CN107275459A - Potted element and its manufacture method - Google Patents
Potted element and its manufacture method Download PDFInfo
- Publication number
- CN107275459A CN107275459A CN201710458067.3A CN201710458067A CN107275459A CN 107275459 A CN107275459 A CN 107275459A CN 201710458067 A CN201710458067 A CN 201710458067A CN 107275459 A CN107275459 A CN 107275459A
- Authority
- CN
- China
- Prior art keywords
- pad
- potted element
- box dam
- chip
- sheet metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 39
- 238000000034 method Methods 0.000 title claims abstract description 34
- 239000002184 metal Substances 0.000 claims abstract description 59
- 229910052751 metal Inorganic materials 0.000 claims abstract description 59
- 239000000084 colloidal system Substances 0.000 claims abstract description 27
- 238000004806 packaging method and process Methods 0.000 claims abstract description 23
- 239000004033 plastic Substances 0.000 claims abstract description 23
- 229920003023 plastic Polymers 0.000 claims abstract description 23
- 239000003292 glue Substances 0.000 claims abstract description 15
- 238000012856 packing Methods 0.000 claims abstract description 14
- 238000000926 separation method Methods 0.000 claims description 30
- 239000000758 substrate Substances 0.000 claims description 20
- 238000007789 sealing Methods 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 13
- 238000005538 encapsulation Methods 0.000 claims description 12
- 150000002739 metals Chemical class 0.000 claims description 7
- 238000007747 plating Methods 0.000 claims description 5
- 238000009434 installation Methods 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 238000002955 isolation Methods 0.000 claims 1
- 238000010068 moulding (rubber) Methods 0.000 claims 1
- 230000000630 rising effect Effects 0.000 abstract description 13
- 238000013461 design Methods 0.000 abstract description 7
- 230000003287 optical effect Effects 0.000 abstract description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 239000000741 silica gel Substances 0.000 description 6
- 229910002027 silica gel Inorganic materials 0.000 description 6
- 230000008859 change Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000000696 magnetic material Substances 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000002776 aggregation Effects 0.000 description 2
- 238000004220 aggregation Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000006071 cream Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 210000002837 heart atrium Anatomy 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 241000208199 Buxus sempervirens Species 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- -1 siloxanes Chemical class 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
Abstract
The invention provides a kind of manufacture method of potted element, comprise the following steps：Box dam is installed, die bond, injecting glue is encapsulated and is stripped, additionally provide potted element, made using the manufacture method of above-mentioned potted element, potted element is used to be mounted on circuit board, potted element includes chip, pad component located at chip side, the packaging plastic that is packaged on the outside of chip and pad component and enclose box dam on the outside of packaging plastic, pad component includes positive pad, negative pad and the sheet metal for connecting circuit board and positive pad and negative pad, sheet metal connects one to one with positive pad and negative pad, the area of sheet metal is more than or equal to the area of positive pad or negative pad.Using the production of the cooperation batch of multiple kinds of molds, large batch of production can be more easily carried out, and preferably chip, packing colloid can be defined relative to dam location is enclosed, the rising angle and the photochromic uniformity of optical design is effectively guaranteed.
Description
Technical field
It is to be related to a kind of potted element and its manufacture more specifically the invention belongs to the technical field of semiconductor packages
Method.
Background technology
CSP (Chip Scale Package) encapsulation is wafer-class encapsulation, is a kind of mode of semiconductor wafer package,
CSP LED encapsulation technologies have the advantages that heat dispersion more preferably simplifies substrate and the reliability of product is greatly lifted.It is existing
CSP LED in technology are encapsulated as the luminous structure in unsupported five face of no substrate, in the field of some light source applications for
Rising angle and outgoing light homogeneity etc. have higher requirement, such as mobile phone flashlight, car lighting lamp, stage lighting, bulkhead lamp
With the field such as torch lamp, and some products do not need the light source of relatively high power in these fields.In the prior art, typically
The problem of rising angle and outgoing light homogeneity are solved using box dam, but the mounting process of box dam is complicated and encloses dam thickness and equal
Evenness is difficult to control, so as to cause rising angle and outgoing light homogeneity not to reach requirement.
The content of the invention
It is an object of the invention to provide a kind of potted element and its manufacture method, to solve to enclose present in prior art
The mounting process on dam is complicated and encloses dam thickness and the uniformity is whard to control, and causing rising angle and outgoing light homogeneity not to reach will
The technical problem asked.
To achieve the above object, the technical solution adopted by the present invention is：A kind of manufacture method of potted element is provided, including
Following steps：
Box dam is installed, and the separation net mould with some mesh is placed on a sealing rubber die, and described sealing rubber die includes first
Substrate and some first protruding blocks on the first substrate, first protruding block in the mesh and with it is described
Mesh is corresponded, and box dam colloid is injected into the mesh and box dam is solidify to form；
Die bond, is removed after described sealing rubber die, the separation net mould and plate body mould matched moulds, fixed brilliant in the box dam
Piece；
Injecting glue is encapsulated, and packing colloid is injected in the box dam and potted element is solidify to form；
The demoulding, removes the plate body mould and separates separation net mould and the potted element.
