CN100362073C - Adhesive for high temp, infrared radiation glaze - Google Patents
Adhesive for high temp, infrared radiation glaze Download PDFInfo
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- CN100362073C CN100362073C CNB2005101205870A CN200510120587A CN100362073C CN 100362073 C CN100362073 C CN 100362073C CN B2005101205870 A CNB2005101205870 A CN B2005101205870A CN 200510120587 A CN200510120587 A CN 200510120587A CN 100362073 C CN100362073 C CN 100362073C
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Abstract
The present invention relates to a high-temperature adhesive between metal materials and ceramic materials, which solves the insufficiency of strict requirements for the components and the granularity of skeletal materials, sintering and glazing by a special device, no high-temperature resistance and easy desquamation by adopting clay as an adhesive in the prior art. The high-temperature adhesive has the technical measure that the present invention relates to an adhesive for high-temperature infrared radiation glaze; the adhesive for high-temperature infrared radiation glaze comprises the components: 80 to 95wt% of silicochromium aluminum composite collosol, 2 to 10 wt% of silicone resin and 1 to 10 wt% of potassium silicate. The adhesive solves the problem for binding a glaze layer and heat-resistant steel, etc. at high temperature, and has the advantages of firm bonding between the glaze layer and the heat-resistant metal, high mechanical strength, good thermal shock resistance and thermal stability, favorable corrosion, oxidation resistance and favorable carburization resistance, simple preparing technology and low cost. The application temperature reaches 1300 DEG C, and the high-temperature adhesive can be widely used for industrial and civilian goods, and has wide market prospects.
Description
Technical field
The present invention relates to a kind of binding agent, especially belong to a kind of high-temperature agglomerant that is used between metal and the stupalith.
Background technology
External glaze and domestic enamel adamantine layer all adopt clay as binding agent, and its composition and granularity requirements to aggregate is strict especially, also must carry out sintering glazing in special equipment, matrix is carried out a series of surface treatments such as sandblast.Its not only complex process, cost an arm and a leg, and be not suitable for on-the-spot large-scale promotion application.Its non-refractory in addition, long-time heating is easily peeled off.
Summary of the invention
The objective of the invention is to overcome above-mentioned deficiency, provide a kind of cohesive force that can make glaze and heating resisting metal matrix strong, good thermal shock, the high temp, infrared radiation glaze binding agent that is not easy to peel off.
Realize the technical measures of above-mentioned purpose:
A kind of binding agent that is used for high temp, infrared radiation glaze, its component and weight percent are: by weight percent is that 85~90% silicon sol, weight percent are that 2~5% chromic anhydride, weight percent are the silicochromium aluminium complex sol 80~95% that 8~10% aluminium colloidal sol is formed, silicone resin 2~10%, potassium silicate 1~10%.
It is that the weight percent of silicochromium aluminium complex sol is 83~90%.
It is that the weight percent of silicochromium aluminium complex sol is 85~87%.
It is that the weight percent of silicone resin is 5~10%.
It is that the weight percent of potassium silicate is 3~6%.
The described a kind of method that is used for the binding agent of high temp, infrared radiation glaze of preparation claim 1, its step:
1) at first is prepared into silicochromium aluminium complex sol: be about to weight percent and be 85~90% silicon sol, weight percent and be 2~5% chromic anhydride, weight percent and be 8~10% aluminium colloidal sol and mix according to weight percent and stir;
2) be that 85~90% silicon sol, weight percent are that 2~5% chromic anhydride, weight percent are 8~10% the mixed mixture of aluminium colloidal sol by weight percentage to above-mentioned steps 1, be heated to 130~170 ℃, stirring is until dissolving, thereby is prepared into silicochromium aluminium complex sol;
3) silicochromium aluminium complex sol, silicone resin and the potassium silicate that above-mentioned steps 2 is prepared mixes according to the described weight percent of claim 1 and stirs;
4) preservation is stand-by.
Main component mechanism and effect:
Silicochromium aluminium complex sol
Stupalith is different with the metallic matrix crystalline structure, is difficult to dissolve each other each other.The present invention has utilized the space chain-like structure of aluminium atom and Siliciumatom, has prepared silicochromium aluminium complex sol.Silicochromium aluminium complex sol essence is the SiO of nm level
2, Al
2O
3, Cr
2O
3Small suspended substance in water with the adhesion strength height under the metallic matrix high temperature, and has certain toughness.Its feature is a nontoxic pollution-free, and higher force of cohesion is arranged, and makes the glaze prolonged preservation not stratified, has good thixotropy with mobile, guarantees that glaze has good workability.
