CN107199488B - A kind of photovoltaic solar wafer thinning processing unit - Google Patents
A kind of photovoltaic solar wafer thinning processing unit Download PDFInfo
- Publication number
- CN107199488B CN107199488B CN201710457481.2A CN201710457481A CN107199488B CN 107199488 B CN107199488 B CN 107199488B CN 201710457481 A CN201710457481 A CN 201710457481A CN 107199488 B CN107199488 B CN 107199488B
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- 238000012545 processing Methods 0.000 title claims abstract description 19
- 238000007789 sealing Methods 0.000 claims abstract description 7
- 241000272534 Struthio camelus Species 0.000 claims description 4
- 230000008676 import Effects 0.000 claims description 4
- 238000009434 installation Methods 0.000 claims description 3
- 239000004744 fabric Substances 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 56
- 229910052710 silicon Inorganic materials 0.000 abstract description 56
- 239000010703 silicon Substances 0.000 abstract description 56
- 238000013461 design Methods 0.000 description 19
- 238000000034 method Methods 0.000 description 18
- 230000000694 effects Effects 0.000 description 7
- 239000012530 fluid Substances 0.000 description 6
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 230000000750 progressive effect Effects 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
- B24B47/12—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces by mechanical gearing or electric power
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/06—Dust extraction equipment on grinding or polishing machines
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/10—Single-purpose machines or devices
- B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
- B24B7/17—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings for simultaneously grinding opposite and parallel end faces, e.g. double disc grinders
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
A kind of photovoltaic solar wafer thinning processing unit of the present invention discloses one kind by two-stage planet wheel disc, carries out the pre- thinned device of double-side grinding to silicon wafer.It is characterized in that sealing bearing, which is placed in, connects bits disk center bottom, one end of the connecting shaft is placed in across sealing bearing and connects in bits disk, it is placed in connecting shaft in the middle part of grinding workbench by connection, the grinding worktable upper surface is provided with intake chute, the intake chute is reticulate pattern structure, grinding table core position drain groove density is greater than marginal position, multiple rubber rings are respectively placed on grinding workbench, and it is distributed in a ring, the diameter of the rubber ring is gradually increased from centre to two sides, multiple salient points are uniformly equipped on the inner wall of the rubber ring, multiple range line holes are provided on the grinding workbench, range line mark post is placed in range line hole, first central gear is placed in connecting shaft, and it is located at the lower section of grinding workbench, primary planet carrier assembly is placed in connecting shaft.
Description
Technical field
A kind of photovoltaic solar wafer thinning processing unit of the present invention, is related to a kind of pair of photovoltaic solar silicon wafer and is subtracted in advance
The device of thin processing belongs to photovoltaic apparatus field.In particular to a kind of to pass through two-stage planet wheel disc, double-side grinding is carried out to silicon wafer
Pre- thinned device.
Background technique
Currently, silicon wafer is widely used in photovoltaic art, and silicon wafer is in process, needs to carry out the thickness of silicon wafer
Thinned adjustment appropriate, the main reason is that thin slice can reduce the conducting resistance and pressure drop of device, so that device be greatly reduced
The conduction loss of part, and promoted device in terms of performance, existing silicon wafer process when first silicon wafer is cut, so
After carry out thinned, and wafer thinning mode includes grinding, chemically mechanical polishing, dry type polishing etc., however such thinned is all
The reduction processing of a small range is carried out to silicon wafer, required precision is higher, and the die size difference after cutting is larger, directly carries out
Aforesaid way carry out it is thinned, it is time-consuming and laborious, and equipment is lost and is increased, and when thinned, since thinned grinding stroke is big, grinding
It will appear the problem of release of silicon wafer internal stress leads to cracking during cutting, it is therefore necessary to after dicing and reduce the number of between thin
Increase pre- thinned work, to solve the problems, such as that wafer thinning low efficiency, percentage of damage are high, and meanwhile it is existing in grinding process,
Individually silicon wafer can only be ground on one side, then replace another side again, this method is not only time-consuming and laborious, reduces processing
Efficiency, and need when overturning silicon wafer to cooperate vacuum chuck, however vacuum chuck meeting and silicon chip surface in overturning
Contact, damages silicon chip surface, is unfavorable for the postorder processing of silicon wafer.