Further, the outer surface of the separation net mould and described sealing rubber die is coated with release materials.
Further, the volume of first protruding block is less than the volume of first mesh.
Further, in the box dam installation steps, the box dam colloid is toasted to solidify to form box dam, the box dam glue
The baking temperature of body is 100 degrees Celsius to 200 degrees Celsius, and baking time was half an hour to 3 hours.
Further, the plate body mould is sticked close to the side of the separation net mould gummed paper, the plate body mould with
Pasted and fixed by gummed paper between the separation net mould.
Further, in the demoulding step, the potted element is stripped by pushing the demoulding mould,
The demoulding mould include second substrate and some second protruding blocks on the second substrate, second protruding block with
The potted element is corresponded.
Another object of the present invention is to provide a kind of potted element, using manufacturer's legal system of above-mentioned potted element
Make, the potted element is used to be mounted on circuit board, and the potted element includes chip, the pad located at the chip side
Component, the packaging plastic being packaged on the outside of the chip and the pad component and box dam on the outside of the packaging plastic is enclosed,
The pad component includes positive pad, negative pad and for connecting the circuit board and the positive pad and the negative pad
Sheet metal, the sheet metal connects one to one with the positive pad and the negative pad, and the area of the sheet metal is more than
Or equal to the positive pad or the area of the negative pad.
Further, the height of the box dam is identical with the height of the packaging plastic.
Further, the quantity of the sheet metal be two, two sheet metals respectively with the positive pad and institute
State negative pad to be connected, the gap between two sheet metals is more than or equal between the positive pad and the negative pad
Gap.
Further, the sheet metal is provided with high plating reflecting layer close to the one side of the chip.
The potted element and its beneficial effect of manufacture method that the present invention is provided are：Compared with prior art, it is of the invention
Potted element and its manufacture method, by setting the first protruding block in the inside of several mesh, then again in mesh and first
Injecting glue is carried out between protruding block so as to form box dam, it is spacing by enclosing operation progress of the dam location to fixed wafer, effectively
The position for avoiding chip exceedes box dam so that the position of chip fixes more accurate, is finally carrying out injecting glue encapsulation and the demoulding
Processing, be effectively guaranteed box dam height and packing colloid it is highly consistent, reduce performance accuracy in being operated to injecting glue
It is required that.And the production of the cooperation batch using multiple kinds of molds, can more easily carry out large batch of production, and can
Preferably chip, packing colloid are defined relative to dam location is enclosed, the rising angle of optical design is effectively guaranteed
With the photochromic uniformity.
Brief description of the drawings
Technical scheme in order to illustrate the embodiments of the present invention more clearly, below will be to embodiment or description of the prior art
In required for the accompanying drawing that uses be briefly described, it should be apparent that, drawings in the following description are only some of the present invention
Embodiment, for those of ordinary skill in the art, without having to pay creative labor, can also be according to these
Accompanying drawing obtains other accompanying drawings.
Fig. 1 for potted element provided in an embodiment of the present invention manufacture method in box dam installation steps structural representation；
Fig. 2 for potted element provided in an embodiment of the present invention manufacture method in die bond step structural representation；
Fig. 3 for potted element provided in an embodiment of the present invention manufacture method in injecting glue encapsulation step structural representation；
Fig. 4 be Fig. 3 shown in potted element manufacture method in demoulding step structural representation；
Separation net mould and the structural representation of point sealing rubber die that Fig. 5 is used by the embodiment of the present invention；
Fig. 6 is the structural representation of potted element provided in an embodiment of the present invention.
Wherein, each reference in figure：
1- separation net moulds；2- point sealing rubber dies；3- plate body moulds；4- demoulding moulds；5- box dams；6- chips；7- pad components；
8- packaging plastics；11- mesh；21- first substrates；The protruding blocks of 22- first；41- second substrates；The protruding blocks of 42- second；71- face-bondings
Disk；72- bears pad；73- sheet metals.
Embodiment
In order that technical problems, technical solutions and advantages to be solved are more clearly understood, tie below
Drawings and Examples are closed, the present invention will be described in further detail.It should be appreciated that specific embodiment described herein is only
To explain the present invention, it is not intended to limit the present invention.
It should be noted that when element is referred to as " being fixed on " or " being arranged at " another element, it can be directly another
On one element or it is connected on another element.When an element is known as " being connected to " another element, it can
To be directly to another element or be indirectly connected on another element.
It is to be appreciated that term " length ", " width ", " on ", " under ", "front", "rear", "left", "right", " vertical ",
The orientation or position relationship of the instruction such as " level ", " top ", " bottom " " interior ", " outer " are to be closed based on orientation shown in the drawings or position
System, is for only for ease of the description present invention and simplifies description, rather than indicate or imply that the device or element of meaning must have
Specific orientation, with specific azimuth configuration and operation, therefore be not considered as limiting the invention.
In addition, term " first ", " second " are only used for describing purpose, and it is not intended that indicating or implying relative importance
Or the implicit quantity for indicating indicated technical characteristic.Thus, define " first ", the feature of " second " can express or
Implicitly include one or more this feature.In the description of the invention, " multiple " are meant that two or more,
Unless otherwise specifically defined.
