CN107402682A - A kind of touch-screen and its preparation method - Google Patents
A kind of touch-screen and its preparation method Download PDFInfo
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- CN107402682A CN107402682A CN201710640550.3A CN201710640550A CN107402682A CN 107402682 A CN107402682 A CN 107402682A CN 201710640550 A CN201710640550 A CN 201710640550A CN 107402682 A CN107402682 A CN 107402682A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
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- Manufacturing Of Printed Circuit Boards (AREA)
- Position Input By Displaying (AREA)
Abstract
This application provides a kind of touch-screen and its preparation method.The touch-screen includes frame lead and induction region, and frame lead includes：Edge lead, the width in the gap between at least part of at least two adjacent edge leads is D2；Middle leads, the width in the gap between any two middle leads is D1, D2>D1.In the touch-screen, the width at least part of gap of at least two adjacent edge leads is more than the width in the gap between two adjacent middle leads, it may further ensure that two adjacent edge leads are completely separable, and then the problem of avoiding edge lead that short circuit easily occurs, the frame lead ensure that touch-screen has good performance.
Description
Technical field
The application is related to touch-screen field, in particular to a kind of touch-screen and its preparation method.
Background technology
It is well known that capacitance plate is not bad in the past, simply applies and be short of in the technology of large scale touch-screen,
Capacitance plate can even deserve to be called the mark of an era development, and the mobile phone or flat board more than 95% of in the market are all using electricity
Rong Ping, it is very popular to well imagine capacitance plate.
With the gradual maturation of large scale capacitance plate technology, also input sells ranks, chi to capacitance plate touch one-piece machine again
Very little aspect can reach 98 cun, also, with the advantages of click is sensitive and the response time is fast is touched, major domain purposes has：Enterprise
Industry meeting, commercial advertisement, education and instruction, intelligence inquiry, exhibitions displaying, smart home and intelligent game etc..
At present, as shown in figure 1, the circuit that large scale touches screen products includes induction region 1' and frame lead 2', frame
The forming process of lead mainly includes：First, using printing screen plate in frame region printed leads material, then, according to laser
Laser path 02' in design drawing 2, frame lead is gone out by laser-induced thermal etching laser.
Because printing screen plate can stop lead material, and then cause at the marginal position of the frame region of induction region
Lead material it is thicker, the lead material of middle position is relatively thin, and the frame lead at such marginal position is easy to short circuit, such as
Shown in Fig. 3, the black of right side (i.e. in face of paper or the right-hand side of the people of screen) represents lead material, white in black region
Interval of the colo(u)r streak bar between frame lead, the frame lead material in left side can not be completely separable, i.e., the frame at marginal position
Lead material can not be completely separable.If increase laser energy separates the lead material at marginal position, can cause again in
Between opening position lead material broken string increase.
The content of the invention
The main purpose of the application is to provide a kind of touch-screen and its preparation method, to solve frame of the prior art
The problem of short circuit easily occurs for the frame lead of the easy short circuit of lead or centre position in lead at marginal position.
To achieve these goals, according to the one side of the application, there is provided a kind of touch-screen, the touch-screen include side
Frame lead and induction region, above-mentioned frame lead include：Edge lead, at least portion of at least two adjacent above-mentioned edge leads
/ the width in gap be D2；Middle leads, the width in the gap between the above-mentioned middle leads of any two is D1, D2>
D1。
Further, above-mentioned frame lead has bending section in the longitudinal direction, and the above-mentioned gap that width is D2 extends
Projection of the terminal on above-mentioned edge lead on the above-mentioned bending section or above-mentioned bending section downstream.
Further, projection of the terminal that the above-mentioned gap that width is D2 extends on above-mentioned edge lead is located at above-mentioned folding
The starting point of curved segment overlaps.
Further, above-mentioned D2 is 0.055~0.01mm, and above-mentioned D1 is 0.03~0.05mm.
Further, above-mentioned D2 is 0.07~0.08mm, and above-mentioned D1 is 0.04mm.