Summary of the invention
In order to improve above situation, a kind of photovoltaic solar wafer thinning processing unit of the present invention provides a kind of by two
Grade planet wheel disc carries out the pre- thinned device of double-side grinding to silicon wafer.Structure is simple, convenient and practical.
A kind of photovoltaic solar wafer thinning processing unit of the present invention is achieved in that a kind of photovoltaic solar of the present invention
Wafer thinning processing unit is made of the fixed device of main body, transmission device and grinding attachment, and the fixed device of main body is by connecing bits disk, rubber
Rubber ring, connector sleeve, range line mark post, range line hole, grinding workbench, connecting shaft and sealing bearing composition, sealing bearing, which is placed in, connects bits
Disk center bottom, one end of the connecting shaft are placed in across sealing bearing and connect in bits disk, pass through the connection company of being placed in the middle part of grinding workbench
In spindle, the grinding worktable upper surface is provided with intake chute, and the intake chute is reticulate pattern structure, in the grinding workbench
Heart position drain groove density is greater than marginal position, and multiple rubber rings are respectively placed on grinding workbench, and are distributed in a ring, described
The diameter of rubber ring is gradually increased from centre to two sides, and multiple salient points, the grinding are uniformly equipped on the inner wall of the rubber ring
Multiple range line holes are provided on workbench, range line mark post is placed in range line hole, and transmission device is by the first central gear, secondary planet frame
Assembly, the second central gear, the second gear ring, the first gear ring and primary planet carrier assembly composition, the first central gear are placed in connection
On axis, and it is located at the lower section of grinding workbench, primary planet carrier assembly is placed in connecting shaft, on the primary planet carrier assembly
Four planetary gears are meshed with the first central gear respectively, and the first gear ring is placed on primary planet carrier assembly, and respectively and
Four planetary gears on primary planet carrier assembly are meshed, and the second central gear is placed in connecting shaft, and are located at grinding work
The top of platform, secondary planet frame assembly are placed in connecting shaft, four planetary gears on the secondary planet frame assembly respectively and
Second central gear is meshed, and the second gear ring is placed on secondary planet frame assembly, and respectively and on secondary planet frame assembly
Four planetary gears are meshed, and grinding attachment is by grinding cutterhead, grinding flannelette, mounting groove, guide sleeve, grinding item, mounting blocks, company
Buckle, chip space and grinding cutter head composition, two grinding cutterheads are respectively placed on the first gear ring and the second gear ring, and middle part is distinguished
It is placed in connecting shaft by connection, described two grinding cutterheads are located at the two sides up and down of grinding workbench, top mill
Sharpener disk lower surface is angularly provided with multiple mounting grooves, and grinding cutterhead upper surface on the lower is angularly provided with multiple mounting grooves, institute
Stating installation slot cross-section is T-type, and the mounting groove is built-in with rubber pad, and mounting blocks are placed in mounting groove, and grinding item is placed in mounting blocks
On, grinding cutter head is buckled on grinding item by connection, and the grinding cutter head intermediate altitude is higher than two sides, on the grinding cutter head
Multiple chip spaces are provided with, the import of the chip space is wide, and outlet is narrow, and the outer surface of the grinding cutter head and corresponding grinding cutterhead lean on
The surface of nearly grinding workbench flushes, and described two grinding cutterheads are equipped with one layer of grinding on the surface of grinding workbench respectively
Flannelette, the grinding flannelette are made of ostrich.