Also referring to Fig. 1 to Fig. 5, the manufacture method of the potted element now provided the present invention is illustrated.One kind envelope
The manufacture method of element is filled, is comprised the following steps：
Box dam 5 is installed, and the separation net mould 1 with some mesh 11 is placed on a sealing rubber die 2, and point sealing rubber die 2 includes the
One substrate 21 and some first protruding blocks 22 on first substrate 21, the first protruding block 22 are located in mesh 11 and and mesh
11 are corresponded, and box dam colloid is injected into mesh 11 and box dam 5 is solidify to form；
Die bond, is removed after point sealing rubber die 2, separation net mould 1 and the matched moulds of plate body mould 3, the fixed wafer 6 in box dam 5；
Injecting glue is encapsulated, and packing colloid is injected in box dam 5 and potted element is solidify to form；
The demoulding, removes plate body mould 3 and separates separation net mould 1 and potted element.
The potted element that the present invention is provided, compared with prior art, by setting first in the inside of several mesh 11
Protruding block 22, then carries out injecting glue so as to form box dam 5 between the protruding block 22 of mesh 11 and first again, passes through the position of box dam 5
Put the operation to fixed wafer 6 carry out it is spacing, effectively avoid chip 6 position exceed box dam 5 so that the position of chip 6
Fixation is more accurate, is finally carrying out injecting glue encapsulation and demoulding processing, is being effectively guaranteed the height and packing colloid of box dam 5
It is highly consistent, reduce the requirement of performance accuracy in being operated to injecting glue.And the production of the cooperation batch using multiple kinds of molds, energy
It is enough more easily to carry out large batch of production, and can preferably to chip 6, packing colloid relative to box dam 5 position
It is defined, is effectively guaranteed the rising angle and the photochromic uniformity of optical design.
Specifically, being to offer some mesh 11 being uniformly arranged, the first protruding block 22 on a plate body on separation net mould 1
Uniformly it is arranged on first substrate 21, and the first protruding block 22 can be arranged on the inside of mesh 11, and each one by one
The outer surface of one protruding block 22 is equal with the distance between the inner surface of mesh 11, the shapes and sizes of the first protruding block 22 with
The shapes and sizes of packaging plastic 8 are completely the same in default potted element.Utilized in mesh 11 away from the side of first substrate 21
Glue-injection machine injects box dam colloid.Separation net mould 1 and the box dam 5 being arranged on inside mesh 11 are there remains after point sealing rubber die 2 is removed,
In the side arranging plate mould 3 of box dam 5 so as to form atrium, the bottom that chip 6 is fixed on the atrium by bonder is adopted
The centre in portion.
It is preferred that, the material of box dam colloid is generally the particle of silica gel mixing high reflectance, and the material of packing colloid is general
Using encapsulating materials such as silica gel, epoxy resin or glass cements, and time and the temperature of every kind of different packing colloid baking-curing
Degree is differed, when packing colloid uses silica gel as packing colloid, and the temperature of its baking-curing is 150 degrees Celsius, during baking
Between for two hours.
Further, a kind of embodiment of the manufacture method of the potted element provided as the present invention, separation net
The outer surface of mould 1 and point sealing rubber die 2 is coated with release materials.Specifically, separation net mould 1 and point sealing rubber die 2 use metal
Material is made, generally the material such as stainless steel, iron, copper or aluminium.For the ease of realizing box dam 5 and separation net mould 1 or dispensing
The disengaging of mould 2, the inwall of mesh 11, first substrate 21 typically in separation net mould 1 are close to the one side of separation net mould 1 and convex
Be coated with bittiness side surface beneficial to the demoulding material, release materials can using high adhesive aggregation siloxanes, silica gel releasing agent or
Person other contribute to the demoulding releasing agent.
Further, referring to Fig. 5, a kind of specific embodiment party of the manufacture method of the potted element provided as the present invention
Formula, the volume of the first protruding block 22 is less than the volume of the first mesh 11.Specifically, the first protruding block 22 is arranged at the first mesh 11
Inside, and the distance between the inner surface of outer surface and the relative position of mesh 11 of any side of the first protruding block 22 is homogeneous
Deng the thickness of i.e. box dam 5 is uniform.Wherein, it is square, circular or triangle that the first protruding block 22 is consistent with the shape of mesh 11
Etc. shape, certainly, according to actual conditions and real needs, in other embodiments of the invention, the first protruding block 22 and mesh
11 cross section can also be trapezoidal, can be conducive to the demoulding and box dam 5 has certain angle, not make unique restriction herein.
Further, refering to Fig. 1, a kind of specific embodiment party of the manufacture method of the potted element provided as the present invention
In formula, the installation steps of box dam 5, box dam colloid is toasted to solidify to form box dam 5, and the baking temperature of box dam colloid is 100 degrees Celsius
To 200 degrees Celsius, baking time was half an hour to 3 hours.Specifically, the material of box dam colloid is generally silica gel mixing high reflection
The particle of rate, in the material using the particle of silica gel mixing high reflectance, baking temperature is preferably 150 degrees Celsius, during baking
Between be 2 hours.Corresponding change can also occur for baking temperature and baking time when the material of box dam colloid changes, this
Unique restriction is not made in place.
Further, Fig. 2 and Fig. 3 is referred to, one kind of the manufacture method of the potted element provided as the present invention is specific
Embodiment, plate body mould 3 is sticked close to the side of separation net mould 1 gummed paper (not shown), plate body mould 3 and separation net mould 1
Between pass through gummed paper paste fix.Specifically, plate body mould 3 is used to be combined to chip 6 and envelope with separation net mould 1 and box dam 5
The position of dress colloid is defined, wherein gummed paper is set close to the side of separation net mould 1 in plate body mould 3, on the one hand can be right
The position of separation net mould 1 is defined, and on the other hand chip 6 can be fixed, it is to avoid chip 6 occurs inside box dam 5
It is mobile, cause distance between box dam 5 and chip 6 to change, cause rising angle and outgoing light homogeneity to change.
It is preferred that, plate body mould 3 can also be made of magnetic material, and separation net mould 1 is made of metal material, be isolated
Be fixed between net mould 1 and plate body mould 3 using the absorption affinity of magnetic material and metal material, chip 6 and plate body mould 3 it
Between can also be fixed by the absorption affinity of magnetic material, compare and be fixed by way of gummed paper is pasted, using magnetic
The plate body mould 3 that property material is made can be recycled, more environmentally-friendly, effectively save resource.
It is preferred that, referring to Fig. 2, in die bond step, the plate before the chip 6 that is sticked first inside each box dam 5
Be sticked sheet metal 73 on mould 3, and sheet metal 73 is located at the both sides of any one box dam 5, and two sheet metals 73 are to be symmetrical arranged
, chip 6 be placed in sheet metal 73 deviate from plate body mould 3 side, and chip 6 positive pad 71 and negative pad 72 respectively with two
Sheet metal 73 fits.Sheet metal 73 is provided with tin cream in the side away from plate body mould 3, and chip 6 passes through backflow with sheet metal 73
The mode of weldering is welded, and tin cream will be fixedly connected and electrically conduct between the bottom of chip 6 and sheet metal 73 after melting.
Further, referring to Fig. 4, a kind of specific embodiment party of the manufacture method of the potted element provided as the present invention
Formula, in demoulding step, is stripped by pushing demoulding mould 4 to potted element, and demoulding mould 4 includes the He of second substrate 41
Some second protruding blocks 42 on second substrate 41, the second protruding block 42 is corresponded with potted element.Specifically, right
The potted element that encapsulation is completed typically is stripped when being stripped by the way of mechanical force is pushed, the second protruding block 42 and envelope
Dress element is abutted against, and drives the second protruding block 42 to extrude potted element when extruding second substrate 41 using external force, so that will encapsulation
Element and separation net mould 1 are separated.Wherein, the volume of the second protruding block 42 is identical with the volume of mesh 11, i.e. the second protruding block 42
The inside of mesh 11 can be squeezed into the lower pressure of external force, so that the demoulding by potted element completely.
Referring to Fig. 6, the present invention also provides a kind of potted element, using the system of the potted element in any of the above-described embodiment
Method making is made, potted element is used to be mounted on circuit board, and potted element includes chip 6, the pad group located at the side of chip 6
Part 7, the packaging plastic 8 for being packaged in chip 6 and the outside of pad component 7 and enclose in the box dam 5 in the outside of packaging plastic 8, pad component 7
Sheet metal 73 including positive pad 71, negative pad 72 and for connecting circuit board and positive pad 71 and negative pad 72, metal
Piece 73 connects one to one with positive pad 71 and negative pad 72, also, sheet metal 73 area be more than or equal to positive pad 71 or
The area of negative pad 72.
The potted element that the present invention is provided, by setting the first protruding block 22, Ran Houzai in the inside of several mesh 11
Injecting glue is carried out between the protruding block 22 of mesh 11 and first so as to form box dam 5, by the position of box dam 5 to fixed wafer 6
Operation progress is spacing, and the position for effectively avoiding chip 6 exceedes box dam 5 so that the position of chip 6 fixes more accurate, most
Afterwards carry out injecting glue encapsulation and the demoulding processing, be effectively guaranteed box dam 5 height and packing colloid it is highly consistent, reduce
The requirement of performance accuracy in being operated to injecting glue.And the production of the cooperation batch using multiple kinds of molds, can more easily enter
The large batch of production of row, and preferably chip 6, packing colloid can be defined relative to the position of box dam 5, effectively
It ensure that the rising angle and the photochromic uniformity of optical design.
Specifically, expanding the surface area of positive pad 71 and negative pad 72 by sheet metal 73, encapsulation can be effectively reduced
The manufacture method of element carries out the work difficulty of paster, and the lighting angle of the chip 6 made by box dam 5 reduces, and is conducive to light
Learn the rising angle and the photochromic uniformity of design.Chip 6 is generally LED chip, and positive pad 71 and negative pad 72 are arranged on chip 6
The same side and positive pad 71 and negative pad 72 set so that chip 6 is symmetrical, sheet metal 73 respectively with positive pad 71 and negative pad
72 are fixedly connected and electrically conduct, and sheet metal 73 is used to positive pad 71 and negative pad 72 being conducted with circuit board.
