CN107325489B - A kind of anticorrosion epoxy-phenol glue and its application in battery dies etching technique - Google Patents
A kind of anticorrosion epoxy-phenol glue and its application in battery dies etching technique Download PDFInfo
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- CN107325489B CN107325489B CN201710689677.4A CN201710689677A CN107325489B CN 107325489 B CN107325489 B CN 107325489B CN 201710689677 A CN201710689677 A CN 201710689677A CN 107325489 B CN107325489 B CN 107325489B
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- epoxy
- phenol glue
- anticorrosion
- glue
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- 239000003292 glue Substances 0.000 title claims abstract description 34
- 238000005530 etching Methods 0.000 title claims abstract description 24
- 238000000034 method Methods 0.000 title claims abstract description 17
- 239000000463 material Substances 0.000 claims abstract description 16
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims abstract description 6
- 239000012752 auxiliary agent Substances 0.000 claims abstract description 6
- 239000003822 epoxy resin Substances 0.000 claims abstract description 6
- 239000000203 mixture Substances 0.000 claims abstract description 6
- 239000005011 phenolic resin Substances 0.000 claims abstract description 6
- 229920001568 phenolic resin Polymers 0.000 claims abstract description 6
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 6
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims abstract description 5
- 239000004014 plasticizer Substances 0.000 claims abstract description 5
- 229920002492 poly(sulfone) Polymers 0.000 claims abstract description 5
- 229910052581 Si3N4 Inorganic materials 0.000 claims abstract description 4
- 230000001681 protective effect Effects 0.000 claims abstract description 4
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 claims description 6
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims description 6
- 238000005507 spraying Methods 0.000 claims description 6
- 238000002156 mixing Methods 0.000 claims description 5
- 239000003795 chemical substances by application Substances 0.000 claims description 4
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 3
- 239000003963 antioxidant agent Substances 0.000 claims description 3
- 230000003078 antioxidant effect Effects 0.000 claims description 3
- 239000008367 deionised water Substances 0.000 claims description 3
- 229910021641 deionized water Inorganic materials 0.000 claims description 3
- 238000009792 diffusion process Methods 0.000 claims description 3
- 235000008216 herbs Nutrition 0.000 claims description 3
- 239000003112 inhibitor Substances 0.000 claims description 3
- 229910017604 nitric acid Inorganic materials 0.000 claims description 3
- 229910052698 phosphorus Inorganic materials 0.000 claims description 3
- 239000011574 phosphorus Substances 0.000 claims description 3
- 238000007751 thermal spraying Methods 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 210000002268 wool Anatomy 0.000 claims description 3
- 239000004593 Epoxy Substances 0.000 claims description 2
- INKDAKMSOSCDGL-UHFFFAOYSA-N [O].OC1=CC=CC=C1 Chemical compound [O].OC1=CC=CC=C1 INKDAKMSOSCDGL-UHFFFAOYSA-N 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- -1 phthalic acid salt compound Chemical class 0.000 claims description 2
- UHOVQNZJYSORNB-UHFFFAOYSA-N monobenzene Natural products C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims 2
- 230000003213 activating effect Effects 0.000 claims 1
- 150000002148 esters Chemical class 0.000 claims 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims 1
- 238000002360 preparation method Methods 0.000 abstract description 6
- 238000005260 corrosion Methods 0.000 abstract description 3
- 230000007797 corrosion Effects 0.000 abstract description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Chemical compound CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 2
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical class OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 2
- 239000004568 cement Substances 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000005007 epoxy-phenolic resin Substances 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- XCKAPGALQORDHA-UHFFFAOYSA-L [Sn+4].CCCC[Sn++]CCCC.CCCCCCCCCCCC([O-])=O.CCCCCCCCCCCC([O-])=O Chemical compound [Sn+4].CCCC[Sn++]CCCC.CCCCCCCCCCCC([O-])=O.CCCCCCCCCCCC([O-])=O XCKAPGALQORDHA-UHFFFAOYSA-L 0.000 description 1
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical group CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000012975 dibutyltin dilaurate Substances 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000006266 etherification reaction Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000006396 nitration reaction Methods 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 125000005498 phthalate group Chemical group 0.000 description 1
- 239000008029 phthalate plasticizer Substances 0.000 description 1
- JQCXWCOOWVGKMT-UHFFFAOYSA-N phthalic acid diheptyl ester Natural products CCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCC JQCXWCOOWVGKMT-UHFFFAOYSA-N 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000002633 protecting effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Sealing Battery Cases Or Jackets (AREA)
- Epoxy Resins (AREA)
Abstract
The invention discloses a kind of anticorrosion epoxy-phenol glue and its in the application of battery dies etching technique, epoxy-the phenol glue is made of the composition of following parts by weight: 100 parts of epoxy resin, 40-50 parts of phenolic resin, 9-12 parts of polysulfones, anti- rotten 20-25 parts of the material of nanometer, 0.3-0.8 parts of plasticizer, 0.5-1 parts of drier, 1.5-2 parts of other auxiliary agents, the nanometer corrosion-resistant material is nano SiC, the Nano-meter SiO_2 for being 1:2:1 by mass values2, nano Si3N4Epoxy-phenol glue of composition, preparation has good mechanical performance, alkaline-resisting, acidproof, electrical insulating property, the protective glue for battery dies etching technique.
