SG10201900327YA - A method of cvd plasma processing with a toroidal plasma processing apparatus - Google Patents
A method of cvd plasma processing with a toroidal plasma processing apparatusInfo
- Publication number
- SG10201900327YA SG10201900327YA SG10201900327YA SG10201900327YA SG10201900327YA SG 10201900327Y A SG10201900327Y A SG 10201900327YA SG 10201900327Y A SG10201900327Y A SG 10201900327YA SG 10201900327Y A SG10201900327Y A SG 10201900327YA SG 10201900327Y A SG10201900327Y A SG 10201900327YA
- Authority
- SG
- Singapore
- Prior art keywords
- plasma processing
- toroidal plasma
- toroidal
- conduit
- cvd
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
- C23C16/505—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/26—Deposition of carbon only
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/26—Deposition of carbon only
- C23C16/27—Diamond only
- C23C16/272—Diamond only using DC, AC or RF discharges
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
- C23C16/505—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges
- C23C16/507—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges using external electrodes, e.g. in tunnel type reactors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32357—Generation remote from the workpiece, e.g. down-stream
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32458—Vessel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3266—Magnetic control means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3266—Magnetic control means
- H01J37/32669—Particular magnets or magnet arrangements for controlling the discharge
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
- H05H1/4645—Radiofrequency discharges
- H05H1/4652—Radiofrequency discharges using inductive coupling means, e.g. coils
Abstract
A Method of CVD Plasma Processing with a Toroidal Plasma Processing Apparatus A method of CVD plasma processing for depositing at least one of diamond, diamond-like-carbon, or graphene comprising includes forming a vacuum chamber comprising a first toroidal plasma source comprising a conduit and a magnetic core, a second toroidal plasma source comprising a conduit and a magnetic core, and a process chamber that is common to both the first and second toroidal plasma source. Gas is introduced into the vacuum chamber. A first RF electromagnetic field is applied to the magnetic core surrounding the conduit of the first toroidal plasma source to form a first toroidal plasma loop discharge in the vacuum chamber. A second RF electromagnetic field is applied to the magnetic core surrounding the conduit of the second toroidal plasma source to form a second toroidal plasma loop discharge in the vacuum chamber. A workpiece is positioned in the process chamber for plasma processing at a distance from a hot plasma core to a surface of the workpiece that is in a range from .1 cm to 5 cm. A gas comprising hydrogen is introduced to the workpiece so that at least one of the first and second toroidal plasma loop discharges generates atomic hydrogen. (Fig. 2)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201361791274P | 2013-03-15 | 2013-03-15 | |
US201361910387P | 2013-12-01 | 2013-12-01 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201900327YA true SG10201900327YA (en) | 2019-02-27 |
Family
ID=51528210
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201506564RA SG11201506564RA (en) | 2013-03-15 | 2014-03-14 | Toroidal plasma processing apparatus |
SG10201708625XA SG10201708625XA (en) | 2013-03-15 | 2014-03-14 | Toroidal plasma processing apparatus |
SG10201900327YA SG10201900327YA (en) | 2013-03-15 | 2014-03-14 | A method of cvd plasma processing with a toroidal plasma processing apparatus |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201506564RA SG11201506564RA (en) | 2013-03-15 | 2014-03-14 | Toroidal plasma processing apparatus |
SG10201708625XA SG10201708625XA (en) | 2013-03-15 | 2014-03-14 | Toroidal plasma processing apparatus |
Country Status (8)
Country | Link |
---|---|
US (3) | US20140272108A1 (en) |
EP (1) | EP2974558A4 (en) |
JP (2) | JP6417390B2 (en) |
KR (1) | KR102003106B1 (en) |
CN (1) | CN105144849B (en) |
MY (1) | MY187052A (en) |
SG (3) | SG11201506564RA (en) |
WO (1) | WO2014143775A1 (en) |
Families Citing this family (19)
