CN202083762U - Detection device for printed circuit board - Google Patents
Detection device for printed circuit board Download PDFInfo
- Publication number
- CN202083762U CN202083762U CN2011201612469U CN201120161246U CN202083762U CN 202083762 U CN202083762 U CN 202083762U CN 2011201612469 U CN2011201612469 U CN 2011201612469U CN 201120161246 U CN201120161246 U CN 201120161246U CN 202083762 U CN202083762 U CN 202083762U
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- China
- Prior art keywords
- circuit board
- printed circuit
- probe
- installing plate
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- Expired - Fee Related
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- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Tests Of Electronic Circuits (AREA)
Abstract
The utility model relates to a detection device for a printed circuit board, which comprises an installation plate (1); the upper surface of the installation plate (1) is provided with detection points which are matched with network points on the printed circuit board to be detected; the lower surface of the installation plate (1) is provided with probes (2) which are connected with welding points on the circuit board to be detected; and the probes (2) are connected with a computer (3). The detection device for the printed circuit board can detect the invisible welding points.
Description
Technical field
The utility model relates to printed circuit board detection technique field, particularly relates to a kind of pick-up unit that is used for printed circuit board.
Background technology
Along with the develop rapidly of electronic technology, continuing to bring out of the miniaturization of encapsulation and the densification of assembling and various novel encapsulated technology, also more and more higher to the requirement of electronics assembling quality.So method and the technology checked are had higher requirement.The measuring technology of using in electronics assembling test field at present is of a great variety, and Manual Visual Inspection, on-line testing, automated optical are tested in commonly used having, X ray test, functional test etc. automatically.These detection modes all have oneself advantage and weak point separately.
Manual Visual Inspection is a kind of method of with the naked eye checking.Its sensing range is limited, can only check that device neglected loading, direction polarity, model are corrected errors, bridging and part rosin joint.Because Manual Visual Inspection is subject to the influence of people's subjective and objective factor, has very high instability.Manual Visual Inspection is difficult more when handling the thin space chip.Particularly when the BGA device adopted in a large number, to the inspection of its welding quality, Manual Visual Inspection was almost powerless.
Flying probe is a kind of hardware check mode.It is to realize detecting with the method that two probes power up device, and defective such as can detection means lose efficacy, element function is bad.This test mode is to plug-in mounting PCB and to mount the not high PCB of device density more suitable.But the densification of miniaturization of devices and product makes this detection mode obviously show deficiency, can't accurately connect the less probe of area of small size device owing to solder joint.Particularly highdensity consumer electronics product is as collecting, and probe can can't touch solder joint.It is to adopting shunt capacitance in addition, and the PCB of electric connection mode such as resistance can not accurately measure.So along with the densification and the miniaturization of devices of product, the use amount of flying probe in actual detected work is also fewer and feweri.
It is a kind of detection method of rising in recent years that automated optical detects.It is the image that obtains device or PCB surface visible part by the mode that CCD takes a picture, and relatively judges defective and fault through the processing and the analysis of computing machine then.Its advantage is that detection speed is fast, and the programming time is shorter, can be positioned over the diverse location in the production line, is convenient in time find fault and defective, and production, detection are united two into one.Can shorten and find fault and defective time, in time find out the origin cause of formation of fault and defective.Therefore it is a kind of detection means that adopts often at present.But also there is deficiency in the AOI system, and is as can not the testing circuit mistake, also powerless to the detection of sightless solder joint inner case simultaneously.
There is following deficiency in prior art in the detection technique of printed circuit board: can't invisible solder joint be detected as BGA Package BGA etc., the unable defective that some naked eyes can't be seen is brought hidden danger of quality to printed circuit board; Can't utilize Flame Image Process and recognition technology that lines a large amount of on the printed circuit board plate and solder joint are carried out quick identification,, improve the reliability of detection speed and quality control to carry out qualitative, quantitative test.
Summary of the invention
Technical problem to be solved in the utility model provides a kind of pick-up unit that is used for printed circuit board, can detect invisible solder joint.
The technical scheme that its technical matters that solves the utility model adopts is: a kind of pick-up unit that is used for printed circuit board is provided, comprises installing plate, described installing plate upper surface be provided with described printed circuit board to be measured on the sensing point that is complementary of nexus; Described installing plate lower surface is provided with the probe that links to each other with solder joint on the described circuit board under test; Described probe links to each other with computing machine.
The probe that described installing plate lower surface is provided with is corresponding one by one with described sensing point.
Solder joint on the described circuit board under test links to each other by the electric wire in the installing plate with described probe.
Described probe links to each other with described computing machine by connecting line.