Further, above-mentioned induction region includes induction channels and imitative ornamental thread road, above-mentioned induction channels and above-mentioned imitative ornamental thread
Boundary line between road is boundary line, and above-mentioned imitative ornamental thread road includes the side of the remote above-mentioned induction channels positioned at above-mentioned boundary line
Imitative decoration road, above-mentioned boundary line and above-mentioned imitative decoration road are etched by laser beam along border thread path and imitative decoration road path respectively
Formed, the minimum interval between above-mentioned border thread path and above-mentioned imitative decoration road path is 0.5~1 times of the width of above-mentioned laser beam
Between, the Maximum overlap width of above-mentioned boundary line and above-mentioned imitative decoration road after etching is 0~0.5 times of the width of laser beam.
According to the another aspect of the application, there is provided a kind of preparation method of touch-screen, the preparation method are drawn including frame
The manufacturing process of line and the manufacturing process of induction region, the manufacturing process of above-mentioned frame lead include：Form frame trace layer；Adopt
Above-mentioned frame trace layer is etched along first path with laser beam, forms middle leads and edge lead so that any two is adjacent
Above-mentioned middle leads and arbitrary two adjacent above-mentioned edge leads between the width in gap be D1；Swashed using above-mentioned
Light beam etches at least part region of above-mentioned edge lead formation along the second path so that at least two above-mentioned edge leads are extremely
The width in the gap between small part increases to D2 by above-mentioned D1.
Further, the above-mentioned laser beam along above-mentioned first path and the above-mentioned laser beam etching along above-mentioned second path
Region has the part overlapped.
Further, above-mentioned first path has traveling bending section, and above-mentioned traveling bending section draws for forming above-mentioned frame
The bending section of line, the projection of the terminal of above-mentioned second path extension in above-mentioned first path be located on above-mentioned traveling bending section or
Positioned at the downstream of above-mentioned traveling bending section.
Further, projection of the extension terminal in above-mentioned second path in above-mentioned first path and above-mentioned traveling bending section
Starting point overlap.
Further, the width of above-mentioned laser beam is equal to d, and above-mentioned d is 0.03~0.05mm.
Further, the distance between above-mentioned first path and above-mentioned second path are 0.025~0.05mm.
Further, above-mentioned d is 0.04mm, the distance between above-mentioned first path and above-mentioned second path be 0.03~
0.04mm。
Further, the manufacturing process of above-mentioned induction region includes：Form inductive layer；Using above-mentioned laser beam in above-mentioned sense
Answer and etch to form multiple boundary lines along border thread path on layer；Using above-mentioned laser beam in the side of each above-mentioned boundary line along imitative decorations
Lines path etches to form imitative decoration road, and the opposite side of each above-mentioned boundary line does not form the part as sensing on above-mentioned imitative decoration road
Passage；Minimum interval between above-mentioned border thread path and above-mentioned imitative decoration road path is 0.5~1 times of the width of above-mentioned laser beam
Between, the Maximum overlap width of above-mentioned boundary line and above-mentioned imitative decoration road after etching is the 0~0.5 of the width of above-mentioned laser beam
Times.
Using the technical scheme of the application, the width at least part of gap of at least two adjacent edge leads is more than
The width in the gap between two adjacent middle leads, it may further ensure that two adjacent edge leads are completely separable, enter
And the problem of avoiding edge lead that short circuit easily occurs, the frame lead ensure that touch-screen has good performance.
Brief description of the drawings
The Figure of description for forming the part of the application is used for providing further understanding of the present application, and the application's shows
Meaning property embodiment and its illustrate be used for explain the application, do not form the improper restriction to the application.In the accompanying drawings：
Fig. 1 shows a kind of structural representation of sense film of the prior art；
Fig. 2 shows laser beam design drawing corresponding to Fig. 1；
Fig. 3 shows the microscope figure of Fig. 1 partial structurtes；
Fig. 4 shows the structural representation of frame lead in the sense film that a kind of embodiment of the application provides；
Fig. 5 shows Fig. 4 close-up schematic view；
Fig. 6 shows that a kind of embodiment of the application provides quick-fried situation schematic diagram；
Fig. 7 shows the design drawing for the laser beam that another embodiment of the application provides；
Fig. 8 shows the local microscope figure for the sense film that a kind of embodiment of the application provides；And
Fig. 9 shows the partial structural diagram for the induction region that the another embodiment of the application provides.