In use, photovoltaic solar silicon wafer reduce the number of it is thin before, photovoltaic solar silicon wafer is placed on rubber ring first
It is interior, it is respectively dropped into grinding fluid on the grinding flannelette that two are ground on cutterhead, connecting shaft is connected with external motive device, is led to
It crosses range line hole and adjusts the height of range line mark post, to adjust the thickness of silicon wafer grinding, external impetus rotation drives connecting shaft rotation,
Connecting shaft drives the first central gear and the second central gear to rotate respectively, and the first central gear drives primary planet carrier assembly
On four planetary gear rotations, four planetary gears on primary planet carrier assembly drive the first ring gear against rotation respectively, first
Gear ring drives grinding cutterhead rotation on the lower, and grinding cutterhead on the lower is to drive the grinding cutter head in the mounting groove of upper surface to turn
Dynamic, so that the lower surface to silicon wafer is ground, the second central gear drives four planetary gears on secondary planet frame assembly
It rotates, four planetary gears on secondary planet frame assembly drive the second ring gear against rotation respectively, and the second gear ring drives top mill
The rotation of sharpener disk, top grinding cutterhead is to drive the grinding cutter head in the mounting groove of lower surface to rotate, thus to the upper of silicon wafer
Surface is ground, to be ground simultaneously to the upper and lower surface of silicon wafer, the silicon bits part ground away can be ground flannelette suction
It is attached, it can partially fall into chip space, as the silicon bits in chip space are continuously increased, eventually fall in and connect in bits disk, the grinding work
Make the design that platform upper surface is provided with intake chute, convenient in grinding process, grinding fluid flows on grinding workbench, assistant grinding
The progress of work, the grinding table core position installation groove density is greater than the design of marginal position, more preferable convenient for grinding fluid
Be deposited in grinding workbench on, further increase ground effect, the diameter of the rubber ring is gradually increased from centre to two sides
Design, convenient for being put into for silicon wafer, and be also convenient for grinding cutter head silicon wafer is ground, further increase ground effect, institute
The design for stating rubber ring is that make after test of many times be most adapted to the design of this programme, if rubber ring is by metal material
It is made, then in grinding process, is easy that silicon chip side is caused to damage, the processing for influencing the later period uses, if rubber ring is by ceramics
Material is made, then poor to the stability maintenance of silicon wafer, and in grinding process, silicon wafer is easy to appear shaking, influences to be ground work
Progress, the design of multiple salient points is uniformly equipped on the inner wall of the rubber ring, rubbing between silicon wafer and rubber ring can be increased
Power is wiped, the stability of silicon wafer is further increased, prevents silicon wafer from generating shaking in grinding process, influence ground effect, the peace
Tankage is built-in with the design of rubber pad, and preferably grinding item can be fixed, and reduces in grinding process, the vibration of generation
Dynamic, the grinding cutter head intermediate altitude is higher than the design of two sides, and progressive grinding can be carried out to silicon wafer, the chip space
Import is wide, exports narrow design, and convenient for the discharge of silicon bits, the grinding flannelette is designed made of ostrich, can ground
Electrostatic is not generated during cutting, the hard particles in grinding flannelette absorption dust is prevented, silicon wafer is scratched in grinding process, is reached
By two-stage planet wheel disc, the pre- thinned purpose of double-side grinding is carried out to silicon wafer.
Beneficial effect.
One, structure is simple, convenient and practical.
Two, low in cost, it is easy to spread.
Three, it can be improved wafer thinning effect.
Detailed description of the invention
Fig. 1 is a kind of stereo-resolution figure of photovoltaic solar wafer thinning processing unit of the present invention.
Fig. 2 is the three-dimensional structure diagram that a kind of photovoltaic solar wafer thinning processing unit of the present invention is ground item.
In attached drawing
Wherein part are as follows: bits disk (1) are connect, the first central gear (2) is ground cutterhead (3), rubber ring (4), connector sleeve (5),
Secondary planet frame assembly (6), the second central gear (7), the second gear ring (8) are ground flannelette (9), range line mark post (10), range line hole
(11), workbench (12) are ground, mounting groove (13), guide sleeve (14) is ground item (15), the first gear ring (16), primary planet carrier
Assembly (17), connecting shaft (18) seal bearing (19), mounting blocks (20), connection buckle (21), chip space (22), are ground cutter head
(23).