Beneficial effect
Owing to adopted above-mentioned technical scheme, the utility model compared with prior art, have following advantage and good effect: installing plate upper surface of the present utility model and printed circuit board to be measured mate mutually, and be provided with the probe that links to each other with solder joint on the printed circuit board at lower surface, thereby realize that probe links to each other with invisible solder joint on the printed circuit board, again probe is linked to each other with computing machine, make the utility model to detect, utilize computing machine whether correctly to detect simultaneously circuit to sightless solder joint.
Description of drawings
Fig. 1 is a structural representation of the present utility model;
Fig. 2 is a computing machine inner structure synoptic diagram in the utility model.
Embodiment
Below in conjunction with specific embodiment, further set forth the utility model.Should be understood that these embodiment only to be used to the utility model is described and be not used in the restriction scope of the present utility model.Should be understood that in addition those skilled in the art can make various changes or modifications the utility model after the content of having read the utility model instruction, these equivalent form of values fall within the application's appended claims institute restricted portion equally.
Embodiment of the present utility model relates to a kind of pick-up unit that is used for printed circuit board, as shown in Figure 1, comprise installing plate 1, described installing plate 1 upper surface and printed circuit board to be measured mate mutually, promptly installing plate 1 upper surface be provided with printed circuit board to be measured on the sensing point that matches of nexus.Described installing plate 1 lower surface is provided with the probe 2 that links to each other with solder joint on the described circuit board under test, the probe 2 that described installing plate 1 lower surface is provided with is corresponding one by one with described sensing point, wherein, probe 2 is to electrically connect by the electric wire of installing plate 1 inside and the solder joint on the circuit board under test.Described probe 1 links to each other with computing machine 3 by connecting line, thereby realizes communicating by letter between printed circuit board to be measured and the computing machine 3.
As shown in Figure 2, described computing machine comprises receiving element, transmitting element, judging unit, output unit and default unit.Wherein, the output terminal of transmitting element and the input end of receiving element link to each other with probe on the installing plate respectively, the output terminal of receiving element links to each other with an input end of judging unit, another input end of judging unit links to each other with default unit, output terminal links to each other with the input end of output unit, and the output terminal of output unit links to each other with computer screen.
In use, printed circuit board is installed in the installing plate upper surface, and the probe of installing plate lower surface is linked to each other with computing machine.At this moment, the transmitting element of computer-internal sends signal by probe to printed circuit board makes the element on the printed circuit board start working, this moment, the receiving element of computer-internal received the feedback signal of the output terminal output of element from the printed circuit board, the feedback signal that receives enters the judging unit of computer-internal, thereby the judging unit of computer-internal compares to judge whether printed circuit board exists defective with the parameter that sets in advance in the feedback signal that receives and the default unit, is presented on the computer screen by the result of output unit with judgment unit judges at last.
Be not difficult to find, installing plate upper surface of the present utility model and printed circuit board to be measured mate mutually, and be provided with the probe that links to each other with solder joint on the printed circuit board at lower surface, thereby realize that probe links to each other with invisible solder joint on the printed circuit board, again probe is linked to each other with computing machine, make the utility model to detect, utilize computing machine whether correctly to detect simultaneously circuit to sightless solder joint.
Claims (4)
1. a pick-up unit that is used for printed circuit board comprises installing plate (1), it is characterized in that, described installing plate (1) upper surface be provided with described printed circuit board to be measured on the sensing point that is complementary of nexus; Described installing plate (1) lower surface is provided with the probe (2) that links to each other with solder joint on the described circuit board under test; Described probe (2) links to each other with computing machine (3).
2. the pick-up unit that is used for printed circuit board according to claim 1 is characterized in that, the probe (2) that described installing plate (1) lower surface is provided with is corresponding one by one with described sensing point.
3. the pick-up unit that is used for printed circuit board according to claim 1 is characterized in that, the solder joint on the described circuit board under test links to each other by the electric wire in the installing plate (1) with described probe (2).
4. the pick-up unit that is used for printed circuit board according to claim 1 is characterized in that, described probe (2) links to each other with described computing machine (3) by connecting line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201612469U CN202083762U (en) | 2011-05-19 | 2011-05-19 | Detection device for printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201612469U CN202083762U (en) | 2011-05-19 | 2011-05-19 | Detection device for printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202083762U true CN202083762U (en) | 2011-12-21 |
Family
ID=45344387
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011201612469U Expired - Fee Related CN202083762U (en) | 2011-05-19 | 2011-05-19 | Detection device for printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202083762U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102288858A (en) * | 2011-05-19 | 2011-12-21 | 昆山鑫立电子科技有限公司 | Detecting device for printed circuit board |
-
2011
- 2011-05-19 CN CN2011201612469U patent/CN202083762U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102288858A (en) * | 2011-05-19 | 2011-12-21 | 昆山鑫立电子科技有限公司 | Detecting device for printed circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111221 Termination date: 20140519 |