CN107419524B - 一种超薄电磁屏蔽材料 - Google Patents
一种超薄电磁屏蔽材料 Download PDFInfo
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- 239000000463 material Substances 0.000 title claims abstract description 64
- 238000007747 plating Methods 0.000 claims abstract description 53
- 238000003490 calendering Methods 0.000 claims abstract description 46
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims abstract description 45
- 229910052751 metal Inorganic materials 0.000 claims abstract description 32
- 239000002184 metal Substances 0.000 claims abstract description 32
- 239000000126 substance Substances 0.000 claims abstract description 31
- 238000001035 drying Methods 0.000 claims abstract description 16
- 230000004913 activation Effects 0.000 claims abstract description 13
- 238000000034 method Methods 0.000 claims abstract description 8
- 239000004744 fabric Substances 0.000 claims description 35
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 16
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 12
- 230000003213 activating effect Effects 0.000 claims description 10
- 239000003638 chemical reducing agent Substances 0.000 claims description 10
- 238000007086 side reaction Methods 0.000 claims description 10
- 238000007788 roughening Methods 0.000 claims description 9
- 239000002683 reaction inhibitor Substances 0.000 claims description 7
- 229910021626 Tin(II) chloride Inorganic materials 0.000 claims description 6
- 239000000084 colloidal system Substances 0.000 claims description 6
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims description 6
- 229910052763 palladium Inorganic materials 0.000 claims description 6
- 239000003795 chemical substances by application Substances 0.000 claims description 3
- 238000009990 desizing Methods 0.000 claims description 3
- 210000001161 mammalian embryo Anatomy 0.000 claims description 3
- 230000007797 corrosion Effects 0.000 abstract description 6
- 238000005260 corrosion Methods 0.000 abstract description 6
- 150000003839 salts Chemical class 0.000 description 16
- 238000012360 testing method Methods 0.000 description 14
- 239000008367 deionised water Substances 0.000 description 12
