CN204262924U - A kind of semi-automatic silicon wafer polishing machine - Google Patents
A kind of semi-automatic silicon wafer polishing machine Download PDFInfo
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- CN204262924U CN204262924U CN201420746673.7U CN201420746673U CN204262924U CN 204262924 U CN204262924 U CN 204262924U CN 201420746673 U CN201420746673 U CN 201420746673U CN 204262924 U CN204262924 U CN 204262924U
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- silicon wafer
- polished silicon
- specimen holder
- polishing machine
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Abstract
The utility model relates to a kind of semi-automatic silicon wafer polishing machine, and this polishing machine comprises bench drill, collection stock tank, specimen holder and water tank.One end of bench drill is provided with motor, and its other end is provided with drill bit, and its drilling machine is provided with pallet, and its pedestal is provided with water tank; Drill bit is provided with lifting handle, and its end is connected with specimen holder by drill bit connecting rod; Pallet is provided with collection stock tank, and the upper end of this collection stock tank is provided with the lower polished silicon wafer be connected with drilling machine connecting rod; The top of specimen holder is provided with polished silicon wafer, and on this, the bilateral symmetry of polished silicon wafer is provided with the adjusting nut of one group of band holddown spring; Holddown spring inner sleeve has standing screw, and is connected with lower polished silicon wafer by this standing screw; Specimen holder and lower polished silicon wafer are linked together by abrasive disc frame; The side, bottom of water tank is provided with water inlet pipe, is provided with water pump in it, and this water pump is connected with abrasive disc frame by outlet pipe I; The bottom of collection stock tank is provided with delivery port, and this delivery port communicates with water tank through outlet pipe II.The utility model structure is simple, easy to use.
Description
Technical field
The utility model relates to polissoir field, particularly relates to a kind of semi-automatic silicon wafer polishing machine.
Background technology
Silicon wafer polishing refers to and utilizes the effect of machinery and chemistry to remove surperficial mechanical damage layer, adopts the method for chemistry to be processed into bimirror face, to reach testing requirement further.The domestic and international research to silicon chip mechanical polishing device at present and manufacture have been tending towards ripe, and commercially available have multiple silicon wafer polishing machine, the shortcomings such as operating efficiency is all higher, but all there is complex structure, expensive, and maintenance cost is higher; It is reported that enterprise adopts traditional underhand polish method to carry out silicon wafer polishing, there is polishing level difficulty and control, artifical influence factor is large, and efficiency is low.
Utility model content
Technical problem to be solved in the utility model is to provide a kind of structure semi-automatic silicon wafer polishing machine simple, easy to use.
For solving the problem, the semi-automatic silicon wafer polishing machine of one described in the utility model, is characterized in that: this polishing machine comprises bench drill, collection stock tank, specimen holder and water tank; One end of described bench drill is provided with motor, and its other end is provided with drill bit, and its drilling machine is provided with pallet, and its pedestal is provided with described water tank; Described drill bit is provided with lifting handle, and its end is connected with described specimen holder by drill bit connecting rod; Described pallet is provided with described collection stock tank, and the upper end of this collection stock tank is provided with the lower polished silicon wafer be connected with described drilling machine connecting rod; The top of described specimen holder is provided with polished silicon wafer, and on this, the bilateral symmetry of polished silicon wafer is provided with the adjusting nut of one group of band holddown spring; Described holddown spring inner sleeve has standing screw, and is connected with described lower polished silicon wafer by this standing screw; Described specimen holder and described lower polished silicon wafer are linked together by abrasive disc frame; The side, bottom of described water tank is provided with water inlet pipe, is provided with water pump in it, and this water pump is connected with described abrasive disc frame by outlet pipe I; The bottom of described collection stock tank is provided with delivery port, and this delivery port communicates with described water tank through outlet pipe II.
The center of described specimen holder is connected with described upper polished silicon wafer by hold-down nut.
Described bench drill is provided with bench drill motor shield.
Described lower polished silicon wafer and described upper polished silicon wafer form by varigrained stainless steel emery wheel.
Described upper polished silicon wafer is enclosed with dust cover.
Described specimen holder has several being staggered and the circular print fixing hole of the fixed dimension designed by the size of silicon chip.
