CN107295782B - 一种适用于终端的硅胶垫的结构及终端 - Google Patents
一种适用于终端的硅胶垫的结构及终端 Download PDFInfo
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- CN107295782B CN107295782B CN201710542557.1A CN201710542557A CN107295782B CN 107295782 B CN107295782 B CN 107295782B CN 201710542557 A CN201710542557 A CN 201710542557A CN 107295782 B CN107295782 B CN 107295782B
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims abstract description 93
- 239000000741 silica gel Substances 0.000 title claims abstract description 93
- 229910002027 silica gel Inorganic materials 0.000 title claims abstract description 93
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 25
- 229910003460 diamond Inorganic materials 0.000 claims description 3
- 239000010432 diamond Substances 0.000 claims description 3
- 238000004080 punching Methods 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 abstract description 6
- 238000000034 method Methods 0.000 abstract description 6
- 238000010586 diagram Methods 0.000 description 7
- 239000000956 alloy Substances 0.000 description 6
- 229910045601 alloy Inorganic materials 0.000 description 6
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 239000002184 metal Substances 0.000 description 3
- 230000004075 alteration Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Thermal Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201710542557.1A CN107295782B (zh) | 2017-07-05 | 2017-07-05 | 一种适用于终端的硅胶垫的结构及终端 |
Applications Claiming Priority (1)
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CN201710542557.1A CN107295782B (zh) | 2017-07-05 | 2017-07-05 | 一种适用于终端的硅胶垫的结构及终端 |
Publications (2)
Publication Number | Publication Date |
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CN107295782A CN107295782A (zh) | 2017-10-24 |
CN107295782B true CN107295782B (zh) | 2024-02-23 |
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CN201710542557.1A Active CN107295782B (zh) | 2017-07-05 | 2017-07-05 | 一种适用于终端的硅胶垫的结构及终端 |
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CN (1) | CN107295782B (zh) |
Citations (17)
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CN2370654Y (zh) * | 1999-03-29 | 2000-03-22 | 东圣科技股份有限公司 | 一种电器盒 |
US6531771B1 (en) * | 1999-04-20 | 2003-03-11 | Tyco Electronics Corporation | Dissipation of heat from a circuit board having bare silicon chips mounted thereon |
JP2004349345A (ja) * | 2003-05-20 | 2004-12-09 | Denso Corp | 電子制御装置 |
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CN201725239U (zh) * | 2010-02-08 | 2011-01-26 | 厦门喜康乐电器有限公司 | 多功能电脑垫 |
CN102184001A (zh) * | 2009-10-31 | 2011-09-14 | 佛山市顺德区汉达精密电子科技有限公司 | 隔热结构 |
CN202281972U (zh) * | 2011-10-13 | 2012-06-20 | 鸿富锦精密工业(深圳)有限公司 | 电子装置及其散热装置 |
CN102883202A (zh) * | 2012-10-19 | 2013-01-16 | 苏州汉辰数字科技有限公司 | 双模机顶盒散热装置 |
KR101319564B1 (ko) * | 2013-06-10 | 2013-10-23 | 이진성 | 전기전자 기기용 방열구조체 |
CN203413587U (zh) * | 2013-06-19 | 2014-01-29 | 天长市金陵电子有限责任公司 | 一种led灯条的散热结构 |
