CN108203776A - A kind of high-strength tin spelter soldering alloy and preparation method thereof - Google Patents

A kind of high-strength tin spelter soldering alloy and preparation method thereof Download PDF

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Publication number
CN108203776A
CN108203776A CN201711398407.4A CN201711398407A CN108203776A CN 108203776 A CN108203776 A CN 108203776A CN 201711398407 A CN201711398407 A CN 201711398407A CN 108203776 A CN108203776 A CN 108203776A
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CN
China
Prior art keywords
soldering alloy
spelter
strength
strength tin
tin spelter
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Pending
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CN201711398407.4A
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Chinese (zh)
Inventor
梁宁
莫原
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Liuzhou Zhi Zhen Intelligent Machinery Co Ltd
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Liuzhou Zhi Zhen Intelligent Machinery Co Ltd
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Priority to CN201711398407.4A priority Critical patent/CN108203776A/en
Publication of CN108203776A publication Critical patent/CN108203776A/en
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    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C13/00Alloys based on tin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/26Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262Sn as the principal constituent
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C1/00Making non-ferrous alloys
    • C22C1/02Making non-ferrous alloys by melting

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

The present invention provides a kind of high-strength tin spelter soldering alloys and preparation method thereof, include the following steps:According to weight percent, Zn, Cu, Co, In, Ni, Ce, Sm, P, Sn are added in into smelting furnace, are warming up to 290 DEG C, keeps the temperature 40 minutes, stirring is continuously heating to 510 DEG C, keeps the temperature 40 minutes, and stirring is cooled to room temperature, obtains high-strength tin spelter soldering alloy.Compared with prior art, using Zn, Cu, Co, In, Ni, Ce, Sm, P, Sn as raw material, each ingredient interaction influences each other the present invention, improves the shear strength of the Welding Sn-Zn material alloy of preparation, and with good wettability.