Wherein, above-mentioned accompanying drawing marks including the following drawings：
1', induction region；2', frame lead；02', laser path；1st, induction region；2nd, edge lead；3rd, centre is drawn
Line；20th, bending section；01st, first path；02nd, the second path；03rd, laser piecemeal line；010th, traveling bending section；10th, sensing is logical
Road；11st, boundary line；12nd, decoration road is imitated；011st, border thread path；012nd, decoration road path is imitated；013rd, lead district border.
Embodiment
It is noted that described further below is all exemplary, it is intended to provides further instruction to the application.It is unless another
Indicate, all technologies used herein and scientific terminology are with usual with the application person of an ordinary skill in the technical field
The identical meanings of understanding.
It should be noted that term used herein above is merely to describe embodiment, and be not intended to restricted root
According to the illustrative embodiments of the application.As used herein, unless the context clearly indicates otherwise, otherwise singulative
It is also intended to include plural form, additionally, it should be understood that, when in this manual using term "comprising" and/or " bag
Include " when, it indicates existing characteristics, step, operation, device, component and/or combinations thereof.
As background technology is introduced, in the prior art, in the frame trace layer formed using printing screen plate, margin location
Put that the lead material at place is thicker, the relatively thin edge lead of the lead material in centre position, if be defined by the thickness in centre position
To carry out laser-induced thermal etching, then, the frame lead that follow-up laser incising is formed at marginal position is easy to inseparable, causes short
Road problem；If mainly consider the thickness of marginal position, then, the frame lead that follow-up laser incising is formed in middle position
It is easy to break.In order to solve technical problem as above, present applicant proposes a kind of touch-screen and its preparation method.
In a kind of typical embodiment of the application, there is provided a kind of touch-screen, the touch-screen include frame lead and
Induction region 1, as shown in figure 4, the frame lead includes edge lead 2 and middle leads 3, wherein, frame lead is close to sensing
Region, middle leads are located at the opening position of the remote induction region of frame lead.Wherein, as shown in Fig. 5 partial enlarged drawing, extremely
The width in the gap between at least part of few two adjacent above-mentioned edge leads 2 is D2；The above-mentioned middle leads 3 of any two
Between the width in gap be D1, D2>D1.
In the frame lead of above-mentioned touch-screen, the width at least part of gap of at least two adjacent edge leads
The width in the gap between more than two adjacent middle leads, it may further ensure that two adjacent edge leads divide completely
The problem of opening, and then avoiding edge lead that short circuit easily occurs, and ensure that the problem of breaking, the frame is not present in middle leads
Lead ensure that touch-screen has good performance.
In addition, it is necessary to explanation, the frame lead of the application can apply simultaneously touch-screen two sense films i.e.
Usually said upper film is with that in lower film, can also apply in any one sense film, those skilled in the art can in this area
So that above-mentioned frame lead is applied in any one sense film according to actual conditions.
It should be noted that in Fig. 4, Fig. 5 and Fig. 6, Fig. 8 and Fig. 9 hereafter, white part represents there is material
Region, the part of black represents that the material is etched removal, i.e., for the induction region of centre, white part represents
Region with inductive material, the part of black represent that the inductive material of the part is etched and eliminated；For frame lead pair
For the region answered, white part represents the region with lead material, the region of black to should part lead material
It is etched and eliminates.No matter for region corresponding to induction region or frame lead, the part of black corresponds to laser beam
The path of etching, also correspond to the gap of white portion.