Silicone resin: it is the compound of organic radical and silicon, mainly plays low-temperature curing, and it is after sintering glazing, or volatilization or decomposition and inversion become inorganics, has increased the cohesive force of glaze and metallic matrix.
Potassium silicate: as additive, not only play the hot setting effect, also can increase the high temperature bond power of glaze and high temperature steel metallic matrix greatly, glaze is sintered on the high temperature steel metal base surface " does not collapse porcelain ", resistance to thermal shocks is good, the physical strength height.
Binding agent of the present invention is water base, contains the SiO of inferior microscopic size
2, Al
2O
3, Cr
2O
3Deng the oxide compound suspended substance, volume is little, and surface-area is big, is in the height active state, and it can make the glaze brushing at the heating resisting metal matrix surface as paint, heats glazing then, has then formed Chemical bond with matrix.
The present invention can becoming the glaze temperature to adjust to 950~1150 ℃ of scopes, both adapt to the actual production working conditions of industrial stove by adjusting and the powdered frit ratio, can utilize heating member self to be heated into glaze again.
The invention solves under the high temperature, the bonding difficult problem of metals such as glaze layer and high temperature steel, have and bond between the glaze of making layer and the heating resisting metal firmly, the physical strength height, heat-shock resistance and Heat stability is good, and have good anticorrosive, anti-oxidant and anti-carburizing energy, manufacture craft is simple, cost is low, use temperature can be widely used in industry and civil goods up to 1300 ℃, has boundless market outlook.
Embodiment
The invention will be further described below in conjunction with embodiment:
Embodiment 1:
Getting by weight percent is that the weight percent that 86% silicon sol, 5% chromic anhydride, 9% aluminium colloidal sol are prepared into is a silicochromium aluminium complex sol 81%, silicone resin 10%, potassium silicate 9%.
The preparation method, its step:
1) at first be that 86% silicon sol, 6% chromic anhydride, 8% aluminium colloidal sol mix and stirs with weight percent;
2) above-mentioned silicon sol, chromic anhydride and aluminium collosol intermixture are heated to 130 ℃, and stir, be prepared into silicochromium aluminium complex sol until dissolving;
3) be 81%, 10%, 9% to mix and stir according to weight percent respectively with the silicochromium aluminium complex sol, silicone resin and the potassium silicate that prepare;
4) preservation is stand-by.
Embodiment 2:
Getting by weight percent is that the weight percent that 88% silicon sol, 3% chromic anhydride, 9% aluminium colloidal sol are prepared into is a silicochromium aluminium complex sol 86%, silicone resin 8%, potassium silicate 6%.
The preparation method, its step:
1) at first be that 88% silicon sol, 3% chromic anhydride, 9% aluminium colloidal sol mix and stirs with weight percent;
2) above-mentioned silicon sol, chromic anhydride and aluminium collosol intermixture are heated to 150 ℃, and stir, be prepared into silicochromium aluminium complex sol until dissolving;
3) be 86%, 8%, 6% to mix and stir according to weight percent respectively with the silicochromium aluminium complex sol, silicone resin and the potassium silicate that prepare;
4) preservation is stand-by.
Embodiment 3:
Getting by weight percent is that the weight percent that 90% silicon sol, 2% chromic anhydride, 8% aluminium colloidal sol are prepared into is a silicochromium aluminium complex sol 93%, silicone resin 4%, potassium silicate 3%.
The preparation method, its step:
1) at first be that 90% silicon sol, 2% chromic anhydride, 8% aluminium colloidal sol mix and stirs with weight percent;
2) above-mentioned silicon sol, chromic anhydride and aluminium collosol intermixture are heated to 165 ℃, and stir, be prepared into silicochromium aluminium complex sol until dissolving;
3) be 93%, 4%, 3% to mix and stir according to weight percent respectively with the silicochromium aluminium complex sol, silicone resin and the potassium silicate that prepare;
4) preservation is stand-by.
