CN107195526A - A kind of method rubbed between the part for reducing board - Google Patents
A kind of method rubbed between the part for reducing board Download PDFInfo
- Publication number
- CN107195526A CN107195526A CN201710428635.5A CN201710428635A CN107195526A CN 107195526 A CN107195526 A CN 107195526A CN 201710428635 A CN201710428635 A CN 201710428635A CN 107195526 A CN107195526 A CN 107195526A
- Authority
- CN
- China
- Prior art keywords
- gas
- hole
- ring
- cavity
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3244—Gas supply means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32458—Vessel
- H01J37/32513—Sealing means, e.g. sealing between different parts of the vessel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/334—Etching
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Drying Of Semiconductors (AREA)
Abstract
The present invention relates to a kind of field of semiconductor devices, more particularly to a kind of method for reducing the friction between semiconductor equipment.A kind of method rubbed between part for reducing board, applied to the board including gas ejector and double gas bands, the gas ejector has sets an O-ring on hollow circular hole, the inwall of described hole；Described pair of gas band has the circular cavity of protrusion, and the diameter of the cavity is not more than the diameter of the O-ring, so that the cavity is inserted into described hole through the O-ring.The present invention carries out phase mutual friction, so as to improve service life when being inserted into the cavity for avoiding double gas bands in hole by setting an O-ring on the inwall of the hole of gas ejector with hole.
Description
Technical field
The present invention relates to a kind of field of semiconductor devices, more particularly to a kind of side for reducing the friction between semiconductor equipment
Method.
Background technology
In semiconductor dry etching equipment, Kiyo process cavities make gas evenly into chamber using gas distributing system
Body.Wherein board side is mainly included with lower component：1) shutoff valve；2) segment gas pipeline；3) double gas bands；4) gas ejector.
Facilities Engineer can involve following action in daily maintenance process of beginning to speak：The circular cavity of double gas bands is inserted in segment gas
After body pipeline, the hollow hole of alignment insertion gas ejector, then with screw locking, to fasten double gas bands and gas injection
Device.In this alignment procedures, if due to lacking experience, repeatedly double gas bands are not aligned for insertion into gas ejector
Empty hole, then can cause the junction of double gas bands and gas ejector to produce multiple friction, and leave brown impression, Ke Nengzao
Into product center defect, more serious possibility damages part.
The content of the invention
For above mentioned problem present in current gas ejector alignment procedures, the present invention provides a kind of portion for reducing board
The method rubbed between part.
The technical proposal for solving the technical problem of the invention is：
A kind of method rubbed between the part for reducing board, applied to the board including gas ejector and double gas bands,
The gas ejector has sets an O-ring on hollow circular hole, the inwall of described hole；
Described pair of gas band has the circular cavity of protrusion, and the diameter of the cavity is not more than the diameter of the O-ring, with
The cavity is set to be inserted into through the O-ring in described hole.
It is preferred that, the gas ejector is made up of quartz.
It is preferred that, described pair of gas band is made up of Teflon.
It is preferred that, the o-ring is made of perfluor material.
It is preferred that, the O-ring is located at the opening of described hole.
It is preferred that, the gas ejector has two holes being provided separately.
It is preferred that, described pair of gas band has two cavitys being provided separately, and the position and the position one of hole of cavity
One correspondence.
Beneficial effects of the present invention：The present invention on the inwall of the hole of gas ejector by setting an O-ring, to keep away
Phase mutual friction is carried out with hole when the cavity for exempting from double gas bands is inserted into hole, so as to improve service life.
Brief description of the drawings
Fig. 1 is the structural representation of embodiments of the invention；
Fig. 2 is the structural representation of the hole as viewed from Fig. 1 AB ends.
Embodiment
The invention will be further described with specific embodiment below in conjunction with the accompanying drawings, but not as limiting to the invention.