Description
Technical field
Present invention relates particularly to a kind of anticorrosion epoxy-phenol glues, belong to anticorrosion material technical field, and of the invention is another
One purpose is to provide anticorrosion epoxy-phenol glue in the application of battery dies etching technique.
Background technique
Lithographic technique is that have the film layer of semiconductor material surface or substrate surface layer by method physically or chemically
Selection is corroded or is removed, and in crystal silicon solar cell sheet manufacturing process, the purpose of etching technics is to remove and expand
The PN junction formed after dissipating in silicon chips periphery, avoids periphery short-circuited conducting sleeve from causing the electric leakage of cell piece, when associated with lithographic technique
The protection of non-etched portions, more protection materials at present are paraffin, and with the development of photovoltaic industry, etch resistant material is ground
Study carefully and have attracted more and more attention from people, as China Patent Publication No. CN102549498A prepares a kind of erosion resistant with photonasty tree
Oil/fat composition is mainly used for photoetching, and selected resin structure is complex, and complex for operation step, China Patent Publication No.
CN104681641A discloses a kind of resist, this resist is mainly used for SE crystal silicon solar energy battery, and application field is small.
The present invention is namely based on this thinking, has selected suitable material, use acidproof, alkaline-resisting epoxy-phenolic resin for
Matrix simultaneously adds the anti-rotten material of nanometer, and epoxy-phenol glue of preparation has good mechanical performance, alkaline-resisting, acidproof and electrical isolation
Property, it can be not only used for erosion-resisting insulating cement, more can be used for the protective glue of battery dies etching technique.
Summary of the invention
The present invention is to overcome the shortcoming in existing background technique, and the present invention provides a kind of anticorrosion epoxy-phenol
Aldehyde glue, it is a further object of the present invention to provide anticorrosion epoxy-phenol glue battery dies etching technique application.
To achieve the above object, the invention provides the following technical scheme:
A kind of anticorrosion epoxy-phenol glue, is made of the composition of following parts by weight:
100 parts of epoxy resin
40-50 parts of phenolic resin
9-12 parts of polysulfones
Anti- rotten 20-25 parts of the material of nanometer
0.3-0.8 parts of plasticizer
0.5-1 parts of drier
1.5-2 parts of other auxiliary agents
Wherein, the anti-rotten material of nanometer is nano SiC, the Nano-meter SiO_2 for being 1:2:1 by mass values2, nano Si3N4Mixing and
At.
Preferably, the plasticizer is phthalate or phthalic acid salt compound.
Preferably, the drier is dibutyl tin dilaurate.
Preferably, other described auxiliary agents are one of surfactant, mould inhibitor, antioxidant and curing agent or more
Kind.
A kind of anticorrosion epoxy described in claim 1-application of the phenol glue in battery dies etching technique, including it is following
Step:
Step 1: cell piece is after making herbs into wool, phosphorus diffusion, in the above-mentioned anticorrosion epoxy-of the thermal spraying on surface of cell piece
Phenol glue is to protect cell piece surface to be not required to etching area, and 15-25 μm of coating thickness, spraying temperature is 85 ± 3 DEG C；
Step 2: then immersing cell piece of the spraying after dry by mass fraction is respectively 20-25% hydrofluoric acid and 25-
It is etched in the etching solution of 30% nitric acid mixing, removes the anticorrosion on surface after the completion of etching in chloroform organic liquor
Epoxy-phenol glue, then cleaned with the KOH solution that mass fraction is 1-5%, then cleaned with deionized water.
