CN107340573A - Lamination photoelectricity interconnects printed board and its implementation - Google Patents
Lamination photoelectricity interconnects printed board and its implementation Download PDFInfo
- Publication number
- CN107340573A CN107340573A CN201710739720.3A CN201710739720A CN107340573A CN 107340573 A CN107340573 A CN 107340573A CN 201710739720 A CN201710739720 A CN 201710739720A CN 107340573 A CN107340573 A CN 107340573A
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- copper
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- fiber waveguide
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4237—Welding
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4287—Optical modules with tapping or launching means through the surface of the waveguide
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Integrated Circuits (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The present invention discloses a kind of lamination photoelectricity interconnection printed board and its implementation, and lamination photoelectricity interconnection printed board includes the laminar substrate of upper, middle and lower 3, optical transmitting set, optical receiver and fiber waveguide；Fiber waveguide is produced on lower substrate surface, and Intermediate substrate is pressed together in fiber waveguide, and optical transmitting set and optical receiver are mounted on the surface of Intermediate substrate, and face standard by 45 ° of coupled ends of light through hole and fiber waveguide；Pad array is surrounded by laser and detector, identical pad array is provided with the same position of upper substrate surface, and it is implanted into soldered ball on all pads of upper substrate, the pin of optical transceiver is connected on pad by substrate upward wiring, top substrate layer and Intermediate substrate are interconnected by soldered ball, form 3 layers of stacked structure.The defects of easily causing damage in the high-temperature laminating technical process of printed board instant invention overcomes optical transceiving device, realize in the plate of opto-electronic conversion and conduction path and assemble.
Description
Technical field
The invention belongs to technical field of electronic devices, particularly a kind of photoelectricity interconnection printed board EOPCB laminated construction and
Its implementation, in the research available for multilayer EOPCB.
Background technology
With the development of electronic information technology, explosive growth is presented to the demand of high-speed communication, and with data transfer
Speed and frequency rise, between short-range interconnection field, especially electronic equipment internal machine frame, between veneer and
Interconnection between chip, the build-in attribute such as Kelvin effect and dielectric loss can make high speed signal distortion, band in traditional electricity interconnection
Width is limited.New photoelectricity interconnection has many features, such as low-energy-consumption, eliminates EMI, high bandwidth, high speed, special based on these
Point, light network are very suitable for the transmission of plate level signal.
Package technique is primarily referred to as the whole piece photoelectricity including photonic device in photoelectricity interconnection printed board EOPCB plate
Process routes in path embedment pcb board, electrical characteristic interface is only stayed in PCB surface, to strengthen the reliability of photoelectricity interconnection.It is existing
There is the connection between technique processing multilayer printed circuit board adjacent layer to be realized by prepreg melting.Realized using heat pressing process
Assembled in photonic device plate, it is necessary to the good mould of lamination is put into laminating machine, by the method for HTHP, makes prepreg
Melting.Now, the performance of photonic device has to keep stable under nearly 200 DEG C of high temperature and 15kp/cm2 pressure, and light
Sub- device is more sensitive to temperature and pressure, and such a process easily causes very big mechanical damage and heat waste to photonic device
Wound, device performance is caused to fail or fail.
Therefore to realize that assembling of the photonic device in printed circuit board can not directly utilize existing ripe PCB technology side
Method is carried out.
The content of the invention
It is an object of the invention to for above-mentioned deficiency of the prior art, propose a kind of lamination photoelectricity interconnection printed board and
Its implementation, with avoid photonic device caused in the high-temperature laminating technical process of printed board failure the problem of, make photoelectricity turn
Change and conduction path is completed in substrate completely, play a protective role.
To achieve the above object, lamination photoelectricity of the invention interconnection printed board, including：
The laminar substrate of upper, middle and lower 3, optical transmitting set, optical receiver and fiber waveguide；Fiber waveguide is produced on lower substrate surface, fiber waveguide
It is provided with 45 ° of coupling end faces；Intermediate substrate is pressed together in fiber waveguide, and optical transmitting set and optical receiver are mounted on the table of Intermediate substrate
Face, and face standard with 45 ° of coupled ends of fiber waveguide, it is characterised in that：
Pad array is surrounded by the optical transmitting set positioned at the upper surface of Intermediate substrate and optical receiver, in upper substrate
Same position be provided with identical pad array, and be implanted into soldered ball, optical transmitting set and light-receiving on all pads of upper substrate
The pin of device is connected on pad by substrate upward wiring, and top substrate layer and Intermediate substrate are interconnected by soldered ball, is formed 3 layers and is stacked knot
Structure.
