CN107249287A - A kind of electronic building brick and electronic equipment - Google Patents
A kind of electronic building brick and electronic equipment Download PDFInfo
- Publication number
- CN107249287A CN107249287A CN201710623570.XA CN201710623570A CN107249287A CN 107249287 A CN107249287 A CN 107249287A CN 201710623570 A CN201710623570 A CN 201710623570A CN 107249287 A CN107249287 A CN 107249287A
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- China
- Prior art keywords
- substrate
- heat
- cored
- face
- dissipation channel
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The present invention provides a kind of electronic building brick and electronic equipment, and wherein electronic building brick includes：Heat generating member and substrate, the heat generating member and the substrate, which are stacked, to be set, and the substrate includes the first face and the second face being oppositely arranged, wherein the first of the substrate facing to the heat generating member；Metal-cored and at least one heat dissipation channel is provided with the substrate, it is described metal-cored to be connected with least one heat dissipation channel, heat-conducting medium is filled with each heat dissipation channel, the heat that the heat generating member is produced can be conducted to the second face of the substrate along the heat-conducting medium in described metal-cored and heat dissipation channel from the first face of the substrate.The present invention in substrate by setting metal-cored and heat dissipation channel, so, the heat that chip is produced just can be by the heat-conducting medium in metal-cored and heat dissipation channel, conducted from the first face of substrate to the second face of substrate, the quick diffusion of heat is realized, so as to improve the radiating effect of electronic building brick.
Description
Technical field
The present invention relates to communication technical field, more particularly to a kind of electronic building brick and electronic equipment.
Background technology
With the high speed development of current electronic device, the electronic equipment such as mobile phone, notebook computer increasingly pursues " ultra-thin
Change "." ultrathin " is intended to carry more electronic building bricks in narrow space, electronic building brick, such as battery, shooting
First-class large power assembly can operationally produce substantial amounts of heat, if the heat that electronic building brick is produced can not be disperseed in time,
Then the service behaviour of electronic building brick will be influenceed to a certain extent.
At present, traditional radiating mode is essentially relying on around electronic building brick Heat Conduction Material of fitting, but this radiating side
Formula is for battery, the first-class large power assembly of shooting, and radiating effect is not still good.It can be seen that, it is necessary to electronic building brick in electronic equipment
Radiating effect improved.
The content of the invention
The embodiment of the present invention provides a kind of electronic building brick and electronic equipment, poor to solve existing electronic building brick radiating effect
The problem of.
In order to solve the above-mentioned technical problem, the present invention is realized in：A kind of electronic building brick, including electronic device, hair
Warmware and substrate, the electronic device, the heat generating member and the substrate stack gradually setting, and the substrate includes being oppositely arranged
The first face and the second face, wherein the first of the substrate facing to the heat generating member；
Metal-cored and at least one heat dissipation channel, described metal-cored and at least one heat dissipation channel are provided with the substrate
Heat-conducting medium is filled with connection, each heat dissipation channel, the heat that the heat generating member is produced can be along described metal-cored and radiating
Heat-conducting medium in passage, conducts to the second face of the substrate from the first face of the substrate.
The embodiment of the present invention additionally provides a kind of electronic equipment, including above-mentioned electronic building brick.
In embodiments of the present invention, by setting metal-cored and heat dissipation channel in substrate, so, the heat that heat generating member is produced
Amount can be just conducted to the second face of substrate by the heat-conducting medium in metal-cored and heat dissipation channel from the first face of substrate,
The quick diffusion of heat is realized, so as to improve the radiating effect of electronic building brick.
Brief description of the drawings
In order to illustrate the technical solution of the embodiments of the present invention more clearly, below will be to needed for description of the embodiment of the present invention
The accompanying drawing to be used is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the present invention,
For those of ordinary skill in the art, without having to pay creative labor, it can also be obtained according to these accompanying drawings
Take other accompanying drawings.
Fig. 1 is a kind of structural representation of camera module provided in an embodiment of the present invention；
Fig. 2 is a kind of heat conduction schematic diagram of camera module provided in an embodiment of the present invention；
Fig. 3 is the structural representation of another camera module provided in an embodiment of the present invention；
Fig. 4 is the heat conduction schematic diagram of another camera module provided in an embodiment of the present invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described, it is clear that described embodiment is a part of embodiment of the invention, rather than whole embodiments.Based on this hair
Embodiment in bright, those of ordinary skill in the art's every other implementation acquired under the premise of creative work is not made
Example, belongs to the scope of protection of the invention.