In a kind of embodiment of the application, as shown in figs. 4 and 5, above-mentioned frame lead has bending in the longitudinal direction
Section 20, projection of the terminal on above-mentioned edge lead 2 that the above-mentioned gap that width is D2 extends be located on above-mentioned bending section 20 or
The downstream of above-mentioned bending section 20.The situation of fracture occurs in the gap that so can further avoid width from being D1, if width
For D2 above-mentioned gap extend terminal on above-mentioned edge lead 2 projection positioned at above-mentioned bending section 20 upstream be it is close or
The not up to position of the starting point of bending section 20 (basipetal order in figure), the width in the above-mentioned gap downstream that width is D2 can make it that
The energy deficiency of the starting point in the gap for D1 is spent, short circuit easily occurs.
It is wide in a kind of embodiment of the application in order to which the situation of short circuit occurs in the gap for further avoiding width from being D1
Projection of the terminal of the above-mentioned gap extension for D2 on above-mentioned edge lead 2 is spent to overlap positioned at the starting point of above-mentioned bending section 20.
Each travel range is limited during due to laser-induced thermal etching, therefore to needing etching area to be provided with virtual laser piecemeal line
03, to show each laser-induced thermal etching border, laser-induced thermal etching is spliced in boundary, but forming the gap that width is D2 inherently needs
Laser energy is wanted with regard to larger, is led in order to avoid laser energy again is superimposed with the width formed for the laser energy in D2 gap
Cause to break, in a kind of embodiment of the application, above-mentioned touch-screen also includes induction region 1, and it is logical that above-mentioned induction region 1 includes sensing
Road, above-mentioned induction channels include boundary line, and above-mentioned laser piecemeal line is located between the gap that different width is D2, and as far as possible
Laser piecemeal line is arranged to the position of less laser-induced thermal etching, such as at induction channels.
In another embodiment of the application, above-mentioned D2 is 0.055~0.01mm, and above-mentioned D1 is 0.03~0.05mm.This
Sample can allow two laser beams to partially overlap, and be further ensured that edge lead is not short-circuit, and two endless full weights of laser beam
Close, further avoid energy from concentrating, cause film spot shape to burn, cause quick-fried perforated line.
In order to be further ensured that edge lead is not short-circuit and further avoiding energy to concentrate simultaneously causes film spot shape to burn very
The problem of to quick-fried perforated line, in a kind of embodiment of the application, above-mentioned D2 is 0.07~0.08mm, and above-mentioned D1 is 0.04mm.
Because laser splices characteristic in itself, stitching position needs as far as possible can be logical on imitative decoration road and sensing in straight line, splicing
The border line overlap in road, 4 times of numbers of that position meeting laser normal position energy, so the position of laser piecemeal line can cause
The point-like of sense film is burnt, that is, the quick-fried point B shown in Fig. 6 occurs, in order to prevent the generation of quick-fried point, another embodiment of the application
In, as shown in Fig. 4 and Fig. 9, above-mentioned induction region 1 includes induction channels and imitative ornamental thread road, and above-mentioned induction channels 10 are imitated with above-mentioned
Boundary line between ornamental thread road is boundary line 11, and above-mentioned imitative ornamental thread road includes the remote above-mentioned induction channels 10 positioned at above-mentioned boundary line
Side imitative decoration road 12, above-mentioned boundary line 11 and above-mentioned imitative decoration road 12 are by laser beam respectively along border thread path 011
Etch and formed with imitative decoration road path 012, the minimum interval between above-mentioned border thread path 011 and above-mentioned imitative decoration road path 012
Between 0.5~1 times of the width of above-mentioned laser beam, above-mentioned boundary line 11 and above-mentioned imitative decoration road 12 after laser beam etching
Maximum overlap width is 0~0.5 times of the width of laser beam.
It should be noted that the above-mentioned induction region of the application can apply the two sense films i.e. sheet in touch-screen simultaneously
In field in usually said upper film and lower film, it can also be applied in any one sense film, those skilled in the art can be with
Above-mentioned induction region is applied in any one sense film according to actual conditions.