- 229910021641 deionized water Inorganic materials 0.000 description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 12
- 238000002360 preparation method Methods 0.000 description 8
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Natural products CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 230000005611 electricity Effects 0.000 description 6
- 239000003292 glue Substances 0.000 description 6
- 239000007921 spray Substances 0.000 description 6
- 239000004327 boric acid Substances 0.000 description 5
- 239000000654 additive Substances 0.000 description 4
- 230000000996 additive effect Effects 0.000 description 4
- 235000019441 ethanol Nutrition 0.000 description 4
- DITXJPASYXFQAS-UHFFFAOYSA-N nickel;sulfamic acid Chemical compound [Ni].NS(O)(=O)=O DITXJPASYXFQAS-UHFFFAOYSA-N 0.000 description 4
- 229910052708 sodium Inorganic materials 0.000 description 4
- 239000011734 sodium Substances 0.000 description 4
- UEUXEKPTXMALOB-UHFFFAOYSA-J tetrasodium;2-[2-[bis(carboxylatomethyl)amino]ethyl-(carboxylatomethyl)amino]acetate Chemical group [Na+].[Na+].[Na+].[Na+].[O-]C(=O)CN(CC([O-])=O)CCN(CC([O-])=O)CC([O-])=O UEUXEKPTXMALOB-UHFFFAOYSA-J 0.000 description 4
- 229920004934 Dacron® Polymers 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- -1 Sodium alkyl sulfate Chemical class 0.000 description 3
- 125000005619 boric acid group Chemical group 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical group O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000011056 performance test Methods 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 230000001629 suppression Effects 0.000 description 3
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 241000692870 Inachis io Species 0.000 description 1
- RCEAADKTGXTDOA-UHFFFAOYSA-N OS(O)(=O)=O.CCCCCCCCCCCC[Na] Chemical compound OS(O)(=O)=O.CCCCCCCCCCCC[Na] RCEAADKTGXTDOA-UHFFFAOYSA-N 0.000 description 1
- 208000027418 Wounds and injury Diseases 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- MOTZDAYCYVMXPC-UHFFFAOYSA-N dodecyl hydrogen sulfate Chemical compound CCCCCCCCCCCCOS(O)(=O)=O MOTZDAYCYVMXPC-UHFFFAOYSA-N 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 125000005909 ethyl alcohol group Chemical group 0.000 description 1