The embodiment of the present invention provides a kind of electronic building brick, including heat generating member and substrate, the heat generating member and the substrate stack
Folded to set, the substrate includes the first face and the second face being oppositely arranged, wherein the first of the substrate facing to the heating
Part；Be provided with metal-cored and at least one heat dissipation channel in the substrate, it is described it is metal-cored be connected with least one heat dissipation channel,
Heat-conducting medium is filled with each heat dissipation channel, the heat that the heat generating member is produced can be along along described metal-cored and heat dissipation channel
Heat-conducting medium, conducted from the first face of the substrate to the second face of the substrate.
The embodiment of the present invention is applied to any electronic building brick with radiating requirements, and be particularly suitable for use in great-power electronic group
Part.
For example, with it is current in time bitcom it is prevailing, increasing user is by mobile phone or notebook computer
Taken pictures, imaged or live Deng electronic equipment, the frequency of use of camera is more and more frequent, time of work is also increasingly
It is long.Therefore, CCD camera assembly needs good heat dispersion.
For another example electronic equipment is in long-term use or charging, battery-heating is more serious, therefore, and battery component needs
Good heat dispersion.
It can be seen that, the electronic building brick in the embodiment of the present invention can be camera module or battery modules, can be with
It is other high-power heat generating member modules.For camera module, the heat generating member in the embodiment of the present invention can be chip, core
Camera lens can be stacked with piece；For battery modules, the heating in the embodiment of the present invention can be just battery and chip.
To more fully understand the embodiment of the present invention, it is specifically described below so that electronic building brick is camera module as an example.
As shown in Figures 1 to 4, the embodiment of the present invention provides a kind of camera module, including camera lens 1, chip 2 and substrate 3,
Camera lens 1, chip 2 and substrate 3 stack gradually setting, and substrate 3 includes the first face 31 and the second face 32 being oppositely arranged, wherein substrate
3 the first face 31 is towards chip 2；
Be provided with metal-cored 33 and at least one heat dissipation channel 34 in substrate 3, metal-cored 33 with least one heat dissipation channel
34 connections, are filled with heat-conducting medium in each heat dissipation channel 34, and the heat that chip 2 is produced can be along metal-cored 33 and heat dissipation channel
Heat-conducting medium in 34, conducts to the second face 32 of substrate 3 from the first face of substrate 3.
In the embodiment of the present invention, printed circuit board (PCB) (PCB, Printed of the prior art are replaced using substrate 3
Circuit Board), the electric connection with chip 2 is realized by substrate 3.Substrate 3 in addition to being provided with metal-cored 33, its
It is remaining to be partially filled with the base material such as resin.
Wherein, metal-cored 33 can be good metal-cored of the electric conductivities such as aluminium core or copper core, and metal-cored 33 in substrate 3
It is integral, based on the layout requirements of substrate 3, the window at interval can be set on metal-cored 33.Metal-cored 33 thickness can
Flexibly to set according to stacking space, under conditions of meeting and stacking space, can suitably select that thickness is larger metal-cored 33.
In addition, should set the circuit 35 of electron-donating connection in substrate 3, circuit 35 should be arranged in base material, circuit 35
Layout can flexibly be set according to the need for electric connection.
In general, circuit 35 can be set in metal-cored 33 both sides up and down, metal-cored 33 can also be positioned only at
Top, the quantity of circuit 35 can also differentiation.Also just say, be reference with metal-cored 33, the circuit close to the side of chip 2 is minimum
It can be one layer, the circuit away from the side of chip 2 can be at least zero layer.
As shown in Figure 1 to Figure 2, when only setting circuit 35 in metal-cored 33 top, because metal-cored 33 lower sections do not have
Circuit 35, therefore, metal-cored 33 lower section need not fill base material, so, the second face that metal-cored 33 side wall can be with substrate 3
32 is concordant, i.e., metal-cored 33 side wall is exposed to the second face 32 of substrate 3.
Based on the set-up mode, because metal-cored 33 exposed side walls can serve as radiating surface, therefore can be only in metal
The top of core 33 sets heat dissipation channel 34, that is to say, that at least one heat dissipation channel 34 extends to gold from the first face 31 of substrate 3
Belong to core 33.
