CN1073018C - Led阵列板以及制造这种led阵列板的方法 - Google Patents

Led阵列板以及制造这种led阵列板的方法 Download PDF

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CN1073018C
CN1073018C CN97191333A CN97191333A CN1073018C CN 1073018 C CN1073018 C CN 1073018C CN 97191333 A CN97191333 A CN 97191333A CN 97191333 A CN97191333 A CN 97191333A CN 1073018 C CN1073018 C CN 1073018C
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substrate
line
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pellet parts
led
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CN1204984A (zh
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小野幸一郎
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Sanyo Electric Co Ltd
Sanyo Consumer Electronics Co Ltd
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Tottori Sanyo Electric Co Ltd
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Abstract

在带有发光区的发光二极管片沿长且狭窄的树脂制基片的长度于该基片宽度中心的一侧在该基片上基本上排成一行的发光二极管阵列板中，当把发光二极管设置到基片上时，该基片保持弯曲。另外，发光二极管片排成一条曲线。这就能确保在热硬化处理之后发光二极管片阵列会构成一条直线。

Description

LED阵列板以及制造这种LED阵列板的方法
技术领域
本发明涉及到一种诸如用于光学印刷机头或类似装置的LED(发光二极管)阵列板以及制造这种LED阵列板的方法。
背景技术
通常，业已通过按一行将多个LED(发光二极管)片并按另一行将多个驱动装置片同时设置在一长且狭窄的基片上而制造出诸如用于光学印刷机头或类似装置的ELO阵列板，如日本公开专利申请书第S60-72281号所述。这是因为，尽管不能生产出比约10mm长的片状器件，但光学印刷机头却通常要比200mm长。此外，为了获得令人满意的高印刷质量，需将LED片设置在一条直线上，所以，通常使用陶瓷或其它抗变形的材料制成的基片。
但是，可在诸如A0纸之类大型纸张下进行印刷的光学印刷机需要约1100mm长的基片，并且，如果这种基片是由陶瓷制成的，则该基片会非常沉重。使用这种重的基片需要相应较大的支承组件，从而使得印刷机在整体上很大。
为了克服这个问题，业已发明了这样一种方法，其中，将LED片设置在由树脂制成的轻重量基片上。图1(a)和1(b)示出了用这种方法制成的LED阵列板的结构。图1(a)是使用了树脂制基片的LED阵列板的平面图。图1(b)是沿图1(a)中A-A线的剖面图。长且狭窄的树脂制基片1是长1100mm、35mm宽、0.6-1.5mm厚的印刷电路板。基片的基体11是由环氧玻璃聚酯胶片、环氧玻璃聚酯胶片及陶瓷的混合物、环氧纸聚酯胶片或类似材料制成的。基片1带有印刷图案12a至12d，它们通过镀铜、印刷、金属化或类似方法而形成在基体11上。这些图案最好形成在尽可能大的区域上，以提高基片1的强度、便于形成在LED片2上的LED的散热并减少连线电阻对向LED供电的电源电压的影响。事实上，在这个实例中，分别用于电源负极(接地侧)和正极的印刷图案12a和12b形成在尽可能大的区域上，此外，用于散热的印刷图案12d同时还形成在基片1的底面上。如果需要的话，可将多层布线印刷电路板用作基片1。印刷图案12c用来连接驱动LED的驱动器(以后予以说明)。
沿基片1的长度成行地设置LED片2，并且，按与LED片相平行的另一行设置用于驱动LED的驱动器片3。上述片状器件相对基片1的宽度方向上的中心用热凝性粘合剂4和5固定在该基片1的一侧(图1(a)中的上侧)上。在这一实例中，图中的尺寸C约为10mm。在一侧设置片状器件有助于减小印刷机头的宽度。每个LED片2均形成为一所谓的单体阵列，例如，每个LED片均为8mm长、0.6mm宽并且顶表面上沿长度方向带有一线性发光区21阵列，这些发光区可提供为500dpi(每英寸的点数)的清晰度，而且，每个发光区均配备有一独立的电极22，此外，LED片的底面上还带有一共用电极(未示出)。将多个这样的LED片2设置成它们的发光区21会形成一直线，该直线几乎在基片1的整个长度上延伸，这些片状器件用导电的热凝性粘合剂4如包含环氧树脂作为主要成份的银胶固定在从而停留在基片1上。