Specific embodiment:
A kind of photovoltaic solar wafer thinning processing unit of the present invention is achieved in that in use, carrying out essence in silicon wafer
Before being thinned, silicon wafer is placed in rubber ring (4) first, is respectively dropped on the grinding flannelette (9) that two are ground on cutterhead (3)
Connecting shaft (18) is connected by grinding fluid with external motive device, and the height of range line mark post (10) is adjusted by range line hole (11),
To adjust the thickness of silicon wafer grinding, external impetus rotation drives connecting shaft (18) rotation, and connecting shaft (18) drives first respectively
Central gear (2) and the second central gear (7) rotated, and the first central gear (2) drives on primary planet carrier assembly (17)
Four planetary gear rotations, four planetary gears on primary planet carrier assembly (17) drive the first gear ring (16) to rotate respectively,
First gear ring (16) drives grinding cutterhead (3) rotation on the lower, and grinding cutterhead (3) on the lower is to drive upper surface mounting groove
(13) grinding cutter head (23) rotation in, so that the lower surface to silicon wafer is ground, the second central gear (7) drives second level row
Four planetary gear rotations on carrier assembly (6), four planetary gears on secondary planet frame assembly (6) drive second respectively
Gear ring (8) rotation, the second gear ring (8) drives top grinding cutterhead (3) rotation, under top grinding cutterhead (3) is to drive
Grinding cutter head (23) rotation in surface mounting groove (13), so that the upper surface to silicon wafer is ground, thus simultaneously to silicon wafer
Upper and lower surface be ground, the silicon that grinds away bits part can be ground flannelette (9) absorption, can partially fall into chip space (22)
It is interior, as the silicon bits in chip space (22) are continuously increased, eventually fall in and connect in bits disk (1), table on the grinding workbench (12)
Face is provided with the design of intake chute, convenient in grinding process, grinding fluid flows in grinding workbench (12), assistant grinding work
Progress, it is described grinding workbench (12) center drain groove density be greater than marginal position design, convenient for grinding fluid it is more preferable
Be deposited in grinding workbench (12), further increase ground effect, the diameter of the rubber ring (4) from centre to two sides by
Gradually increased design convenient for being put into for silicon wafer, and is also convenient for grinding cutter head (23) and is ground to silicon wafer, further increases mill
Cut effect, the design of the rubber ring (4) is that make after test of many times be most adapted to the design of this programme, if rubber
Ring (4) is made of metal material, then in grinding process, is easy to cause to damage to silicon chip side, and the processing for influencing the later period uses,
If rubber ring (4) is made of ceramic materials, poor to the stability maintenance of silicon wafer, in grinding process, silicon wafer is easy to appear
It shakes, influences the progress for being ground work, the design of multiple salient points is uniformly equipped on the inner wall of the rubber ring (4), can be increased
Frictional force between silicon wafer and rubber ring (4), further increases the stability of silicon wafer, prevents silicon wafer from generating rolling in grinding process
It is dynamic, ground effect is influenced, the mounting groove (13) is built-in with the design of rubber pad, can preferably consolidate to grinding item (15)
It is fixed, and reduce in grinding process, the vibration of generation, grinding cutter head (23) intermediate altitude is higher than the design of two sides, can
Progressive grinding is carried out to silicon wafer, the import of the chip space (22) is wide, narrow design is exported, convenient for the discharge of silicon bits, institute
It states grinding flannelette (9) to design made of ostrich, electrostatic can not be generated in grinding process, prevent grinding flannelette (9)
The hard particles in dust are adsorbed, silicon wafer is scratched in grinding process, reaches through two-stage planet wheel disc, silicon wafer is carried out two-sided
It is ground pre- thinned purpose.