- 208000014674 injury Diseases 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000011536 re-plating Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 239000004753 textile Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
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- D06M11/83—Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereof; Such treatment combined with mechanical treatment, e.g. mercerising with metals; with metal-generating compounds, e.g. metal carbonyls; Reduction of metal compounds on textiles
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- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
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- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
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- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
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Abstract
本发明提供了一种超薄电磁屏蔽材料,由以下方法制得:将厚度为0.04mm~0.045mm的柔性基材轧光,所述轧光的压力为15~25MPa,轧光的温度小于等于250℃;将轧光后的柔性基材依次进行粗化、活化、解胶、化学镀、电镀和烘干,得到超薄电磁屏蔽材料;粗化采用的粗化液为质量分数为15~25%的NaOH溶液;活化的温度为45~55℃。本发明通过采用厚度为0.04mm~0.045mm的柔性基材在特定条件下轧光,然后在质量分数为15~25%的NaOH溶液中粗化,再在温度为45~55℃下活化,使制得的超薄电磁屏蔽材料轻薄,且具有优异的电磁屏蔽性能和耐腐蚀性能;具有良好的装饰、服用、保护、消光和遮光性能。
Description
技术领域
本发明涉及电磁屏蔽材料技术领域,尤其涉及一种超薄电磁屏蔽材料。
背景技术
电磁屏蔽织物作为新型的EMC材料,兼有金属的导电性、电磁屏蔽的特性和纺织品的柔软、透气特性,是新兴用途广泛的屏蔽材料之一,已广泛应用于电子产品电磁兼容EMC领域(Electromagnetic Compatibility),以其制成导电布胶带、导电衬垫已广泛应用于手机、液晶电视LCD(Liquid Crystal Display)、笔记本电脑、网络硬件(机柜、路由器)、医疗电仪等电子产品,在航空航天及军工国防等领域也有广阔的发展前景(防雷达侦察遮障布、微波/电磁屏蔽室、伪装军事目标、雷达靶子等),民用市场也迅速增长(如屏蔽服、屏蔽视窗、电磁辐射防护服、劳动保护服等)。
随着电子、电器产品越来越普遍,产品的体积越来越小,产品的功率越来越大,电磁辐射产生的问题也日益严重,探索高效电磁屏蔽材料尤其是柔性电磁屏蔽织物,防止电磁波引起的电磁干扰、电磁兼容及对人体的伤害,对提高我国电子产品、弹药、引信、精密电子武器设备等的安全可靠性及人身安全,确保信息通信***、网络***、传输***、武器平台等的安全畅通及人身安全具有十分重要的意义。
从2001年第一款智能手机发布后,智能手机已经经历了十多年的发展历程。2001年,爱立信推出了世界上第一款智能手机,开创了手机在智能应用方面的先河,众多厂商看到智能手机市场的前景,纷纷展开研发,智能手机时代来临。在接下来的几年中,智能手机风靡全球。随着电子、通讯设备的高度集成化,产品体积越来越小,尤其是以手机为代表的电子产品,对电磁屏蔽材料的厚度要求也越来越高。为了使智能手机拥有更加轻薄的结构,必须减薄关键部位的厚度,因而需要使用更薄的电磁屏蔽材料,在不影响电磁兼容的情况下达到目标。
发明内容
有鉴于此,本发明的目的在于提供一种超薄电磁屏蔽材料,该电磁屏蔽材料轻薄,且具有优异的电磁屏蔽性能和耐腐蚀性能。
本发明提供了一种超薄电磁屏蔽材料,由以下方法制得:
将厚度为0.04mm~0.045mm的柔性基材轧光,所述轧光的压力为15~25MPa,轧光的温度小于等于250℃;
