CN107299337A - A kind of chemical copper plating solution stabilization agent and preparation method thereof - Google Patents
A kind of chemical copper plating solution stabilization agent and preparation method thereof Download PDFInfo
- Publication number
- CN107299337A CN107299337A CN201710438460.6A CN201710438460A CN107299337A CN 107299337 A CN107299337 A CN 107299337A CN 201710438460 A CN201710438460 A CN 201710438460A CN 107299337 A CN107299337 A CN 107299337A
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- CN
- China
- Prior art keywords
- plating solution
- copper plating
- stabilization agent
- chemical copper
- added
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
Abstract
The invention discloses a kind of chemical copper plating solution stabilization agent, it is made up of following mass parts raw materials：The three hydration g/L of potassium ferrocyanide 22 26, the g/L of Rochelle salt 60 70,2 thiol benzothiazole of accelerator 0.38 0.39 g/L, water 1L.The preparation method of chemical copper plating solution stabilization agent, is comprised the following steps that：Under normal temperature, three are added into water and is hydrated potassium ferrocyanides, and stir 5 10min, then added Rochelle salt, stir 5 10min, be eventually adding 2 thiol benzothiazoles, stirring is to being completely dissolved.The present invention, which has, can improve the stability of chemical copper electrolyte, the advantage for reducing and avoiding copper ion to be disproportionated.
Description
Technical field
The present invention relates to a kind of chemical copper plating solution stabilization agent and preparation method thereof.
Background technology
In the production of electroless copper, the existence form of copper ion is most of second order copper ion and few portion in copper plating solution
The single order copper ion divided, still, the presence of other anion are easy to the superfine small particulate for making copper ion disproportionation become copper, it
Be irregularly dispersed in chemical bronze plating liquid, these copper particulates have catalytic, if to these copper particulates without control,
Then rapidly lead to whole plating solution to decompose, this is the main cause for causing chemical bronze plating liquid unstable.
The content of the invention
Goal of the invention：The invention aims to solve deficiency of the prior art there is provided one kind to improve chemistry
The stability of copper electrolyte is plated, a kind of chemical copper plating solution stabilization agent and preparation method thereof of copper ion disproportionation is reduced and avoid.
Technical scheme：A kind of chemical copper plating solution stabilization agent of the present invention, is made up of following mass parts raw materials：Three hydrations are sub-
Potassium ferricyanide 22-26 g/L, Rochelle salt 60-70 g/L, accelerator 2- thiol benzothiazoles 0.38-0.39
G/L, water 1L.
The preparation method of chemical copper plating solution stabilization agent, is comprised the following steps that：Under normal temperature, three hydrations are added into water sub-
The potassium ferricyanide, and 5-10min is stirred, Rochelle salt is then added, 5-10min is stirred, is eventually adding 2- mercaptos
Benzothiazole, stirring is to being completely dissolved.
Beneficial effect：
Preparation technology of the present invention is simple and convenient, and the stabilization agent being made improves the stability of copper ion in copper plating solution, it is therefore prevented that
Because disproportionated reaction bears copper powder.
Embodiment
Embodiments of the present invention are illustrated by particular specific embodiment below, those skilled in the art can be by this explanation
Content disclosed by book understands other advantages and effect of the present invention easily.
Embodiment 1,
Raw material：Three hydration potassium ferrocyanide 22g/L, the g/L of Rochelle salt 70, accelerator 2- thiol benzothiazoles
0.39 g/L, water 1L.
Preparation method, is comprised the following steps that：Under normal temperature, three hydration potassium ferrocyanides are added into water, and stir 5-
10min, then adds Rochelle salt, stirs 5-10min, is eventually adding 2- thiol benzothiazoles, stirs to complete
Fully dissolved.
The copper plating solution for the stabilization agent that embodiment 1 is made is added, chemical bronze plating liquid is stable, the copper plate outward appearance being finally made
Glow, surfacing, crystal grain is careful.
Embodiment 2,
Raw material：Three hydration potassium ferrocyanide 22 g/L, Rochelle salt 60g/L, accelerator 2- thiol benzothiazoles
0.38g/L, water 1L.
Preparation method, is comprised the following steps that：Under normal temperature, three hydration potassium ferrocyanides are added into water, and stir 5-
10min, then adds Rochelle salt, stirs 5-10min, is eventually adding 2- thiol benzothiazoles, stirs to complete
Fully dissolved.
The copper plating solution for the stabilization agent that embodiment 2 is made is added, chemical bronze plating liquid is stable, the copper plate outward appearance being finally made
Glow, surfacing, crystal grain is careful.
Embodiment 3,
Raw material：The three hydration g/L of potassium ferrocyanide 25, the g/L of Rochelle salt 65, accelerator 2- thiol benzothiazoles
0.385 g/L, water 1L.
Preparation method, is comprised the following steps that：Under normal temperature, three hydration potassium ferrocyanides are added into water, and stir 5-
10min, then adds Rochelle salt, stirs 5-10min, is eventually adding 2- thiol benzothiazoles, stirs to complete
Fully dissolved.
The copper plating solution for the stabilization agent that embodiment 3 is made is added, chemical bronze plating liquid is stable, the copper plate outward appearance being finally made
Glow, surfacing, crystal grain is careful.