As shown in Fig. 2 the heat conduction path under the set-up mode is shown in arrow in figure, first, heat is passed from chip 2
Be directed at heat dissipation channel 34, then conducted through heat dissipation channel 34 to metal-cored 33, finally from metal-cored 33 exposed side walls radiation or
It is distributed to the outside of substrate 3.Should during, heat, can be with except can be metal-cored 33 and the internal consumption of heat dissipation channel 34
Rapid radiating is distributed to outside, is quickly dissipated so as to the heat that produces chip 2.
As shown in Figure 3 to Figure 4, when needing to set circuit 35 in metal-cored 33 both sides up and down, metal-cored about 33 two
Side should fill base material, so, and metal-cored 33 each side wall may be contained within the inside of substrate 3.
Based on the set-up mode, in order that heat conducted from the first face 31 of substrate 3 to the second face 32 of substrate 3, it is necessary to
Heat dissipation channel 34 is respectively provided with metal-cored 33 both sides up and down, that is to say, that at least one heat dissipation channel 34 is from the first of substrate 3
Face 31 extends to metal-cored 33, and at least one heat dissipation channel 34 extends to metal-cored 33 from the second face 32 of substrate 3.
As shown in figure 4, the heat conduction path under the set-up mode is shown in arrow in figure, to avoid repeating, to this not
Repeat.
The quantity of heat dissipation channel 34 of metal-cored about 33 both sides can be consistent, can also be inconsistent；Metal-cored about 33 two
The heat dissipation channel 34 of side can be oppositely arranged, and can also be staggered.
In addition, in addition to the set-up mode of the heat dissipation channel 34 shown in Fig. 1 and Fig. 3, can also metal-cored 33 window
The heat dissipation channel 34 in the second face 32 that substrate 3 is extended to from the first face 31 of substrate 3 is set at mouthful.
It should be noted that in order to avoid being produced on the electric connection of electronic building brick in influence, any of the above mode, dissipating
The setting of the passage of heat 34 is required to avoid the position where circuit 35.
The diameter of heat dissipation channel 34 can flexibly be set according to process capability, and the quantity of heat dissipation channel 34 is in the space of substrate 3
, can be many as far as possible in the case of license, and be in the layout of as homogeneously as possible in substrate 3.
In heat dissipation channel 34 heat-conducting medium of filling can be the metal column that is formed using blind hole filling perforation mode or
The Heat Conduction Materials such as heat-conducting resin, heat-conducting glue, phase-change material or heat-conducting silicone grease.
In embodiments of the present invention, by substrate 3 set metal-cored 33 and heat dissipation channel 34, so, chip 2 produce
Heat can just be conducted by the heat-conducting medium in metal-cored 33 and heat dissipation channel 34 from the first face 31 of substrate 3 to base
Second face 32 of plate 3, realizes the quick diffusion of heat, so as to improve the radiating effect of electronic building brick.
Optionally, as shown in Figures 1 to 4, First Transition layer 4 is provided between chip 2 and substrate 3, First Transition layer 4 exists
The corresponding position of heat dissipation channel 34 offers in window 41, the window 41 of First Transition layer 4 and is filled with heat-conducting medium.
In the embodiment of the present invention, chip 2 can be stacked on substrate 3 by First Transition layer 4, so, First Transition layer 4
Window 41, and the filling heat-conducting medium in window 41 can be opened up in the corresponding position of heat dissipation channel 34.So, First Transition layer
Heat-conducting medium in 4 window 41 can be in contact with the heat-conducting medium in heat dissipation channel 34, and the heat of chip 2 can be through window
Heat-conducting medium in 41 is conducted to the heat-conducting medium in heat dissipation channel 34, so that the conduction for the heat of chip 2 is provided continuously
Path.
The heat-conducting medium of filling can be heat-conducting metal, heat-conducting resin, heat-conducting glue, phase in the window 41 of First Transition layer 4
Become the Heat Conduction Material such as material or heat-conducting silicone grease.
First Transition layer 4 can be the fixation glue-line for adhering chip 2 and substrate 3, as such, it is desirable to open up through fixation
The window 41 of glue-line；First Transition layer 4 can also be the green oil layer for protective substrate 3, as such, it is desirable to open up through green oil layer
Window 41；First Transition layer 4 can also be fixed glue-line 42 and green oil layer 43, as such, it is desirable to open up through fixed glue-line 42
With the window 41 of green oil layer 43.
Optionally, as shown in Figures 1 to 4, the window 41 of First Transition layer 4 is more than its court towards the opening of the side of chip 2
To the opening of the side of substrate 3.
It is well known that the conduction of velocity of heat is directly proportional to the size of thermal conductive surface, i.e., thermal conductive surface is bigger, heat conduction of velocity
It is higher.Therefore, in embodiment of the present invention, in order to improve heat conduction efficiency, the window 41 of First Transition layer 4 is towards chip 2
The opening of side can be more than its opening towards the side of substrate 3.
Optionally, as shown in Figures 1 to 4, the window 41 of First Transition layer 4 is more than radiating towards the opening of the side of substrate 3
Opening of the passage 34 towards 4 side of First Transition layer.
In embodiment of the present invention, in order to improve heat conduction efficiency, the window 41 of First Transition layer 4 is towards substrate 3 one
The opening of side can be more than heat dissipation channel 34 towards the opening of 4 side of First Transition layer.
Optionally, as shown in Figure 3 to Figure 4, the second face 32 of substrate 3 is covered with heat dissipating layer 5.
In order to which the waste heat in metal-cored 33 is transferred out into electronic building brick, heat dissipating layer can be covered in the second face 32 of substrate 3
5.The heat dissipating layer 5 can be from heat-conducting glue, conductive graphite piece or heat pipe etc..
Optionally, the second face 32 covering matcoveredn 6 of substrate 3, protective layer 6 is in heat dissipation channel 34 or metal-cored 33 correspondence
Position offer window 61.
For protective substrate 3, can substrate 3 the protective mulch 6 of the second face 32, such as green oil layer.Meanwhile, protective layer
6 open up window 61 in heat dissipation channel 34 or metal-cored 33 corresponding position, in favor of distributing for heat.
For the set-up mode shown in Fig. 1 to Fig. 2, protective layer 6 should open up window 61 in metal-cored 33 corresponding positions；
For the set-up mode shown in Fig. 3 to Fig. 4, protective layer should open up window 61 in the corresponding position of heat dissipation channel 34.
Optionally, as shown in Figure 3 to Figure 4, it is filled with heat-conducting medium in the window 61 of protective layer 6.
Filling heat-conducting medium, is conducive to heat to conduct in the window 61 of protective layer 6, covers and dissipates especially on protective layer 6
The situation of thermosphere 5, by filling heat-conducting medium in the window 61 in protective layer 6, makes window 61 form continuous dissipate with heat dissipating layer 5
Hot path.
It should be noted that substrate 3 can also include other structures for being used to be electrically connected with.Knot on electric connection
Structure, can realize that it is unrelated with radiator structure provided in an embodiment of the present invention, and does not collide, therefore based on prior art, this
It is not specifically described inventive embodiments.
In addition, the embodiment of the present invention further relates to a kind of electronic equipment, including above-mentioned electronic building brick.
In the embodiment of the present invention, electronic equipment includes but is not limited to be such as mobile phone, tablet personal computer, notebook computer, the palm
The electronic equipments such as upper computer, guider, wearable device, Intelligent bracelet, pedometer.
More than, it is only the embodiment of the present invention, but protection scope of the present invention is not limited thereto, and it is any to be familiar with
Those skilled in the art the invention discloses technical scope in, change or replacement can be readily occurred in, should all be covered
Within protection scope of the present invention.Therefore, protection scope of the present invention should be defined by scope of the claims.
Claims (11)
1. a kind of electronic building brick, it is characterised in that including heat generating member and substrate, the heat generating member is stacked with the substrate and set,
The substrate includes the first face and the second face that are oppositely arranged, wherein the first of the substrate facing to the heat generating member；
Metal-cored and at least one heat dissipation channel is provided with the substrate, described metal-cored and at least one heat dissipation channel connects
Connect, heat-conducting medium is filled with each heat dissipation channel, the heat that the heat generating member is produced can be logical along described metal-cored and radiating
Heat-conducting medium in road, conducts to the second face of the substrate from the first face of the substrate.
2. electronic building brick according to claim 1, it is characterised in that the metal-cored side wall and the second of the substrate
Face is concordant, and at least one heat dissipation channel extends to described metal-cored from the first face of the substrate.
3. electronic building brick according to claim 1, it is characterised in that metal-cored each side wall may be contained within the base
The inside of plate, at least one heat dissipation channel extends to described metal-cored, at least one heat dissipation channel from the first face of the substrate
Extended to from the second face of the substrate described metal-cored.
