CN107293502B - A kind of BGA Package component solder ball coplanarity detection system - Google Patents
A kind of BGA Package component solder ball coplanarity detection system Download PDFInfo
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- CN107293502B CN107293502B CN201610223751.9A CN201610223751A CN107293502B CN 107293502 B CN107293502 B CN 107293502B CN 201610223751 A CN201610223751 A CN 201610223751A CN 107293502 B CN107293502 B CN 107293502B
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- client
- electrode leads
- processing system
- compression bar
- piezo
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
A kind of BGA Package component solder ball coplanarity detection system, including stress compression bar 1, play needle shell 2, power transmission spring 3, piezo-electric crystal 4, electrode leads to client 5, information processing system 8, the wherein BGA soldered ball 6 on 1 upper-end contact device package 7 of stress compression bar, 1 lower end of stress compression bar connects power transmission spring 3, power transmission spring 3 and 1 lower end of stress compression bar, which are installed on, to be played among needle shell 2, the bottom for playing needle shell 2 is installed by piezo-electric crystal 4, 4 lower part of piezo-electric crystal is installed by electrode leads to client 5, electrode leads to client 5 passes through conducting wire link information processing system 8, information processing system 8 can be handled the signal that electrode leads to client 5 transmits.
Description
Technical field
The invention belongs to detection system fields, and in particular to a kind of BGA Package component solder ball coplanarity detection system
System.
Background technique
BGA package form becomes numerous semiconductor element devices due to pin density is high, signal is delayed small, excellent radiation performance
The first choice of part.According to the requirement of GJB 7677-2012 " ball grid array (BGA) test method ", to guarantee bga semiconductor device
The structural reliability that the quality conformance and product of part are welded needs to examine the coplanarity parameter of bottom device soldered ball
It surveys.The vertical range between datum plane when coplanarity refers to soldered ball vertex and the welding established.
Currently, common BGA solder ball coplanarity detection system is Systems for optical inspection in the market.Using optical 3-dimensional at
As to all soldered balls carry out three-dimensional imaging, extract the height on soldered ball vertex, then judge all soldered balls apex height whether
Meet the requirement of relevant criterion or application.These optical systems are expensive, maintenance cost is high, and the corresponding design of domestic shortage
Manufacturing capacity.
Summary of the invention
The purpose of the present invention is to provide a kind of BGA Package component solder ball coplanarity detection systems, can be to not
Solder ball coplanarity with the bga semiconductor component of outer dimension carries out quantitative detection, final to determine that solder ball coplanarity refers to
Whether mark meets relevant standard or application requirement.
Technical scheme is as follows: a kind of BGA Package component solder ball coplanarity detection system, including by
It forces bar, play needle shell, power transmission spring, piezo-electric crystal, electrode leads to client, information processing system, wherein terminated on stress compression bar
The BGA soldered ball on device package is touched, stress compression bar lower end connection power transmission spring, power transmission spring and stress compression bar lower end are installed on
It plays among needle shell, piezo-electric crystal is installed in the bottom for playing needle shell, and electrode leads to client, electrode leads to client are installed in piezo-electric crystal lower part
By conducting wire link information processing system, the signal that information processing system can transmit electrode leads to client is handled.
Piezo-electric crystal experiences the size of pressure, signal is passed to information processing system by electrode leads to client, by information
Processing system identifies pressure size.
Remarkable result of the invention is: it is of simple structure and low cost, it can be conveniently accurately to the height of BGA soldered ball
It is detected, obtains the coplanarity information of soldered ball, realized to the whether standard compliant judgement of semiconductor components and devices presentation quality.