In the typical embodiment of another of the application, there is provided a kind of preparation method of touch-screen, including frame draw
The manufacturing process of line and the manufacturing process of induction region 1, wherein, the manufacturing process of frame lead includes：Form frame trace layer；
Above-mentioned frame trace layer is etched using first path 01 of the laser beam along Fig. 7, forms middle leads and edge lead so that be any
The width in the gap between the above-mentioned edge lead of spacing and any two between two above-mentioned middle leads is D1；Using upper
State second path 02 of the laser beam along Fig. 7 and etch at least part region that above-mentioned edge lead is formed so that at least two edges
The width in the gap between at least part of lead increases to D2 by above-mentioned D1, and then the frame formed in Fig. 4, Fig. 5 and Fig. 8 draws
Line.
Using the preparation method, in the fringe region of frame trace layer, at least two sides are formed using two laser beams
The part spacing of edge lead so that the spacing of the part is larger, and then the frame lead in thicker lead areas is separated, and delays
The problem of having solved caused edge lead short circuit thicker due to the fringe region of frame trace layer in the prior art, also, the party
The laser beam of middle leads need not be increased in method, avoid the disconnection problem of middle leads, so as to ensure that the side in touch-screen
Frame lead has good electric property.
For the situation of edge shorting caused by further avoiding edge silver paste blocked up, in a kind of embodiment of application, such as
Shown in Fig. 7, the region of the laser beam along above-mentioned first path 01 and the laser beam etching along above-mentioned second path 02, which has, to be overlapped
Part.
In another embodiment of the application, as shown in fig. 7, above-mentioned first path 01 has traveling bending section 010, it is above-mentioned
Traveling bending section 010 is used for the bending section for forming above-mentioned frame lead, and the terminal in above-mentioned second path 02 is in first path 01
Projection on the above-mentioned traveling bending section or positioned at the downstream of above-mentioned traveling bending section.The width so can be further avoided to be
The situation of fracture occurs in D1 gap, if the terminal that the above-mentioned gap that width is D2 extends is on above-mentioned edge lead 2
Projection is located at least in the upstream of above-mentioned bending section 20 i.e. closer to the position of laser beam starting point, and width can be caused for above-mentioned of D2
The width in gap downstream is the energy deficiency of the starting point in D1 gap, and short circuit easily occurs.
It should be noted that the black lines in addition to lead district border 013 in Fig. 7 represent the etched path of laser beam.
In order to avoid short-circuit situation occurs for D1 gap for width, the terminal in above-mentioned second path 02 is in first path
Projection on 01 overlaps with the starting point of above-mentioned laser bending section.
Due to this body structure of laser, typically once can only laser certain distance, product exceedes a laser of laser
Distance is, it is necessary to carry out subregion laser, and in a kind of embodiment of the application, as shown in Fig. 4 and Fig. 7, above-mentioned frame lead is divided into
Multiple regions, the line of demarcation between different zones are laser piecemeal line 03, and it is each that laser piecemeal line 03 only shows that laser beam is carried out
The movable boundary of etching, the line actually and are not present, the terminal in above-mentioned second path 02 be located at above-mentioned laser piecemeal line with it is upper
State between sensor wire channel boundary line.Laser energy is inherently needed with regard to larger due to forming the gap that width is D2, so
The laser energy in the gap that second of laser energy is D2 with the width formed can be avoided to be superimposed, and then the part can be avoided
The frame lead in region breaks, and ensure that frame lead has good electric property.
In a kind of embodiment of the application, the width of above-mentioned laser beam is equal to d, and above-mentioned d is 0.03~0.05mm.This Shen
Please in the width d of laser beam be equal to above-mentioned D1.Can so allow has along first path 01 and two laser beams in the second path 02
Partially overlap, be further ensured that edge lead is not short-circuit, and two laser beams not exclusively overlap, and further avoiding can quantity set
In, cause film spot shape to burn, cause quick-fried perforated line.