It is preferred that, the height of box dam 5 is identical with the height of packaging plastic 8.Specifically, box dam 5 is used for the light sent to chip 6
Source is blocked, and packaging plastic 8 is used to be packaged chip 6 while the light that chip 6 is sent is reflected and spread, it is ensured that
The highly consistent rising angle that can effectively ensure that the light that chip 6 is sent of box dam 5 and packaging plastic 8 is controllable, and the thickness of packaging plastic 8
Degree and the box dam 5 consistent outgoing light homogeneity that ensure that the light that chip 6 is sent with the distance between chip 6.
Further, refering to Fig. 6, a kind of embodiment of the potted element provided as the present invention, sheet metal 73
Quantity be two, two sheet metals 73 are connected with positive pad 71 and negative pad 72 respectively, between two sheet metals 73
Gap is more than or equal to the gap between positive pad 71 and negative pad 72.Specifically, any two sheet metal 73 and any two
It is positive that gap is each formed between pad 71 or negative pad 72, and the area of sheet metal 73 is more than or equal to positive pad 71 or negative pad
72 area, i.e. sheet metal 73 fit in the side of positive pad 71 or negative pad 72 away from the gap.It can expand in sheet metal 73
During the bonding area of big positive pad 71 or negative pad 72, the gap between positive pad 71 or negative pad 72 can also be increased, not only
Reduce the operation difficulty of the wafer-level package in technique, also increase the area of dissipation of potted element, it is to avoid heat aggregation is led
The phenomenon for causing potted element overheat to burn.
Further, referring to Fig. 6, a kind of embodiment of the potted element provided as the present invention, sheet metal
73 one sides for deviating from chip 6 are located at the outside of packaging plastic 8.Specifically, the encapsulation of sheet metal 73 and the outside of packaging plastic 8, can
Ensure effectively to turn on when sheet metal 73 carries out SMT attachments with circuit board, it is to avoid the presence influence sheet metal 73 of packaging plastic 8
With the conduction property of circuit board.Certainly, according to actual conditions and real needs, in other embodiments of the invention, sheet metal
73 one sides for deviating from chip 6 can not also make unique restriction at grade, herein with the lateral surface of packaging plastic 8.
Further, a kind of embodiment of the potted element provided as the present invention, sheet metal 73 is close to chip 6
One side be provided with high plating reflecting layer.Specifically, floor height plating reflecting layer is electroplated on sheet metal 73 to be effectively improved
Chip 6 sends the light emission rate of light, and the light that chip 6 is sent reflects the outside of potted element through high plating reflecting layer.Certainly, according to reality
Border situation and real needs, in other embodiments of the invention, sheet metal 73 can also use smooth with reflecting effect
The body of sheet metal 73, is directly carried out reflective by metal, does not make unique restriction herein.
Further, the gap between positive pad 71 and negative pad 72 is 0.02~0.3mm.Specifically, the positive He of pad 71
Gap between negative pad 72 is used to avoid the short circuit between positive electrode and negative electrode, can increase potted element when gap is too small and exist
Operation difficulty during paster is carried out, conference is crossed in gap causes the edge of sheet metal 73 to exceed the edge of potted element, so as to increase
The area occupied of potted element.Certainly, according to actual conditions and real needs, in other embodiments of the invention, face-bonding
Gap between disk 71 and negative pad 72 can also be more than or equal to 0.3mm or less than 0.02mm, not make unique restriction herein.
Further, edge of the edge of sheet metal 73 without departing from packaging plastic 8.Specifically, being located at for sheet metal 73 is encapsulated
The bottom of element.The edge of sheet metal 73 is larger beyond the area that the edge of packaging plastic 8 can cause potted element to take, and increases
The volume of potted element, and the manufacture of box dam 5 can be influenceed.The edge of sheet metal 73, can be not without departing from the edge of packaging plastic 8
Increase the gap between positive pad 71 and negative pad 72 in the case of increase potted element volume, and increase the weldering of potted element
Junction is accumulated.
It is preferred that, chip 6 can also use common chip, can effectively avoid chip from connecting the positive He of pad 71 respectively
Spacing distance between negative pad 72 is excessively near, so as to cause short-circuit failure between chip, and avoids the heat accumulation on chip
It can not pass down, so that the phenomenon for causing chip to burn.
Present invention also offers potted element in a kind of circuit board, including any of the above-described embodiment of some uses.
The circuit board that the present invention is provided, expands the surface area of positive pad 71 and negative pad 72, Neng Gouyou by sheet metal 73
The manufacture method of the reduction potted element of effect carries out the work difficulty of paster, and the lighting angle contracting of the chip 6 made by box dam 5
It is small, be conducive to the rising angle and the photochromic uniformity of optical design.Chip 6 is generally LED chip, positive pad 71 and negative pad 72
The same side and positive pad 71 and negative pad 72 for being arranged on chip 6 are set so that chip 6 is symmetrical, sheet metal 73 respectively with positive pad
71 are fixedly connected and electrically conduct with negative pad 72, and sheet metal 73 is used to circuit board mutually lead positive pad 71 and negative pad 72
It is logical.
