. manufacturing method as described in claim 1, wherein the inside dimensions of first open end and the size of the plate body are substantive
It is identical.
7. manufacturing method as described in claim 1, further comprising the steps of:
A jig is provided, wherein the shape of the jig is corresponding with first plate；
First capillary structure is set in the surface of the jig；
The jig with first capillary structure is inserted into the heat conducting element of first plate；
First capillary structure is set to the inner wall of the heat conducting element and the lower surface of the plate body by the jig；And
Remove the jig.
8. manufacturing method as described in claim 1, the wherein thickness and first opening of the plate body and first capillary structure
It holds substantially identical at a distance from second capillary structure.
9. manufacturing method as described in claim 1, wherein first capillary structure connects second capillary structure.
10. manufacturing method as described in claim 1, wherein forming the chamber connecting first plate with second plate
It is further comprising the steps of before the step of body:
An at least supporting element is provided；And
The supporting element is set in this first mao on the plate body of second capillary structure and first plate on second plate
Between fine texture.
11. manufacturing method as claimed in claim 10, wherein the structure of the supporting element and first capillary structure or this second
Capillary structure is identical.
12. manufacturing method as described in claim 1, wherein the heat conducting element is to connect the plate by sintering or welding manner
Body.
13. manufacturing method as described in claim 1, wherein first plate and second plate are by being sintered or the side of welding
Formula connection.
14. manufacturing method as described in claim 1, further comprising the steps of:
Multiple radiating fins are provided；And
By the radiating fin combination in the heat conducting element.
15. manufacturing method as described in claim 1, further comprising the steps of:
The cavity is vacuumized；And
A working fluid is filled in the cavity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15/615,140 US10663231B2 (en) | 2016-06-08 | 2017-06-06 | Manufacturing method of heat conducting device |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201662347459P | 2016-06-08 | 2016-06-08 | |
| US62/347,459 | 2016-06-08 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107484386A CN107484386A (en) | 2017-12-15 |
| CN107484386B true CN107484386B (en) | 2019-09-03 |
Family
ID=60594358
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710377130.0A Active CN107484386B (en) | 2016-06-08 | 2017-05-25 | The manufacturing method of heat conducting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107484386B (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10900718B2 (en) * | 2018-05-21 | 2021-01-26 | Juniper Networks, Inc | Apparatus, system, and method for improving the efficiency of heatsinks |
| TWI692606B (en) * | 2019-06-28 | 2020-05-01 | 新加坡商 Ｊ＆Ｊ 資本控股有限公司 | Heat conducting structure, manufacturing method thereof, and mobile device |
| CN110769647B (en) * | 2019-10-22 | 2020-10-27 | 东莞领杰金属精密制造科技有限公司 | Manufacturing method of vapor chamber |
| CN112254559A (en) * | 2020-10-21 | 2021-01-22 | 碳元科技股份有限公司 | Three-dimensional radiator and preparation method thereof |
| CN114383453A (en) | 2020-10-22 | 2022-04-22 | 讯凯国际股份有限公司 | Heat sink device |
| TWI828112B (en) * | 2022-04-12 | 2024-01-01 | 邁萪科技股份有限公司 | Heat dissipation module and manufacturing method thereof |
| US20240147666A1 (en) * | 2022-10-31 | 2024-05-02 | Guangzhou Neogene Thermal Management Technology Co., Ltd. | Three-dimensional vapor chamber device and the method for manufacturing the same |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10502498B2 (en) * | 2015-07-20 | 2019-12-10 | Delta Electronics, Inc. | Slim vapor chamber |
| TWI592623B (en) * | 2015-09-23 | 2017-07-21 | 邁萪科技股份有限公司 | Vapor chamber and manufacturing method thereof |
| CN205093079U (en) * | 2015-11-17 | 2016-03-16 | 奇鋐科技股份有限公司 | Radiator |
| CN106255396B (en) * | 2016-10-18 | 2019-06-11 | 中车大连机车研究所有限公司 | A kind of pipe type microcirculation radiator and microcirculation heat-exchange system |
| CN106643246A (en) * | 2017-01-23 | 2017-05-10 | 中车大连机车研究所有限公司 | Composite wick type special-shaped heat pipe radiator |
-
2017
- 2017-05-25 CN CN201710377130.0A patent/CN107484386B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN107484386A (en) | 2017-12-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107484386B (en) | The manufacturing method of heat conducting device | |
| US10663231B2 (en) | Manufacturing method of heat conducting device | |
| EP2057678B1 (en) | Three-dimensional thermal spreading in an air-cooled thermal device | |
| US20140082943A1 (en) | Thin heat pipe structure and method of manufacturing same | |
| US20090308576A1 (en) | Heat pipe with a dual capillary structure and manufacturing method thereof | |
| US20090014154A1 (en) | Passive Thermal Management System | |
| CN106033749B (en) | Parallel parallel microchannels multicore sheet heat radiator | |
| TWM517314U (en) | Heat dissipation apparatus | |
| CN104197612B (en) | A kind of high efficiency and heat radiation assembly of semiconductor freezer | |
| TW201010590A (en) | Heat dissipation module, flat heat column thereof and manufacturing method for flat heat column | |
| US10240873B2 (en) | Joint assembly of vapor chambers | |
| TWI609164B (en) | Heat dissipation device | |
| TWM517315U (en) | Heat dissipating unit | |
| US9102020B2 (en) | Manufacturing method of thin heat pipe | |
| TWI596313B (en) | Heat dissipation device | |
| CN102208375B (en) | Circulation radiator, and manufacturing method and components thereof | |
| EP3772629B1 (en) | Heat dissipating fin with thermosiphon | |
| US10408506B2 (en) | Heat exchanger and method of manufacturing the same | |
| CN108614627B (en) | Fin-superconducting heat pipe integrated heat radiator for CPU | |
| TWI620910B (en) | A three dimensional vapor chamber device | |
| CN106793671B (en) | Heat radiation unit | |
| TW201732212A (en) | Heat pipe module and heat dissipating device using the same | |
| DK177987B1 (en) | Heat exchanger and method and application | |
| TWI690138B (en) | Three-dimensional heat transmission device and manufacturing method thereof | |
| US9421648B2 (en) | Manufacturing method of heat pipe structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |