CN107221507B - Method for self-adaptively defining defect scanning equation scanning area - Google Patents
Method for self-adaptively defining defect scanning equation scanning area Download PDFInfo
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- CN107221507B CN107221507B CN201710613874.8A CN201710613874A CN107221507B CN 107221507 B CN107221507 B CN 107221507B CN 201710613874 A CN201710613874 A CN 201710613874A CN 107221507 B CN107221507 B CN 107221507B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
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Abstract
The invention provides a method for self-adaptively defining a scanning area of a defect scanning equation, which comprises the following steps: defining a scanning area according to different functions of the device, and setting different scanning parameters; analyzing the defined different area graphs and data reflected during light intensity debugging, and recording the different area graphs and the data as the characteristics for distinguishing different areas; when a defect scanning equation is established for a subsequent process layer, the graph and light intensity analysis of the current layer is added, and different scanning areas are redefined according to the characteristics represented by the different areas; if the previously recorded region characteristics cannot be matched, the system prompts to additionally add a new scanning region. The method for adaptively defining the scanning area of the defect scanning equation provided by the invention is a method for accurately defining the scanning area again under the condition of large pattern change of different process layers, and avoids inaccurate defect feedback caused by inaccurate scanning area, thereby avoiding fault judgment.
Description
Technical Field
The present invention relates to the field of semiconductor integrated circuit manufacturing, and more particularly, to a method for adaptively defining a scanning area of a defect scan equation.
Background
In recent years, as semiconductor integrated circuits have been rapidly developed and the critical dimensions have been scaled down, the manufacturing processes thereof have become more complicated. The current advanced integrated circuit manufacturing process generally includes hundreds of process steps, and a problem occurring in one of the process steps may cause a problem of the whole semiconductor integrated circuit chip, and may seriously cause a failure of the whole chip, so that it is important to find a problem existing in the product manufacturing process in time in the manufacturing process of the semiconductor integrated circuit. In view of the above, the industry generally controls defect problems in the manufacturing process by defect inspection to improve the product yield.
With the rapid development of the integrated circuit industry, companies tend to diversify in the process of product research and development, and it is necessary to establish a perfect defect scanning system in order to ensure the safe production of products, and the accuracy of defect scanning is important for judging some major problems.
The conventional method for establishing defect scan equations on line at present is to establish a first defect scan mother equation after the first mask exposure just under the product line, divide different scan regions (such as SRAM, LOGIC, FULL, etc.) according to different functions of the device, and then establish the scan equations of all process layers according to the scan regions defined by the first mother equation. However, due to the subsequent processes, it is found that the patterns on the device surface between different process layers are changed compared with the previous patterns, and some initially defined scan regions are not suitable for the subsequent process layers, which may result in the definition of the scan regions being not accurate enough, and the reflected defect data being not accurate enough, which may result in some errors in the determination of problems.
Disclosure of Invention
The invention provides a method for adaptively defining a scanning area of a defect scanning equation, which is a method for accurately defining the scanning area again under the condition of large pattern change of different process layers, and avoids inaccurate defect feedback caused by inaccurate scanning area so as to cause fault judgment.
In order to achieve the above object, the present invention provides a method for adaptively defining a scanning area of a defect scanning equation, comprising the following steps:
defining a scanning area according to different functions of the device, and setting different scanning parameters;
analyzing the defined different area graphs and data reflected during light intensity debugging, and recording the different area graphs and the data as the characteristics for distinguishing different areas;
when a defect scanning equation is established for a subsequent process layer, the graph and light intensity analysis of the current layer is added, and different scanning areas are redefined according to the characteristics represented by the different areas;
if the previously recorded region characteristics cannot be matched, the system prompts to additionally add a new scanning region.
Further, the defined scan region includes a LOGIC region, a FULL region, an SRAM region, and a PIXEL region.
Further, the characteristic for distinguishing the different regions includes graphical features of the different regions and the fed-back image brightness.
Further, the graphic characteristics of the different areas and the fed back image brightness data are stored at the machine end, and a corresponding database is established.
Further, after the step of adding the new scanning area, fine tuning is performed to accurately define the scanning area of the current process layer.
The method for adaptively defining the scanning area of the defect scanning equation can accurately define the area characteristics of each process layer, and avoid the problem judgment error caused by inaccurate defect feedback due to inaccurate scanning area caused by graphic change.
Drawings
FIG. 1 is a flow chart of a method for adaptively defining a scanning area of a defect scan equation according to a preferred embodiment of the present invention.
Fig. 2 to 5 are schematic views of different areas of the preferred embodiment of the present invention.
FIG. 6 is a schematic view of the scan region definition of the front-end process layer.
FIG. 7 is a schematic view of the passivation layer scan area definition.
Detailed Description
The following description will be given with reference to the accompanying drawings, but the present invention is not limited to the following embodiments. Advantages and features of the present invention will become apparent from the following description and from the claims. It is noted that the drawings are in greatly simplified form and that non-precision ratios are used for convenience and clarity only to aid in the description of the embodiments of the invention.