Compared with prior art, the beneficial effects of the present invention are:
1. epoxy-phenolic resin is used to obtain epoxy-phenol glue for the technology of substrate in the present invention, can not only use
In erosion-resisting insulating cement, it more can be used for the protective glue of battery dies etching technique.
2. obtaining epoxy-phenol glue with dual alkaline-resisting, acidproof using the anti-rotten material technology of addition nanometer in the present invention
The advantages of,
Specific embodiment
The present invention is described in further detail combined with specific embodiments below, to enable those skilled in the art's reference say
Bright book text can be implemented accordingly.
Embodiment 1
By load weighted 100 parts of epoxy resin and 9 parts of polysulfone resin powder be mixed and heated to 140 DEG C of stirrings to polysulfones it is complete it is molten after
400 parts of phenolic resin are added, 2 parts other auxiliary agents being mixed by mould inhibitor, antioxidant and curing agent are then added, in high speed
Stirrer for mixing stirs 15min, and nano SiC, the Nano-meter SiO_2 that 20 parts are 1:2:1 by mass values are successively added thereto2、
Nano Si3N4The anti-rotten material of the nanometer mixed, 0.5 part of di-n-octyl phthalate plasticizer, 1 part of tin dilaurate
Dibutyl tin drier continues to stir 10min, obtains anticorrosion epoxy-phenol glue.
Embodiment 2
The preparation method is the same as that of Example 1 for the present embodiment, the difference is that 50 parts of phenolic resin, the anti-rotten material of nanometer is 25 parts.
Embodiment 3
The present embodiment is anticorrosion epoxy-phenol glue of preparation method preparation as described above in battery dies etching technique
Application: specific step is as follows:
Step 1: polycrystalline silicon battery plate specification: 150 × 150mm, with a thickness of 200 μm (before corrosion), before spraying with a thickness of
180μm.Making herbs into wool, phosphorus diffusion are first carried out to cell piece surface, the anticorrosion ring of thermal spraying embodiment 1-2 is then distinguished at 85 DEG C
The side of oxygen-phenol glue to cell piece is not required to the part of etching；
Step 2: then immersing cell piece of the spraying after dry by mass fraction is respectively 25% hydrofluoric acid and 30%
It is etched in the etching solution of nitric acid mixing, removes the anticorrosion epoxy-on surface after the completion of etching in chloroform organic liquor
Phenol glue, then successively cleaned with the KOH solution that mass fraction is 4% and cleaned with deionized water.
Anticorrosion epoxy-phenol glue performance that embodiment 1-2 is prepared is detected, testing result is as follows: real
Applying anticorrosion epoxy-phenol glue of 1-2 preparation viscosity at 85 DEG C is 12-13.5cps, the resistance to nitration mixture etching at 85 DEG C of temperature
The time of liquid is respectively 150S and 170S, is longer than commercially available anti-etching dose of the acidproof time, that is, it is higher to illustrate that it has with cell piece
Adhesive force, good protecting effect can be played, this is because: the hydroxyl and ring of methylol and epoxy resin in phenolic resin
Oxygroup reacts, and phenolic hydroxyl group and epoxy group play etherification reaction, and by above-mentioned reaction, epoxy resin is crosslinked, and forms complicated body
Type structure condensation polymer, the addition of the anti-rotten material of nanometer, has filled up the cavity of three-dimensional-structure condensation polymer, has kept total more close
Real, acidproof, alkaline-resisting, corrosion resistance can increase.
It although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
A variety of variations, modification, replacement can be carried out to these embodiments without departing from the principles and spirit of the present invention by understanding
And modification, the scope of the present invention is by appended claims and its is equal.
Claims (5)
1. a kind of anticorrosion epoxy-phenol glue, the protective glue applied to battery dies etching technique, it is characterised in that: the epoxy-
Phenol glue is made of the composition of following parts by weight:
100 parts of epoxy resin
40-50 parts of phenolic resin
9-12 parts of polysulfones
Anti- rotten 20-25 parts of the material of nanometer
0.3-0.8 parts of plasticizer
0.5-1 parts of drier
1.5-2 parts of other auxiliary agents
Wherein, the anti-rotten material of nanometer is nano SiC, the Nano-meter SiO_2 for being 1:2:1 by mass values2, nano Si3N4It mixes.
2. a kind of anticorrosion epoxy-phenol glue according to claim 1, it is characterised in that: the plasticizer is adjacent benzene
Diformic ester or phthalic acid salt compound.
3. a kind of anticorrosion epoxy-phenol glue according to claim 1, it is characterised in that: the drier is February
Dilaurylate.