Present invention also offers potted element and circuit in a kind of lighting device, including any of the above-described embodiment of some uses
Plate.
The lighting device that the present invention is provided, expands the surface area of positive pad 71 and negative pad 72 by sheet metal 73, can
The manufacture method for effectively reducing potted element carries out the work difficulty of paster, and the lighting angle of the chip 6 made by box dam 5
Reduce, be conducive to the rising angle and the photochromic uniformity of optical design.Chip 6 is generally LED chip, positive pad 71 and negative pad
72 are arranged on the same side of chip 6 and positive pad 71 and negative pad 72 are set so that chip 6 is symmetrical, and sheet metal 73 is respectively and face-bonding
Disk 71 is fixedly connected and electrically conducted with negative pad 72, and sheet metal 73 is used to circuit board mutually lead positive pad 71 and negative pad 72
It is logical.
These are only presently preferred embodiments of the present invention, be not intended to limit the invention, it is all the present invention spirit and
Any modifications, equivalent substitutions and improvements made within principle etc., should be included in the scope of the protection.
Claims (10)
1. the manufacture method of potted element, it is characterised in that：Comprise the following steps：
Box dam is installed, and the separation net mould with some mesh is placed on a sealing rubber die, and described sealing rubber die includes first substrate
With some first protruding blocks on the first substrate, first protruding block in the mesh and with the mesh
Correspond, box dam colloid is injected into the mesh and box dam is solidify to form；
Die bond, is removed after described sealing rubber die, the separation net mould and plate body mould matched moulds, the fixed wafer in the box dam；
Injecting glue is encapsulated, and packing colloid is injected in the box dam and potted element is solidify to form；
The demoulding, removes the plate body mould and separates separation net mould and the potted element.
2. the manufacture method of potted element as claimed in claim 1, it is characterised in that：The separation net mould and described rubber moulding
The outer surface of tool is coated with release materials.
3. the manufacture method of potted element as claimed in claim 1, it is characterised in that：The volume of first protruding block is less than
The volume of first mesh.
4. the manufacture method of potted element as claimed in claim 1, it is characterised in that：It is described in the box dam installation steps
Box dam colloid is toasted to solidify to form box dam, and the baking temperature of the box dam colloid is 100 degrees Celsius to 200 degrees Celsius, baking
Time was half an hour to 3 hours.
5. the manufacture method of potted element as claimed in claim 5, it is characterised in that：The plate body mould is close to the isolation
The side of net mould, which is sticked, gummed paper, is pasted and fixed by gummed paper between the plate body mould and the separation net mould.
6. the manufacture method of the potted element as described in any one of claim 1 to 5, it is characterised in that：In the demoulding step
In, the potted element is stripped by pushing the demoulding mould, the demoulding mould includes second substrate and is located at
Some second protruding blocks on the second substrate, second protruding block is corresponded with the potted element.
7. potted element, makes using the manufacture method of the potted element described in any one of claim 1 to 6, the encapsulation member
Part is used to be mounted on circuit board, it is characterised in that：The potted element includes chip, the pad group located at the chip side
Part, the packaging plastic being packaged on the outside of the chip and the pad component and box dam on the outside of the packaging plastic is enclosed, institute
Pad component is stated including positive pad, negative pad and for connecting the circuit board and the positive pad and the negative pad
Sheet metal, the sheet metal connects one to one with the positive pad and the negative pad, the area of the sheet metal be more than or
Equal to the positive pad or the area of the negative pad.
8. potted element as claimed in claim 7, it is characterised in that：The height of the box dam and the height phase of the packaging plastic
Together.
9. potted element as claimed in claim 7, it is characterised in that：The quantity of the sheet metal is two, two gold
Category piece is connected with the positive pad and the negative pad respectively, and the gap between two sheet metals is more than or equal to institute
State the gap between positive pad and the negative pad.