Referring to fig. 1, fig. 1 is a flowchart illustrating a method for adaptively defining a scanning area of a defect scanning equation according to a preferred embodiment of the invention. The invention provides a method for self-adaptively defining a scanning area of a defect scanning equation, which comprises the following steps:
step S100: defining a scanning area according to different functions of the device, and setting different scanning parameters;
step S200: analyzing the defined different area graphs and data reflected during light intensity debugging, and recording the different area graphs and the data as the characteristics for distinguishing different areas;
step S300: when a defect scanning equation is established for a subsequent process layer, the graph and light intensity analysis of the current layer is added, and different scanning areas are redefined according to the characteristics represented by the different areas;
step S400: if the previously recorded region characteristics cannot be matched, the system prompts to additionally add a new scanning region.
Referring to fig. 2 to 5, fig. 2 to 5 are schematic views of different areas of a preferred embodiment of the invention. According to the preferred embodiment of the present invention, the defined scan region includes a LOGIC region, a FULL region, an SRAM region, and a PIXEL region. In order to accurately scan defects in different regions, a device structure needs to be divided into different regions, and generally, a device structure includes a plurality of different regions, and the different regions have different defect types which greatly affect the yield of the device structure. When a scanning equation is established, a complete device can be defined as the following 4 regions for differential scanning, wherein the graph in fig. 2 is irregular, the brightness of the fed back image is brightest, and the fed back image is defined as a LOGIC region; the graph in FIG. 3 is a large open area, defined as the FULL area; FIG. 4 shows a dense repeating rectangular pattern, lighter in color, defined as an SRAM region; the pattern in fig. 5 is also a dense repeating pattern, but darker in color than the SRAM region, present in CIS products, defined as the PIXEL region.
According to a preferred embodiment of the present invention, the characteristic for distinguishing the different regions includes a graphic feature of the different regions and a fed-back image brightness. Further, the graphic characteristics of the different areas and the fed back image brightness data are stored at the machine end, and a corresponding database is established. Then, when the scanning equation is established in different process steps later, the graph presented by the layer process can be analyzed, if the scanning area and the equation area definition established before are in great difference, the redefinition of the scanning area is prompted, and the accuracy of the scanning area and the correct feedback of the defects are ensured.
And after the step of adding the new scanning area, fine adjustment processing is carried out, and the scanning area of the current process layer is accurately defined.
Referring to fig. 6 and 7, fig. 6 is a schematic view illustrating the scan region definition of the front-end process layer, and fig. 7 is a schematic view illustrating the scan region definition of the passivation process layer. As shown in the figure, the scanning areas of the front-stage process and the passivation layer process of the same product are very different, because the passivation layer process redefines the pattern on the surface of the product, and if the scanning area defined according to the above equation is scanned, there is a large error, so that the scanning needs to be redefined according to the actual pattern distribution of the current layer to perform correct scanning. We can see that the region definition of fig. 7 is relatively complex, and the graph & luminance analysis method proposed in the present invention can distinguish and define new scanning regions quickly and accurately.
In summary, the method for adaptively defining the scanning area of the defect scanning equation provided by the present invention can accurately define the area characteristics of each process layer, and avoid the problem determination error caused by inaccurate defect feedback due to inaccurate scanning area caused by the pattern change.
Although the present invention has been described with reference to the preferred embodiments, it is not intended to be limited thereto. Those skilled in the art can make various changes and modifications without departing from the spirit and scope of the invention. Therefore, the protection scope of the present invention should be determined by the appended claims.
Claims (2)
1. A method for adaptively defining a scanning area of a defect scanning equation, comprising the steps of:
defining a scanning area according to different functions of the device, and setting different scanning parameters;
analyzing the defined different region graphs and data reflected when the light intensity is debugged, taking the data as the characteristics for distinguishing different regions and recording the characteristics, wherein the characteristics for distinguishing different regions comprise the graph characteristics of different regions and the fed-back image brightness, the graph characteristics of different regions and the fed-back image brightness data are stored at a machine end, and a corresponding database is established;
when a defect scanning equation is established for a subsequent process layer, the graph and light intensity analysis of the current layer is added, and different scanning areas are redefined according to the characteristics represented by the different areas;
if the area characteristics recorded before can not be corresponded, the system prompts to additionally add a new scanning area, and fine tuning processing is carried out, so that the scanning area of the current process layer is accurately defined.
2. The method of claim 1, wherein the defined scan area comprises a LOGIC area, a FULL area, an SRAM area, and a PIXEL area.
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| CN201710613874.8A CN107221507B (en) | 2017-07-25 | 2017-07-25 | Method for self-adaptively defining defect scanning equation scanning area |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103928365A (en) * | 2014-04-28 | 2014-07-16 | 上海华力微电子有限公司 | Method for defect scanning of unit chips with different picture conditions in photomask |
| CN105204377A (en) * | 2014-06-18 | 2015-12-30 | 上海华力微电子有限公司 | Method for improving product standard |
| CN105931976A (en) * | 2016-05-25 | 2016-09-07 | 上海华力微电子有限公司 | Detection method capable of automatically defining scanning area for bright field scanning device |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103928365A (en) * | 2014-04-28 | 2014-07-16 | 上海华力微电子有限公司 | Method for defect scanning of unit chips with different picture conditions in photomask |
| CN105204377A (en) * | 2014-06-18 | 2015-12-30 | 上海华力微电子有限公司 | Method for improving product standard |
| CN105931976A (en) * | 2016-05-25 | 2016-09-07 | 上海华力微电子有限公司 | Detection method capable of automatically defining scanning area for bright field scanning device |
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