Embodiment 4,
Raw material：Three hydration potassium ferrocyanide 26 g/L, Rochelle salt 60g/L, accelerator 2- thiol benzothiazoles
0.38g/L, water 1L.
Preparation method, is comprised the following steps that：Under normal temperature, three hydration potassium ferrocyanides are added into water, and stir 5-
10min, then adds Rochelle salt, stirs 5-10min, is eventually adding 2- thiol benzothiazoles, stirs to complete
Fully dissolved.
The copper plating solution for the stabilization agent that embodiment 4 is made is added, chemical bronze plating liquid is stable, the copper plate outward appearance being finally made
Glow, surfacing, crystal grain is careful.
Embodiment 5,
Raw material：The three hydration g/L of potassium ferrocyanide 26, the g/L of Rochelle salt 70, accelerator 2- thiol benzothiazoles
0.38 g/L, water 1L.
Preparation method, is comprised the following steps that：Under normal temperature, three hydration potassium ferrocyanides are added into water, and stir 5-
10min, then adds Rochelle salt, stirs 5-10min, is eventually adding 2- thiol benzothiazoles, stirs to complete
Fully dissolved.
The copper plating solution for the stabilization agent that embodiment 5 is made is added, chemical bronze plating liquid is stable, the copper plate outward appearance being finally made
Glow, surfacing, crystal grain is careful.
Embodiment 6,
Raw material：The three hydration g/L of potassium ferrocyanide 22, the g/L of Rochelle salt 68, accelerator 2- thiol benzothiazoles
0.39 g/L, water 1L.
Preparation method, is comprised the following steps that：Under normal temperature, three hydration potassium ferrocyanides are added into water, and stir 5-
10min, then adds Rochelle salt, stirs 5-10min, is eventually adding 2- thiol benzothiazoles, stirs to complete
Fully dissolved.
The copper plating solution for the stabilization agent that embodiment 6 is made is added, chemical bronze plating liquid is stable, the copper plate outward appearance being finally made
Glow, surfacing, crystal grain is careful.
By being separately added into the stabilization agent that 1-6 of the embodiment of the present invention is made in copper plating solution, present invention system is added
Into copper plating solution transparency preferably, no precipitation, copper plating solution stability is good.And the stabilization agent that embodiment 3 is made, it is used as addition
Agent is added after copper plating solution, and the stability of copper plating solution is best, transparency highest.The present invention has marketing.
Above-mentioned embodiment, technical concept and architectural feature only to illustrate the invention, it is therefore intended that allow and be familiar with this
The stakeholder of item technology can implement according to this, but above content is not intended to limit protection scope of the present invention, every according to this hair
Any equivalent change or modification that bright Spirit Essence is made, all should fall under the scope of the present invention.
Claims (3)
1. a kind of chemical copper plating solution stabilization agent, it is characterised in that be made up of following mass parts raw materials：Three hydration ferrocyanides
Potassium 22-26 g/L, Rochelle salt 60-70 g/L, 2- thiol benzothiazole 0.38-0.39 g/L, water 1L.
2. a kind of preparation method of chemical copper plating solution stabilization agent according to claim 1, it is characterised in that specific step
It is rapid as follows：Under normal temperature, three hydration potassium ferrocyanides are added into water, and stir 5-10min, four is then added and is hydrated potassium tartrates
Sodium, stirs 5-10min, is eventually adding 2- thiol benzothiazoles, and stirring is to being completely dissolved.
3. a kind of chemical copper plating solution stabilization agent according to claim 1, it is characterised in that described 2- mercaptos benzene a pair of horses going side by side
Thiazole is accelerator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710438460.6A CN107299337A (en) | 2017-06-12 | 2017-06-12 | A kind of chemical copper plating solution stabilization agent and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710438460.6A CN107299337A (en) | 2017-06-12 | 2017-06-12 | A kind of chemical copper plating solution stabilization agent and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
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| CN107299337A true CN107299337A (en) | 2017-10-27 |
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| CN201710438460.6A Pending CN107299337A (en) | 2017-06-12 | 2017-06-12 | A kind of chemical copper plating solution stabilization agent and preparation method thereof |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101684554A (en) * | 2008-09-23 | 2010-03-31 | 比亚迪股份有限公司 | Chemical copper plating solution for polyimide film and surface chemical copper plating method thereof |
| CN102191491A (en) * | 2010-03-10 | 2011-09-21 | 比亚迪股份有限公司 | Chemical copper-plating solution and chemical copper-plating method |
| CN102877046A (en) * | 2011-07-13 | 2013-01-16 | 比亚迪股份有限公司 | Chemical copper plating liquid and chemical copper plating method |
-
2017
- 2017-06-12 CN CN201710438460.6A patent/CN107299337A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101684554A (en) * | 2008-09-23 | 2010-03-31 | 比亚迪股份有限公司 | Chemical copper plating solution for polyimide film and surface chemical copper plating method thereof |
| CN102191491A (en) * | 2010-03-10 | 2011-09-21 | 比亚迪股份有限公司 | Chemical copper-plating solution and chemical copper-plating method |
| CN102877046A (en) * | 2011-07-13 | 2013-01-16 | 比亚迪股份有限公司 | Chemical copper plating liquid and chemical copper plating method |
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Application publication date: 20171027 |