The utility model compared with prior art has the following advantages:
1, the utility model adopts bench drill as dynamical system, by regulating the holddown spring pressure on standing screw, thus makes silicon chip surface uniform force, consistency of thickness.
2, in the utility model, lower polished silicon wafer and upper polished silicon wafer form by varigrained stainless steel emery wheel, and therefore, during use, coordinate corresponding antiscuffing paste, throwing/grounds travel, silicon chip directly can be thrown into minute surface by polishing step by step, saves the part of chemical polishing.
3, in the utility model, specimen holder has several being staggered and the circular print fixing hole of the fixed dimension designed by the size of silicon chip, therefore, multi-disc polishing can be carried out simultaneously.
4, the utility model changes traditional underhand polish into machine glazed finish, not only can increase work efficiency, and saves production cost, and greatly can improve the quality of finish of silicon chip.
5, the utility model structure is simple, cheap, effectively can reduce the input of procurement payment.
Accompanying drawing explanation
Below in conjunction with accompanying drawing, detailed description of the invention of the present utility model is described in further detail.
Fig. 1 is structural representation of the present utility model.
Fig. 2 is the structural representation of specimen holder in the utility model.
In figure: 1-bench drill, 2-bench drill motor shield, 3-lifting handle, 4-specimen holder, 5-upper polished silicon wafer 6-standing screw 7-lower polished silicon wafer 8-collection stock tank, 9-outlet pipe, I 10-water pump, 11-water inlet pipe, 12-delivery port, 13-outlet pipe, II 14-water tank, 15-holddown spring, 16-adjusting nut.
Detailed description of the invention
As shown in Figure 1 and Figure 2, a kind of semi-automatic silicon wafer polishing machine, this polishing machine comprises bench drill 1, collection stock tank 8, specimen holder 4 and water tank 14.
One end of bench drill 1 is provided with motor, and its other end is provided with drill bit, and its drilling machine is provided with pallet, and its pedestal is provided with water tank 14; Drill bit is provided with lifting handle 3, and its end is connected with specimen holder 4 by drill bit connecting rod; Pallet is provided with collection stock tank 8, and the upper end of this collection stock tank 8 is provided with the lower polished silicon wafer 7 be connected with drilling machine connecting rod; The top of specimen holder 4 is provided with polished silicon wafer 5, and on this, the bilateral symmetry of polished silicon wafer 5 is provided with the adjusting nut 16 of one group of band holddown spring 15; Holddown spring 15 inner sleeve has standing screw 6, and is connected with lower polished silicon wafer 7 by this standing screw 6; Specimen holder 4 and lower polished silicon wafer 7 are linked together by abrasive disc frame; The side, bottom of water tank 14 is provided with water inlet pipe 11, is provided with water pump 10 in it, and this water pump 10 is connected with abrasive disc frame by outlet pipe I 9; The bottom of collection stock tank 8 is provided with delivery port 12, and this delivery port 12 communicates with water tank 14 through outlet pipe II 13.
Wherein:
The center of specimen holder 4 is connected with upper polished silicon wafer 5 by hold-down nut.
Bench drill 1 is provided with bench drill motor shield 2.
Lower polished silicon wafer 7 and upper polished silicon wafer 5 form by varigrained stainless steel emery wheel.
Upper polished silicon wafer 5 is enclosed with dust cover.
Specimen holder 4 has several being staggered and the circular print fixing hole of the fixed dimension designed by the size of silicon chip.
During use, first select suitable specimen holder 4 according to silicon chip diameter, be fixed on drill bit by drill bit connecting rod, driven by drill bit and rotate, polished silicon chip is put in the circular print fixing hole in specimen holder 4, polished silicon wafer 5 position in adjustment, starts bench drill 1, rotation and lifting handle 3, in pressure, polished silicon wafer 5 carries out polishing; Meanwhile, water is introduced into abrasive disc frame from outlet pipe I 9 by water pump 10 by water, and the powder produced when the collection stock tank 8 be fixed on bench drill 1 pallet can collect silicon wafer polishing and water dirt, the water after precipitation imports water tank 14 by outlet pipe II 13.After end, close bench drill 1, take out silicon chip.
Claims (6)
1. a semi-automatic silicon wafer polishing machine, is characterized in that: this polishing machine comprises bench drill (1), collection stock tank (8), specimen holder (4) and water tank (14); One end of described bench drill (1) is provided with motor, and its other end is provided with drill bit, and its drilling machine is provided with pallet, and its pedestal is provided with described water tank (14); Described drill bit is provided with lifting handle (3), and its end is connected with described specimen holder (4) by drill bit connecting rod; Described pallet is provided with described collection stock tank (8), and the upper end of this collection stock tank (8) is provided with the lower polished silicon wafer (7) be connected with described drilling machine connecting rod; The top of described specimen holder (4) is provided with polished silicon wafer (5), and on this, the bilateral symmetry of polished silicon wafer (5) is provided with the adjusting nut (16) of one group of band holddown spring (15); Described holddown spring (15) inner sleeve has standing screw (6), and is connected with described lower polished silicon wafer (7) by this standing screw (6); Described specimen holder (4) and described lower polished silicon wafer (7) are linked together by abrasive disc frame; The side, bottom of described water tank (14) is provided with water inlet pipe (11), is provided with water pump (10) in it, and this water pump (10) is connected with described abrasive disc frame by outlet pipe I (9); The bottom of described collection stock tank (8) is provided with delivery port (12), and this delivery port (12) communicates with described water tank (14) through outlet pipe II (13).
2. a kind of semi-automatic silicon wafer polishing machine as claimed in claim 1, is characterized in that: the center of described specimen holder (4) is connected with described upper polished silicon wafer (5) by hold-down nut.
3. a kind of semi-automatic silicon wafer polishing machine as claimed in claim 1, is characterized in that: described bench drill (1) is provided with bench drill motor shield (2).
4. a kind of semi-automatic silicon wafer polishing machine as claimed in claim 1, is characterized in that: described lower polished silicon wafer (7) and described upper polished silicon wafer (5) form by varigrained stainless steel emery wheel.
5. a kind of semi-automatic silicon wafer polishing machine as claimed in claim 1, is characterized in that: described upper polished silicon wafer (5) is enclosed with dust cover.
6. a kind of semi-automatic silicon wafer polishing machine as claimed in claim 1, is characterized in that: described specimen holder (4) has several being staggered and the circular print fixing hole of the fixed dimension designed by the size of silicon chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420746673.7U CN204262924U (en) | 2014-12-03 | 2014-12-03 | A kind of semi-automatic silicon wafer polishing machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420746673.7U CN204262924U (en) | 2014-12-03 | 2014-12-03 | A kind of semi-automatic silicon wafer polishing machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204262924U true CN204262924U (en) | 2015-04-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420746673.7U Active CN204262924U (en) | 2014-12-03 | 2014-12-03 | A kind of semi-automatic silicon wafer polishing machine |
Country Status (1)
| Country | Link |
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| CN (1) | CN204262924U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106695524A (en) * | 2017-03-07 | 2017-05-24 | 湖州瀚海科技咨询有限公司 | Grinding and polishing equipment for resin artware |
| CN107717693A (en) * | 2017-05-31 | 2018-02-23 | 安徽省华启汽车零部件有限公司 | A kind of automatic rust-removing equipment |
| CN109202684A (en) * | 2018-09-10 | 2019-01-15 | 西安成立航空制造有限公司 | A kind of high-precision plane machining detection method for jet parts |
-
2014
- 2014-12-03 CN CN201420746673.7U patent/CN204262924U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106695524A (en) * | 2017-03-07 | 2017-05-24 | 湖州瀚海科技咨询有限公司 | Grinding and polishing equipment for resin artware |
| CN107717693A (en) * | 2017-05-31 | 2018-02-23 | 安徽省华启汽车零部件有限公司 | A kind of automatic rust-removing equipment |
| CN109202684A (en) * | 2018-09-10 | 2019-01-15 | 西安成立航空制造有限公司 | A kind of high-precision plane machining detection method for jet parts |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 810007 No.1, Jinsi Road, Chengdong economic and Technological Development Zone, Xining City, Qinghai Province Patentee after: Asia silicon (Qinghai) Co.,Ltd. Address before: 810007 Qinghai city of Xining Province Economic and Technological Development Zone No. 1 gold Guilu Patentee before: ASIA SILICON (QINGHAI) Co.,Ltd. |