将轧光后的柔性基材依次进行粗化、活化、解胶、化学镀、电镀和烘干,得到超薄电磁屏蔽材料;
所述粗化采用的粗化液为质量分数为15~25%的NaOH溶液;
所述活化的温度为45~55℃。
优选地,所述活化采用的活化液包括胶体钯7~10ml/L、HCl 250~350ml/L和SnCl2 6~10g/L。
优选地,所述解胶采用的解胶剂为70~100ml/L的盐酸溶液。
优选地,所述化学镀采用的镀液包括硫酸铜8~12g/L、还原剂12~18g/L、配位剂35~45g/L和副反应抑制剂为1~2g/L。
优选地,所述化学镀的温度为40~50℃,化学镀的时间为10~20min。
优选地,所述电镀的温度为45~48℃;所述电镀的时间为10~20min。
优选地,所述粗化的温度为60~80℃;所述粗化的时间为10~20min。
优选地,所述柔性基材选自退浆处理的白胚布。
优选地,所述烘干的温度为50~60℃;所述烘干的时间为30~60min。
优选地,所述超薄电磁屏蔽材料的厚度为0.015±0.002~0.03±0.005mm。
本发明提供了一种超薄电磁屏蔽材料,由以下方法制得:将厚度为0.04mm~0.045mm的柔性基材轧光,所述轧光的压力为15~25MPa,轧光的温度小于等于250℃;将轧光后的柔性基材依次进行粗化、活化、解胶、化学镀、电镀和烘干,得到超薄电磁屏蔽材料;所述粗化采用的粗化液为质量分数为15~25%的NaOH溶液;所述活化的温度为45~55℃。本发明通过采用厚度为0.04mm~0.045mm的柔性基材在特定条件下轧光,然后在质量分数为15~25%的NaOH溶液中粗化,再在温度为45~55℃下活化,使制得的超薄电磁屏蔽材料轻薄,且具有优异的电磁屏蔽性能和耐腐蚀性能。另外,本发明提供的超薄电磁屏蔽材料具有良好的装饰、服用、保护、消光和遮光性能。实验结果表明:该电磁屏蔽材料的克重为26±5~46±5g/cm2;厚度为0.015±0.002~0.03±0.005mm;织物密度为340±10~480±10T;屏蔽效能为50~60dB(min)in 10MHz~3GHz;表面电阻≤0.07Ω/sq;盐雾试验<0.5Ω/sq。
附图说明
图1为本发明实施例1制备的超薄电磁屏蔽材料的厚度测试图。
具体实施方式
本发明提供了一种超薄电磁屏蔽材料,由以下方法制得:
将厚度为0.04mm~0.045mm的柔性基材轧光,所述轧光的压力为15~25MPa,轧光的温度小于等于250℃;
将轧光后的柔性基材依次进行粗化、活化、解胶、化学镀、电镀和烘干,得到超薄电磁屏蔽材料;
所述粗化采用的粗化液为质量分数为15~25%的NaOH溶液;
所述活化的温度为45~55℃。
本发明通过采用厚度为0.04mm~0.045mm的柔性基材在特定条件下轧光,然后在质量分数为15~25%的NaOH溶液中粗化,再在温度为45~55℃下活化,使制得的超薄电磁屏蔽材料轻薄,且具有优异的电磁屏蔽性能和耐腐蚀性能。
本发明将厚度为0.04mm~0.045mm的柔性基材轧光,所述轧光的压力为15~25MPa,轧光的温度小于等于250℃。在本发明中,所述柔性基材的克重优选为15~22g/m2。所述柔性基材优选选自退浆处理的白胚布。在本发明中,所述轧光时布面速度优选为20~30m/min。在本发明的具体实施例中,所述轧光的压力具体为15MPa、20MPa或25MPa;所述轧光的温度小于200℃,小于225℃或250℃。
本发明将轧光后的柔性基材依次进行粗化、活化、解胶、化学镀、电镀和烘干,得到超薄电磁屏蔽材料。
在本发明中,所述粗化的温度优选为60~80℃;在本发明的具体实施例中,所述粗化的温度为60℃、70℃或80℃。所述粗化的时间优选为10~20min;在本发明的具体实施例中,所述粗化的时间为10min、15min或20min。本发明优选将粗化后的柔性基材水洗,更优选采用去离子水清洗。
在本发明中,所述活化采用的活化液优选包括胶体钯7~10ml/L、HCl250~350ml/L和SnCl2 6~10g/L。本发明优选将粗化后的柔性基材浸泡在上述活化液中。所述活化的温度优选为48~52℃,更优选为50℃;活化的时间优选为2~5min。
本发明优选将活化后的柔性基材用去离子水漂洗干净后再解胶;所述解胶采用的解胶剂优选为70~100ml/L的盐酸溶液。所述解胶的温度优选为28~32℃,更优选为30℃;所述解胶的时间优选为2~4min。
本发明将解胶后的柔性基材用去离子水漂洗干净后再进行化学镀;所述化学镀采用的镀液优选包括硫酸铜8~12g/L、还原剂12~18g/L、配位剂35~45g/L和副反应抑制剂为1~2g/L。所述还原剂优选选自甲醛;所述配位剂优选为乙二胺四乙酸四钠,所述副反应抑制剂优选为乙醇。在本发明中,所述化学镀的温度优选为40~50℃,化学镀的时间优选为10~20min。所述镀液的pH值优选为11.5~12.5。
本发明将化学镀后的柔性基材水洗后再电镀。所述电镀的温度优选为45~48℃;所述电镀的时间优选为10~20min。所述电镀为电镀镍;电镀镍的溶液包括主盐氨基磺酸镍52~58g/L、硼酸27~33g/L和十二烷基硫酸钠0.2~0.4g/L;硼酸为缓冲剂;十二烷基硫酸钠为添加剂。电镀时的电流密度优选为0.5~1.5A/dm2。