Description

A kind of high-strength tin spelter soldering alloy and preparation method thereof
Technical field
The present invention relates to solder alloy technical field more particularly to a kind of high-strength tin spelter soldering alloy and its preparation sides Method.
Background technology
In recent years, the industries such as household electrical appliances and refrigeration rapidly develop, and in order to reduce production cost, are ensureing product electrical resistance While energy, part copper material is replaced by aluminium, and since the conductivity of aluminium and copper approaches, the cheap of aluminium, density are small The advantages that, mitigate the product quality of its related field, cost reduction.Traditional tin-lead solder is since the lead in solder is to environment It is very big with the harmfulness of health, disabled by countries in the world.
In the prior art, solder and preparation method thereof has obtained extensive report, for example, application No. is 201110323871.3 Chinese patent literature report a kind of high spreadability tin-antimony-rare earth lead-free solder alloy and its preparation side Method.The raw material weight percentage of the alloy is:Sb7.0-9.0wt%, In0.01-0.03wt%, Bi1-3wt%, Cd0.01- 0.03wt%, Sm0.01-0.03wt%, Nd0.01-0.03wt%, surplus Sn.Raw material is put into vacuum sense according to the above ratio Melting in stove is answered, obtains master alloy, is then placed in remelting tubular type crucible and carries out remelting, remelting tubular type crucible is placed in quick quenching furnace On runner wheel rim, it is ejected in turning for rotation after alloy molten from the hole of a diameter of 1mm of crucible bottom under ar gas acting Wheel forms alloy strip on edge, then suitably crushes alloy strip, then places into ball mill and screening is taken out after grinding.Application Number a kind of low melting point lead-free solder alloy is reported for 201210494897.9 Chinese patent literature, belong to welding material technology Field.In order to solve the problem of that the high shear strength of existing solder alloy fusing point is low, a kind of low-melting point leadless solder is provided and is closed Gold, the solder include the weight percent of following component:Bi:10%-30%;Ag:2.2%-3.0%;In:0.5%-1.0%; P:0.004%-0.008%;Remaining is tin.The Co of RE and 0.0002%-0.0005% containing 0.002%-0.005%.
But the intensity of the solder alloy of above-mentioned report is up for further improving.
Invention content
Present invention solves the technical problem that be to provide a kind of high-strength tin spelter soldering alloy and preparation method thereof, intensity compared with Height, wetability are good.
In view of this, it the present invention provides a kind of high-strength tin spelter soldering alloy, calculates in percentage by weight, using such as It is prepared by lower raw material:Zn 13-18%, Cu 0.1-0.8%, Co 0.3-0.9%, In 0.6-1.5%, Ni 1.2-1.6%, Ce 0.01-0.08%, Sm 0.01-0.06%, P 0.1-0.3%, surplus Sn.
Preferably, Zn 13-16%.
Preferably, Cu 0.3-0.8%.
Preferably, Co 0.3-0.6%.
Preferably, In 0.9-1.5%.
Preferably, Ni 1.2-1.5%.
Preferably, Ce 0.03-0.08%.
Preferably, Sm 0.01-0.05%.
Preferably, P 0.1-0.2%.
Correspondingly, the present invention also provides a kind of preparation method of high-strength tin spelter soldering alloy, include the following steps:According to Weight percent adds in Zn, Cu, Co, In, Ni, Ce, Sm, P, Sn into smelting furnace, is warming up to 290 DEG C, keeps the temperature 40 minutes, Stirring is continuously heating to 510 DEG C, keeps the temperature 40 minutes, and stirring is cooled to room temperature, obtains high-strength tin spelter soldering alloy.
The present invention provides a kind of high-strength tin spelter soldering alloy and preparation method thereof, includes the following steps:According to weight hundred Divide ratio, Zn, Cu, Co, In, Ni, Ce, Sm, P, Sn are added in into smelting furnace, be warming up to 290 DEG C, keep the temperature 40 minutes, stirring, after It is continuous to be warming up to 510 DEG C, 40 minutes are kept the temperature, stirring is cooled to room temperature, obtains high-strength tin spelter soldering alloy.With prior art phase Than using Zn, Cu, Co, In, Ni, Ce, Sm, P, Sn as raw material, each ingredient interaction influences each other the present invention, improves system The shear strength of standby Welding Sn-Zn material alloy, and with good wettability.
Specific embodiment
For a further understanding of the present invention, the preferred embodiment of the invention is described with reference to embodiment, still It should be appreciated that these descriptions are only for the feature and advantage that further illustrate the present invention rather than to the claims in the present invention Limitation.
The embodiment of the invention discloses a kind of high-strength tin spelter soldering alloys, calculate in percentage by weight, using as follows It is prepared by raw material:Zn 13-18%, Cu 0.1-0.8%, Co 0.3-0.9%, In 0.6-1.5%, Ni 1.2-1.6%, Ce 0.01-0.08%, Sm 0.01-0.06%, P 0.1-0.3%, surplus Sn.
Preferably, Zn 13-16%, Cu 0.3-0.8%, Co 0.3-0.6%, In 0.9-1.5%, Ni 1.2-1.5%, Ce 0.03-0.08%, Sm 0.01-0.05%, P 0.1-0.2%.
Correspondingly, the present invention also provides a kind of preparation method of high-strength tin spelter soldering alloy, include the following steps:According to Weight percent adds in Zn, Cu, Co, In, Ni, Ce, Sm, P, Sn into smelting furnace, is warming up to 290 DEG C, keeps the temperature 40 minutes, Stirring is continuously heating to 510 DEG C, keeps the temperature 40 minutes, and stirring is cooled to room temperature, obtains high-strength tin spelter soldering alloy.