CN204178306U (zh) * | 2014-11-18 | 2015-02-25 | 西安邮电大学 | 一种计算机芯片散热器 |
CN105744813A (zh) * | 2016-04-29 | 2016-07-06 | 广东欧珀移动通信有限公司 | 一种移动终端 |
CN205721569U (zh) * | 2016-04-27 | 2016-11-23 | 东莞市锐准精密金属有限公司 | 压铸车载电脑壳体 |
CN106326847A (zh) * | 2016-08-16 | 2017-01-11 | 广东欧珀移动通信有限公司 | 指纹模组、指纹模组制作方法及移动终端 |
CN206181696U (zh) * | 2016-10-28 | 2017-05-17 | 中科创达软件科技(深圳)有限公司 | 一种低热阻的手机屏蔽散热结构及具有该结构的手机 |
CN206226918U (zh) * | 2016-12-06 | 2017-06-06 | 广州科服仪器有限公司 | 一种数据采集卡 |
CN207410645U (zh) * | 2017-07-05 | 2018-05-25 | 华勤通讯技术有限公司 | 一种适用于终端的硅胶垫的结构及终端 |
-
2017
- 2017-07-05 CN CN201710542557.1A patent/CN107295782B/zh active Active
Patent Citations (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2370654Y (zh) * | 1999-03-29 | 2000-03-22 | 东圣科技股份有限公司 | 一种电器盒 |
US6531771B1 (en) * | 1999-04-20 | 2003-03-11 | Tyco Electronics Corporation | Dissipation of heat from a circuit board having bare silicon chips mounted thereon |
JP2004349345A (ja) * | 2003-05-20 | 2004-12-09 | Denso Corp | 電子制御装置 |
CN201230432Y (zh) * | 2008-08-01 | 2009-04-29 | 北京星网锐捷网络技术有限公司 | 一种机箱以及散热装置 |
CN102184001A (zh) * | 2009-10-31 | 2011-09-14 | 佛山市顺德区汉达精密电子科技有限公司 | 隔热结构 |
CN201725239U (zh) * | 2010-02-08 | 2011-01-26 | 厦门喜康乐电器有限公司 | 多功能电脑垫 |
CN202281972U (zh) * | 2011-10-13 | 2012-06-20 | 鸿富锦精密工业(深圳)有限公司 | 电子装置及其散热装置 |
CN102883202A (zh) * | 2012-10-19 | 2013-01-16 | 苏州汉辰数字科技有限公司 | 双模机顶盒散热装置 |
KR101319564B1 (ko) * | 2013-06-10 | 2013-10-23 | 이진성 | 전기전자 기기용 방열구조체 |
CN203413587U (zh) * | 2013-06-19 | 2014-01-29 | 天长市金陵电子有限责任公司 | 一种led灯条的散热结构 |
CN204178306U (zh) * | 2014-11-18 | 2015-02-25 | 西安邮电大学 | 一种计算机芯片散热器 |
CN205721569U (zh) * | 2016-04-27 | 2016-11-23 | 东莞市锐准精密金属有限公司 | 压铸车载电脑壳体 |
CN105744813A (zh) * | 2016-04-29 | 2016-07-06 | 广东欧珀移动通信有限公司 | 一种移动终端 |
CN106326847A (zh) * | 2016-08-16 | 2017-01-11 | 广东欧珀移动通信有限公司 | 指纹模组、指纹模组制作方法及移动终端 |
CN206181696U (zh) * | 2016-10-28 | 2017-05-17 | 中科创达软件科技(深圳)有限公司 | 一种低热阻的手机屏蔽散热结构及具有该结构的手机 |
CN206226918U (zh) * | 2016-12-06 | 2017-06-06 | 广州科服仪器有限公司 | 一种数据采集卡 |
CN207410645U (zh) * | 2017-07-05 | 2018-05-25 | 华勤通讯技术有限公司 | 一种适用于终端的硅胶垫的结构及终端 |
Non-Patent Citations (1)
Title |
---|
一种星载表贴芯片的散热结构设计与优化;朱金彪;;现代电子技术;20081115(22);全文 * |
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CN107295782A (zh) | 2017-10-24 |
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Address after: 201210 Building 1, 399 Keyuan Road, Zhangjiang High Tech Park, Pudong New Area, Shanghai Applicant after: Huaqin Technology Co.,Ltd. Address before: 201210 Building 1, 399 Keyuan Road, Zhangjiang High Tech Park, Pudong New Area, Shanghai Applicant before: Huaqin Technology Co.,Ltd. Address after: 201210 Building 1, 399 Keyuan Road, Zhangjiang High Tech Park, Pudong New Area, Shanghai Applicant after: Huaqin Technology Co.,Ltd. Address before: 201210 Building 1, 399 Keyuan Road, Zhangjiang High Tech Park, Pudong New Area, Shanghai Applicant before: HUAQIN TELECOM TECHNOLOGY Co.,Ltd. |
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