The invention provides a kind of method rubbed between part for reducing board, applied to including as shown in Figure 1-2
The board of gas ejector 2 and double gas bands 1,
Gas ejector 2 has sets an O-ring 22 on hollow circular hole 21, the inwall of hole 21；
Double gas bands 1 have the circular cavity 11 of protrusion, and the diameter of cavity 11 is not more than the diameter of O-ring 22, so that chamber
Body 11 is inserted into hole 21 through O-ring 22.
Board in embodiments of the invention can be Lam Kiyo boards, and the board mainly includes two parts：It is located at
The gas ejector 2 on Fig. 1 right side and double gas bands 1 in left side.Wherein, gas ejector 2 has a circular hole 21, double gas
There is a circular cavity 11 with 1.By setting an O-ring 22 in hole 21 in gas ejector 2, and cavity 11 is straight
Footpath is not more than the diameter of O-ring 22, as shown in Figure 2 so that when cavity 11 is inserted into hole 21, be not directly with hole 21
What inner surface was in contact, but intermediary is used as by the O-ring 22, so as to avoid gas ejector 2 from being aligned with double gas bands 1
When produce phase mutual friction, cause the abrasion of all parts.
The preferred embodiment of the present invention, gas ejector 2 is made up of quartz.
The preferred embodiment of the present invention, double gas bands 1 are made up of Teflon.
The preferred embodiment of the present invention, o-ring is made of perfluor material.
The preferred embodiment of the present invention, O-ring 22 is located at the opening of hole 21.
The preferred embodiment of the present invention, gas ejector 2 has two holes 21 being provided separately.
The preferred embodiment of the present invention, double gas bands 1 have two cavitys 11 being provided separately, and the position of cavity 11
Corresponded with the position of hole 21.
Preferred embodiments of the present invention are the foregoing is only, embodiments of the present invention and protection model is not thereby limited
Enclose, to those skilled in the art, should can appreciate that what all utilization description of the invention and diagramatic content were made
Scheme obtained by equivalent substitution and obvious change, should be included in protection scope of the present invention.
Claims (7)
1. a kind of method rubbed between part for reducing board, it is characterised in that applied to including gas ejector and double gas
The board of band,
The gas ejector has sets an O-ring on hollow circular hole, the inwall of described hole；
Described pair of gas band has the circular cavity of protrusion, and the diameter of the cavity is not more than the diameter of the O-ring, so that institute
Cavity is stated to be inserted into described hole through the O-ring.
2. the method rubbed between the part according to claim 1 for reducing board, it is characterised in that the gas injection
Device is made up of quartz.
3. the method that rubs between the part according to claim 1 for reducing board, it is characterised in that described pair of gas band by
Teflon is made.
4. the method rubbed between the part according to claim 1 for reducing board, it is characterised in that the o-ring is adopted
It is made of perfluor material.
5. the method rubbed between the part according to claim 1 for reducing board, it is characterised in that the O-ring position
At the opening of described hole.
6. the method rubbed between the part according to claim 1 for reducing board, it is characterised in that the gas injection
Utensil has two holes being provided separately.