Detailed description of the invention
Fig. 1 is BGA Package component solder ball coplanarity detecting system schematic diagram of the present invention
In figure: stress compression bar 1 plays needle shell 2, power transmission spring 3, piezo-electric crystal 4, electrode leads to client 5, BGA soldered ball 6, connects
Touch device package 7, information processing system 8
Specific embodiment
A kind of BGA Package component solder ball coplanarity detection system, including stress compression bar 1, bullet needle shell 2, power transmission
Spring 3, piezo-electric crystal 4, electrode leads to client 5, information processing system 8, wherein on 1 upper-end contact device package 7 of stress compression bar
BGA soldered ball 6,1 lower end of stress compression bar connection power transmission spring 3, power transmission spring 3 and 1 lower end of stress compression bar are installed on and play needle shell 2
Among, piezo-electric crystal 4 is installed in the bottom for playing needle shell 2, and electrode leads to client 5 is installed in 4 lower part of piezo-electric crystal, and electrode leads to client 5 is logical
Conducting wire link information processing system 8 is crossed, information processing system 8 can be handled the signal that electrode leads to client 5 transmits.
When work, piezo-electric crystal 4 experiences the size of pressure, and signal is passed to information processing system by electrode leads to client 5
System 8 identifies pressure size by information processing system 8, and the pressure size transmitted to different BGA soldered balls is compared, finally
Judge the coplanarity of BGA Package component soldered ball.
Claims (2)
1. a kind of BGA Package component solder ball coplanarity detection system, it is characterised in that: including stress compression bar (1), bullet
Needle shell (2), power transmission spring (3), piezo-electric crystal (4), electrode leads to client (5), information processing system (8), wherein stress compression bar
(1) the BGA soldered ball (6) on upper-end contact device package (7), stress compression bar (1) lower end connect power transmission spring (3), power transmission bullet
Spring (3) and stress compression bar (1) lower end, which are installed on, to be played among needle shell (2), and piezo-electric crystal (4) are installed in the bottom for playing needle shell (2),
Electrode leads to client (5) are installed in piezo-electric crystal (4) lower part, and electrode leads to client (5) passes through conducting wire link information processing system (8), letter
The signal that breath processing system (8) can transmit electrode leads to client (5) is handled.
2. a kind of BGA Package component solder ball coplanarity detection system according to claim 1, it is characterised in that:
Piezo-electric crystal (4) experiences the size of pressure, signal is passed to information processing system (8) by electrode leads to client (5), by information
Processing system (8) identifies pressure size.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610223751.9A CN107293502B (en) | 2016-04-12 | 2016-04-12 | A kind of BGA Package component solder ball coplanarity detection system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610223751.9A CN107293502B (en) | 2016-04-12 | 2016-04-12 | A kind of BGA Package component solder ball coplanarity detection system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107293502A CN107293502A (en) | 2017-10-24 |
| CN107293502B true CN107293502B (en) | 2019-10-22 |
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ID=60093072
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610223751.9A Active CN107293502B (en) | 2016-04-12 | 2016-04-12 | A kind of BGA Package component solder ball coplanarity detection system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107293502B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109192677B (en) * | 2018-09-11 | 2024-06-14 | 长江存储科技有限责任公司 | Package inspection device |
| CN113739826B (en) * | 2021-08-13 | 2023-09-22 | 湘潭大学 | Optical fiber sensing device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204289401U (en) * | 2014-12-16 | 2015-04-22 | 深圳市慧为智能科技有限公司 | A kind of bga chip manual detection device |
| CN105334444A (en) * | 2015-11-14 | 2016-02-17 | 苏州光韵达光电科技有限公司 | Detection system of BGA chip |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070064243A1 (en) * | 2005-09-20 | 2007-03-22 | Yunus Yusri M | Method of characterizing substrate warpage |
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2016
- 2016-04-12 CN CN201610223751.9A patent/CN107293502B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204289401U (en) * | 2014-12-16 | 2015-04-22 | 深圳市慧为智能科技有限公司 | A kind of bga chip manual detection device |
| CN105334444A (en) * | 2015-11-14 | 2016-02-17 | 苏州光韵达光电科技有限公司 | Detection system of BGA chip |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107293502A (en) | 2017-10-24 |
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