To achieve the above object, implementation method of the invention, comprises the following steps：
(1) sandwich layer of rectangular optical waveguide and upper and lower covering are made using the method for development etching in the first copper-clad plate, and
Laser ablation fiber waveguide, then carry out chemical plating, plating, shape reflective micro-mirrors at 45 °；
(2) make anchor point on second copper-clad plate according to 45 ° of reflective micro-mirrors positions, be in each reserved area of anchor point
N*N space, pad array, wherein N >=5mm are placed outside reserved location, repeat this copper-clad plate of step process the 3rd；
(3) second copper-clad flaggy is pressed onto fiber waveguide top covering, and a light through hole is made at reserved location, receive light
The entry/exit of hair device penetrates light can focus on 45 ° of reflective micro-mirrors by light through hole；
(4) by optical transmitting set attachment at a reserved location of second copper-clad plate, second copper-clad is arrived in optical receiver attachment
At another reserved location of plate, make the alignment precision of photonic device, light through hole and 45 ° of reflective micro-mirrors in range of tolerable variance, light hair
The pin of emitter and optical receiver is connected to pad by substrate upward wiring；
(5) it is implanted into soldered ball on all pads of the 3rd copper-clad plate using automatic ball-embedding machine；
(6) soldered ball in the 3rd copper-clad plate is connected with the pad on second copper-clad plate, by way of lamination, completes light
Assembling and electric interconnection in the plate of transceiving device.
The implementation method of above-mentioned lamination photoelectricity interconnection printed board, wherein the side using development etching in the step (1)
Legal system makees fiber waveguide and makes 45 ° of reflective micro-mirrors, comprises the following steps：
(1a) utilizes FeCl3Solution etches the copper in copper-clad plate to improve coating tack；
(1b) abundant cleaning base plate, remove surface greasy filth；
(1c) coats the low micro- imaging polymers MR-L6100XP of under-clad layer material of refractive index, thickness 60 on substrate
μm；
(1d) coats the high core material SU-8 of refractive index on under-clad layer, and thickness is 50 μm；
(1e) mask film covering version, it is 50 μm of x, 50 μm of rectangular optical waveguides to produce sandwich layer with the mode of exposure imaging；
(1f) spin coating top covering MR-L6100XP, thickness are 50 μm；
(1g) is cut by laser fiber waveguide, shape inclined-plane at 45 °, and carries out chemical plating, plating enhancing slant reflection, and system is at 45 °
Reflective micro-mirrors；
(1h) carries out thang-kng test on five dimension regulation platforms to waveguide, determines that optic path is damaged according to light power meter registration
Consumption, judges whether the light-path including 45 ° of reflective micro-mirrors and fiber waveguide meets to require.
The implementation method of above-mentioned lamination photoelectricity interconnection printed board, the SMT Densos of the photonic device in the step (4), it is
Scanning motion, the light work(of observation receiving terminal output are done in each critical tolerances variable direction using frock clamp control optical transmitting set
Rate；After finding maximum optical power location, in the form of frock is fixed so that optical transceiving device is both horizontally and vertically solid
It is fixed, then implement SMT Densos, there is skew and Warping Effect optical coupling in device during avoiding Denso.
The present invention has advantages below compared with prior art：
1. of the invention due to carrying out electric interconnection using welding refracting films between substrate, light receipts are being realized in such design
While sending out assembling in device board, overcome traditional laminating technology and very big mechanical damage and heat are easily easily caused to optical transceiving device
The shortcomings that damage.
2. the present invention in the form of frock is fixed after luminous power scanning determination light decay minimum position by completing optical transceiver
The Denso of part, avoid during Denso because the factors such as skew and warpage influence alignment precision, cause extra attenuation.
Brief description of the drawings
Fig. 1 is the lamination photoelectricity interconnection printed board schematic diagram of the present invention；
Fig. 2 is the lamination photoelectricity interconnection printed board implementation process schematic diagram of the present invention；
Fig. 3 is that the luminous power scan setting schematic diagram of step (4) is realized in the lamination photoelectricity interconnection printed board of the present invention.