7. the method rubbed between the part according to claim 6 for reducing board, it is characterised in that described pair of gas belt
There are two cavitys being provided separately, and the position of cavity and the position of hole are corresponded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710428635.5A CN107195526A (en) | 2017-06-08 | 2017-06-08 | A kind of method rubbed between the part for reducing board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710428635.5A CN107195526A (en) | 2017-06-08 | 2017-06-08 | A kind of method rubbed between the part for reducing board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107195526A true CN107195526A (en) | 2017-09-22 |
Family
ID=59876055
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710428635.5A Pending CN107195526A (en) | 2017-06-08 | 2017-06-08 | A kind of method rubbed between the part for reducing board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107195526A (en) |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101529997A (en) * | 2006-10-06 | 2009-09-09 | 朗姆研究公司 | Methods of and apparatus for accessing a process chamber using a dual zone gas injector wth improved optical access |
| US7685965B1 (en) * | 2006-01-26 | 2010-03-30 | Lam Research Corporation | Apparatus for shielding process chamber port |
| CN102127752A (en) * | 2007-01-12 | 2011-07-20 | 威科仪器有限公司 | Gas treatment systems |
| CN102154628A (en) * | 2004-08-02 | 2011-08-17 | 维高仪器股份有限公司 | Multi-gas distribution injector for chemical vapor deposition reactors |
| CN202855717U (en) * | 2009-09-10 | 2013-04-03 | 朗姆研究公司 | Replaceable upper chamber part of plasma reaction chamber |
| US20130146095A1 (en) * | 2011-12-07 | 2013-06-13 | Lam Research Corporation | System and method for cleaning gas injectors |
| CN104112639A (en) * | 2013-04-22 | 2014-10-22 | 中微半导体设备(上海)有限公司 | Plasma reaction chamber for realizing fast reaction gas switching and method thereof |
| CN104233231A (en) * | 2013-06-14 | 2014-12-24 | 东京毅力科创株式会社 | Gas processing apparatus |
| CN104541061A (en) * | 2012-07-19 | 2015-04-22 | 阿迪克森真空产品公司 | Method and device for pumping of a process chamber |
| CN104752266A (en) * | 2013-12-31 | 2015-07-01 | 中微半导体设备(上海)有限公司 | Through-silicon-via etching device |
| CN105225912A (en) * | 2014-06-27 | 2016-01-06 | 朗姆研究公司 | The ceramic spray head of center gas injector is comprised in semiconductor wafer processing apparatus |
| US20160002776A1 (en) * | 2013-02-21 | 2016-01-07 | Altatech Semiconductor | Chemical vapor deposition device |
-
2017
- 2017-06-08 CN CN201710428635.5A patent/CN107195526A/en active Pending
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102154628A (en) * | 2004-08-02 | 2011-08-17 | 维高仪器股份有限公司 | Multi-gas distribution injector for chemical vapor deposition reactors |
| US7685965B1 (en) * | 2006-01-26 | 2010-03-30 | Lam Research Corporation | Apparatus for shielding process chamber port |
| CN101529997A (en) * | 2006-10-06 | 2009-09-09 | 朗姆研究公司 | Methods of and apparatus for accessing a process chamber using a dual zone gas injector wth improved optical access |
| CN102127752A (en) * | 2007-01-12 | 2011-07-20 | 威科仪器有限公司 | Gas treatment systems |
| CN203225233U (en) * | 2009-09-10 | 2013-10-02 | 朗姆研究公司 | Ceramic side gas injector |
| CN202855717U (en) * | 2009-09-10 | 2013-04-03 | 朗姆研究公司 | Replaceable upper chamber part of plasma reaction chamber |
| US20130146095A1 (en) * | 2011-12-07 | 2013-06-13 | Lam Research Corporation | System and method for cleaning gas injectors |
| CN104541061A (en) * | 2012-07-19 | 2015-04-22 | 阿迪克森真空产品公司 | Method and device for pumping of a process chamber |
| US20160002776A1 (en) * | 2013-02-21 | 2016-01-07 | Altatech Semiconductor | Chemical vapor deposition device |
| CN104112639A (en) * | 2013-04-22 | 2014-10-22 | 中微半导体设备(上海)有限公司 | Plasma reaction chamber for realizing fast reaction gas switching and method thereof |
| CN104233231A (en) * | 2013-06-14 | 2014-12-24 | 东京毅力科创株式会社 | Gas processing apparatus |
| CN104752266A (en) * | 2013-12-31 | 2015-07-01 | 中微半导体设备(上海)有限公司 | Through-silicon-via etching device |
| CN105225912A (en) * | 2014-06-27 | 2016-01-06 | 朗姆研究公司 | The ceramic spray head of center gas injector is comprised in semiconductor wafer processing apparatus |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170922 |