10. potted element as claimed in claim 7, it is characterised in that：The sheet metal is set close to the one side of the chip
It is equipped with high plating reflecting layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710458067.3A CN107275459B (en) | 2017-06-16 | 2017-06-16 | Package element and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710458067.3A CN107275459B (en) | 2017-06-16 | 2017-06-16 | Package element and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107275459A true CN107275459A (en) | 2017-10-20 |
| CN107275459B CN107275459B (en) | 2024-02-02 |
Family
ID=60067754
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710458067.3A Active CN107275459B (en) | 2017-06-16 | 2017-06-16 | Package element and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107275459B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111512450A (en) * | 2017-12-19 | 2020-08-07 | 欧司朗Oled股份有限公司 | Method for producing a converter element and converter element |
| CN113035723A (en) * | 2021-02-01 | 2021-06-25 | 中之半导体科技(东莞)有限公司 | High-temperature-resistant packaging method for silicon carbide diode |
| CN114242870A (en) * | 2021-12-22 | 2022-03-25 | 鸿利智汇集团股份有限公司 | Wafer support, wafer support plate and wafer packaging method |
| JP7386417B2 (en) | 2020-03-18 | 2023-11-27 | 日亜化学工業株式会社 | Light emitting device and its manufacturing method |
Citations (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000022218A (en) * | 1998-07-01 | 2000-01-21 | Matsushita Electron Corp | Chip-type electronic component and its manufacture |
| CN102148296A (en) * | 2010-12-28 | 2011-08-10 | 广州市鸿利光电股份有限公司 | LED (Light Emitting Diode) manufacturing method and LED device |
| CN102244165A (en) * | 2011-07-20 | 2011-11-16 | 福建泰德视讯数码科技有限公司 | LED encapsulation process |
| CN202487642U (en) * | 2012-03-22 | 2012-10-10 | 深圳市斯迈得光电子有限公司 | Packaging fixture assembly of SMD (surface mount device) light emitting diodes |
| CN102856444A (en) * | 2011-06-30 | 2013-01-02 | 展晶科技(深圳)有限公司 | Manufacturing method of LED package structure |
| CN102931296A (en) * | 2012-03-22 | 2013-02-13 | 深圳市斯迈得光电子有限公司 | Packaging fixture component and packaging method for surface mounted device (SMD) light emitting diode (LED) |
| CN103165762A (en) * | 2011-12-12 | 2013-06-19 | 展晶科技(深圳)有限公司 | Manufacturing method of light-emitting diode |
| CN103400833A (en) * | 2013-07-29 | 2013-11-20 | 深圳市天电光电科技有限公司 | Led module and manufacturing method thereof |
| CN103413885A (en) * | 2013-07-31 | 2013-11-27 | 广州硅能照明有限公司 | Manufacturing method of isolation type COB light source module |
| CN103872218A (en) * | 2014-03-18 | 2014-06-18 | 深圳市瑞丰光电子股份有限公司 | LED support and LED luminous body |
| CN103943764A (en) * | 2014-04-18 | 2014-07-23 | 立达信绿色照明股份有限公司 | Mold and method for forming mold-pressing integrally-packaged LED light source |
| CN104659027A (en) * | 2015-02-09 | 2015-05-27 | 上海三思电子工程有限公司 | LED light emitting body and manufacturing method thereof |
| US9368549B1 (en) * | 2015-09-02 | 2016-06-14 | Nthdegree Technologies Worldwide Inc. | Printed mesh defining pixel areas for printed inorganic LED dies |
| TW201620689A (en) * | 2014-12-05 | 2016-06-16 | 峻泓光電股份有限公司 | Molds for making LEDs and method of making the LEDs |
| CN105826453A (en) * | 2016-05-09 | 2016-08-03 | 广州硅能照明有限公司 | Preparation method of COB optical module and COB optical module |
| CN207097856U (en) * | 2017-06-16 | 2018-03-13 | 深圳市科艺星光电科技有限公司 | Potted element, circuit board and lighting device |
| CN208620092U (en) * | 2018-08-21 | 2019-03-19 | 东莞市伊伯光电科技有限公司 | A kind of steady type luminous lamp strip |
-
2017
- 2017-06-16 CN CN201710458067.3A patent/CN107275459B/en active Active
Patent Citations (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000022218A (en) * | 1998-07-01 | 2000-01-21 | Matsushita Electron Corp | Chip-type electronic component and its manufacture |
| CN102148296A (en) * | 2010-12-28 | 2011-08-10 | 广州市鸿利光电股份有限公司 | LED (Light Emitting Diode) manufacturing method and LED device |
| CN102856444A (en) * | 2011-06-30 | 2013-01-02 | 展晶科技(深圳)有限公司 | Manufacturing method of LED package structure |
| CN102244165A (en) * | 2011-07-20 | 2011-11-16 | 福建泰德视讯数码科技有限公司 | LED encapsulation process |
| CN103165762A (en) * | 2011-12-12 | 2013-06-19 | 展晶科技(深圳)有限公司 | Manufacturing method of light-emitting diode |
| CN202487642U (en) * | 2012-03-22 | 2012-10-10 | 深圳市斯迈得光电子有限公司 | Packaging fixture assembly of SMD (surface mount device) light emitting diodes |
| CN102931296A (en) * | 2012-03-22 | 2013-02-13 | 深圳市斯迈得光电子有限公司 | Packaging fixture component and packaging method for surface mounted device (SMD) light emitting diode (LED) |
| CN103400833A (en) * | 2013-07-29 | 2013-11-20 | 深圳市天电光电科技有限公司 | Led module and manufacturing method thereof |
| CN103413885A (en) * | 2013-07-31 | 2013-11-27 | 广州硅能照明有限公司 | Manufacturing method of isolation type COB light source module |