Embodiment
The present invention is described in further detail referring to the drawings.
A kind of lamination photoelectricity interconnection printed board, its structure reference picture 1, including：The laminar substrate of upper, middle and lower 3, optical transmitting set and light
Receiver, polymer optical wave guide.Substrate is the copper-clad plate that material is FR4, and size is 15 × 5 × 0.5mm3。
Polymer rectangular optical waveguide is produced on lower substrate surface, and Intermediate substrate is pressed together in fiber waveguide, in the fiber waveguide
Provided with 45 ° of reflective micro-mirrors, Intermediate substrate is provided with light through hole, and is aligned with 45 ° of reflective micro-mirrors.
Optical transmitting set and optical receiver are mounted on the upper surface of Intermediate substrate, are aligned with light through hole, 45 ° of reflective micro-mirrors.
Pad array is surrounded by the optical transmitting set positioned at the upper surface of Intermediate substrate and optical receiver, in upper substrate
Same position be provided with identical pad array, and be implanted into soldered ball, optical transmitting set and light-receiving on all pads of upper substrate
The pin of device is connected on pad by substrate upward wiring, and top substrate layer and Intermediate substrate are interconnected by soldered ball, is formed 3 layers and is stacked knot
Structure.
Reference picture 2, the present invention in lamination photoelectricity interconnection printed board implementation method, comprise the following steps：
(1) sandwich layer of rectangular optical waveguide and upper and lower covering are made using the method for development etching in the first copper-clad plate, and
Laser ablation fiber waveguide, then carry out chemical plating, plating, shape reflective micro-mirrors at 45 °；
The step specifically includes following sub-step：
(1a) utilizes FeCl3Solution etches the copper in copper-clad plate to improve coating tack；
(1b) abundant cleaning base plate, remove surface greasy filth；
(1c) coats the low micro- imaging polymers MR-L6100XP of under-clad layer material of refractive index, thickness 60 on substrate
μm；
(1d) coats the high core material SU-8-50 of refractive index on under-clad layer, and thickness is 50 μm；
(1e) mask film covering version, it is 50 μm of x, 50 μm of rectangular optical waveguides to produce sandwich layer with the mode of exposure imaging；
(1f) spin coating top covering MR-L6100XP, thickness are 60 μm；
(1g) is cut by laser fiber waveguide, shape inclined-plane at 45 °, and carries out chemical plating, plating enhancing slant reflection, and system is at 45 °
Reflective micro-mirrors；
The light waveguide-layer after solidification is carried out vertically by laser incident angle of the laser drilling device adjustment through mask
Cut with 45 °, 45 ° of inclined-planes in otch will couple as 45 ° of reflective micro-mirrors after 90 ° of the vertical incidence light steering of optical transmitting set
Enter horizon light waveguide, then the emergent light of fiber waveguide is turned to 90 ° and coupled with light optical receiver.In order to strengthen the smooth of mirror surface
Degree, one layer of very thin coat of metal, the nm of thickness about hundreds of are plated on 45 ° of inclined-planes.Perpendicular cuts form contributing to of otch
Plating is learned, while can also make to couple between photonic device and fiber waveguide end face in light.
(1h) carries out thang-kng test on five dimension regulation platforms to waveguide, determines that optic path is damaged according to light power meter registration
Consumption, judges whether the light-path including 45 ° of reflective micro-mirrors and fiber waveguide meets to require.
(2) make anchor point on second copper-clad plate according to 45 ° of reflective micro-mirrors positions, be in each reserved area of anchor point
N*N space, places pad array, wherein N >=5mm outside reserved location, pad thickness 0.1mm, a diameter of 0.5mm, phase
Adjacent pad spacing is 1.2mm, repeats this copper-clad plate of step process the 3rd；
Second copper-clad plate and the first copper-clad plate are in the same size, after contraposition, according to 45 ° of reflective micro-mirrors positions in second copper-clad plate
Subscript anchor point, headspace can be adjusted according to the size of optical transceiving device at anchor point.