The foregoing description is the sample of base material with Cr25Ni35, Cr20Ni80, after testing its result:
Test item | Requirement | Measured result |
The clod wash of monolithic thin slice sample is the arrisdefect degree not | HB5341-86 requires>30 ° | Cr20Ni80 sample>50 ° |
Thermal shock resistance | HB5341-86 requires 1050 ℃ of hardening 6 times, peels off and is not more than 1.5mm | 1100 ℃ of hardening of Cr25Ni35 sample 6 times are completely without peeling off |
Insulation resistance | General resistance requirement>0.5M Ω | >50MΩ |
Claims (6)
1. binding agent that is used for high temp, infrared radiation glaze, its component and weight percent are: by weight percent is that 85~90% silicon sol, weight percent are that 2~5% chromic anhydride, weight percent are the silicochromium aluminium complex sol 80~95% that 8~10% aluminium colloidal sol is formed, silicone resin 2~10%, potassium silicate 1~10%.
2. a kind of binding agent that is used for high temp, infrared radiation glaze according to claim 1, the weight percent that it is characterized in that silicochromium aluminium complex sol is 83~90%.
3. a kind of binding agent that is used for high temp, infrared radiation glaze according to claim 1 and 2, the weight percent that it is characterized in that silicochromium aluminium complex sol is 85~87%.
4. a kind of binding agent that is used for high temp, infrared radiation glaze according to claim 1, the weight percent that it is characterized in that silicone resin is 5~10%.
5. a kind of binding agent that is used for high temp, infrared radiation glaze according to claim 1, the weight percent that it is characterized in that potassium silicate is 3~6%.
6. prepare the described a kind of method that is used for the binding agent of high temp, infrared radiation glaze of claim 1, its step:
1) at first is prepared into silicochromium aluminium complex sol: be about to weight percent and be 85~90% silicon sol, weight percent and be 2~5% chromic anhydride, weight percent and be 8~10% aluminium colloidal sol and mix according to weight percent and stir;
2) above-mentioned silicon sol, chromic anhydride and aluminium collosol intermixture are heated to 130~170 ℃, stir until dissolving, thereby be prepared into silicochromium aluminium complex sol;
3) silicochromium aluminium complex sol, silicone resin and the potassium silicate that above-mentioned steps 2 is prepared mixes according to the described weight percent of claim 1 and stirs;
4) preservation is stand-by.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2005101205870A CN100362073C (en) | 2005-12-30 | 2005-12-30 | Adhesive for high temp, infrared radiation glaze |
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Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2005101205870A CN100362073C (en) | 2005-12-30 | 2005-12-30 | Adhesive for high temp, infrared radiation glaze |
Publications (2)
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CN1793268A CN1793268A (en) | 2006-06-28 |
CN100362073C true CN100362073C (en) | 2008-01-16 |
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CNB2005101205870A Expired - Fee Related CN100362073C (en) | 2005-12-30 | 2005-12-30 | Adhesive for high temp, infrared radiation glaze |
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Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104291849B (en) * | 2014-08-22 | 2016-09-21 | 李金盛 | Dry binding agent spliced of a kind of new ceramics plane and preparation method thereof |
CN104877624A (en) * | 2015-05-19 | 2015-09-02 | 安徽省华凯轻工科技有限公司 | Special sealing adhesive for preventing mold in bathroom and preparation method of special sealing adhesive |
CN105860611B (en) * | 2016-05-31 | 2017-12-29 | 武汉钢铁有限公司 | A kind of infrared radiation coating and preparation method thereof |
CN107162576A (en) * | 2017-05-17 | 2017-09-15 | 安徽青花坊瓷业股份有限公司 | A kind of ceramic in-glaze decoration paster stamp high-temperature agglomerant |
CN114478066A (en) * | 2021-12-30 | 2022-05-13 | 福建省佳美集团公司 | Ceramic glazing method |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS528039A (en) * | 1975-07-09 | 1977-01-21 | Nippon Paint Co Ltd | Coating composition having selective absorption of light |
KR20020022453A (en) * | 2000-09-20 | 2002-03-27 | 한종웅 | compositions of ceramics for extreme infrared radiation |
-
2005
- 2005-12-30 CN CNB2005101205870A patent/CN100362073C/en not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS528039A (en) * | 1975-07-09 | 1977-01-21 | Nippon Paint Co Ltd | Coating composition having selective absorption of light |
KR20020022453A (en) * | 2000-09-20 | 2002-03-27 | 한종웅 | compositions of ceramics for extreme infrared radiation |
Non-Patent Citations (1)
Title |
---|
高温抗渗碳耐腐蚀红外辐射釉料的研制. 朱小平等.武钢技术,第42卷第5期. 2004 * |
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