The present invention provides a kind of high-strength tin spelter soldering alloy and preparation method thereof, includes the following steps:According to weight hundred Divide ratio, Zn, Cu, Co, In, Ni, Ce, Sm, P, Sn are added in into smelting furnace, be warming up to 290 DEG C, keep the temperature 40 minutes, stirring, after It is continuous to be warming up to 510 DEG C, 40 minutes are kept the temperature, stirring is cooled to room temperature, obtains high-strength tin spelter soldering alloy.With prior art phase Than using Zn, Cu, Co, In, Ni, Ce, Sm, P, Sn as raw material, each ingredient interaction influences each other the present invention, improves system The shear strength of standby Welding Sn-Zn material alloy, and with good wettability.
For a further understanding of the present invention, technical solution provided by the invention is carried out specifically with reference to embodiment Bright, protection scope of the present invention is not limited by the following examples.
Raw material used in the embodiment of the present invention is purchased in market.
Embodiment 1
A kind of high-strength tin spelter soldering alloy, is calculated, is prepared using the following raw material in percentage by weight:
Zn 13%, Cu 0.8%, Co 0.3%, In 1.5%, Ni 1.2%, Ce 0.08%, Sm0.01%, P 0.3%, surplus Sn.
Preparation process:
According to weight percent, Zn, Cu, Co, In, Ni, Ce, Sm, P, Sn are added in into smelting furnace, are warming up to 290 DEG C, Heat preservation 40 minutes, stirring are continuously heating to 510 DEG C, keep the temperature 40 minutes, and stirring is cooled to room temperature, obtains high-strength tin spelter solder Alloy.
The performance of high-strength tin spelter soldering alloy manufactured in the present embodiment is detected, solidus temperature is 221 DEG C, liquid Liquidus temperature is 235 DEG C, shear strength 36N/mm2, elongation percentage 71%.
Embodiment 2
A kind of high-strength tin spelter soldering alloy, is calculated, is prepared using the following raw material in percentage by weight:
Zn 18%, Cu 0.1%, Co 0.9%, In 0.6%, Ni 1.6%, Ce 0.01%, Sm0.06%, P 0.1%, surplus Sn.
Preparation process:
According to weight percent, Zn, Cu, Co, In, Ni, Ce, Sm, P, Sn are added in into smelting furnace, are warming up to 290 DEG C, Heat preservation 40 minutes, stirring are continuously heating to 510 DEG C, keep the temperature 40 minutes, and stirring is cooled to room temperature, obtains high-strength tin spelter solder Alloy.
The performance of high-strength tin spelter soldering alloy manufactured in the present embodiment is detected, solidus temperature is 220 DEG C, liquid Liquidus temperature is 231 DEG C, shear strength 35N/mm2, elongation percentage 72%.
Embodiment 3
A kind of high-strength tin spelter soldering alloy, is calculated, is prepared using the following raw material in percentage by weight:
Zn 14%, Cu 0.5%, Co 0.4%, In 0.8%, Ni 1.3%, Ce 0.04%, Sm0.03%, P 0.2%, surplus Sn.
Preparation process:
According to weight percent, Zn, Cu, Co, In, Ni, Ce, Sm, P, Sn are added in into smelting furnace, are warming up to 290 DEG C, Heat preservation 40 minutes, stirring are continuously heating to 510 DEG C, keep the temperature 40 minutes, and stirring is cooled to room temperature, obtains high-strength tin spelter solder Alloy.
The performance of high-strength tin spelter soldering alloy manufactured in the present embodiment is detected, solidus temperature is 223 DEG C, liquid Liquidus temperature is 232 DEG C, shear strength 35N/mm2, elongation percentage 70%.
Embodiment 4
A kind of high-strength tin spelter soldering alloy, is calculated, is prepared using the following raw material in percentage by weight:
Zn 17%, Cu 0.2%, Co 0.8%, In 0.6%, Ni 1.6%, Ce 0.02%, Sm0.05%, P 0.2%, surplus Sn.
Preparation process:
According to weight percent, Zn, Cu, Co, In, Ni, Ce, Sm, P, Sn are added in into smelting furnace, are warming up to 290 DEG C, Heat preservation 40 minutes, stirring are continuously heating to 510 DEG C, keep the temperature 40 minutes, and stirring is cooled to room temperature, obtains high-strength tin spelter solder Alloy.
The performance of high-strength tin spelter soldering alloy manufactured in the present embodiment is detected, solidus temperature is 223 DEG C, liquid Liquidus temperature is 234 DEG C, shear strength 34N/mm2, elongation percentage 73%.
Embodiment 5
A kind of high-strength tin spelter soldering alloy, is calculated, is prepared using the following raw material in percentage by weight:
Zn 17%, Cu 0.6%, Co 0.8%, In 0.8%, Ni 1.5%, Ce 0.07%, Sm0.05%, P 0.3%, surplus Sn.
Preparation process:
According to weight percent, Zn, Cu, Co, In, Ni, Ce, Sm, P, Sn are added in into smelting furnace, are warming up to 290 DEG C, Heat preservation 40 minutes, stirring are continuously heating to 510 DEG C, keep the temperature 40 minutes, and stirring is cooled to room temperature, obtains high-strength tin spelter solder Alloy.
The performance of high-strength tin spelter soldering alloy manufactured in the present embodiment is detected, solidus temperature is 223 DEG C, liquid Liquidus temperature is 234 DEG C, shear strength 37N/mm2, elongation percentage 70%.
The explanation of above example is only intended to facilitate the understanding of the method and its core concept of the invention.It should be pointed out that pair For those skilled in the art, without departing from the principle of the present invention, the present invention can also be carried out Some improvements and modifications, these improvement and modification are also fallen within the protection scope of the claims of the present invention.
The foregoing description of the disclosed embodiments enables professional and technical personnel in the field to realize or use the present invention. A variety of modifications of these embodiments will be apparent for those skilled in the art, it is as defined herein General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, it is of the invention The embodiments shown herein is not intended to be limited to, and is to fit to and the principles and novel features disclosed herein phase one The most wide range caused.