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US10041168B2 (en) * | 2013-01-14 | 2018-08-07 | California Institute Of Technology | Graphene structure |
US20140272108A1 (en) * | 2013-03-15 | 2014-09-18 | Plasmability, Llc | Toroidal Plasma Processing Apparatus |
US10486232B2 (en) | 2015-04-21 | 2019-11-26 | Varian Semiconductor Equipment Associates, Inc. | Semiconductor manufacturing device with embedded fluid conduits |
US20180130639A1 (en) * | 2015-05-04 | 2018-05-10 | Michael Nicholas Vranich | External plasma system |
KR20180000721A (en) * | 2015-05-21 | 2018-01-03 | 플라즈마빌리티, 엘엘씨 | A toroidal plasma processing apparatus having a shaped workpiece support |
US10249495B2 (en) * | 2016-06-28 | 2019-04-02 | Applied Materials, Inc. | Diamond like carbon layer formed by an electron beam plasma process |
DE102018204585A1 (en) * | 2017-03-31 | 2018-10-04 | centrotherm international AG | Plasma generator, plasma treatment apparatus and method for pulsed supply of electrical power |
US20190006154A1 (en) * | 2017-06-28 | 2019-01-03 | Chaolin Hu | Toroidal Plasma Chamber |
CN108303216B (en) * | 2018-01-02 | 2020-03-06 | 京东方科技集团股份有限公司 | Gas detection device |
US11037765B2 (en) * | 2018-07-03 | 2021-06-15 | Tokyo Electron Limited | Resonant structure for electron cyclotron resonant (ECR) plasma ionization |
US11019715B2 (en) * | 2018-07-13 | 2021-05-25 | Mks Instruments, Inc. | Plasma source having a dielectric plasma chamber with improved plasma resistance |
JP2022508353A (en) | 2018-08-23 | 2022-01-19 | トランスフォーム マテリアルズ エルエルシー | Systems and methods for treating gases |
US11633710B2 (en) | 2018-08-23 | 2023-04-25 | Transform Materials Llc | Systems and methods for processing gases |
CN110872116A (en) * | 2018-09-04 | 2020-03-10 | 新奥科技发展有限公司 | Preparation device and preparation method of graphene |
CN110357085B (en) * | 2019-08-15 | 2020-04-24 | 常州机电职业技术学院 | Graphene surface plasma modification treatment device and treatment method |
WO2021026888A1 (en) * | 2019-08-15 | 2021-02-18 | 常州机电职业技术学院 | Graphene surface plasma modification treatment device and treatment method |
WO2021115596A1 (en) | 2019-12-11 | 2021-06-17 | Jozef Stefan Institute | Method and apparatus for deposition of carbon nanostructures |
KR20220107521A (en) * | 2021-01-25 | 2022-08-02 | (주) 엔피홀딩스 | Reactor, process processing apparatus including the same and method for manufacturing reactor |
CN115274395B (en) * | 2022-09-27 | 2022-12-09 | 北京芯美达科技有限公司 | Method for enlarging effective reaction area of plasma |
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-
2014
- 2014-03-14 US US14/212,073 patent/US20140272108A1/en not_active Abandoned
- 2014-03-14 WO PCT/US2014/027881 patent/WO2014143775A1/en active Application Filing
- 2014-03-14 SG SG11201506564RA patent/SG11201506564RA/en unknown
- 2014-03-14 EP EP14763433.1A patent/EP2974558A4/en not_active Withdrawn
- 2014-03-14 KR KR1020157025382A patent/KR102003106B1/en active IP Right Grant
- 2014-03-14 MY MYPI2015702754A patent/MY187052A/en unknown
- 2014-03-14 CN CN201480014623.2A patent/CN105144849B/en active Active
- 2014-03-14 SG SG10201708625XA patent/SG10201708625XA/en unknown
- 2014-03-14 JP JP2016502655A patent/JP6417390B2/en active Active
- 2014-03-14 SG SG10201900327YA patent/SG10201900327YA/en unknown
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2017
- 2017-04-18 US US15/489,979 patent/US9909215B2/en active Active
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2018
- 2018-01-22 US US15/876,706 patent/US20180155839A1/en not_active Abandoned
- 2018-10-05 JP JP2018190079A patent/JP2019046805A/en active Pending
Also Published As
Publication number | Publication date |
---|---|
US20180155839A1 (en) | 2018-06-07 |
CN105144849B (en) | 2019-06-18 |
KR102003106B1 (en) | 2019-07-23 |
US20140272108A1 (en) | 2014-09-18 |
JP2019046805A (en) | 2019-03-22 |
US20170298513A1 (en) | 2017-10-19 |
US9909215B2 (en) | 2018-03-06 |
JP6417390B2 (en) | 2018-11-07 |
SG10201708625XA (en) | 2017-11-29 |
EP2974558A1 (en) | 2016-01-20 |
KR20150131051A (en) | 2015-11-24 |
SG11201506564RA (en) | 2015-09-29 |
WO2014143775A1 (en) | 2014-09-18 |
EP2974558A4 (en) | 2016-08-10 |
JP2016520950A (en) | 2016-07-14 |
CN105144849A (en) | 2015-12-09 |
MY187052A (en) | 2021-08-27 |
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