(3) second copper-clad flaggy is pressed onto fiber waveguide top covering, and a light through hole is made in reserved location, use incidence
Light can focus on 45 ° of reflective micro-mirrors by light through hole；
Second copper-clad plate hot pressing drills out light according to anchor point using the method for machine drilling in fiber waveguide on substrate
The arteriotomy diameter of through hole, hole size and step (1) laser ablation is as far as possible consistent, to ensure light through hole and 45 ° of mirror surfaces
Alignment precision, it is observed by AXI detecting systems.
(4) by optical transmitting set attachment at a reserved location of second copper-clad plate, second copper-clad is arrived in optical receiver attachment
At another reserved location of plate, make the alignment precision of optical transceiving device, light through hole and 45 ° of reflective micro-mirrors in range of tolerable variance, light
The pin of transmitter and optical receiver is connected to pad by substrate upward wiring；
Reference picture 3, optical transmitting set are VCSEL optical transmitting sets, and optical receiver PD is also face receiving device, uses frock clamp
Control optical transmitting set does scanning motion, observation receiving terminal output on the basis of light through hole geometric center in critical tolerances variable direction
Luminous power, maximum optical power location is optimal para postion.To avoid device during Denso from skew and warpage shadow occur
Optical coupling is rung, in the form of frock is fixed so that photonic device is both horizontally and vertically fixed.
(5) it is implanted into soldered ball on all pads of the 3rd copper-clad plate using automatic ball-embedding machine；
Pad is cleaned before planting ball and scaling powder is smeared on pad, after automatic ball-embedding machine plants soldered ball onto pad, need to be entered
Row quality testing, the underproof soldered ball of quality is implanted into again.
(6) by the pad solder on the soldered ball in the 3rd copper-clad plate and second copper-clad plate, by way of lamination, light is completed
Assembling and electric interconnection in the plate of transceiving device.
Completed with stacked system after being assembled in the plate of photonic device, 5mA's is added to VCSEL optical transmitting sets on test platform
Electric current carries out thang-kng test, the photoelectric current of detection PD optical receiver outputs, and its value shows in the range of photonic device performance parameter
During realizing the interconnection printed board of lamination photoelectricity using the technique, optical transceiving device and fiber waveguide are not caused to damage, it is made
Printed board can be used for photoelectricity interconnected communication.
Above description is only example of the present invention, does not form any limitation of the invention, it is clear that for this
, all may be without departing substantially from the principle of the invention, structure after present invention and principle has been understood for the technical staff in field
In the case of, the various modifications and variations in form and details are carried out, but these modifications and variations based on inventive concept are still
Within the claims of the present invention.
Claims (4)
1. a kind of lamination photoelectricity interconnects printed board, including：The laminar substrate of upper, middle and lower 3, optical transmitting set, optical receiver and fiber waveguide；Light
For waveguide fabrication in lower substrate surface, fiber waveguide is provided with 45 ° of coupling end faces；Intermediate substrate is pressed together in fiber waveguide, optical transmitting set
The surface of Intermediate substrate is mounted on optical receiver, and standard is faced with 45 ° of coupled ends of fiber waveguide, it is characterised in that：
Pad array is surrounded by the optical transmitting set positioned at the upper surface of Intermediate substrate and optical receiver, in the phase of upper substrate
Identical pad array is provided with position, and soldered ball is implanted on all pads of upper substrate, optical transmitting set and optical receiver
Pin is connected on pad by substrate upward wiring, and top substrate layer and Intermediate substrate are interconnected by soldered ball, forms 3 layers of stacked structure.
2. a kind of implementation method of lamination photoelectricity printed board, comprises the following steps：
(1) sandwich layer of rectangular optical waveguide and upper and lower covering, and laser are made using the method for development etching in the first copper-clad plate
Fiber waveguide is etched, then carries out chemical plating, plating, shape reflective micro-mirrors at 45 °；
(2) make anchor point on second copper-clad plate according to 45 ° of reflective micro-mirrors positions, be N*N in each reserved area of anchor point
Space, pad array, wherein N >=5mm are placed outside reserved location, repeats this copper-clad plate of step process the 3rd；
(3) second copper-clad flaggy is pressed onto fiber waveguide top covering, and a light through hole is made at reserved location, make optical transceiver
The entry/exit of part penetrates light can focus on 45 ° of reflective micro-mirrors by light through hole；
(4) by optical transmitting set attachment at a reserved location of second copper-clad plate, optical receiver attachment to second copper-clad plate
At another reserved location, make the alignment precision of optical transceiving device, light through hole and 45 ° of reflective micro-mirrors in range of tolerable variance, light transmitting
The pin of device and optical receiver is connected to pad by substrate upward wiring；
(5) it is implanted into soldered ball on all pads of the 3rd copper-clad plate using automatic ball-embedding machine；
(6) soldered ball in the 3rd copper-clad plate is connected with the pad on second copper-clad plate, by way of lamination, completes light transmitting-receiving
Assembling and electric interconnection in the plate of device.