本发明优选将电镀后的柔性基材水洗后再烘干。本发明优选采用本领域技术人员熟知的真空干燥箱进行烘干。在本发明中,所述烘干的温度优选为50~60℃;所述烘干的时间优选为30~60min。
在本发明中,所述超薄电磁屏蔽材料的厚度优选为0.015±0.002~0.03±0.005mm。
本发明提供了一种超薄电磁屏蔽材料,由以下方法制得:将厚度为0.04mm~0.045mm的柔性基材轧光,所述轧光的压力为15~25MPa,轧光的温度小于等于250℃;将轧光后的柔性基材依次进行粗化、活化、解胶、化学镀、电镀和烘干,得到超薄电磁屏蔽材料;所述粗化采用的粗化液为质量分数为15~25%的NaOH溶液;所述活化的温度为45~55℃。本发明通过采用厚度为0.04mm~0.045mm的柔性基材在特定条件下轧光,然后在质量分数为15~25%的NaOH溶液中粗化,再在温度为45~55℃下活化,使制得的电磁屏蔽材料轻薄,且具有优异的电磁屏蔽性能和耐腐蚀性能。另外,本发明提供的超薄电磁屏蔽材料具有良好的装饰、服用、保护、消光和遮光性能。实验结果表明:该电磁屏蔽材料的克重为26±5~46±5g/cm2;厚度为0.015±0.002~0.03±0.005mm;织物密度为340±10~480±10T;屏蔽效能为50~60dB(min)in 10MHz~3GHz;表面电阻≤0.07Ω/sq;盐雾试验<0.5Ω/sq。
为了进一步说明本发明,下面结合实施例对本发明提供的一种电磁屏蔽材料进行详细地描述,但不能将它们理解为对本发明保护范围的限定。
实施例1
(一)轧光
选厚度为0.04mm的涤纶织物轧光,轧光参数为压力15Mpa,温度小于200℃,布面速度为30m/min。
(二)粗化
将织物浸泡在质量分数为15%的氢氧化钠溶液中,60℃,10min条件下处理织物,然后用去离子水清洗干净。
(三)活化-解胶
将织物浸泡在活化液中,活化液中各组分的浓度分别为:胶体钯7ml/L,HCl250ml/L,SnCl2 6g/L,50℃下浸泡2min。用去离子水漂洗干净后,将织物浸泡在解胶液中,解胶液为70ml/L的盐酸溶液,30℃下浸泡2min。然后用去离子水漂洗干净;
(四)化学镀
将活化-解胶好的织物浸入化学镀中进行镀铜处理,其中溶液配方为:主盐8g/L,还原剂12g/L,配位剂35g/L,副反应抑制剂为1g/L,调节pH为11.5,温度为40℃,化学镀时间为10min,然后对织物进行水洗。
化学镀中的主盐为硫酸铜,还原剂为甲醛,配位剂为乙二胺四乙酸四钠,副反应抑制剂为乙醇;
(五)电镀
将上述化学镀铜处理好的织物进行电镀镍处理,反应条件为pH值为3.8,温度为40℃,电流密度0.5A/dm2,时间10min。
电镀镍中溶液组成:主盐为氨基磺酸镍52g/L,缓冲剂为硼酸27g/L,添加剂为十二烷基硫酸钠0.2g/L。
(六)烘干
将清洗干净的织物放入真空干燥箱内,烘干30min,温度为50℃,得到超薄电磁屏蔽材料。
本发明采用peacock公司生产的型号为G-7C的刻度盘式测厚仪对实施例1制备的超薄电磁屏蔽材料进行厚度的测量,如图1所示,图1为本发明实施例1制备的超薄电磁屏蔽材料的厚度测试图。从图1可知,实施例1制备的超薄电磁屏蔽材料的厚度为0.016mm。
本发明对实施例1制备的超薄电磁屏蔽材料进行克重、厚度、织物密度、屏蔽效能、表面电阻和盐雾试验测试,结果见表1,表1为本发明实施例1制备的超薄电磁屏蔽材料的性能测试结果:
表1本发明实施例1制备的超薄电磁屏蔽材料的性能测试结果
实施例2
制备方法具体操作步骤如下:轧光-粗化-活化-解胶-化学镀-电镀-烘干:
(一)轧光
选厚度为0.04mm的涤纶织物轧光,轧光参数为压力20Mpa,温度小于225℃,布面速度为25m/min。
(二)粗化
将织物浸泡在质量分数为20%的氢氧化钠溶液中,70℃,15min条件下处理织物,然后用去离子水清洗干净。
(三)活化-解胶
将织物浸泡在活化液中,活化液中各组分的浓度分别为,胶体钯8.5ml/L,HCl300ml/L,SnCl2 8g/L,50℃下浸泡3.5min。用去离子水漂洗干净后,将织物浸泡在解胶液中,解胶液为85ml/L的盐酸溶液,30℃下浸泡3min。然后用去离子水漂洗干净;
(四)化学镀
将活化-解胶好的织物浸入化学镀中进行镀铜处理,其中溶液配方为,主盐10g/L,还原剂15g/L,配位剂40g/L,副反应抑制剂为1.5g/L,调节pH为12,温度为45℃,化学镀时间为15min,然后对织物进行水洗。
化学镀中的主盐为硫酸铜,还原剂为甲醛,配位剂为乙二胺四乙酸四钠,副反应抑制剂为乙醇;
(五)电镀
将上述化学镀铜处理好的织物进行电镀镍处理,反应条件为pH值为4.0,温度为45℃,电流密度1.0A/dm2,时间15min。
电镀镍中溶液组成:主盐为氨基磺酸镍55g/L,缓冲剂为硼酸30g/L,添加剂为十二烷基硫酸钠0.3g/L。
(六)烘干
将清洗干净的织物放入真空干燥箱内,烘干45min,温度为55℃,得到超薄电磁屏蔽材料。