The above-mentioned gap that width in the application is D2 due to be by the laser beam along first path 01 with along the second path
What 02 laser beam was formed, i.e., the width of laser beam is equal to the width in corresponding path, so, D2 should be equal to two laser beams
The width in the region in the path of etching, i.e., the half-breadth and the first via of a half-breadth, the second path 02 equal to first path 01
The distance between the path 02 of footpath 01 and second distance refers to the distance of the center line of first path 01 and the center line in the second path 02.
In another embodiment of the application, the above-mentioned first path 01 and above-mentioned the in the above-mentioned gap that width is D2 is formed
The distance between two paths 02 are 0.025~0.05mm, and when D1 is 0.03~0.05mm, then D2 is 0.055~0.01mm.
In order to be further ensured that edge lead is not short-circuit and further avoiding energy to concentrate simultaneously causes film spot shape to burn very
The problem of to quick-fried perforated line, in another embodiment of the application, above-mentioned d be 0.04mm, forms above-mentioned gap of the width for D2
Above-mentioned first path 01 and the distance between above-mentioned second path 02 be 0.03~0.04mm, i.e. D2 is 0.07~0.08mm.
In order to prevent the generation of quick-fried point, in a kind of embodiment of the application, the manufacturing process of above-mentioned induction region includes：Shape
Into inductive layer, multiple boundary lines are formed along the etching of border thread path 011 on above-mentioned inductive layer using laser beam；Using laser beam
Imitative decoration road is formed along the etching of imitative decoration road path 012 in the side of each above-mentioned boundary line, the opposite side of each above-mentioned boundary line is not
The part for forming above-mentioned imitative decoration road is induction channels；Between above-mentioned border thread path 011 and above-mentioned imitative decoration road path 012
Between minimum interval is 0.5~1 times of the width of above-mentioned laser beam, above-mentioned boundary line and above-mentioned imitative decoration after laser beam etching
The Maximum overlap width on road is 0~0.5 times of the width of laser beam, forms the structure shown in Fig. 9.
The manufacturing process of above-mentioned induction region can be used for usually said in two sense films i.e. this area of touch-screen
Upper film and lower film in, can be used in any one sense film, those skilled in the art can will be upper according to actual conditions
State in manufacturing process of the method applied to the induction region of any one sense film.
In addition, it is necessary to explanation, the manufacturing process of the frame lead of the application can be equally used for two of touch-screen
Sense film is upper film usually said in this area with lower film, can be used in any one sense film, art technology
In the manufacturing process for the frame lead that the above method can be applied to any one sense film according to actual conditions by personnel.
In another embodiment of the application, the width W in above-mentioned border thread path 011 and above-mentioned imitative decoration road path 012
For 0.04mm.So between border thread path 011 and above-mentioned imitative decoration road path 012 at intervals of 0.02~0.04mm.
As can be seen from the above description, the application the above embodiments realize following technique effect：
1st, in the frame lead of the application, the width at least part of gap of at least two adjacent edge leads is more than
The width in the gap between two adjacent middle leads, it may further ensure that two adjacent edge leads are completely separable, enter
And the problem of avoiding edge lead that short circuit easily occurs, and ensure that the problem of breaking, the frame lead is not present in middle leads
It ensure that touch-screen has good performance.
2nd, the preparation method of the application, in the fringe region of frame trace layer, at least two are formed using two laser beams
The portion gap of individual edge lead so that the gap of the part is larger, and then the frame lead in thicker lead areas is divided
Open, alleviate in the prior art due to the fringe region of frame trace layer it is thicker caused by edge lead short circuit the problem of, also,
The laser beam of middle leads need not be increased in this method, the disconnection problem of middle leads is avoided, so as to ensure that in touch-screen
Frame lead there is good electric property.
The preferred embodiment of the application is the foregoing is only, is not limited to the application, for the skill of this area
For art personnel, the application can have various modifications and variations.It is all within spirit herein and principle, made any repair
Change, equivalent substitution, improvement etc., should be included within the protection domain of the application.