| CN103872218A (en) * | 2014-03-18 | 2014-06-18 | 深圳市瑞丰光电子股份有限公司 | LED support and LED luminous body |
| CN103943764A (en) * | 2014-04-18 | 2014-07-23 | 立达信绿色照明股份有限公司 | Mold and method for forming mold-pressing integrally-packaged LED light source |
| TW201620689A (en) * | 2014-12-05 | 2016-06-16 | 峻泓光電股份有限公司 | Molds for making LEDs and method of making the LEDs |
| CN104659027A (en) * | 2015-02-09 | 2015-05-27 | 上海三思电子工程有限公司 | LED light emitting body and manufacturing method thereof |
| US9368549B1 (en) * | 2015-09-02 | 2016-06-14 | Nthdegree Technologies Worldwide Inc. | Printed mesh defining pixel areas for printed inorganic LED dies |
| CN105826453A (en) * | 2016-05-09 | 2016-08-03 | 广州硅能照明有限公司 | Preparation method of COB optical module and COB optical module |
| CN207097856U (en) * | 2017-06-16 | 2018-03-13 | 深圳市科艺星光电科技有限公司 | Potted element, circuit board and lighting device |
| CN208620092U (en) * | 2018-08-21 | 2019-03-19 | 东莞市伊伯光电科技有限公司 | A kind of steady type luminous lamp strip |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111512450A (en) * | 2017-12-19 | 2020-08-07 | 欧司朗Oled股份有限公司 | Method for producing a converter element and converter element |
| JP2021507527A (en) * | 2017-12-19 | 2021-02-22 | オスラム オーエルイーディー ゲゼルシャフト ミット ベシュレンクテル ハフツングＯＳＲＡＭ ＯＬＥＤ ＧｍｂＨ | Method of manufacturing conversion element and conversion element |
| JP7317831B2 (en) | 2017-12-19 | 2023-07-31 | オスラム オーエルイーディー ゲゼルシャフト ミット ベシュレンクテル ハフツング | Method of manufacturing conversion element and conversion element |
| JP7386417B2 (en) | 2020-03-18 | 2023-11-27 | 日亜化学工業株式会社 | Light emitting device and its manufacturing method |
| CN113035723A (en) * | 2021-02-01 | 2021-06-25 | 中之半导体科技(东莞)有限公司 | High-temperature-resistant packaging method for silicon carbide diode |
| CN113035723B (en) * | 2021-02-01 | 2021-10-29 | 先之科半导体科技(东莞)有限公司 | High-temperature-resistant packaging method for silicon carbide diode |
| CN114242870A (en) * | 2021-12-22 | 2022-03-25 | 鸿利智汇集团股份有限公司 | Wafer support, wafer support plate and wafer packaging method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107275459B (en) | 2024-02-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN207097856U (en) | Potted element, circuit board and lighting device | |
| CN107275459A (en) | Potted element and its manufacture method | |
| CN100481546C (en) | Power LED with glue-filling formed bottom and manufacturing method thereof | |
| CN108133670A (en) | Integration packaging LED display module packaging method and LED display module | |
| CN102916112B (en) | A kind of high power LED device and manufacture method thereof | |
| CN104124216A (en) | Substrate chip carrier CSP package and production method thereof | |
| CN107146789A (en) | LED encapsulation method and LED display | |
| CN108417699A (en) | The plastic package die of LED light source | |
| CN103872212B (en) | LED (light-emitting diode) packaging method | |
| CN103943756A (en) | LED module COB packaging technology and structure | |
| CN108807649A (en) | A kind of LED light source plastic package method | |
| CN105870298A (en) | Packaging method of LED light source | |
| CN103367612B (en) | LED encapsulation structure and technique | |
| CN105489509A (en) | Optical sensing chip package method for optimizing coating process by applying metal stencil printing technology | |
| CN107452855A (en) | Paster LED is without mould method for packing | |
| CN104600041B (en) | A kind of two-side radiation semiconductor package structure and its method for packing | |
| CN102097340A (en) | Method for manufacturing SMD (surface mounted device) by COB (chip on board) glue filling and encapsulating | |
| CN104810462B (en) | ESOP8 lead frame of medium-and high-power LED driving chip | |
| CN203910845U (en) | Lambert type LED large power packaging structure | |
| CN106373935A (en) | Paddle-free frame package process and package structure | |
| JP2012238740A (en) | Semiconductor device manufacturing method | |
| CN105576107B (en) | LED encapsulation structure and its method for packing | |
| CN206116397U (en) | LED encapsulation is with substrate and LED wrapper spare | |
| CN100394569C (en) | Method for preventing overflow of glue of package element | |
| CN210778675U (en) | Light-emitting component |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20240103 Address after: 518000, Building 21, 2nd Floor, 201, Dayun Software Town, No. 8288 Longgang Avenue, Henggang Street, Longgang District, Shenzhen, Guangdong Province Applicant after: Wanchenglin Real Estate (Shenzhen) Co.,Ltd. Address before: Building 21, 2nd Floor, 203, Dayun Software Town, No. 8288 Longgang Avenue, Henggang Street, Longgang District, Shenzhen City, Guangdong Province, 518000 Applicant before: SHENZHEN COLSTAR PHOTOELECTRIC TECHNOLOGY CO.,LTD. |
|
| GR01 | Patent grant | ||
| GR01 | Patent grant |