另一方面，带有内置于顶面附近的集成电路的驱动器片3沿与LED片2大致平行的线设置并用不导电的热凝性粘合剂5如以环氧树脂为基础的粘合剂固定在基片1上。每个驱动器片3的一端均用一细的连线用导线6与相应的LED片2的独立电极22相连。另一端则同样用细的连线用导线6与用来连接驱动器片的印刷图案12c或用于电源正极的印刷图案12b相连。
基片1带有通孔13a和凹口13b，它们使得基片1固定在印刷头支承部件或散热件上。
但是，具有上述结构的LED阵列板10的实际生产证实了它有下述缺陷。
图4示出了实验结果，其中，通过自动粘合机用热凝性粘合剂4将113个LED片2设置在树脂基片1上，然后靠加热使粘合剂硬化。在图4中，横轴表示各个LED片2的位置，纵轴表示各个LED片2沿基片1的宽度方向相对两端经过LED片2的直线的偏移量。在图4中，曲线(A)示出了刚从自动粘合机上取下基片时所观察到的偏移量，并且，假定LED片2相对基片1的宽度中心设置在基片1的“上侧”，则上述曲线在中部向下弯曲约0.15mm。曲线(B)示出了热凝性粘合剂4热硬化之后所观察到的偏移量，并且，这些曲线在中部向上弯曲约0.15mm。曲线(c)示出了热硬化前的偏移量与热硬化后的偏移量之差，并且，这些曲线表明，热凝性粘合剂4的热硬化会使这些曲线在中部向上移动最大0.25mm。
通过调节自动粘合机可以减小LED片2阵列在热硬化前的弯曲。图3示出了用经过适当调整的自动粘合机所进行的实验的结果。在图3中，和图4一样，横轴表示各个LED片2的位置，纵轴表示各个LED片2沿基片1的宽度方向相对两端经过LED片2的直线的偏移量。曲线(A)示出了调整自动粘合机平直度后将LED片2设置到基片1上时所观察到的偏移量，并且，此曲线表示出了所述偏移量在-0.07mm到+0.03mm的范围内。但是，在热硬化之后，如曲线(B)所示，所述偏移量是一条在中部向上弯曲约0.2mm的曲线。这种源于热硬化的变化不是由热硬化过程中LED片2的运动引起的，而是由于如图2所示在热硬化之前具有如虚线所示形状的基片1在热硬化之后于图2平面内如实线所示那样向上弯曲引起的。这种弯曲源于相对基片1的宽度中心设置在基片1一侧(图1(a)中的上侧)的LED和驱动器片3，并且，业已发现，只要基片是由树脂制成的，就不可避免有这种弯曲。
本发明的一个目的是提供一种LED阵列板，其中，LED片(LEDPellets)在树脂制基片上精确地排成一条直线。
本发明的另一目的是提供一种制造LED阵列板的方法，在所说的LED板中，LED片在树脂制基片上精确地排成一条直线。
发明的公开
依照本发明，在带有发光区的片状器件阵列设置在长且狭窄的树脂制基片上且用粘合剂将片状器件沿基片的长度成排地设置在基片宽度中心的一侧上的LED阵列板中，当把所述片状器件设置到基片上时，基片会在与之平行的平面内保持弯曲(翘曲)。
另外，依照本发明，在一类似的LED阵列板中，用粘合剂将片状器件固定到基片上，并且，所述片状器件会因粘合剂硬化时形成在基片上的弯曲而排成一条直线。
再有，依照本发明，在一类似的LED阵列板中，提供了以下措施：用于使基片在与之平行的平面内形成弯曲的措施；用于通过粘合剂使片状器件基本上排成一条直线的措施；以及，用于使粘合剂硬化的措施。
此外，依照本发明，在一类似的LED阵列基板中，提供了以下措施：用粘合剂以能消除粘合剂硬化时形成在基片上的弯曲从而防止片状器件不排成一条直线的方式使片状器件排成弯曲、V形或阶梯线的措施；以及，用于通过加热使粘合剂硬化的措施。
对附图的简要说明
图1(a)是体现本发明的LED阵列板的平面图，它示出了该阵列板主要部分的结构，图1(b)是沿图1(a)中A-A线的剖面图；
图2是概略说明树脂制基片的弯曲情况的图；
图3是显示本发明LED片阵列与先有技术相比较的平直度的图；
图4是显示先有技术LED片阵列的平直度的图；
图5(a)、5(b)和5(c)是概略说明在制造本发明第一实施例过程中所观察到的基片的弯曲的图；
图6是本发明第二实施例的平面图；
图7是本发明第三实施例的平面图；
图8(a)和8(b)是概略说明本发明第四和第五实施例的图；
图9(a)、9(b)和9(c)是说明上述第三实施例中LED片位置的详细图。
实现本发明的最佳模式