4. a kind of anticorrosion epoxy-phenol glue according to claim 1, it is characterised in that: other described auxiliary agents are table
One of face activating agent, mould inhibitor, antioxidant and curing agent are a variety of.
5. a kind of anticorrosion epoxy described in claim 1-application of the phenol glue in battery dies etching technique, feature exist
In: the following steps are included:
Step 1: cell piece is after making herbs into wool, phosphorus diffusion, in the above-mentioned anticorrosion epoxy-phenolic aldehyde of the thermal spraying on surface of cell piece
Glue is to protect cell piece surface to be not required to etching area, and 15-25 μm of coating thickness, spraying temperature is 85 ± 3 DEG C；
Step 2: then immersing cell piece of the spraying after dry by mass fraction is respectively 20-25% hydrofluoric acid and 25-30%
Nitric acid mixing etching solution in be etched, after the completion of etching in chloroform organic liquor remove surface anticorrosion ring
Oxygen-phenol glue, then cleaned with the KOH solution that mass fraction is 1-5%, then cleaned with deionized water.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710689677.4A CN107325489B (en) | 2017-08-14 | 2017-08-14 | A kind of anticorrosion epoxy-phenol glue and its application in battery dies etching technique |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710689677.4A CN107325489B (en) | 2017-08-14 | 2017-08-14 | A kind of anticorrosion epoxy-phenol glue and its application in battery dies etching technique |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107325489A CN107325489A (en) | 2017-11-07 |
| CN107325489B true CN107325489B (en) | 2019-07-16 |
Family
ID=60225787
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710689677.4A Active CN107325489B (en) | 2017-08-14 | 2017-08-14 | A kind of anticorrosion epoxy-phenol glue and its application in battery dies etching technique |
Country Status (1)
| Country | Link |
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| CN (1) | CN107325489B (en) |
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|---|---|---|---|---|
| CN101048461A (en) * | 2004-10-27 | 2007-10-03 | 纳幕尔杜邦公司 | Self-bonding coating composition |
| CN101853898A (en) * | 2010-03-31 | 2010-10-06 | 晶澳(扬州)太阳能光伏工程有限公司 | Process for preparing N-type crystalline silicon solar cell |
| CN102640576A (en) * | 2009-12-02 | 2012-08-15 | 三井金属矿业株式会社 | Resin composition for use in formation of bonding layer in multilayer flexible printed circuit board, resin varnish, resin-coated copper foil, manufacturing method for resin-coated copper foil for use in manufacturing of multilayer flexible printed circuit board |
| CN104745131A (en) * | 2007-04-30 | 2015-07-01 | Lg化学株式会社 | Adhesive Resin Composition And Dicing Die Bonding Film Using The Same |
| CN106117976A (en) * | 2016-07-01 | 2016-11-16 | 宜兴市凯诚模具有限公司 | A kind of fiber reinforced plastic mold and preparation method thereof |
| CN106784026A (en) * | 2016-12-13 | 2017-05-31 | 苏州城邦达力材料科技有限公司 | A kind of solar cell wiring board and preparation method thereof |
| CN107011625A (en) * | 2017-04-21 | 2017-08-04 | 山东圣泉新材料股份有限公司 | A kind of resin combination, laminate, prepreg and preparation method thereof, application |
-
2017
- 2017-08-14 CN CN201710689677.4A patent/CN107325489B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101048461A (en) * | 2004-10-27 | 2007-10-03 | 纳幕尔杜邦公司 | Self-bonding coating composition |
| CN104745131A (en) * | 2007-04-30 | 2015-07-01 | Lg化学株式会社 | Adhesive Resin Composition And Dicing Die Bonding Film Using The Same |
| CN102640576A (en) * | 2009-12-02 | 2012-08-15 | 三井金属矿业株式会社 | Resin composition for use in formation of bonding layer in multilayer flexible printed circuit board, resin varnish, resin-coated copper foil, manufacturing method for resin-coated copper foil for use in manufacturing of multilayer flexible printed circuit board |
| CN101853898A (en) * | 2010-03-31 | 2010-10-06 | 晶澳(扬州)太阳能光伏工程有限公司 | Process for preparing N-type crystalline silicon solar cell |
| CN106117976A (en) * | 2016-07-01 | 2016-11-16 | 宜兴市凯诚模具有限公司 | A kind of fiber reinforced plastic mold and preparation method thereof |
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| Publication number | Publication date |
|---|---|
| CN107325489A (en) | 2017-11-07 |
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