Claims (10)

1. a kind of high-strength tin spelter soldering alloy, which is characterized in that calculate, prepared using the following raw material in percentage by weight:
Zn 13-18%, Cu 0.1-0.8%, Co 0.3-0.9%, In 0.6-1.5%, Ni 1.2-1.6%, Ce 0.01- 0.08%th, Sm 0.01-0.06%, P 0.1-0.3%, surplus Sn.
2. high-strength tin spelter soldering alloy according to claim 1, which is characterized in that Zn 13-16%.
3. high-strength tin spelter soldering alloy according to claim 1, which is characterized in that Cu 0.3-0.8%.
4. high-strength tin spelter soldering alloy according to claim 1, which is characterized in that Co 0.3-0.6%.
5. high-strength tin spelter soldering alloy according to claim 1, which is characterized in that In 0.9-1.5%.
6. high-strength tin spelter soldering alloy according to claim 1, which is characterized in that Ni 1.2-1.5%.
7. high-strength tin spelter soldering alloy according to claim 1, which is characterized in that Ce 0.03-0.08%.
8. high-strength tin spelter soldering alloy according to claim 1, which is characterized in that Sm 0.01-0.05%.
9. high-strength tin spelter soldering alloy according to claim 1, which is characterized in that P 0.1-0.2%.
10. a kind of preparation method of high-strength tin spelter soldering alloy described in any one of claim 1-9, which is characterized in that Include the following steps:
According to weight percent, Zn, Cu, Co, In, Ni, Ce, Sm, P, Sn are added in into smelting furnace, are warming up to 290 DEG C, heat preservation 40 minutes, stirring was continuously heating to 510 DEG C, keeps the temperature 40 minutes, and stirring is cooled to room temperature, and obtained the conjunction of high-strength tin spelter solder Gold.
CN201711398407.4A 2017-12-21 2017-12-21 A kind of high-strength tin spelter soldering alloy and preparation method thereof Pending CN108203776A (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109483081A (en) * 2018-12-03 2019-03-19 先导薄膜材料(广东)有限公司 Metal targets bind solder and preparation method thereof
CN109595972A (en) * 2018-11-01 2019-04-09 广西瑞祺丰新材料有限公司 A kind of aluminium alloy cooling tube
CN109763024A (en) * 2019-04-01 2019-05-17 杭州辰卓科技有限公司 A kind of cladded type 80-120 degree heat transmission tinbase liquid metal material
CN112475664A (en) * 2020-11-24 2021-03-12 苏州优诺电子材料科技有限公司 Soldering tin alloy and preparation method thereof

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1390672A (en) * 2002-05-10 2003-01-15 大连理工大学 Leadfree SnZn-base alloy solder containing rare-earth elements
US20050109822A1 (en) * 2002-04-09 2005-05-26 Ford Motor Company Solder fillers for aluminum body parts and methods of applying the same
CN1981978A (en) * 2005-12-28 2007-06-20 梁树华 Lead-free soldering tin crease and its production
CN101208174A (en) * 2005-06-03 2008-06-25 千住金属工业株式会社 Lead-free solder alloy
CN101618485A (en) * 2009-08-03 2010-01-06 浙江强力焊锡材料有限公司 Lead free brazing material

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050109822A1 (en) * 2002-04-09 2005-05-26 Ford Motor Company Solder fillers for aluminum body parts and methods of applying the same
CN1390672A (en) * 2002-05-10 2003-01-15 大连理工大学 Leadfree SnZn-base alloy solder containing rare-earth elements
CN101208174A (en) * 2005-06-03 2008-06-25 千住金属工业株式会社 Lead-free solder alloy
CN1981978A (en) * 2005-12-28 2007-06-20 梁树华 Lead-free soldering tin crease and its production
CN101618485A (en) * 2009-08-03 2010-01-06 浙江强力焊锡材料有限公司 Lead free brazing material

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109595972A (en) * 2018-11-01 2019-04-09 广西瑞祺丰新材料有限公司 A kind of aluminium alloy cooling tube
CN109483081A (en) * 2018-12-03 2019-03-19 先导薄膜材料(广东)有限公司 Metal targets bind solder and preparation method thereof
CN109763024A (en) * 2019-04-01 2019-05-17 杭州辰卓科技有限公司 A kind of cladded type 80-120 degree heat transmission tinbase liquid metal material
CN112475664A (en) * 2020-11-24 2021-03-12 苏州优诺电子材料科技有限公司 Soldering tin alloy and preparation method thereof

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