以下用一个实施例即图1(a)和1(b)所示的前述LED阵列板10来说明本发明的第一实施例。图5(a)、5(b)和5(c)是概略说明图1(a)所示基片1在制造该实施例过程中是如何形成弯曲的图。图5(a)说明了如何在自动粘合机上用粘合剂将LED片2固定到基片1上的实例。所述自动粘合机带有一用螺栓31固定在其上的板材夹持台24。板材夹持台24上设置有横向止动件23a和23b、纵向止动件26、板簧30以及通过气缸固定件固定在台24上的气缸29。气缸29的活塞杆的端部嵌有一加压部件27。基片1自动地传到板材夹持台24上并通过纵向止动件26和板簧30纵向地定位。然后，气缸29启动，因此，加压部件27和横向止动件23a和23b会使基片1横向定位。横向止动件23a和23b在基片1的纵向端部附近支承着该基片。加压部件27大致在基片1的纵向中部处支承着该基片。通过调整气缸29在这时施加的压力，可以控制基片1在其所在平面内的弯曲程度。在这一实施例中，基片1定位成能以对称于其长度中心的方式向上弯曲。适当的压力取决于基片1的类型以及热凝性粘合剂4的硬化特性。所以，应该用实验的方式来确定该压力。在上述状态下，用热凝性粘合剂4沿点划线25a所示的直线将LED片2粘合于基片1。然后，从自动粘合机上取下基片1。这时，也就是说在热凝性粘合剂4硬化之前，如图5(b)所示，基片1几乎未表现出弯曲，从而，LED片2沿其设置的线会如点划线25b所示那样向下弯曲。在热凝性粘合剂4热硬化之后，如图5(c)所示，基片1向上弯曲，从而，LED片2沿其设置的线会如点划线25c所示那样变为几乎是直线。
按着这种方式，通过在将LED片2设置到基片1上时使基片1在其所在平面内保持弯曲，可在热凝性粘合剂4热硬化之后获得LED片2精确地排成一条直线的LED阵列板。
以下参照图6说明本发明的第二实施例。在图6中，用相同的标号表示与图5共有的部分。热硬化所导致的弯曲并不总是对称于基片1的长度中心，而是取决于诸如基片1形状和LED片2的位置之类的LED阵列板结构，取决于热凝性粘合剂4的硬化特性以及其它因素，所说的弯曲通常会具有位于偏离基片1长度中心的位置处的顶点。在这种情况下，不是如前所述那样向基片1的纵向中部施加压力，而是使气缸29移动成压力能够作用于基片1的不同部分。这就会使得基片1以能消除在热凝性粘合剂4热硬化之后所产生的弯曲的方式弯曲。
图3示出了将上述内容付诸实践的实验结果。在图3中，曲线(c)示出了当用自动粘合机将LED片2粘合于基片1并且在沿纵向离开基片1的一端距离为基片1总长的六分之一的位置处将压力作用于基片1从而基片1会适当弯曲然后从自动粘合机上取下基片1时所观察到的LED片2的偏移量。在120℃下硬化120分钟之后，如曲线(D)所示，LED片阵列会构成一条高精度的直线，最大偏移量为0.03mm。
以下参照图7说明本发明的第三实施例。在图7中，用相同的标号表示与图5共有的部分。如图7所示，在传送到自动粘合机的板材夹持台24上之后，基片1会因紧贴在纵向止动件26以及横向止动件23a和23b上而定位。将气缸29所施加的压力设置为在不导致弯曲的情况下使基片1定位所需的最小值。这就能够在从自动粘合机上取下基片1时阻止该基片弯曲。然后，用热凝性粘合剂4沿点划线25d所示的曲线将LED片2粘合于基片1，因此，可在热凝性粘合剂4热硬化之后获得LED片2以与图5(c)所示的同样方式排成一条直线的LED阵列板。同在第二实施例中一样，曲线(点划线25d)可具有位于偏离基片1长度中心的位置处的顶点。
相反地使用通常是在自动粘合机中所提供的平直度校正功能可以获得LED片2的弯曲结构，具体地说，通过保存表现为两维坐标的各片状器件相对理想直线的偏移量，可以使LED片2排成一条曲线。但是，在有大量的LED片2时，保存每个位置的偏移量不仅需要复杂地调节设备，而且需要有超出该设备存贮容量的存贮容量。因此，在将LED片2设置到基片1上时，可用如图8(a)中的点划线25f所示的V形线或者由如图8(b)所示的阶梯线来逼近所说的偏移量。
图9(a)示出了第三实施例中如图7所示的部分D的详细图。如图9(a)所示，由于存在有两维偏移，故LED片2沿曲线(点划线25d)排列，但每个LED片均放置成平行于基片1的边缘1a。在热硬化之后，如图9(b)所示，LED片2阵列会构成一条直线(点划线25e)，但每个LED片均放置成与该直线(点划线25e)有一定的角度。LED片离基片1的纵向端部之一越近，它所形成的角度就越大。每个LED片2均具有沿长度形成在一条线上的发光区(未示出)，所以，按一定角度放置LED片意味着其发光区与直线(点划线25e)有一定的角度。只要曲线(点划线25d)的曲率半径足够地大，就不会导致严重的问题，但是，当所述曲率半径不是很大时，上述发光区就会偏离直线(点划线25e)而使得做为最终产品的光学印刷机有较差的印刷质量。相反，如图9(c)所示，如果除LED片2的位置有两维偏移以外还以LED片的发光区较小地偏离曲线(点划线25d)的方式校正LED片的角度，则可以按所有的LED片2的发光区会在热硬化之后构成一条几乎为直的线的方式来设置所说的发光区。在难以用设备来进行角度校正的情况下，如图5(a)所示以及先前所述那样，可以在将基片1放置到板材夹持台24上时使该基片弯曲一定的程度，然后使LED片2排列成一条曲线。这有助于增加该曲线的曲率半径，从而提高了前述发光区的平直度。这一点也可应用于使用V形或阶梯线的情况。
在上述第一和第二实施例中，使基片1弯曲成具有过小的曲率半径会导致诸如细印刷图案折断，宽印刷图案脱落或在较高压力下基片掉下之类的问题。在这种情况下，也可以通过事先使基片1弯曲一定的程度而减小弯曲度，然后使LED片2排成一条曲线。
产业上的可应用性
如前所述，本发明的LED基板及其制造方法可用作其中用粘合剂多个LED片沿树脂基片的长度并于该基片宽度中心的一侧在该基片上排成一行的LED阵列板以及用作制造这种LED阵列的方法。