Claims (3)
1. a kind of photovoltaic solar wafer thinning processing unit, it is characterized in that: sealing bearing, which is placed in, connects bits disk center bottom, connection
Axis one end is placed in across sealing bearing and connects in bits disk, passes through connection in the middle part of grinding workbench and is placed in connecting shaft, the grinding
Worktable upper surface is provided with intake chute, and grinding table core position drain groove density is greater than marginal position, multiple rubber
Ring is respectively placed on grinding workbench, and is distributed in a ring, and the diameter of the rubber ring is gradually increased from centre to two sides, described
It is uniformly equipped with multiple salient points on the inner wall of rubber ring, is provided with multiple range line holes on the grinding workbench, range line mark post is placed in limit
Away from hole, the first central gear is placed in connecting shaft, and is located at the lower section of grinding workbench, and primary planet carrier assembly is placed in connection
On axis, four planetary gears on the primary planet carrier assembly are meshed with the first central gear respectively, and the first gear ring is nested with
In on primary planet carrier assembly, and it is meshed respectively with four planetary gears on primary planet carrier assembly, the second central gear
It is placed in connecting shaft, and is located at the top of grinding workbench, secondary planet frame assembly is placed in connecting shaft, the secondary planet frame
Four planetary gears on assembly are meshed with the second central gear respectively, and the second gear ring is placed on secondary planet frame assembly,
And be meshed respectively with four planetary gears on secondary planet frame assembly, two grinding cutterheads are respectively placed in the first gear ring and
On two gear rings, and middle part passes through connection respectively and is placed in connecting shaft, and described two grinding cutterheads are located at grinding workbench
Two sides up and down, top grinding cutterhead lower surface is angularly provided with multiple mounting grooves, grinding cutterhead upper surface isogonism on the lower
Degree is provided with multiple mounting grooves, and the installation slot cross-section is T-type, and the mounting groove is built-in with rubber pad, and mounting blocks are placed in mounting groove
Interior, grinding item is placed on mounting blocks, and grinding cutter head is buckled on grinding item by connection, and the grinding cutter head intermediate altitude is higher than
Two sides are provided with multiple chip spaces on the grinding cutter head, and the import of the chip space is wide, export it is narrow, the grinding cutter head it is outer
Surface and corresponding grinding cutterhead are flushed close to the surface of grinding workbench, table of described two grinding cutterheads close to grinding workbench
One layer of grinding flannelette is equipped on face respectively.
2. a kind of photovoltaic solar wafer thinning processing unit according to claim 1, it is characterised in that the intake chute
For reticulate pattern structure.
3. a kind of photovoltaic solar wafer thinning processing unit according to claim 1, it is characterised in that the grinding suede
Cloth is made of ostrich.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710457481.2A CN107199488B (en) | 2017-06-16 | 2017-06-16 | A kind of photovoltaic solar wafer thinning processing unit |
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|---|---|---|---|
| CN201710457481.2A CN107199488B (en) | 2017-06-16 | 2017-06-16 | A kind of photovoltaic solar wafer thinning processing unit |
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| CN107199488A CN107199488A (en) | 2017-09-26 |
| CN107199488B true CN107199488B (en) | 2019-10-11 |
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| CN108942534A (en) * | 2018-08-16 | 2018-12-07 | 陶佩林 | A kind of anti-stealing manhole cover automatic processing device |
| CN109760220B (en) * | 2019-01-21 | 2020-04-21 | 中国科学院半导体研究所 | Method for thinning substrate of semiconductor photoelectric device |
| CN113857966A (en) * | 2021-11-11 | 2021-12-31 | 宁国九鼎橡塑制品有限公司 | Surface treatment production line and treatment process for clutch driving disc |
| CN115609392B (en) * | 2022-09-29 | 2023-07-25 | 亚新半导体科技(无锡)有限公司 | Fab factory is with processing equipment that has intelligent automatic function of snatching |
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- 2017-06-16 CN CN201710457481.2A patent/CN107199488B/en not_active Expired - Fee Related
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| EP2301081A2 (en) * | 2008-06-03 | 2011-03-30 | Vserv Technologies Corp | System for simultaneous tabbing and stringing of solar cells |
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| CN107199488A (en) | 2017-09-26 |
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