4. electronic building brick according to any one of claim 1 to 3, it is characterised in that the heat generating member and the substrate
Between be provided with First Transition layer, First Transition layer offers window, first mistake in the corresponding position of heat dissipation channel
Cross and heat-conducting medium is filled with the window of layer.
5. electronic building brick according to claim 4, it is characterised in that the window of the First Transition layer is towards the heating
The opening of part side is more than its opening towards the substrate side.
6. electronic building brick according to claim 4, it is characterised in that the window of the First Transition layer is towards the substrate
The opening of side is more than heat dissipation channel towards the opening of First Transition layer side.
7. electronic building brick according to claim 4, it is characterised in that the First Transition layer include fixed glue-line and/or
Green oil layer.
8. electronic building brick according to any one of claim 1 to 3, it is characterised in that the second face covering of the substrate
There is heat dissipating layer.
9. electronic building brick according to any one of claim 1 to 3, it is characterised in that the second face of the substrate is set
Matcoveredn, the protective layer offers window in heat dissipation channel or the metal-cored corresponding position.
10. electronic building brick according to claim 9, it is characterised in that be situated between in the window of the protective layer filled with heat conduction
Matter.
11. a kind of electronic equipment, it is characterised in that including the electronic building brick as any one of claim 1 to 10.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710623570.XA CN107249287A (en) | 2017-07-27 | 2017-07-27 | A kind of electronic building brick and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710623570.XA CN107249287A (en) | 2017-07-27 | 2017-07-27 | A kind of electronic building brick and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107249287A true CN107249287A (en) | 2017-10-13 |
Family
ID=60011843
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710623570.XA Pending CN107249287A (en) | 2017-07-27 | 2017-07-27 | A kind of electronic building brick and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107249287A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110896435A (en) * | 2018-09-13 | 2020-03-20 | 三赢科技（深圳）有限公司 | Camera module |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0582694B1 (en) * | 1992-01-27 | 1998-05-20 | Harris Corporation | Semiconductor device with a semiconductor substrate and a ceramic plate as lid |
| JP2006128512A (en) * | 2004-10-29 | 2006-05-18 | Ngk Spark Plug Co Ltd | Ceramic substrate for light emitting element |
| CN102625563A (en) * | 2011-01-31 | 2012-08-01 | 华通电脑股份有限公司 | Multilayer circuit board embedded with heat-conducting metal block and manufacturing method thereof |
| CN104094405A (en) * | 2012-02-07 | 2014-10-08 | 株式会社尼康 | Imaging unit and imaging apparatus |
| US8859908B2 (en) * | 2012-11-23 | 2014-10-14 | Subtron Technology Co., Ltd. | Package carrier |
| US20140355215A1 (en) * | 2013-05-31 | 2014-12-04 | Dialog Semiconductor Gmbh | Embedded Heat Slug to Enhance Substrate Thermal Conductivity |
| CN106231780A (en) * | 2016-07-28 | 2016-12-14 | 广东欧珀移动通信有限公司 | Pcb board and there is its mobile terminal |
-
2017
- 2017-07-27 CN CN201710623570.XA patent/CN107249287A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0582694B1 (en) * | 1992-01-27 | 1998-05-20 | Harris Corporation | Semiconductor device with a semiconductor substrate and a ceramic plate as lid |
| JP2006128512A (en) * | 2004-10-29 | 2006-05-18 | Ngk Spark Plug Co Ltd | Ceramic substrate for light emitting element |
| CN102625563A (en) * | 2011-01-31 | 2012-08-01 | 华通电脑股份有限公司 | Multilayer circuit board embedded with heat-conducting metal block and manufacturing method thereof |
| CN104094405A (en) * | 2012-02-07 | 2014-10-08 | 株式会社尼康 | Imaging unit and imaging apparatus |
| US8859908B2 (en) * | 2012-11-23 | 2014-10-14 | Subtron Technology Co., Ltd. | Package carrier |
| US20140355215A1 (en) * | 2013-05-31 | 2014-12-04 | Dialog Semiconductor Gmbh | Embedded Heat Slug to Enhance Substrate Thermal Conductivity |
| CN106231780A (en) * | 2016-07-28 | 2016-12-14 | 广东欧珀移动通信有限公司 | Pcb board and there is its mobile terminal |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110896435A (en) * | 2018-09-13 | 2020-03-20 | 三赢科技（深圳）有限公司 | Camera module |
| CN110896435B (en) * | 2018-09-13 | 2021-07-20 | 三赢科技（深圳）有限公司 | Camera module |
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Application publication date: 20171013 |