CN107216838A - A kind of bisphenol A epoxide resin class heat-resistant building structure adhesive - Google Patents
A kind of bisphenol A epoxide resin class heat-resistant building structure adhesive Download PDFInfo
- Publication number
- CN107216838A CN107216838A CN201710469113.XA CN201710469113A CN107216838A CN 107216838 A CN107216838 A CN 107216838A CN 201710469113 A CN201710469113 A CN 201710469113A CN 107216838 A CN107216838 A CN 107216838A
- Authority
- CN
- China
- Prior art keywords
- parts
- bisphenol
- epoxide resin
- building structure
- resistant building
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
- C08K2003/265—Calcium, strontium or barium carbonate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Epoxy Resins (AREA)
Abstract
A kind of this real bisphenol A epoxide resin class heat-resistant building structure adhesive of disclosure of the invention, including by 65 parts of epoxy resin；25 parts of precipitated calcium carbonate；5 parts of dibutyl phthalate；Poly- 4.5 parts of adipate；0.4 part of polyamide, 0.1 part of benzene is host from above-mentioned bisphenol A epoxide resin, and cohesive force is big, adhesion strength height, small cure shrinkage, excellent electrical properties, good stability of the dimension, creep-resistant property by force, resistant to chemical media, it is pollution-free the advantages of.All there is good cementitiousness for multiple materials such as metal, timber and concrete, in addition to adhesive property, also seal, insulate, the effect such as anti-corrosion snearing and magnetic conduction, heat conduction, therefore also can be widely used to the fields such as machinery, water conservancy, chemical industry.
Description
Technical field
The present invention relates to adhesive techniques field, specifically a kind of bisphenol A epoxide resin class heat-resistant building structure glue
Glutinous agent.
Background technology
Epoxyn is also known as epoxy adhesive, abbreviation epoxy glue.Since applying since the 1950s, hair
Exhibition is rapid, in one's favour always not wane it is well known that almost without not gluing, be performance more comprehensively, using relatively wide one
Class adhesive, have the laudatory title of " all-purpose adhesive " and " strong adhesive ".
At present, hundreds of heat resistant structure adhesives have been applied to building structural member, cold curing and have bonded armored concrete
Or steel, but the heat-resistant building structure glue that can be used for a long time more than 150 degree does not find report also.United States Patent (USP)
USP4.841.010 technologies once referred to a kind of multifunctional bisphenol A epoxide resin adhesive, and it need to use preparation technology is complicated to have
Machine aromatic anhydride is as curing agent, and it can only be below 120 degree using temperature, and the country also once reported that hot setting was resistance to high-strength
Toughness bisphenol-A epoxy structural adhesive is spent, it adds hydroxybutyronitrile reaction to be composited by host of bis-phenol bisphenol A epoxide resin,
And added with organic silica auxiliary agent, can be used for a long time in -55-150 degree, but this structure glue cannot function as heat-resistant building structure glue and make
With.
The content of the invention
The technical assignment of the present invention is that there is provided a kind of heat-resisting building of bisphenol A epoxide resin class for solution the deficiencies in the prior art
Structural adhesive.
The technical solution adopted for the present invention to solve the technical problems is：
The heat-resistant building structure adhesive that the present invention is provided is to be improved and be made on the basis of prior art, and it still belongs to
In two component gluing formulations, in practical application, each component is proportionally reconciled uniform.Its gluing agent prescription is：
50-65 parts of bisphenol A epoxide resin；15-25 parts of precipitated calcium carbonate；5-10 parts of dibutyl phthalate；Poly- two
2-9 parts of dioctyl phthalate；0.2-3 parts of polyamide；0.1-1 parts of benzene；
Adhesive is being using the percentage by weight for being preceding made into ingredient in two components, each component：
First component：
65 parts of bisphenol A epoxide resin；25 parts of precipitated calcium carbonate；6 parts of dibutyl phthalate；Poly- adipate
4.5 part；Remaining is filler.
Second component：0.4 part of polyamide；0.1 part of benzene；Remaining is filler；And first component content is 30-40% in adhesive,
Second component is 25-35%.
A kind of bisphenol A epoxide resin class heat-resistant building structure adhesive of the present invention is produced compared with prior art to be had
Beneficial effect is：
The heat-resistant building structure adhesive that the present invention is provided, due to being host from above-mentioned bisphenol A epoxide resin, in hot environment
Under, its cohesive force is big, and adhesion strength height, small cure shrinkage, excellent electrical properties, good stability of the dimension, creep-resistant property are strong, resistance toization
Learn medium, it is pollution-free the advantages of.All there is good cementitiousness for multiple materials such as metal, timber and concrete.
In addition to adhesive property, also seal, insulate, the effect such as anti-corrosion snearing and magnetic conduction, heat conduction, therefore also extensive use
In fields such as machinery, water conservancy, chemical industry.
