CN107186385A - A kind of silverless Cu-base soldering material - Google Patents
A kind of silverless Cu-base soldering material Download PDFInfo
- Publication number
- CN107186385A CN107186385A CN201710643395.0A CN201710643395A CN107186385A CN 107186385 A CN107186385 A CN 107186385A CN 201710643395 A CN201710643395 A CN 201710643395A CN 107186385 A CN107186385 A CN 107186385A
- Authority
- CN
- China
- Prior art keywords
- solder
- silverless
- soldering material
- base soldering
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/302—Cu as the principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a kind of silverless Cu-base soldering material, the solder is made up of the component of following mass percent：Fe5% 10%, Ni 15% 25%, Sn10% 15%, Ti 1% 3%, Cu surpluses；This kind of silverless Cu-base soldering material, composition is simple, without any toxicity and side effects, safety and environmental protection, wetability is high, and appropriate Ti elements are with the addition of in solder, reduce the splashing in welding process and improve the intensity of weld seam, element ti, Ni add the resistance to corrosion of solder simultaneously, the fusing point of solder are reduced by adding Sn, while Sn, Ni add the tensile strength of solder.
Description
【Technical field】
The present invention relates to a kind of solder, more particularly to a kind of silverless Cu-base soldering material.
【Background technology】
Silver is a kind of important noble metal, and silver is also one of component of human body, and silver-colored physicochemical property is all relatively stable,
Heat conduction, electric conductivity are all fine, and matter is soft rich in ductility, existing to have silver-colored copper base solder, existing argentiferous copper-based material
That is used in reality is also very extensive, but silver ion is poisonous, because silver ion has very strong oxidisability, if silver ion
Enter that in human body the symptoms such as internal organs oedema can be caused, seriously also result in people's death, because human body is without effectively row's silver
Mechanism, argentiferous copper-based material is difficult the contact for avoiding people Yu Yin during production or use, if imprudence allows silver to enter
In vivo, then consequence is hardly imaginable, so needing nontoxic to improve this problem without silver solder.
【The content of the invention】
It is a primary object of the present invention to provide a kind of silverless Cu-base soldering material, asking in background technology can be effectively solved
Topic.
To achieve the above object, the technical scheme taken of the present invention is：A kind of silverless Cu-base soldering material, the solder is by following
The component composition of mass percent：
Preferably, the solder constituting by following mass percent：
Compared with prior art, the present invention has the advantages that：This kind of silverless Cu-base soldering material, composition is simple, nontoxic
Have no side effect, safety and environmental protection, wetability is high, appropriate Ti elements with the addition of in solder, reduce splashing in welding process and
The intensity of weld seam is improved, while element ti, Ni add the resistance to corrosion of solder, the molten of solder is reduced by adding Sn
Point, while Sn, Ni add the tensile strength of solder.
【Embodiment】
To be easy to understand the technical means, the inventive features, the objects and the advantages of the present invention, with reference to
Embodiment, is expanded on further the present invention.
A kind of silverless Cu-base soldering material, the solder is made up of the component of following mass percent：
Preferably, the solder constituting by following mass percent：
Advantages of the present invention：Silverless Cu-base soldering material, composition is simple, without any toxicity and side effects, safety and environmental protection, and wetability is high, draws
Stretch intensity big, fusing point is low.
The general principle and principal character and advantages of the present invention of the present invention has been shown and described above.The technology of the industry
Personnel are it should be appreciated that the present invention is not limited to the above embodiments, and the simply explanation described in above-described embodiment and specification is originally
The principle of invention, without departing from the spirit and scope of the present invention, various changes and modifications of the present invention are possible, these changes
Change and improvement all fall within the protetion scope of the claimed invention.The claimed scope of the invention by appended claims and its
Equivalent thereof.
Claims (2)
1. a kind of silverless Cu-base soldering material, it is characterised in that the solder is made up of the component of following mass percent：
2. a kind of silverless Cu-base soldering material according to claim 1, it is characterised in that the solder is by following mass percent
Composition：
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710643395.0A CN107186385A (en) | 2017-07-31 | 2017-07-31 | A kind of silverless Cu-base soldering material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710643395.0A CN107186385A (en) | 2017-07-31 | 2017-07-31 | A kind of silverless Cu-base soldering material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107186385A true CN107186385A (en) | 2017-09-22 |
Family
ID=59884334
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710643395.0A Pending CN107186385A (en) | 2017-07-31 | 2017-07-31 | A kind of silverless Cu-base soldering material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107186385A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0411882A1 (en) * | 1989-07-31 | 1991-02-06 | Toyota Jidosha Kabushiki Kaisha | Dispersion strengthened copper-base alloy for overlay |
| CN101717878A (en) * | 2009-12-10 | 2010-06-02 | 北京有色金属研究总院 | Seawater scouring corrosion resistant nickel-copper alloy and tubular product and preparation method thereof |
| CN102794578A (en) * | 2012-08-10 | 2012-11-28 | 大连理工大学 | Brazing filler metal for brazing titanium alloy and steel or titanium aluminum alloy as well as steel |
| CN102994801A (en) * | 2012-11-26 | 2013-03-27 | 中国铝业股份有限公司 | Alloy material applicable to inert anode of metal molten salt electrolytic cell |
| CN104646852A (en) * | 2014-12-31 | 2015-05-27 | 苏州铜宝锐新材料有限公司 | Braze coating paste and application thereof |
| CN105195845A (en) * | 2015-09-18 | 2015-12-30 | 河南理工大学 | Manufacturing method of copper-based brazing filler metal laser brazing cubic boron nitride grinding particles |
-
2017
- 2017-07-31 CN CN201710643395.0A patent/CN107186385A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0411882A1 (en) * | 1989-07-31 | 1991-02-06 | Toyota Jidosha Kabushiki Kaisha | Dispersion strengthened copper-base alloy for overlay |
| CN101717878A (en) * | 2009-12-10 | 2010-06-02 | 北京有色金属研究总院 | Seawater scouring corrosion resistant nickel-copper alloy and tubular product and preparation method thereof |
| CN102794578A (en) * | 2012-08-10 | 2012-11-28 | 大连理工大学 | Brazing filler metal for brazing titanium alloy and steel or titanium aluminum alloy as well as steel |
| CN102994801A (en) * | 2012-11-26 | 2013-03-27 | 中国铝业股份有限公司 | Alloy material applicable to inert anode of metal molten salt electrolytic cell |
| CN104646852A (en) * | 2014-12-31 | 2015-05-27 | 苏州铜宝锐新材料有限公司 | Braze coating paste and application thereof |
| CN105195845A (en) * | 2015-09-18 | 2015-12-30 | 河南理工大学 | Manufacturing method of copper-based brazing filler metal laser brazing cubic boron nitride grinding particles |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170922 |