Claims (14)
1. a kind of touch-screen, including frame lead and induction region (1), it is characterised in that the frame lead includes：
Edge lead (2), the width in the gap between at least part of at least two adjacent edge leads (2) is D2；
And
Middle leads (3), the width in the gap between middle leads (3) described in any two is D1, D2>D1.
2. touch-screen according to claim 1, it is characterised in that the frame lead has bending section in the longitudinal direction
(20) projection of the terminal that the gap that, width is D2 extends on the edge lead (2) is located at the bending section (20)
The downstream of upper or described bending section (20).
3. touch-screen according to claim 2, it is characterised in that the terminal that the gap that width is D2 extends is described
The starting point that projection on edge lead (2) is located at the bending section (20) overlaps.
4. touch-screen according to claim 1, it is characterised in that the D2 is 0.055~0.01mm, and the D1 is 0.03
~0.05mm.
5. touch-screen according to claim 1, it is characterised in that the D2 is 0.07~0.08mm, and the D1 is
0.04mm。
6. touch-screen according to claim 1, it is characterised in that the induction region (1) include induction channels (10) and
Imitative ornamental thread road, the boundary line between the induction channels (10) and the imitative ornamental thread road is boundary line (11), the imitative ornamental thread road bag
Include the imitative decoration road (12) of the side of the remote induction channels (10) positioned at the boundary line (11), the boundary line (11)
Etch and to be formed along border thread path and imitative decoration road path by laser beam respectively with the imitative decoration road (12), the boundary line
Between minimum interval between path and the imitative decoration road path is 0.5~1 times of the width of the laser beam, the institute after etching
The Maximum overlap width of boundary line (11) and the imitative decoration road (12) is stated as 0~0.5 times of the width of laser beam.
7. a kind of preparation method of touch-screen, including the manufacturing process of frame lead and the manufacturing process of induction region, its feature
It is, the manufacturing process of the frame lead includes：
Form frame trace layer；
The frame trace layer is etched along first path using laser beam, forms middle leads and edge lead so that any two
The width in the gap between the individual adjacent middle leads and arbitrary two adjacent edge leads is D1；And
At least part region of the edge lead formation is etched along the second path using the laser beam so that at least two institutes
The width for stating the gap between at least part of edge lead increases to D2 by the D1.
8. preparation method according to claim 7, it is characterised in that along the first path the laser beam with along institute
The region for stating the laser beam etching in the second path has the part overlapped.
9. preparation method according to claim 8, it is characterised in that the first path has traveling bending section, described
Traveling bending section is used for the bending section for forming the frame lead, and the terminal of the second path extension is in the first path
Projection on the traveling bending section or positioned at the downstream of the traveling bending section.
10. preparation method according to claim 9, it is characterised in that the extension terminal in second path is described
Projection on one path overlaps with the starting point of the traveling bending section.
11. preparation method according to claim 7, it is characterised in that the width of the laser beam is equal to d, and the d is
0.03~0.05mm.
12. preparation method according to claim 11, it is characterised in that between the first path and second path
Distance be 0.025~0.05mm.
13. preparation method according to claim 11, it is characterised in that the d is 0.04mm, the first path and institute
It is 0.03~0.04mm to state the distance between second path.
14. preparation method according to claim 7, it is characterised in that the manufacturing process of the induction region includes：
Form inductive layer；
Etch to form multiple boundary lines along border thread path on the inductive layer using the laser beam；And
Etch to form imitative decoration road along imitative decoration road path in the side of each boundary line using the laser beam, each side
The part that the opposite side in boundary line does not form the imitative decoration road is induction channels；
Minimum interval between the border thread path and the imitative decoration road path is 0.5~1 times of the width of the laser beam
Between, the Maximum overlap width of the boundary line and the imitative decoration road after etching is the 0~0.5 of the width of the laser beam
Times.
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