Embodiment
The present invention is described in detail with reference to specific embodiment.
The hardening time of bisphenol A type epoxy resin adhesive under external force is shorter than the hardening time acted on without external force,
Therefore as heat-resistant building structure glue in use, reply smeared adhesive workpiece apply pretightning force.
Meanwhile, bisphenol A type epoxy resin adhesive for identical material the bonding time than the bonding between different materials
Time is short.
Embodiment 1：
First component is prepared：By 65 parts of epoxy resin；25 parts of precipitated calcium carbonate；5 parts of dibutyl phthalate；Poly- diacid two is pungent
4.5 parts of ester.
Second component is prepared：
0.4 part of polyamide, 0.1 part of benzene.
First epoxy resin is added in the retort equipped with agitator, dropping funel, reflux condensing tube and thermometer, stirs and adds
Heat makes bisphenol-A all dissolvings to 70 degree;Weigh precipitated calcium carbonate to be dissolved in water, dropping liquid is added into funnel, be slowly added dropwise light
Matter calcium carbonate soln keeps reacting liquid temperature at 70 DEG C or so into three-necked flask;Continue to react 1.5~2. at 75~80 DEG C
0h, can be observed reaction mixture in milk yellow；Benzene and polyamide are added into reaction bulb, is sufficiently stirred for, pours into separatory funnel,
After static layering, branch vibration layer;Oil reservoir is with water washing is distilled for several times, until in neutrality without chlorion in the aqueous phase separated；Often first
Pressure distillation, removes benzene；Then vacuum distillation, removes benzene, water and unreacted epoxychloropropane.Obtain pale yellow transparent sticky
Liquid.
Embodiment 2：
First component is prepared：By 64 parts of epoxy resin；24 parts of precipitated calcium carbonate；7 parts of dibutyl phthalate；Poly- diacid two is pungent
4.7 parts of ester；
Second component is prepared：
0.2 part of polyamide, 0.1 part of benzene.
First epoxy resin is added in the retort equipped with agitator, dropping funel, reflux condensing tube and thermometer, stirs and adds
Heat makes bisphenol-A all dissolvings to 70 degree;Weigh precipitated calcium carbonate to be dissolved in water, dropping liquid is added into funnel, be slowly added dropwise light
Matter calcium carbonate soln keeps reacting liquid temperature at 70 DEG C or so into three-necked flask;75~80 DEG C continue react 1.5~
2.0h, can be observed reaction mixture in milk yellow；Benzene and polyamide are added into reaction bulb, is sufficiently stirred for, a point liquid leakage is poured into
After bucket, static layering, branch vibration layer;Oil reservoir is with water washing is distilled for several times, until in neutrality without chlorion in the aqueous phase separated；First
Air-distillation, removes benzene；Then vacuum distillation, removes benzene, water and unreacted epoxychloropropane.Obtain pale yellow transparent sticky
Liquid.
Embodiment 3：
First component is prepared：By 63.5 parts of epoxy resin；24 parts of precipitated calcium carbonate；7 parts of dibutyl phthalate；Poly- diacid two
5 parts of monooctyl ester.
Second component is prepared：
0.4 part of polyamide, 0.1 part of benzene.
First epoxy resin is added in the retort equipped with agitator, dropping funel, reflux condensing tube and thermometer, stirs and adds
Heat makes bisphenol-A all dissolvings to 70 degree;Weigh precipitated calcium carbonate to be dissolved in water, dropping liquid is added into funnel, be slowly added dropwise light
Matter calcium carbonate soln keeps reacting liquid temperature at 70 DEG C or so into three-necked flask;Continue to react 1.5~2. at 75~80 DEG C
0h, can be observed reaction mixture in milk yellow；Benzene and polyamide are added into reaction bulb, is sufficiently stirred for, pours into separatory funnel,
After static layering, branch vibration layer;Oil reservoir is with water washing is distilled for several times, until in neutrality without chlorion in the aqueous phase separated；Often first
Pressure distillation, removes benzene；Then vacuum distillation, removes benzene, water and unreacted epoxychloropropane.Obtain pale yellow transparent sticky
Liquid.
It should be noted that above content is merely illustrative of the technical solution of the present invention, rather than to the scope of the present invention
Limitation, although the embodiment part is explained to the present invention, one of ordinary skill in the art should
Understand, technical scheme can be modified or equivalent substitution, without departing from the essence of technical solution of the present invention
And scope.
Claims (4)
1. a kind of bisphenol A epoxide resin class heat-resistant building structure adhesive, it is characterised in that including following components and each component weight
Measuring score ratio is：50-65 parts of bisphenol A epoxide resin；15-25 parts of precipitated calcium carbonate；5-10 parts of dibutyl phthalate；
Poly- adipate 2-9 parts；0.2-3 parts of polyamide；0.1-1 parts of benzene.