Claims (4)

1．一种发光二极管阵列板，在这种阵列板中，带有发光区的片状器件阵列设置在长且狭窄的树脂制基片上，用粘合剂使所述片状器件沿上述基片的长度在该基片的宽度中心的一侧上排成一行，其中，在把前述片状器件设置到基片上时，使该基片在与之平行的平面内保持弯曲。
2．一种发光二极管阵列板，在这种阵列板中，带有发光区的片状器件阵列设置在长且狭窄的树脂制基片上，用粘合剂使所述片状器件沿上述基片的长度在该基片的宽度中心的一侧上排成一行，其中，用所述粘合剂将前述片状器件连接于所说的基片，在所述粘合剂硬化时，所说的片状器件会因形成在前述基片上的弯曲而排成一条直线。
3．一种制造发光二极管阵列板的方法，在所述阵列板中，带有发光区的片状器件阵列设置在长且狭窄的树脂制基片上，用粘合剂使所述片状器件沿上述基片的长度在该基片的宽度中心的一侧上排成一行，其中，所述方法包括：用于使所述基片在与之平行的平面内形成弯曲的措施；用于用所述粘合剂使所述片状器件基本上排成一条直线的措施；以及，用于使所述粘合剂硬化的措施。
4．一种制造发光二极管阵列板的方法，在所述阵列板中，带有发光区的片状器件阵列设置在长且狭窄的树脂制基片上，用粘合剂使所述片状器件沿上述基片的长度在该基片的宽度中心的一侧上排成一行，其中，所述方法包括：用所述粘合剂以能消除粘合剂硬化时形成在基片上的弯曲从而防止片状器件不排成一条直线的方式使片状器件排成弯曲、V形或阶梯线的措施；以及，用于通过加热使所述粘合剂硬化的措施。
CN97191333A 1996-09-26 1997-09-22 Led阵列板以及制造这种led阵列板的方法 Expired - Fee Related CN1073018C (zh)

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JPS5323230A (en) * 1976-08-14 1978-03-03 Fujitsu Ltd Power closing control system
JPS57118077A (en) * 1981-01-06 1982-07-22 Central Glass Co Ltd Manufacture of glazed ceramic substrate

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