3. the implementation method of lamination photoelectricity interconnection printed board according to claim 2, it is characterised in that：
The method using development etching in the step (1) makes fiber waveguide and makes 45 ° of reflective micro-mirrors, including following step
Suddenly：
(3a) etches the copper in copper-clad plate to improve coating tack using FeCl3 solution；
(3b) abundant cleaning base plate, remove surface greasy filth；
(3c) coats the low micro- imaging polymers MR-L6100XP of under-clad layer material of refractive index on substrate, and thickness is 60 μm；
(3d) coats the high core material SU-8-50 epoxies of refractive index on under-clad layer, and thickness is 50 μm；
(3e) mask film covering version, it is 50 μm of x50 μm of rectangular optical waveguides to produce sandwich layer with the mode of exposure imaging；
(3f) spin coating top covering MR-L6100XP, thickness are 60 μm；
(3g) is cut by laser fiber waveguide, shape inclined-plane at 45 °, and carries out chemical plating, plating enhancing slant reflection, makes reflection at 45 °
Micro mirror；
(3h) carries out thang-kng test on five dimension regulation platforms to waveguide, determines that optic path is lost according to light power meter registration,
Judge whether the light-path including 45 ° of reflective micro-mirrors and fiber waveguide meets to require.
4. the implementation method of lamination photoelectricity interconnection printed board according to claim 2, it is characterised in that：The step (4)
In optical transceiving device surface mount, be using frock clamp control optical transmitting set scanned in each critical tolerances variable direction
Motion, the luminous power of observation receiving terminal output；After finding maximum optical power location, in the form of frock is fixed so that light is received and dispatched
Device is both horizontally and vertically fixed, then implements SMT Densos, avoids during Denso device from occurring offseting and Warping Effect
Optical coupling.
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| CN201710739720.3A CN107340573B (en) | 2017-08-25 | 2017-08-25 | Lamination photoelectricity interconnects printed board and its implementation |
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| CN201710739720.3A CN107340573B (en) | 2017-08-25 | 2017-08-25 | Lamination photoelectricity interconnects printed board and its implementation |
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| CN107340573B CN107340573B (en) | 2019-06-21 |
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| CN108776371A (en) * | 2018-05-22 | 2018-11-09 | 苏州席正通信科技有限公司 | Opto-electronic integrated circuit plate |
| CN112327407A (en) * | 2020-11-03 | 2021-02-05 | 中航光电科技股份有限公司 | Double-layer polymer waveguide composite veneer |
| CN113009625A (en) * | 2021-03-09 | 2021-06-22 | 中国电子科技集团公司第五十四研究所 | Manufacturing method of multilayer LCP optical transmission module of integrated optical waveguide |
| CN113874688A (en) * | 2019-05-29 | 2021-12-31 | ams国际有限公司 | Reducing optical crosstalk in optical sensor modules |
| CN115097577A (en) * | 2022-04-27 | 2022-09-23 | 中航光电科技股份有限公司 | Photoelectric conversion printed board structure based on polymer optical waveguide |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108776371A (en) * | 2018-05-22 | 2018-11-09 | 苏州席正通信科技有限公司 | Opto-electronic integrated circuit plate |
| CN113874688A (en) * | 2019-05-29 | 2021-12-31 | ams国际有限公司 | Reducing optical crosstalk in optical sensor modules |
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| CN113009625A (en) * | 2021-03-09 | 2021-06-22 | 中国电子科技集团公司第五十四研究所 | Manufacturing method of multilayer LCP optical transmission module of integrated optical waveguide |
| CN115097577A (en) * | 2022-04-27 | 2022-09-23 | 中航光电科技股份有限公司 | Photoelectric conversion printed board structure based on polymer optical waveguide |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107340573B (en) | 2019-06-21 |
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