2. a kind of bisphenol A epoxide resin class heat-resistant building structure adhesive according to claim 1, it is characterised in that gluing
Agent is being using the percentage by weight for being preceding made into ingredient in two components, each component：
First component：65 parts of bisphenol A epoxide resin；25 parts of precipitated calcium carbonate；6 parts of dibutyl phthalate；Poly- diacid two is pungent
4.5 parts of ester；Remaining is filler；Second component：0.4 part of polyamide；0.1 part of benzene.
3. a kind of bisphenol A epoxide resin class heat-resistant building structure adhesive according to claim 1, it is characterised in that use
Organo-silicon coupling agent is used as auxiliary agent, such as silane, titanate esters.
4. a kind of bisphenol A epoxide resin class heat-resistant building structure adhesive according to claim 1, it is characterised in that mixing
Filler is that the inorganic fillers such as flake asbestos, chromium oxide powder, aluminium powder and graphite powder are mixed, and the content of aluminium powder accounts for filler weight hundred
Divide the 55-65% of ratio.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710469113.XA CN107216838A (en) | 2017-06-20 | 2017-06-20 | A kind of bisphenol A epoxide resin class heat-resistant building structure adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710469113.XA CN107216838A (en) | 2017-06-20 | 2017-06-20 | A kind of bisphenol A epoxide resin class heat-resistant building structure adhesive |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107216838A true CN107216838A (en) | 2017-09-29 |
Family
ID=59949892
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710469113.XA Pending CN107216838A (en) | 2017-06-20 | 2017-06-20 | A kind of bisphenol A epoxide resin class heat-resistant building structure adhesive |
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Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080145667A1 (en) * | 2006-12-15 | 2008-06-19 | Barker Michael J | Low odor, fast cure, toughened epoxy adhesive |
| CN101570675A (en) * | 2009-06-11 | 2009-11-04 | 中国京冶工程技术有限公司 | Delayed coagulation adhesive used for retard-bonded prestressed tendon |
| CN102533193A (en) * | 2011-12-22 | 2012-07-04 | 上海康达化工新材料股份有限公司 | Bi-component epoxy resin construction adhesive and preparation method thereof |
| CN102732209A (en) * | 2012-07-06 | 2012-10-17 | 郑州大学 | High-temperature-resistant flexible adhesive cured at normal temperature and preparation method thereof |
| CN104804693A (en) * | 2015-05-20 | 2015-07-29 | 叶芳 | Novel high temperature-resistant epoxy resin structure adhesive and preparation method thereof |
| CN105062396A (en) * | 2015-08-21 | 2015-11-18 | 卡本复合材料（天津）有限公司 | Double-component high-strength building epoxy structural adhesive and preparing method thereof |
| CN105440976A (en) * | 2015-12-03 | 2016-03-30 | 三友（天津）高分子技术有限公司 | Single-component solvent-free sealing adhesive capable of being quickly cured at 100 DEG C and preparation method |
| CN106147538A (en) * | 2016-07-20 | 2016-11-23 | 西安天元化工有限责任公司 | A kind of low VOC epoxy resin combination |
-
2017
- 2017-06-20 CN CN201710469113.XA patent/CN107216838A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080145667A1 (en) * | 2006-12-15 | 2008-06-19 | Barker Michael J | Low odor, fast cure, toughened epoxy adhesive |
| CN101570675A (en) * | 2009-06-11 | 2009-11-04 | 中国京冶工程技术有限公司 | Delayed coagulation adhesive used for retard-bonded prestressed tendon |
| CN102533193A (en) * | 2011-12-22 | 2012-07-04 | 上海康达化工新材料股份有限公司 | Bi-component epoxy resin construction adhesive and preparation method thereof |
| CN102732209A (en) * | 2012-07-06 | 2012-10-17 | 郑州大学 | High-temperature-resistant flexible adhesive cured at normal temperature and preparation method thereof |
| CN104804693A (en) * | 2015-05-20 | 2015-07-29 | 叶芳 | Novel high temperature-resistant epoxy resin structure adhesive and preparation method thereof |
| CN105062396A (en) * | 2015-08-21 | 2015-11-18 | 卡本复合材料（天津）有限公司 | Double-component high-strength building epoxy structural adhesive and preparing method thereof |
| CN105440976A (en) * | 2015-12-03 | 2016-03-30 | 三友（天津）高分子技术有限公司 | Single-component solvent-free sealing adhesive capable of being quickly cured at 100 DEG C and preparation method |
| CN106147538A (en) * | 2016-07-20 | 2016-11-23 | 西安天元化工有限责任公司 | A kind of low VOC epoxy resin combination |
Non-Patent Citations (1)
| Title |
|---|
| 杨理准 等编: "《公路施工手册 基本作业》", 30 April 1993 * |
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Application publication date: 20170929 |
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