本发明对实施例2制备的超薄电磁屏蔽材料进行克重、厚度、织物密度、屏蔽效能、表面电阻和盐雾试验测试,结果见表2,表2为本发明实施例2制备的超薄电磁屏蔽材料的性能测试结果:
表2本发明实施例1制备的超薄电磁屏蔽材料的性能测试结果
实施例3
制备方法具体操作步骤如下:轧光-粗化-活化-解胶-化学镀-电镀-烘干:
(一)轧光
选厚度为0.045mm的涤纶织物轧光,轧光参数为压力25Mpa,温度250℃,布面速度为20m/min。
(二)粗化
将织物浸泡在质量分数为25%的氢氧化钠溶液中,80℃,20min条件下处理织物,然后用去离子水清洗干净。
(三)活化-解胶
将织物浸泡在活化液中,活化液中各组分的浓度分别为,胶体钯10ml/L,HCl350ml/L,SnCl2 10g/L,50℃下浸泡5min。用去离子水漂洗干净后,将织物浸泡在解胶液中,解胶液为100ml/L的盐酸溶液,30℃下浸泡4min。然后用去离子水漂洗干净;
(四)化学镀
将活化-解胶好的织物浸入化学镀中进行镀铜处理,其中溶液配方为,主盐12g/L,还原剂18g/L,配位剂45g/L,副反应抑制剂为2g/L,调节pH值为12.5,温度为50℃,化学镀时间为20min,然后对织物进行水洗。
化学镀中的主盐为硫酸铜,还原剂为甲醛,配位剂为乙二胺四乙酸四钠,副反应抑制剂为乙醇;
(五)电镀
将上述化学镀铜处理好的织物进行电镀镍处理,反应条件为pH值为4.2,温度为50℃,电流密度1.5A/dm2,时间20min。
电镀镍中溶液组成:主盐为氨基磺酸镍58g/L,缓冲剂为硼酸33g/L,添加剂为十二烷基硫酸钠0.4g/L。
(六)烘干
将清洗干净的织物放入真空干燥箱内,烘干60min,温度为60℃,得到超薄电磁屏蔽材料。
本发明对实施例3制备的超薄电磁屏蔽材料进行克重、厚度、织物密度、屏蔽效能、表面电阻和盐雾试验测试,结果见表3,表3为本发明实施例3制备的超薄电磁屏蔽材料的性能测试结果:
表3本发明实施例3制备的超薄电磁屏蔽材料的性能测试结果
由以上实施例可知,本发明提供了一种超薄电磁屏蔽材料,由以下方法制得:将厚度为0.04mm~0.045mm的柔性基材轧光,所述轧光的压力为15~25MPa,轧光的温度小于等于250℃;将轧光后的柔性基材依次进行粗化、活化、解胶、化学镀、电镀和烘干,得到超薄电磁屏蔽材料;所述粗化采用的粗化液为质量分数为15~25%的NaOH溶液;所述活化的温度为45~55℃。本发明通过采用厚度为0.04mm~0.045mm的柔性基材在特定条件下轧光,然后在质量分数为15~25%的NaOH溶液中粗化,再在温度为45~55℃下活化,使制得的电磁屏蔽材料轻薄,且具有优异的电磁屏蔽性能和耐腐蚀性能。另外,本发明提供的超薄电磁屏蔽材料具有良好的装饰、服用、保护、消光和遮光性能。实验结果表明:该电磁屏蔽材料的克重为26±5~46±5g/cm2;厚度为0.015±0.002~0.03±0.005mm;织物密度为340±10~480±10T;屏蔽效能为50~60dB(min)in 10MHz~3GHz;表面电阻≤0.07Ω/sq;盐雾试验<0.5Ω/sq。
以上所述仅是本发明的优选实施方式,应当指出,对于本技术领域的普通技术人员来说,在不脱离本发明原理的前提下,还可以做出若干改进和润饰,这些改进和润饰也应视为本发明的保护范围。
Claims (9)
1.一种超薄电磁屏蔽材料,由以下方法制得:
将厚度为0.04mm~0.045mm的柔性基材轧光,所述轧光的压力为15~25MPa,轧光的温度小于等于250℃;
将轧光后的柔性基材依次进行粗化、活化、解胶、化学镀、电镀和烘干,得到超薄电磁屏蔽材料;
所述粗化采用的粗化液为质量分数为15~25%的NaOH溶液;
所述活化的温度为45~55℃;
所述活化采用的活化液包括胶体钯7~10ml/L、HCl 250~350ml/L和SnCl2 6~10g/L。
2.根据权利要求1所述的超薄电磁屏蔽材料,其特征在于,所述解胶采用的解胶剂为70~100ml/L的盐酸溶液。
3.根据权利要求1所述的超薄电磁屏蔽材料,其特征在于,所述化学镀采用的镀液包括硫酸铜8~12g/L、还原剂12~18g/L、配位剂35~45g/L和副反应抑制剂为1~2g/L。
4.根据权利要求1所述的超薄电磁屏蔽材料,其特征在于,所述化学镀的温度为40~50℃,化学镀的时间为10~20min。
5.根据权利要求1所述的超薄电磁屏蔽材料,其特征在于,所述电镀的温度为45~48℃;所述电镀的时间为10~20min。
6.根据权利要求1所述的超薄电磁屏蔽材料,其特征在于,所述粗化的温度为60~80℃;所述粗化的时间为10~20min。
7.根据权利要求1所述的超薄电磁屏蔽材料,其特征在于,所述柔性基材选自退浆处理的白胚布。
8.根据权利要求1所述的超薄电磁屏蔽材料,其特征在于,所述烘干的温度为50~60℃;所述烘干的时间为30~60min。
9.根据权利要求1所述的超薄电磁屏蔽材料,其特征在于,所述超薄电磁屏蔽材料的厚度为0.015±0.002~0.03±0.005mm。
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